S9S08AW16AE1CLDR vs MC9S08AW16CFGE Perbandingan
Perbandingan bersamaan detil S9S08AW16AE1CLDR dari NXP Semiconductors dan MC9S08AW16CFGE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S08AW16CFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP
MC9S08AW16CFGE NrndPerbandingan Spesifikasi
| Parameter Umum | S9S08AW16AE1CLDR | MC9S08AW16CFGE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core | HCS08 (S08) - 8-bit CISC | — |
| Program Memory (Flash) | 16 KB (16K x 8) | — |
| RAM | 1 KB | — |
| Maximum Bus Frequency | 40 MHz | — |
| Tegangan Pemuat | 2.7 V to 5.5 V | — |
| Suhu Kerja | -40 C to +85 C | [DATA_NEEDED: operating temperature range] |
| Paket | 44-pin LQFP (10x10 mm) | — |
| AEC-Q100 Grade | Qualified (Automotive) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| I/O Pins (max) | 38 | — |
| ADC | 10-bit, 8-channel | — |
| Communication Peripherals | SCI (UART), SPI, I2C | — |
| Timers | TPM (Timer/PWM Module) | — |
| Debug Interface | Background Debug Mode (BDM) | Single-wire background debug mode (BDM) |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-bit |
| CPU Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Architecture | — | CISC, HC08 instruction set with added BGND instruction |
| Flash Memory | — | 16KB (16K x 8) |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Ports | — | 38 general-purpose I/O |
| Package Type | — | 44-LQFP (10x10 mm) |
| Package Outline | — | QFNL, MO-220VKKD-2, 0.50 mm pitch, 1 mm height |
| Family | — | S08AW (AW60/AW48/AW32/AW16) |
| Target Industries | — | Industrial and Automotive |
| Lifecycle Status (NXP) | — | NRND (Not Recommended for New Designs) |