5M160ZE64C4N - MAX V CPLD 128 Macro 54 IOs EQFP-64 | Intel
Référence : 5M160ZE64C4N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.8 | $6,80 |
| 10 | $6.12 | $61,20 |
| 100 | $5.42 | $542,00 |
| 500 | $4.85 | $2 425,00 |
| 1 000 | $4.3 | $4 300,00 |
5M160ZE64C4N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PLA-style macrocells and a global interconnect matrix into a single chip, offering deterministic timing, single-chip operation, and infinite reconfigurability. The MAX V family targets glue-logic, bus-interface, I/O expansion, and power-sequencing roles where ASICs would be uneconomical and FPGAs would be over-specified; within Intel's programmable-logic taxonomy, MAX V sits below Cyclone FPGAs but above discrete 74-series glue logic.
Key features include an internal oscillator (3.3/5.0 V tolerant), 1.8 V/2.5 V/3.3 V MultiVolt I/O support, JTAG and ISP interfaces, and IEEE 1149.1 boundary-scan support. The device operates from a 1.71 V core supply with I/O banks supporting LVTTL, LVCMOS, PCI, and SSTL-2/3 standards. Per the Intel MAX V datasheet, the 'C4N' speed grade corresponds to tPD1 (pin-to-pin) of approximately 4.0 ns worst-case over commercial 0 C to 85 C conditions, while 'Z' denotes the 1.8 V core variant.
Typical applications include bus-interface bridging, I/O expansion for microcontrollers without sufficient pins, power-up/down sequencing in multi-rail systems, address decoding for memory mapped peripherals, and state-machine controllers in industrial control. The flash-backed configuration eliminates the boot PROM that larger FPGAs require, simplifying BOM and reducing board area.
When designing, ensure that all JTAG pins (TCK/TMS/TDO/TDI) are pulled or terminated correctly and that the E64 exposed pad is soldered to a clean ground plane for thermal dissipation. Quartus II / Quartus Prime support provides compilation, simulation and in-system programming flows.
Alternatives de remplacement direct pour 5M160ZE64C4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5M160ZE64C4N (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Operating Temperature, Configuration Memory, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5M160ZE64C5N
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →5M160ZE64A5N
✅ Remplacement direct✓ En stock
$6.2 / unité
Voir la fiche technique →5M160ZE64I4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →5M160ZE100C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
5M80ZE64C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.1 / unité
Voir la fiche technique →5M40ZE64C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.7 / unité
Voir la fiche technique →5M160ZE64C4N Valeurs maximales et caractéristiques électriques
| Family | MAX V |
| Device | 5M160Z |
| Logic Elements / Macrocells | 128 |
| Maximum User I/Os | 54 |
| User Flash Memory | 8 Kbits |
| Core Voltage | 1.8 V |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V MultiVolt |
| Speed Grade | C4 (tPD1 ~4.0 ns) |
| Température de fonctionnement | 0 C to +85 C (Commercial) |
| Boîtier | EQFP-64 (E64), 7x7x1.4 mm, 0.4 mm pitch |
| Configuration | Non-volatile flash, instant-on |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Internal Oscillator | Yes (programmable) |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL-2/3 |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
| Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| Supply Voltage (VCCIO) | 1.2 V to 3.3 V |
Configuration des broches de 5M160ZE64C4N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | VCCINT — Core supply voltage (1.8 V) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | TDI — JTAG Test Data In |
| Broche 35 | TMS — JTAG Test Mode Select |
| Broche 36 | TCK — JTAG Test Clock |
| Broche 37 | TDO — JTAG Test Data Out |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | GND — Ground |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | GND — Ground |
| Broche 54 | I/O — User I/O pin (bank 3) |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 62 | I/O — User I/O pin (bank 4) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
Applications typiques
5M160ZE64C4N convient pour 6 applications: Bus Interface Bridging, Industrial I/O Expansion, Power-Up/Down Sequencing, Address Decoding for Memory-Mapped Peripherals, State-Machine Controllers, Display and Touch-Panel Hub.
Bus Interface Bridging
The 5M160ZE64C4N is well suited as a bus bridge between microcontrollers and peripherals operating at different voltages, thanks to its MultiVolt I/O support for 1.8 V, 2.5 V, and 3.3 V logic on the same die. With 128 macrocells and 4.0 ns tPD1 propagation delay, the device can implement glue logic, address-latch demultiplexing, and protocol conversion (e.g., SPI to parallel GPIO) without external logic. The flash-backed configuration means no boot PROM is required, simplifying BOM and reducing board area compared to FPGA-based bridges.
Recommandé
Industrial I/O Expansion
With 54 user I/Os, the 5M160ZE64C4N can expand the limited GPIO count of low-cost microcontrollers in PLCs, motor controllers, and sensor hubs. The C4N speed grade provides 4.0 ns pin-to-pin delay, fast enough for deterministic I/O response in closed-loop control loops. The internal programmable oscillator eliminates the need for an external clock generator for simple timed events, and the 0-85 C operating range covers most factory-floor enclosures.
