EPF10K100EQC208-1N - 100K Gate FLEX-10KE FPGA, 147 I/O, 208-PQFP | Intel
MPN: EPF10K100EQC208-1N ⚠ Waktu Beli TerakhirEPF10K100EQC208-1N Ringkasan
A Field Programmable Gate Array (FPGA) is a type of integrated circuit that contains an array of configurable logic blocks (CLBs), programmable interconnects, and configurable I/O cells. FPGAs sit in the digital logic hierarchy between simple PLDs/CPLDs and ASICs, offering higher logic density than CPLDs while avoiding the NRE cost of ASICs. The FLEX 10K family, launched in the mid-1990s, was the industry's first family to embed dedicated SRAM memory blocks (Embedded Array Blocks, EABs) alongside general-purpose logic, enabling System-on-a-Programmable-Chip (SOPC) integration. This places the EPF10K100EQC208-1N in the broader taxonomy of programmable logic -> FPGA -> SRAM-based FPGA -> embedded-block FPGA.
Key features of the EPF10K100EQC208-1N include 147 user I/O pins supporting multiple I/O standards, 49,152 bits of distributed SRAM organized into EABs, in-system programmability via SRAM configuration cells, and a 2.375V to 2.625V core supply (5V tolerant I/O with proper reference). The '-1N' speed grade denotes the faster commercial speed bin, while 'N' indicates a lead-free, RoHS-compliant package. The device is built on a 0.42 um CMOS SRAM process with a maximum internal propagation delay of approximately 0.6 ns.
The architecture combines a symmetrical array of logic elements (LEs) with rows of EABs spanning the full device width, providing high-density memory and arithmetic functions. Each LE contains a 4-input look-up table (LUT) and a programmable register. The continuous FastTrack Interconnect routes signals across rows and columns with predictable timing, making static timing analysis straightforward. Configuration bitstream is loaded from a serial or parallel PROM into SRAM cells at power-up; the design is volatile and must be reconfigured on each power cycle.
Typical applications include glue logic replacement, bus and protocol bridging (PCI, ISA, VME), custom DSP datapaths, telecommunications line-card controllers, industrial control and instrumentation front-ends, and legacy system refresh where original FLEX 10K designs must be replicated or migrated. Designers also use the EABs to implement ROM, dual-port RAM, FIFO, and arithmetic functions such as multipliers. The PQFP-208 package supports hand-soldering and socketed prototyping, which is convenient for industrial and laboratory use.
When designing with the EPF10K100EQC208-1N, ensure a stable 2.5V core supply and configure all VCCINT and VCCIO pins per the Altera datasheet; missing power pins will cause unpredictable behavior. A configuration PROM (such as the EPC2 or EPC8 in the same family) is required to load the bitstream at power-up. JTAG boundary-scan and programming are supported, enabling in-system updates. Designers should also note that the FLEX 10K family is a mature legacy product line - verify long-term availability with distributors before committing to new designs, and consider a Cyclone or Cyclone II migration path when starting new projects.
This page synthesizes distributor pricing, drop-in alternatives from the same FLEX 10K family and from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
Alternatif penggantian untuk EPF10K100EQC208-1N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF10K100EQC208-1N (sama faktor bentuk dan footprint) — berbeda di dalam RoHS Status, Operating Temperature, Process Technology, Family, Speed Grade.
