5M160ZE64C4N - MAX V CPLD 128 Macro 54 IOs EQFP-64 | Intel
MPN: 5M160ZE64C4N ✓ Aktif5M160ZE64C4N Ringkasan
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PLA-style macrocells and a global interconnect matrix into a single chip, offering deterministic timing, single-chip operation, and infinite reconfigurability. The MAX V family targets glue-logic, bus-interface, I/O expansion, and power-sequencing roles where ASICs would be uneconomical and FPGAs would be over-specified; within Intel's programmable-logic taxonomy, MAX V sits below Cyclone FPGAs but above discrete 74-series glue logic.
Key features include an internal oscillator (3.3/5.0 V tolerant), 1.8 V/2.5 V/3.3 V MultiVolt I/O support, JTAG and ISP interfaces, and IEEE 1149.1 boundary-scan support. The device operates from a 1.71 V core supply with I/O banks supporting LVTTL, LVCMOS, PCI, and SSTL-2/3 standards. Per the Intel MAX V datasheet, the 'C4N' speed grade corresponds to tPD1 (pin-to-pin) of approximately 4.0 ns worst-case over commercial 0 C to 85 C conditions, while 'Z' denotes the 1.8 V core variant.
Typical applications include bus-interface bridging, I/O expansion for microcontrollers without sufficient pins, power-up/down sequencing in multi-rail systems, address decoding for memory mapped peripherals, and state-machine controllers in industrial control. The flash-backed configuration eliminates the boot PROM that larger FPGAs require, simplifying BOM and reducing board area.
When designing, ensure that all JTAG pins (TCK/TMS/TDO/TDI) are pulled or terminated correctly and that the E64 exposed pad is soldered to a clean ground plane for thermal dissipation. Quartus II / Quartus Prime support provides compilation, simulation and in-system programming flows.
Alternatif penggantian untuk 5M160ZE64C4N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian 5M160ZE64C4N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Programming Interface, Operating Temperature, Configuration Memory, RoHS Status.
5M160ZE64C5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →5M160ZE64A5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →5M160ZE64I4N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →5M160ZE100C4N
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
5M80ZE64C4N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →5M40ZE64C4N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →5M160ZE64C4N Rating Maksimal & Karakteristik Listrik
| Family | MAX V |
| Device | 5M160Z |
| Logic Elements / Macrocells | 128 |
| Maximum User I/Os | 54 |
| User Flash Memory | 8 Kbits |
| Core Voltage | 1.8 V |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V MultiVolt |
| Speed Grade | C4 (tPD1 ~4.0 ns) |
| Suhu Kerja | 0 C to +85 C (Commercial) |
| Paket | EQFP-64 (E64), 7x7x1.4 mm, 0.4 mm pitch |
| Configuration | Non-volatile flash, instant-on |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Internal Oscillator | Yes (programmable) |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL-2/3 |
| Status RoHS | Compliant |
| Level MSL | 3 |
| Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| Supply Voltage (VCCIO) | 1.2 V to 3.3 V |
Konfigurasi Pin 5M160ZE64C4N
| Pin produk 1 | I/O — User I/O pin (bank 1) |
| Pin produk 2 | I/O — User I/O pin (bank 1) |
| Pin produk 3 | I/O — User I/O pin (bank 1) |
| Pin produk 4 | I/O — User I/O pin (bank 1) |
| Pin produk 5 | I/O — User I/O pin (bank 1) |
| Pin produk 6 | I/O — User I/O pin (bank 1) |
| Pin produk 7 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 8 | I/O — User I/O pin (bank 1) |
| Pin produk 9 | I/O — User I/O pin (bank 1) |
| Pin produk 10 | I/O — User I/O pin (bank 1) |
| Pin produk 11 | GND — Ground |
| Pin produk 12 | I/O — User I/O pin (bank 1) |
| Pin produk 13 | I/O — User I/O pin (bank 1) |
| Pin produk 14 | I/O — User I/O pin (bank 1) |
| Pin produk 15 | I/O — User I/O pin (bank 1) |
| Pin produk 16 | I/O — User I/O pin (bank 1) |
| Pin produk 17 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk 18 | I/O — User I/O pin (bank 2) |
