MPXM2102D vs MPXM2102A Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPXM2102D disebabkan oleh NXP Semiconductors dan MPXM2102A disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPXM2102D | MPXM2102A |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | Aktif |
| Pressure Type | Differential | — |
| Operating Pressure Range | 0 kPa to 100 kPa (0 psi to 14.5 psi) | 14.5 PSI (100 kPa) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure kPa] | — |
| Jenis Output | Analog Voltage (Wheatstone bridge, ratiometric) | Wheatstone Bridge (analog, differential) |
| Tegangan Output | 0 mV to 40 mV at Vex = 10 V | — |
| Sensitivity | 0.4 mV/kPa nominal | — |
| Supply Voltage (Vex) | 10 V typical (up to 16 V max) | — |
| Arus Pemberi Arus | 6 mA typical at 10 V | — |
| Offset (null pressure) | 0 mV to 1 mV nominal | — |
| Linearity | ±0.1% FS typical (±0.5% FS max) | — |
| Temperature Compensation Range | 0C to 85C | — |
| Gambaran Suhu Operasi | -40C to +125C | — |
| Storage Temperature | -55C to +150C | — |
| Port Configuration | Dual horizontal ports, differential | — |
| Kemasan | 5-SMD Module (M-PAK) | 5-SMD Module (MPAK) |
| Jenis Pemasangan | Surface Mount | Surface Mount, Board Mount |
| Media Compatibility | Dry air and non-corrosive gases | — |
| Status RoHS | Compliant (lead-free M-PAK) | — |
| Jenis Sensus | — | Absolute Pressure |
| Maximum Overpressure | — | 58.02 PSI (400 kPa) |
| Output Voltage Span | — | 0 mV to 40 mV (at 10 V excitation) |
| Tegangan Pemberi Arus | — | 10 V DC nominal |
| Operating Pressure Range (kPa) | — | 0 kPa to 100 kPa absolute |
| Pressure Port Style | — | No Port (board mount) |
| Bridge Impedance | — | 1.0 kOhm to 4.0 kOhm |
| Suhu Operasi | — | -40C to +125C |
| Termination Style | — | Gull Wing |
| Supplier Device Package | — | 5-MPAK |
| Case Outline | — | CASE 1320 |
| Technology | — | Silicon Piezoresistive, on-chip temperature compensated |