Recommandé
Power-Up/Down Sequencing
The 5M160ZE64C4N is ideal for multi-rail power-sequencing controllers, where multiple DC-DC converters and LDO regulators must be enabled in a specific order to protect downstream processors and FPGAs. Using the internal 128 macrocells, the CPLD can monitor PG (power-good) signals and generate sequenced EN outputs with programmable delays. Its flash-backed configuration eliminates external boot logic, and the 1.8 V core + MultiVolt I/O allow direct interface to most power-supervisor ICs.
Recommandé
Address Decoding for Memory-Mapped Peripherals
Engineers commonly use the 5M160ZE64C4N to decode chip-select lines for memory-mapped peripherals (SRAM, NOR flash, ASIC registers) on 8/16/32-bit buses. With 128 macrocells and 4.0 ns tPD, the CPLD delivers sub-bus-cycle decoding latency for 50-100 MHz microcontroller/MPU buses. The device's JTAG interface allows in-field reprogramming of the address map without soldering, and the small EQFP-64 footprint fits easily under BGA fan-out.
Recommandé
State-Machine Controllers
The 5M160ZE64C4N's non-volatile flash configuration makes it ideal for deterministic state-machine controllers in appliances, vending machines, and point-of-sale terminals. 128 macrocells provide ample capacity for Mealy/Moore state machines with 16-24 states plus output combinational logic. Instant-on operation from the flash cell guarantees that critical safety states are active within microseconds of VCC ramp, without external configuration boot time.
Recommandé
Display and Touch-Panel Hub
In display panels and touch-controller hubs, the 5M160ZE64C4N can perform LVTTL-to-LVDS signal conversion, backlight PWM generation, and I2C/SPI touch-controller bridging. The MultiVolt I/O banks enable direct connection to both 1.8 V display timing controllers and 3.3 V touch sensors. The 4.0 ns pin-to-pin delay supports 50-100 MHz pixel-clock regeneration for small LCDs up to WVGA resolution. Low power consumption and small EQFP-64 footprint suit space-constrained display modules.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5M160ZE64C4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5M160ZE64C5N | 5M160ZE64A5N | 5M160ZE64I4N | 5M80ZE64C4N | 5M40ZE64C4N |
|---|---|---|---|---|---|---|
| Package | EQFP-64 (E64) | EQFP-64 (E64) - same | EQFP-64 (E64) - same | EQFP-64 (E64) - same | EQFP-64 (E64) - same | EQFP-64 (E64) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements / Macrocells | 128 | 128 | 128 | 128 | 64 | 40 |
| Maximum User I/Os | 54 | 54 | 54 | 54 | 30 | 30 |
| Speed Grade (tPD1) | ~4.0 ns (C4) | ~5.0 ns (C5) | ~3.5 ns (A5) | ~4.0 ns (I4) | ~4.0 ns (C4) | ~4.0 ns (C4) |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Configuration Method | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash |
Principaux différenciateurs
- Lowest-power 128-macro MAX V in EQFP-64 with 54 I/Os (vs 5M1270ZT144C4N)
- Faster timing at equivalent density than 5M160ZE64C5N (vs 5M160ZE64C5N)
- MultiVolt I/O support across 4 banks for mixed-voltage glue logic (vs 5M160ZE64I4N (industrial variant))
Notes de conception
Solder the E64 exposed thermal pad (on the underside of the package) to the PCB ground plane with multiple thermal vias for heat spreading and ground inductance reduction. Per the Intel MAX V datasheet pin-connection guidelines, leaving the ePad floating can cause thermal runaway and erratic I/O behavior. Provide at least 9 thermal vias (0.3 mm drill, 1.0 mm pitch) directly under the ePad to a continuous ground plane on the opposite PCB layer.
Decouple VCCINT (1.8 V) with one 1 uF X7R ceramic capacitor placed within 5 mm of the pin, plus a 0.1 uF X7R high-frequency bypass capacitor. Each VCCIO bank (1, 2, 3, 4) requires its own 0.1 uF + 1 uF decoupling pair placed close to the package. Bulk 10 uF tantalum or polymer capacitors should be located near the regulator outputs. Estimated: total decoupling budget is approximately 6 capacitors for full 4-bank operation.
Do not leave JTAG pins (TCK/TMS/TDO/TDI) floating - they must be pulled to a defined logic level through 10 kohm resistors to prevent spurious configuration attempts. The TRST/nCONFIG pin should be tied high through 10 kohm for normal operation. When programming in-system via JTAG, ensure that no other devices on the JTAG chain are interfering with the TCK signal by using a JTAG buffer if chain length exceeds 6 inches.
Route all high-speed I/O (faster than 100 MHz) on inner PCB layers with a continuous ground reference plane to control impedance. For LVCMOS 3.3 V outputs driving long traces (greater than 50 mm), use 22-33 ohm series damping resistors near the CPLD pin to suppress ringing. The 5M160ZE64C4N C4N speed grade supports edge rates below 1 ns, so impedance-controlled routing is essential above 50 MHz toggle rates.
Informations de conformité
RoHS and REACH compliance per Intel MAX V product family declaration. Not AEC-Q100 qualified (commercial-grade CPLD); choose industrial 5M160ZE64I4N for harsher environments.