| Pin produk 19 | I/O — User I/O pin (bank 2) |
| Pin produk 20 | I/O — User I/O pin (bank 2) |
| Pin produk 21 | I/O — User I/O pin (bank 2) |
| Pin produk 22 | GND — Ground |
| Pin produk 23 | I/O — User I/O pin (bank 2) |
| Pin produk 24 | I/O — User I/O pin (bank 2) |
| Pin produk 25 | I/O — User I/O pin (bank 2) |
| Pin produk 26 | I/O — User I/O pin (bank 2) |
| Pin produk 27 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 28 | I/O — User I/O pin (bank 2) |
| Pin produk 29 | I/O — User I/O pin (bank 2) |
| Pin produk 30 | I/O — User I/O pin (bank 2) |
| Pin produk 31 | GND — Ground |
| Pin produk 32 | I/O — User I/O pin (bank 2) |
| Pin produk 33 | I/O — User I/O pin (bank 2) |
| Pin produk 34 | TDI — JTAG Test Data In |
| Pin produk 35 | TMS — JTAG Test Mode Select |
| Pin produk 36 | TCK — JTAG Test Clock |
| Pin produk 37 | TDO — JTAG Test Data Out |
| Pin produk 38 | I/O — User I/O pin (bank 2) |
| Pin produk 39 | I/O — User I/O pin (bank 2) |
| Pin produk 40 | I/O — User I/O pin (bank 3) |
| Pin produk 41 | I/O — User I/O pin (bank 3) |
| Pin produk 42 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 43 | I/O — User I/O pin (bank 3) |
| Pin produk 44 | I/O — User I/O pin (bank 3) |
| Pin produk 45 | GND — Ground |
| Pin produk 46 | I/O — User I/O pin (bank 3) |
| Pin produk 47 | I/O — User I/O pin (bank 3) |
| Pin produk 48 | I/O — User I/O pin (bank 3) |
| Pin produk 49 | I/O — User I/O pin (bank 3) |
| Pin produk 50 | I/O — User I/O pin (bank 3) |
| Pin produk 51 | I/O — User I/O pin (bank 3) |
| Pin produk 52 | I/O — User I/O pin (bank 3) |
| Pin produk 53 | GND — Ground |
| Pin produk 54 | I/O — User I/O pin (bank 3) |
| Pin produk 55 | I/O — User I/O pin (bank 3) |
| Pin produk 56 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 57 | I/O — User I/O pin (bank 3) |
| Pin produk 58 | I/O — User I/O pin (bank 4) |
| Pin produk 59 | I/O — User I/O pin (bank 4) |
| Pin produk 60 | I/O — User I/O pin (bank 4) |
| Pin produk 61 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk 62 | I/O — User I/O pin (bank 4) |
| Pin produk 63 | I/O — User I/O pin (bank 4) |
| Pin produk 64 | I/O — User I/O pin (bank 4) |
Aplikasi Umum
5M160ZE64C4N cocok untuk 6 aplikasis: Bus Interface Bridging, Industrial I/O Expansion, Power-Up/Down Sequencing, Address Decoding for Memory-Mapped Peripherals, State-Machine Controllers, Display and Touch-Panel Hub.
Bus Interface Bridging
The 5M160ZE64C4N is well suited as a bus bridge between microcontrollers and peripherals operating at different voltages, thanks to its MultiVolt I/O support for 1.8 V, 2.5 V, and 3.3 V logic on the same die. With 128 macrocells and 4.0 ns tPD1 propagation delay, the device can implement glue logic, address-latch demultiplexing, and protocol conversion (e.g., SPI to parallel GPIO) without external logic. The flash-backed configuration means no boot PROM is required, simplifying BOM and reducing board area compared to FPGA-based bridges.
Direkomendasikan
Industrial I/O Expansion
With 54 user I/Os, the 5M160ZE64C4N can expand the limited GPIO count of low-cost microcontrollers in PLCs, motor controllers, and sensor hubs. The C4N speed grade provides 4.0 ns pin-to-pin delay, fast enough for deterministic I/O response in closed-loop control loops. The internal programmable oscillator eliminates the need for an external clock generator for simple timed events, and the 0-85 C operating range covers most factory-floor enclosures.
Direkomendasikan
Power-Up/Down Sequencing
The 5M160ZE64C4N is ideal for multi-rail power-sequencing controllers, where multiple DC-DC converters and LDO regulators must be enabled in a specific order to protect downstream processors and FPGAs. Using the internal 128 macrocells, the CPLD can monitor PG (power-good) signals and generate sequenced EN outputs with programmable delays. Its flash-backed configuration eliminates external boot logic, and the 1.8 V core + MultiVolt I/O allow direct interface to most power-supervisor ICs.