EPF10K100EQC208-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K100EQC208-2
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EPF10K100EQC208-3
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EPF10K100EQC208-1XN
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EPF10K100EQC208-1N Rating Maksimal & Karakteristik Listrik
| Series | FLEX-10KE |
| Family | FLEX 10K (SRAM-based FPGA with EAB) |
| Typical Gates | 100,000 gates |
| Logic Elements | 4,992 |
| Total RAM Bits | 49,152 bits |
| Number of Logic Array Blocks (LABs) | 624 |
| User I/Os | 147 |
| Supply Voltage - Core (VCCINT) | 2.375 V to 2.625 V |
| Propagation Delay (max) | 0.6 ns |
| Speed Grade | -1 (faster bin) |
| Suhu Kerja | 0 C to +70 C (Commercial) |
| Paket / Case | 208-BFQFP / 208-PQFP |
| Supplier Device Package | 208-PQFP (28 x 28 mm) |
| Tipe Mounting | Surface Mount |
| Status RoHS | Compliant (lead-free, 'N' suffix) |
| Process Technology | 0.42 um CMOS SRAM |
| Configuration Method | SRAM, serial or parallel |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
Konfigurasi Pin EPF10K100EQC208-1N
| Pin produk 1 | I/O — User I/O pin (bank 1) |
| Pin produk 2 | I/O — User I/O pin (bank 1) |
| Pin produk 3 | I/O — User I/O pin (bank 1) |
| Pin produk 4 | I/O — User I/O pin (bank 1) |
| Pin produk 5 | I/O — User I/O pin (bank 1) |
| Pin produk 6 | I/O — User I/O pin (bank 1) |
| Pin produk 7 | I/O — User I/O pin (bank 1) |
| Pin produk 8 | I/O — User I/O pin (bank 1) |
| Pin produk 9 | I/O — User I/O pin (bank 1) |
| Pin produk 10 | I/O — User I/O pin (bank 1) |
| Pin produk 11 | GND — Ground |
| Pin produk 12 | I/O — User I/O pin (bank 1) |
| Pin produk 13 | I/O — User I/O pin (bank 1) |
| Pin produk 14 | I/O — User I/O pin (bank 1) |
| Pin produk 15 | I/O — User I/O pin (bank 1) |
| Pin produk 16 | VCCINT — Core supply voltage 2.5V |
| Pin produk 17 | I/O — User I/O pin (bank 2) |
| Pin produk 18 | I/O — User I/O pin (bank 2) |
| Pin produk 19 | I/O — User I/O pin (bank 2) |
| Pin produk 20 | I/O — User I/O pin (bank 2) |
| Pin produk 21 | I/O — User I/O pin (bank 2) |
| Pin produk 22 | I/O — User I/O pin (bank 2) |
| Pin produk 23 | I/O — User I/O pin (bank 2) |
| Pin produk 24 | I/O — User I/O pin (bank 2) |
| Pin produk 25 | I/O — User I/O pin (bank 2) |
| Pin produk 26 | I/O — User I/O pin (bank 2) |
| Pin produk 27 | GND — Ground |
| Pin produk 28 | I/O — User I/O pin (bank 2) |
| Pin produk 29 | I/O — User I/O pin (bank 2) |
| Pin produk 30 | I/O — User I/O pin (bank 2) |
| Pin produk 31 | I/O — User I/O pin (bank 2) |
| Pin produk 32 | I/O — User I/O pin (bank 2) |
| Pin produk 33 | I/O — User I/O pin (bank 2) |
| Pin produk 34 | I/O — User I/O pin (bank 2) |
| Pin produk 35 | I/O — User I/O pin (bank 2) |
| Pin produk 36 | I/O — User I/O pin (bank 2) |
| Pin produk 37 | I/O — User I/O pin (bank 2) |
| Pin produk 38 | I/O — User I/O pin (bank 2) |
