S9S08AW16AE1CLDR vs MC9S08AW16CFGE 比較
詳細並排比較 S9S08AW16AE1CLDR 由 NXP Semiconductors 與 MC9S08AW16CFGE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S08AW16CFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP
MC9S08AW16CFGE Nrnd規格比較
| 參數 | S9S08AW16AE1CLDR | MC9S08AW16CFGE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Core | HCS08 (S08) - 8-bit CISC | — |
| Program Memory (Flash) | 16 KB (16K x 8) | — |
| RAM | 1 KB | — |
| Maximum Bus Frequency | 40 MHz | — |
| 供應電壓 | 2.7 V to 5.5 V | — |
| 工作溫度 | -40 C to +85 C | [DATA_NEEDED: operating temperature range] |
| 封裝 | 44-pin LQFP (10x10 mm) | — |
| AEC-Q100 Grade | Qualified (Automotive) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| I/O Pins (max) | 38 | — |
| ADC | 10-bit, 8-channel | — |
| Communication Peripherals | SCI (UART), SPI, I2C | — |
| Timers | TPM (Timer/PWM Module) | — |
| Debug Interface | Background Debug Mode (BDM) | Single-wire background debug mode (BDM) |
| RoHS 狀態 | Compliant | [DATA_NEEDED: RoHS status] |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-bit |
| CPU Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Architecture | — | CISC, HC08 instruction set with added BGND instruction |
| Flash Memory | — | 16KB (16K x 8) |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Ports | — | 38 general-purpose I/O |
| Package Type | — | 44-LQFP (10x10 mm) |
| Package Outline | — | QFNL, MO-220VKKD-2, 0.50 mm pitch, 1 mm height |
| Family | — | S08AW (AW60/AW48/AW32/AW16) |
| Target Industries | — | Industrial and Automotive |
| Lifecycle Status (NXP) | — | NRND (Not Recommended for New Designs) |