Direkomendasikan
Address Decoding for Memory-Mapped Peripherals
Engineers commonly use the 5M160ZE64C4N to decode chip-select lines for memory-mapped peripherals (SRAM, NOR flash, ASIC registers) on 8/16/32-bit buses. With 128 macrocells and 4.0 ns tPD, the CPLD delivers sub-bus-cycle decoding latency for 50-100 MHz microcontroller/MPU buses. The device's JTAG interface allows in-field reprogramming of the address map without soldering, and the small EQFP-64 footprint fits easily under BGA fan-out.
Direkomendasikan
State-Machine Controllers
The 5M160ZE64C4N's non-volatile flash configuration makes it ideal for deterministic state-machine controllers in appliances, vending machines, and point-of-sale terminals. 128 macrocells provide ample capacity for Mealy/Moore state machines with 16-24 states plus output combinational logic. Instant-on operation from the flash cell guarantees that critical safety states are active within microseconds of VCC ramp, without external configuration boot time.
Direkomendasikan
Display and Touch-Panel Hub
In display panels and touch-controller hubs, the 5M160ZE64C4N can perform LVTTL-to-LVDS signal conversion, backlight PWM generation, and I2C/SPI touch-controller bridging. The MultiVolt I/O banks enable direct connection to both 1.8 V display timing controllers and 3.3 V touch sensors. The 4.0 ns pin-to-pin delay supports 50-100 MHz pixel-clock regeneration for small LCDs up to WVGA resolution. Low power consumption and small EQFP-64 footprint suit space-constrained display modules.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk 5M160ZE64C4N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | 5M160ZE64C5N | 5M160ZE64A5N | 5M160ZE64I4N | 5M80ZE64C4N | 5M40ZE64C4N |
|---|---|---|---|---|---|---|
| Package | EQFP-64 (E64) | EQFP-64 (E64) - same | EQFP-64 (E64) - same | EQFP-64 (E64) - same | EQFP-64 (E64) - same | EQFP-64 (E64) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements / Macrocells | 128 | 128 | 128 | 128 | 64 | 40 |
| Maximum User I/Os | 54 | 54 | 54 | 54 | 30 | 30 |
| Speed Grade (tPD1) | ~4.0 ns (C4) | ~5.0 ns (C5) | ~3.5 ns (A5) | ~4.0 ns (I4) | ~4.0 ns (C4) | ~4.0 ns (C4) |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Configuration Method | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash |
Diferensiator Kunci
- Lowest-power 128-macro MAX V in EQFP-64 with 54 I/Os (vs5M1270ZT144C4N)
- Faster timing at equivalent density than 5M160ZE64C5N (vs5M160ZE64C5N)
- MultiVolt I/O support across 4 banks for mixed-voltage glue logic (vs5M160ZE64I4N (industrial variant))
Catatan Desain
Solder the E64 exposed thermal pad (on the underside of the package) to the PCB ground plane with multiple thermal vias for heat spreading and ground inductance reduction. Per the Intel MAX V datasheet pin-connection guidelines, leaving the ePad floating can cause thermal runaway and erratic I/O behavior. Provide at least 9 thermal vias (0.3 mm drill, 1.0 mm pitch) directly under the ePad to a continuous ground plane on the opposite PCB layer.
Decouple VCCINT (1.8 V) with one 1 uF X7R ceramic capacitor placed within 5 mm of the pin, plus a 0.1 uF X7R high-frequency bypass capacitor. Each VCCIO bank (1, 2, 3, 4) requires its own 0.1 uF + 1 uF decoupling pair placed close to the package. Bulk 10 uF tantalum or polymer capacitors should be located near the regulator outputs. Estimated: total decoupling budget is approximately 6 capacitors for full 4-bank operation.
Do not leave JTAG pins (TCK/TMS/TDO/TDI) floating - they must be pulled to a defined logic level through 10 kohm resistors to prevent spurious configuration attempts. The TRST/nCONFIG pin should be tied high through 10 kohm for normal operation. When programming in-system via JTAG, ensure that no other devices on the JTAG chain are interfering with the TCK signal by using a JTAG buffer if chain length exceeds 6 inches.
Route all high-speed I/O (faster than 100 MHz) on inner PCB layers with a continuous ground reference plane to control impedance. For LVCMOS 3.3 V outputs driving long traces (greater than 50 mm), use 22-33 ohm series damping resistors near the CPLD pin to suppress ringing. The 5M160ZE64C4N C4N speed grade supports edge rates below 1 ns, so impedance-controlled routing is essential above 50 MHz toggle rates.
Informasi Konformitas
RoHS and REACH compliance per Intel MAX V product family declaration. Not AEC-Q100 qualified (commercial-grade CPLD); choose industrial 5M160ZE64I4N for harsher environments.