| Pin produk 39 | VCCIO — I/O supply voltage (bank 2) |
| Pin produk 40 | I/O — User I/O pin (bank 3) |
| Pin produk 41 | I/O — User I/O pin (bank 3) |
| Pin produk 42 | I/O — User I/O pin (bank 3) |
| Pin produk 43 | I/O — User I/O pin (bank 3) |
| Pin produk 44 | I/O — User I/O pin (bank 3) |
| Pin produk 45 | I/O — User I/O pin (bank 3) |
| Pin produk 46 | I/O — User I/O pin (bank 3) |
| Pin produk 47 | I/O — User I/O pin (bank 3) |
| Pin produk 48 | I/O — User I/O pin (bank 3) |
| Pin produk 49 | I/O — User I/O pin (bank 3) |
| Pin produk 50 | I/O — User I/O pin (bank 3) |
| Pin produk 51 | GND — Ground |
| Pin produk 52 | I/O — User I/O pin (bank 3) |
| Pin produk 53 | I/O — User I/O pin (bank 3) |
| Pin produk 54 | I/O — User I/O pin (bank 3) |
| Pin produk 55 | I/O — User I/O pin (bank 3) |
| Pin produk 56 | I/O — User I/O pin (bank 3) |
| Pin produk 57 | I/O — User I/O pin (bank 3) |
| Pin produk 58 | I/O — User I/O pin (bank 3) |
| Pin produk 59 | I/O — User I/O pin (bank 4) |
| Pin produk 60 | I/O — User I/O pin (bank 4) |
| Pin produk 61 | I/O — User I/O pin (bank 4) |
| Pin produk 62 | I/O — User I/O pin (bank 4) |
| Pin produk 63 | VCCIO — I/O supply voltage (bank 4) |
| Pin produk 64 | I/O — User I/O pin (bank 4) |
| Pin produk 65 | I/O — User I/O pin (bank 4) |
| Pin produk 66 | I/O — User I/O pin (bank 4) |
| Pin produk 67 | I/O — User I/O pin (bank 4) |
| Pin produk 68 | I/O — User I/O pin (bank 4) |
| Pin produk 69 | I/O — User I/O pin (bank 4) |
| Pin produk 70 | I/O — User I/O pin (bank 4) |
| Pin produk 71 | I/O — User I/O pin (bank 4) |
| Pin produk 72 | I/O — User I/O pin (bank 4) |
| Pin produk 73 | I/O — User I/O pin (bank 4) |
| Pin produk 74 | I/O — User I/O pin (bank 4) |
| Pin produk 75 | GND — Ground |
| Pin produk 76 | I/O — User I/O pin (bank 4) |
| Pin produk 77 | I/O — User I/O pin (bank 4) |
| Pin produk 78 | I/O — User I/O pin (bank 4) |
| Pin produk 79 | I/O — User I/O pin (bank 4) |
| Pin produk 80 | I/O — User I/O pin (bank 5) |
| Pin produk 81 | I/O — User I/O pin (bank 5) |
| Pin produk 82 | I/O — User I/O pin (bank 5) |
| Pin produk 83 | I/O — User I/O pin (bank 5) |
| Pin produk 84 | I/O — User I/O pin (bank 5) |
| Pin produk 85 | VCCIO — I/O supply voltage (bank 5) |
| Pin produk 86 | I/O — User I/O pin (bank 5) |
| Pin produk 87 | I/O — User I/O pin (bank 5) |
| Pin produk 88 | I/O — User I/O pin (bank 5) |
| Pin produk 89 | I/O — User I/O pin (bank 5) |
| Pin produk 90 | I/O — User I/O pin (bank 5) |
| Pin produk 91 | I/O — User I/O pin (bank 5) |
| Pin produk 92 | I/O — User I/O pin (bank 5) |
| Pin produk 93 | I/O — User I/O pin (bank 5) |
| Pin produk 94 | I/O — User I/O pin (bank 5) |
| Pin produk 95 | I/O — User I/O pin (bank 5) |
| Pin produk 96 | I/O — User I/O pin (bank 5) |
| Pin produk 97 | I/O — User I/O pin (bank 5) |
| Pin produk 98 | I/O — User I/O pin (bank 5) |
