EPF10K130EFC484-3 - 130K Gates FLEX 10KE FPGA, 484-BGA | Altera
MPN: EPF10K130EFC484-3 ✗ Akhir HidupEPF10K130EFC484-3 Ringkasan
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacturing through configuration memory; FPGAs are widely used as glue logic, prototyping vehicles, and short-to-medium-volume custom compute blocks. The FLEX 10KE family in particular introduced an embedded array block concept that pairs distributed logic with dedicated RAM blocks, enabling System-on-a-Programmable-Chip (SOPC) integration by combining microprocessor cores, custom datapath logic, and on-chip memory in a single device.
Key features include 6,656 logic elements, 832 LABs each containing 8 LEs, 65,536 bits of embedded array SRAM organized as 16 EABs (Embedded Array Blocks) of 4,096 bits each, a propagation delay of approximately 0.6 ns per LE, and 369 user I/Os. The device supports in-system programmability via serial or parallel configuration and operates across the commercial 0 C to 70 C temperature range with a -3 speed grade denoting the slowest of three performance bins.
The architecture combines a fine-grained logic fabric with course-grained EABs that can implement RAM, ROM, FIFO, or multiplier functions. Multivolt I/O pins support 5.0 V, 3.3 V, and 2.5 V interfaces, allowing direct bridging between legacy TTL/CMOS peripherals and modern low-voltage ASICs without external level shifters. The 484-FBGA package offers high I/O density with a controlled-impedance substrate suitable for high-speed parallel buses and DDR memory interfaces.
Typical applications include telecommunications line cards and crosspoint switches, industrial motor-control and machine-vision front ends, ASIC prototyping, military/aerospace signal processing (with the military-grade screening variant), and embedded DSP glue logic between microprocessors and peripherals. The wide I/O count makes the EPF10K130EFC484-3 particularly attractive for parallel bus aggregation in legacy replacement designs.
When designing with this part, allocate at least one configuration device (EPC2 or compatible) or a microprocessor-driven configuration scheme, since the FLEX 10KE is SRAM-based and reconfigures on every power-up. Ensure controlled-impedance routing for all clocks and high-speed I/O, and verify that the FBGA land pattern matches your PCB manufacturer's BGA process capability.
This page synthesizes distributor pricing snapshots, same-package alternatives, and practical design guidance not assembled in the original FLEX 10KE datasheet, providing a single reference for engineers evaluating end-of-life FLEX 10KE designs against current alternatives.
Alternatif penggantian untuk EPF10K130EFC484-3 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF10K130EFC484-3 (sama faktor bentuk dan footprint) — berbeda di dalam Speed Grade, Package, Configuration Method, Operating Temperature, Propagation Delay.
EPF10K130EFC484-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K130EFC484-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K130EFC484-1
✅ Drop-In✗ Habis Stok
$92 / Satuan
Lihat Datasheet →EPF10K130EFC484-3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K100EFC484-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K100EFC484-3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K130EFC484-3 Rating Maksimal & Karakteristik Listrik
| Family | FLEX 10KE |
| Logic Elements (LEs) | 6,656 |
| Typical Gate Count | 130,000 system gates |
| Logic Array Blocks (LABs) | 832 |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) |
| Maximum User I/O | 369 |
| Supply Voltage (Core) | 3.3 V |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) |
| Propagation Delay | 0.6 ns (per LE) |
| Speed Grade | -3 |
| Suhu Kerja | 0 C to +70 C (commercial) |
| Paket | 484-pin FBGA (FineLine BGA) |
| Tipe Mounting | Surface Mount (BGA) |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device |
| Logic Family | CMOS (SRAM-based) |
EPF10K130EFC484-3 484-pin fbga (fineline bga) Diamant Konfigurasi Panduan
Konfigurasi pin untuk EPF10K130EFC484-3 (484-pin fbga (fineline bga) pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk EPF10K130EFC484-3.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
EPF10K130EFC484-3 cocok untuk 6 aplikasis: Telecommunications Line Cards, Industrial Motor Control Front Ends, ASIC Prototyping, Military and Aerospace Signal Processing, Embedded DSP Glue Logic, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EPF10K130EFC484-3 is well-suited for legacy telecom line-card designs that aggregate multiple E1/T1 or DSL channels into a backplane fabric. With 369 user I/Os and 6,656 logic elements, it can implement framing, HDLC controllers, and crosspoint switching fabric in a single device, replacing multiple 74-series TTL parts. Its multi-volt I/O (5.0 V/3.3 V/2.5 V) bridges legacy line-interface ICs to modern 3.3 V framers without level shifters. The 484-FBGA's high I/O density also enables direct connection to 32-bit parallel buses and DDR memory interfaces.
Direkomendasikan
Industrial Motor Control Front Ends
Factory automation and motor-drive systems benefit from the EPF10K130EFC484-3's ability to combine PWM generation, encoder decoding (QEP), and field-oriented control state machines in a single programmable device. The 832 LABs provide ample logic for multi-axis control loops, while the 16 EABs deliver 65,536 bits of lookup-table storage for sine-wave modulation profiles. Commercial 0-70 C operation covers most factory-floor enclosures, and the SRAM-based configuration supports field firmware updates as drive algorithms evolve.