| Pin produk 99 | GND — Ground |
| Pin produk 100 | I/O — User I/O pin (bank 6) |
| Pin produk 101 | I/O — User I/O pin (bank 6) |
| Pin produk 102 | I/O — User I/O pin (bank 6) |
| Pin produk 103 | I/O — User I/O pin (bank 6) |
| Pin produk 104 | I/O — User I/O pin (bank 6) |
| Pin produk 105 | I/O — User I/O pin (bank 6) |
| Pin produk 106 | I/O — User I/O pin (bank 6) |
| Pin produk 107 | I/O — User I/O pin (bank 6) |
| Pin produk 108 | I/O — User I/O pin (bank 6) |
| Pin produk 109 | I/O — User I/O pin (bank 6) |
| Pin produk 110 | I/O — User I/O pin (bank 6) |
| Pin produk 111 | VCCIO — I/O supply voltage (bank 6) |
| Pin produk 112 | I/O — User I/O pin (bank 6) |
| Pin produk 113 | I/O — User I/O pin (bank 6) |
| Pin produk 114 | I/O — User I/O pin (bank 6) |
| Pin produk 115 | I/O — User I/O pin (bank 6) |
| Pin produk 116 | I/O — User I/O pin (bank 6) |
| Pin produk 117 | I/O — User I/O pin (bank 6) |
| Pin produk 118 | I/O — User I/O pin (bank 6) |
| Pin produk 119 | I/O — User I/O pin (bank 7) |
| Pin produk 120 | I/O — User I/O pin (bank 7) |
| Pin produk 121 | I/O — User I/O pin (bank 7) |
| Pin produk 122 | I/O — User I/O pin (bank 7) |
| Pin produk 123 | GND — Ground |
| Pin produk 124 | I/O — User I/O pin (bank 7) |
| Pin produk 125 | I/O — User I/O pin (bank 7) |
| Pin produk 126 | I/O — User I/O pin (bank 7) |
| Pin produk 127 | I/O — User I/O pin (bank 7) |
| Pin produk 128 | I/O — User I/O pin (bank 7) |
| Pin produk 129 | I/O — User I/O pin (bank 7) |
| Pin produk 130 | I/O — User I/O pin (bank 7) |
| Pin produk 131 | I/O — User I/O pin (bank 7) |
| Pin produk 132 | I/O — User I/O pin (bank 7) |
| Pin produk 133 | I/O — User I/O pin (bank 7) |
| Pin produk 134 | I/O — User I/O pin (bank 7) |
| Pin produk 135 | VCCIO — I/O supply voltage (bank 7) |
| Pin produk 136 | I/O — User I/O pin (bank 7) |
| Pin produk 137 | I/O — User I/O pin (bank 7) |
| Pin produk 138 | I/O — User I/O pin (bank 8) |
| Pin produk 139 | I/O — User I/O pin (bank 8) |
| Pin produk 140 | I/O — User I/O pin (bank 8) |
| Pin produk 141 | I/O — User I/O pin (bank 8) |
| Pin produk 142 | I/O — User I/O pin (bank 8) |
| Pin produk 143 | I/O — User I/O pin (bank 8) |
| Pin produk 144 | I/O — User I/O pin (bank 8) |
| Pin produk 145 | I/O — User I/O pin (bank 8) |
| Pin produk 146 | I/O — User I/O pin (bank 8) |
| Pin produk 147 | GND — Ground |
| Pin produk 148 | I/O — User I/O pin (bank 8) |
| Pin produk 149 | I/O — User I/O pin (bank 8) |
| Pin produk 150 | I/O — User I/O pin (bank 8) |
| Pin produk 151 | I/O — User I/O pin (bank 8) |
| Pin produk 152 | I/O — User I/O pin (bank 8) |
| Pin produk 153 | I/O — User I/O pin (bank 8) |
| Pin produk 154 | I/O — User I/O pin (bank 8) |
| Pin produk 155 | I/O — User I/O pin (bank 8) |
| Pin produk 156 | I/O — User I/O pin (bank 8) |
| Pin produk 157 | I/O — User I/O pin (bank 8) |
| Pin produk 158 | I/O — User I/O pin (bank 8) |
| Pin produk 159 | VCCINT — Core supply voltage 2.5V |
| Pin produk 160 | I/O — User I/O pin (bank 1) |
| Pin produk 161 | I/O — User I/O pin (bank 1) |
| Pin produk 162 | I/O — User I/O pin (bank 1) |
| Pin produk 163 | I/O — User I/O pin (bank 1) |
| Pin produk 164 | I/O — User I/O pin (bank 1) |
| Pin produk 165 | I/O — User I/O pin (bank 1) |
| Pin produk 166 | I/O — User I/O pin (bank 1) |
| Pin produk 167 | I/O — User I/O pin (bank 1) |
| Pin produk 168 | I/O — User I/O pin (bank 1) |
| Pin produk 169 | I/O — User I/O pin (bank 1) |
| Pin produk 170 | I/O — User I/O pin (bank 1) |
| Pin produk 171 | GND — Ground |
| Pin produk 172 | I/O — User I/O pin (bank 1) |
| Pin produk 173 | I/O — User I/O pin (bank 1) |
| Pin produk 174 | I/O — User I/O pin (bank 1) |
| Pin produk 175 | I/O — User I/O pin (bank 1) |
| Pin produk 176 | I/O — User I/O pin (bank 1) |
| Pin produk 177 | I/O — User I/O pin (bank 1) |
| Pin produk 178 | I/O — User I/O pin (bank 1) |
| Pin produk 179 | I/O — User I/O pin (bank 1) |
| Pin produk 180 | I/O — User I/O pin (bank 1) |
| Pin produk 181 | I/O — User I/O pin (bank 1) |
| Pin produk 182 | I/O — User I/O pin (bank 1) |
| Pin produk 183 | I/O — User I/O pin (bank 1) |
| Pin produk 184 | I/O — User I/O pin (bank 1) |
| Pin produk 185 | VCCIO — I/O supply voltage (bank 1) |
| Pin produk 186 | I/O — User I/O pin (bank 1) |
| Pin produk 187 | I/O — User I/O pin (bank 1) |
| Pin produk 188 | I/O — User I/O pin (bank 1) |
| Pin produk 189 | I/O — User I/O pin (bank 1) |
| Pin produk 190 | I/O — User I/O pin (bank 1) |
| Pin produk 191 | I/O — User I/O pin (bank 1) |
| Pin produk 192 | I/O — User I/O pin (bank 1) |
| Pin produk 193 | I/O — User I/O pin (bank 1) |
| Pin produk 194 | I/O — User I/O pin (bank 1) |
| Pin produk 195 | I/O — User I/O pin (bank 1) |
| Pin produk 196 | VCCINT — Core supply voltage 2.5V |
| Pin produk 197 | nCONFIG — Configuration control (active low) |
| Pin produk 198 | nSTATUS — Configuration status (active low) |
| Pin produk 199 | CONF_DONE — Configuration done indicator |
| Pin produk 200 | DCLK — Configuration clock |
| Pin produk 201 | DATA0 — Configuration data input |
| Pin produk 202 | MSEL0 — Configuration mode select |
| Pin produk 203 | MSEL1 — Configuration mode select |
| Pin produk 204 | TCK — JTAG test clock |
| Pin produk 205 | TMS — JTAG test mode select |
| Pin produk 206 | TDI — JTAG test data in |
| Pin produk 207 | TDO — JTAG test data out |
| Pin produk 208 | VCCINT — Core supply voltage 2.5V |
Aplikasi Umum
EPF10K100EQC208-1N cocok untuk 6 aplikasis: Legacy Telecom Line-Card Controller, Industrial Control and Instrumentation Front-End, PCI/ISA/VME Bus Bridge and Protocol Glue, DSP Datapath Custom Co-Processor, Aerospace and Avionics Legacy Sustaining, Automotive Diagnostic and Test Equipment.