Direkomendasikan
ASIC Prototyping
Before taping out an ASIC, design teams validate RTL on FPGAs to catch logic bugs early; the EPF10K130EFC484-3 with 130K gates maps most mid-complexity ASICs 1:1. Its 6,656 logic elements and 369 I/Os accommodate multi-million-gate ASIC prototypes broken into a single FLEX 10KE domain, allowing real-world timing verification with 0.6 ns propagation delay per LE. The multi-volt I/O is critical when prototyping ASICs destined for mixed 5 V/3.3 V/2.5 V environments.
Direkomendasikan
Military and Aerospace Signal Processing
The FLEX 10KE family includes military-temperature-screened variants in the same 484-FBGA package, making the EPF10K130EFC484-3 platform a candidate for avionics, radar signal preprocessing, and ruggedized display controllers. Its embedded array blocks implement FIR filters and FFT twiddle-factor ROMs directly in silicon, saving external memory accesses. Long-term availability through Rochester Electronics supports multi-decade program lifecycles typical of military programs.
Direkomendasikan
Embedded DSP Glue Logic
Between microprocessors, DSPs, and peripherals, the EPF10K130EFC484-3 provides custom bus bridges, DMA engines, and protocol converters without the cost of a full ASIC. With 369 I/Os it can sit on the system bus and connect multiple peripherals simultaneously, while its 65,536 bits of embedded SRAM act as dual-ported buffer memory between clock domains. The -3 speed grade offers sufficient margin for typical 33-66 MHz peripheral interfaces.
Direkomendasikan
Test and Measurement Instrumentation
Digital oscilloscopes, logic analyzers, and protocol testers leverage the EPF10K130EFC484-3's deep I/O count to implement high-speed pattern generators, parallel capture buffers, and protocol decoders (I2C, SPI, UART, CAN) in a single device. The EABs serve as waveform memories and trace FIFOs, while the LE fabric handles real-time triggering logic. Multi-volt I/O simplifies probing 1.8 V to 5 V systems without external level translation.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF10K130EFC484-3 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF10K130EFC484-2N | EPF10K130EFC484-2 | EPF10K130EFC484-1 | EPF10K130EFC484-3N | EPF10K100EFC484-3 | EPF10K100EFC484-3N |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Brand | Intel (formerly Altera) | Intel (same) | Intel (same) | Intel (same) | Intel (same) | Intel (same) | Intel (same) |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Elements | 6,656 | 6,656 (same) | 6,656 (same) | 6,656 (same) | 6,656 (same) | 4,992 (-25%) | 4,992 (-25%) |
| Typical Gate Count | 130K gates | 130K gates | 130K gates | 130K gates | 130K gates | 100K gates (-23%) | 100K gates (-23%) |
| User I/Os | 369 | 369 (same) | 369 (same) | 369 (same) | 369 (same) | 338 (-8%) | 338 (-8%) |
| Embedded Memory (EAB) | 65,536 bits (16 EABs) | 65,536 bits | 65,536 bits | 65,536 bits | 65,536 bits | 49,152 bits (-25%) | 49,152 bits (-25%) |
| Speed Grade | -3 (slowest) | -2 (faster) | -2 (faster) | -1 (fastest) | -3 (same) | -3 (same) | -3 (same) |
Diferensiator Kunci
- Pin-compatible capacity headroom within same package (vsEPF10K100EFC484-3)
- Higher I/O count for parallel bus aggregation (vsEPF10K100EFC484-3)
- Mid-density sweet spot in FLEX 10KE family (vsEPF10K200SFC484-3N)
Catatan Desain
Estimated: at 3.3 V core with typical FLEX 10KE ICCINT of approximately 200-400 mA plus I/O bank current, total board supply must be sized for 1.5-2.5 W steady state plus configuration inrush. Provide at least four 0.1 uF decoupling capacitors directly under the FBGA plus bulk 33-100 uF tantalum or polymer caps near the VCCINT/VCCIO pins. Use a star-ground topology separating analog PLL supplies from digital ground returns.
The 484-FBGA package has relatively poor top-side heat dissipation; bottom-side thermal balls (if present in the package variant) must be soldered to inner-plane copper with thermal vias for heatsinking. Ensure continuous GND copper beneath the device. In enclosed industrial cabinets, derate ambient temperature by 10 C above datasheet maximums to account for FBGA thermal resistance.
Use at least 6-layer PCB stack-up with continuous VCCINT and GND planes for the 484-FBGA fan-out; BGA breakout requires microvia or 4-mil line/space fabrication. Match trace lengths within +/- 150 mil for clocks and high-speed buses. Confirm PCB manufacturer supports your BGA pitch (1.0 mm typical for FineLine BGA) and offers ENIG or OSP surface finish for reliable solder joints.
Common pitfalls: (1) forgetting that FLEX 10KE is SRAM-volatile and needs a configuration device (EPC2/EPC4 family) at every power-up, (2) mixing 5 V and 3.3 V signals on the same I/O bank without proper VCCIO rail selection, (3) exceeding maximum JTAG chain length causing configuration failures, and (4) assuming -3 speed grade meets timing closure for fast DDR interfaces (it generally does not). Always validate timing with the Quartus II design software.
Informasi Konformitas
RoHS/REACH status not explicitly stated in verified distributor snippets; lead-free finish confirmed by -3N variant ordering code. AEC-Q100 not applicable to FPGAs.