Legacy Telecom Line-Card Controller
The EPF10K100EQC208-1N fits telecom line-card applications because its 4,992 logic elements and 49,152 bits of embedded SRAM provide enough density to implement framing, signaling, and protocol glue logic on a single device. The 147 user I/Os on the 208-PQFP are sufficient to bridge parallel bus interfaces (H.110, H-MVIP), serial TDM streams, and front-panel LED drivers. The FLEX 10KE architecture's EABs can implement dual-port RAM and FIFOs for inter-block buffering without external memory. Designers should note that for new line-card designs, the Cyclone II family is the recommended modern migration path; this part is appropriate for sustaining and replicating legacy FLEX 10K line-card designs in service.
Direkomendasikan
Industrial Control and Instrumentation Front-End
The EPF10K100EQC208-1N is well-suited to industrial instrumentation front-ends because its 100,000-gate density and 0.6 ns propagation delay enable high-speed ADC/DAC interface glue logic, encoder/decoder state machines, and custom DSP datapaths. The 208-PQFP package supports hand-soldering for prototype builds, socketed testing, and field-replaceable modules, which is valuable for industrial maintenance workflows. The commercial 0 to 70 C operating range covers most factory-floor environments when mounted in a temperature-controlled enclosure. Pair with a MAX+PLUS II-generated bitstream and the EPC2LC20N configuration PROM for non-volatile storage; add JTAG-based in-system updates for firmware maintenance cycles.
Direkomendasikan
PCI/ISA/VME Bus Bridge and Protocol Glue
The EPF10K100EQC208-1N excels at bus-bridging and protocol-glue applications because its 4,992 logic elements and 147 user I/Os provide ample resources for implementing PCI target interfaces, ISA decoder logic, VME bus masters, and custom peripheral bridges in a single device. The EABs efficiently implement FIFO buffers and address-mapping tables that bus protocols require. The 3.3 V LVTTL I/O bank with 5 V-tolerant inputs is compatible with PCI signaling levels. Designers targeting legacy industrial PCI systems should pay attention to VCCIO banking and use the -1 speed grade to meet the 33 MHz PCI timing budget with comfortable margin.
Direkomendasikan
DSP Datapath Custom Co-Processor
The EPF10K100EQC208-1N supports custom DSP co-processor designs because its 49,152 bits of embedded RAM can hold coefficients and intermediate state for FIR filters, FFT butterflies, and adaptive equalizers. The EABs implement ROM lookup tables for log, exp, and trig functions used in DSP datapaths, while the logic elements implement adders, multipliers (built from shift-and-add trees), and control state machines. The 0.6 ns propagation delay at the -1 speed grade enables approximately 166 MHz single-cycle operation, sufficient for many mid-rate DSP tasks. For modern DSP-intensive designs, a Cyclone II or Cyclone III device with hardware multipliers is the recommended path.
Direkomendasikan
Aerospace and Avionics Legacy Sustaining
The EPF10K100EQC208-1N is appropriate for aerospace sustaining engineering because avionics systems designed in the late 1990s and early 2000s often used FLEX 10KE FPGAs and require ongoing support, repair, and exact-form-fit reproduction. The 208-PQFP package is suitable for through-hole retrofit boards and conformal-coated assemblies common in avionics. Note that the standard 'N' suffix device is commercial temperature grade (0 to 70 C); avionics applications typically require the industrial (-40 to 85 C) variant. For new DO-254 certified designs, consult the latest certifiable FPGA offerings from Microchip (formerly Microsemi) rather than reusing legacy FLEX 10K parts.
Direkomendasikan
Automotive Diagnostic and Test Equipment
The EPF10K100EQC208-1N fits automotive diagnostic equipment because its logic density and I/O count are well matched to OBD-II, CAN, and proprietary vehicle bus protocol analyzers, in-circuit testers, and engine-control simulation rigs. The EABs store lookup tables for fault-code interpretation and protocol decoding, while the logic elements implement timing-critical signal generation and capture logic. The 208-PQFP package is well-suited to through-hole assembly on test fixture PCBs used by service shops. For new automotive designs targeting production, migrate to AEC-Q100 qualified Cyclone III or Cyclone IV devices; this part is for legacy test equipment sustaining only.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF10K100EQC208-1N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF10K100EQC208-1 | EPF10K100EQC208-2 | EPF10K100EQC208-3 | EPF10K100EQC208-1XN |
|---|---|---|---|---|---|
| Package | 208-PQFP (28x28 mm) | 208-PQFP (28x28 mm) - same | 208-PQFP (28x28 mm) - same | 208-PQFP (28x28 mm) - same | 208-PQFP (28x28 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE |
| Speed Grade | -1 (fastest) | -1 | -2 (slower) | -3 (slowest) | -1 (extended temp) |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| User I/Os | 147 | 147 | 147 | 147 | 147 |
| Embedded RAM Bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits |
| Core Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Lead-Free (RoHS) | Yes (N suffix) | No (SnPb) | Yes (N suffix on -2N variant) | Yes (N suffix on -3N variant) | Yes (N suffix) |
| Operating Temperature | 0 C to +70 C (Commercial) | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | -40 C to +85 C (Extended) |
Diferensiator Kunci
- RoHS lead-free finish on production package (vsEPF10K100EQC208-1)
- Fastest FLEX 10KE speed grade available in PQFP-208 (vsEPF10K100EQC208-2)
- Industrial/extended temperature variant option (vsEPF10K100EQC208-1XN)
Catatan Desain
Provide a clean 2.5V core supply to VCCINT (all VCCINT pins must be connected per the FLEX 10KE datasheet) and properly decouple with 0.1 uF and 10 uF capacitors placed close to each VCCINT/GND pair. VCCIO pins must be supplied at the I/O signaling voltage (typically 3.3V for LVTTL) and must also be fully populated; floating VCCIO pins cause configuration failure. Sequence VCCINT and VCCIO together or VCCINT first; do not apply VCCIO before VCCINT. Use a low-impedance ground plane and route all four GND pins (11, 27, 51, 75, 99, 123, 147, 171) directly to the ground plane with minimum trace inductance.
The EPF10K100EQC208-1N requires an external configuration PROM (EPC2LC20N, EPC2TC32N, or EPC8QC100N) to load the bitstream at power-up because SRAM configuration is volatile. Forgetting the configuration PROM is the most common board-bring-up failure. Use MSEL0/MSEL1 pins to select the configuration mode (serial vs parallel) - incorrect MSEL settings cause CONF_DONE to never assert. Add a pull-up on nCONFIG and monitor nSTATUS during POR; a stuck-low nSTATUS after power-up indicates configuration failure and the bitstream will not load.
The 208-PQFP package has 0.5 mm lead pitch and requires careful PCB layout - use fine-pitch surface-mount pads with proper solder mask defined (SMD) land patterns, and follow IPC-7351 guidelines for PQFP-208. Use a 4-layer or 6-layer stackup with dedicated ground and power planes to manage signal integrity for the 147 user I/Os. Route high-speed signals (clocks, global buffers) first with controlled impedance; keep clock traces short and surrounded by ground. Decoupling capacitors (0.1 uF ceramic) should be placed within 5 mm of every VCCINT and VCCIO pin.
For clock-distribution designs, use the dedicated clock input pins (CLK0, CLK1, CLK2, CLK3) and the global low-skew clock network rather than routing clocks on general-purpose I/Os. The FLEX 10KE has 4 dedicated clock inputs and 4 dedicated clock enable inputs; misuse of these resources for non-clock signals reduces available global routing. For high-fanout nets, use the dedicated FastRow interconnect, which provides low-skew distribution across the device. When migrating an existing FLEX 10K (non-E) design, re-validate timing because the -1, -2, -3 speed grade relationships differ between the original FLEX 10K and FLEX 10KE families.
Informasi Konformitas
Lead-free RoHS compliance indicated by 'N' suffix per Altera/Intel legacy packaging convention. Not AEC-Q100 qualified; commercial temperature grade only. Reach and conflict-minerals compliance inferred from standard Altera/Intel corporate compliance posture for legacy FPGAs - exact certificates available from Rochester Electronics on request.