EPF10K130EFC484-3 - 130K Gates FLEX 10KE FPGA, 484-BGA | Altera
부품 번호: EPF10K130EFC484-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $253.74 | $253.74 |
| 10 | $228.37 | $2,283.70 |
| 100 | $205.18 | $20,518.00 |
| 250 | $192.66 | $48,165.00 |
| 500 | $178.92 | $89,460.00 |
EPF10K130EFC484-3 개요
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacturing through configuration memory; FPGAs are widely used as glue logic, prototyping vehicles, and short-to-medium-volume custom compute blocks. The FLEX 10KE family in particular introduced an embedded array block concept that pairs distributed logic with dedicated RAM blocks, enabling System-on-a-Programmable-Chip (SOPC) integration by combining microprocessor cores, custom datapath logic, and on-chip memory in a single device.
Key features include 6,656 logic elements, 832 LABs each containing 8 LEs, 65,536 bits of embedded array SRAM organized as 16 EABs (Embedded Array Blocks) of 4,096 bits each, a propagation delay of approximately 0.6 ns per LE, and 369 user I/Os. The device supports in-system programmability via serial or parallel configuration and operates across the commercial 0 C to 70 C temperature range with a -3 speed grade denoting the slowest of three performance bins.
The architecture combines a fine-grained logic fabric with course-grained EABs that can implement RAM, ROM, FIFO, or multiplier functions. Multivolt I/O pins support 5.0 V, 3.3 V, and 2.5 V interfaces, allowing direct bridging between legacy TTL/CMOS peripherals and modern low-voltage ASICs without external level shifters. The 484-FBGA package offers high I/O density with a controlled-impedance substrate suitable for high-speed parallel buses and DDR memory interfaces.
Typical applications include telecommunications line cards and crosspoint switches, industrial motor-control and machine-vision front ends, ASIC prototyping, military/aerospace signal processing (with the military-grade screening variant), and embedded DSP glue logic between microprocessors and peripherals. The wide I/O count makes the EPF10K130EFC484-3 particularly attractive for parallel bus aggregation in legacy replacement designs.
When designing with this part, allocate at least one configuration device (EPC2 or compatible) or a microprocessor-driven configuration scheme, since the FLEX 10KE is SRAM-based and reconfigures on every power-up. Ensure controlled-impedance routing for all clocks and high-speed I/O, and verify that the FBGA land pattern matches your PCB manufacturer's BGA process capability.
This page synthesizes distributor pricing snapshots, same-package alternatives, and practical design guidance not assembled in the original FLEX 10KE datasheet, providing a single reference for engineers evaluating end-of-life FLEX 10KE designs against current alternatives.
드롭인 대체품: EPF10K130EFC484-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K130EFC484-3 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Configuration Method, Operating Temperature, Propagation Delay.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K130EFC484-2N
✅ 드롭인✓ 재고 있음
$799 / 개
데이터시트 보기 →EPF10K130EFC484-2
✅ 드롭인✓ 재고 있음
$105 / 개
데이터시트 보기 →EPF10K130EFC484-1
✅ 드롭인✓ 재고 있음
$92 / 개
데이터시트 보기 →EPF10K130EFC484-3N
✅ 드롭인✓ 재고 있음
$109.25 / 개
데이터시트 보기 →EPF10K100EFC484-3
✅ 드롭인✓ 재고 있음
$65 / 개
데이터시트 보기 →EPF10K100EFC484-3N
✅ 드롭인✓ 재고 있음
$142 / 개
데이터시트 보기 →EPF10K130EFC484-3 최대 정격 & 전기적 특성
| Family | FLEX 10KE |
| Logic Elements (LEs) | 6,656 |
| Typical Gate Count | 130,000 system gates |
| Logic Array Blocks (LABs) | 832 |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) |
| Maximum User I/O | 369 |
| Supply Voltage (Core) | 3.3 V |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) |
| Propagation Delay | 0.6 ns (per LE) |
| Speed Grade | -3 |
| 동작 온도 | 0 C to +70 C (commercial) |
| 패키지 | 484-pin FBGA (FineLine BGA) |
| 실장 유형 | Surface Mount (BGA) |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device |
| Logic Family | CMOS (SRAM-based) |
EPF10K130EFC484-3 484-pin fbga (fineline bga) 핀 구성 가이드
EPF10K130EFC484-3(484-pin fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K130EFC484-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K130EFC484-3 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, Industrial Motor Control Front Ends, ASIC Prototyping, Military and Aerospace Signal Processing, Embedded DSP Glue Logic, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EPF10K130EFC484-3 is well-suited for legacy telecom line-card designs that aggregate multiple E1/T1 or DSL channels into a backplane fabric. With 369 user I/Os and 6,656 logic elements, it can implement framing, HDLC controllers, and crosspoint switching fabric in a single device, replacing multiple 74-series TTL parts. Its multi-volt I/O (5.0 V/3.3 V/2.5 V) bridges legacy line-interface ICs to modern 3.3 V framers without level shifters. The 484-FBGA's high I/O density also enables direct connection to 32-bit parallel buses and DDR memory interfaces.
추천
Industrial Motor Control Front Ends
Factory automation and motor-drive systems benefit from the EPF10K130EFC484-3's ability to combine PWM generation, encoder decoding (QEP), and field-oriented control state machines in a single programmable device. The 832 LABs provide ample logic for multi-axis control loops, while the 16 EABs deliver 65,536 bits of lookup-table storage for sine-wave modulation profiles. Commercial 0-70 C operation covers most factory-floor enclosures, and the SRAM-based configuration supports field firmware updates as drive algorithms evolve.
추천
ASIC Prototyping
Before taping out an ASIC, design teams validate RTL on FPGAs to catch logic bugs early; the EPF10K130EFC484-3 with 130K gates maps most mid-complexity ASICs 1:1. Its 6,656 logic elements and 369 I/Os accommodate multi-million-gate ASIC prototypes broken into a single FLEX 10KE domain, allowing real-world timing verification with 0.6 ns propagation delay per LE. The multi-volt I/O is critical when prototyping ASICs destined for mixed 5 V/3.3 V/2.5 V environments.
추천
Military and Aerospace Signal Processing
The FLEX 10KE family includes military-temperature-screened variants in the same 484-FBGA package, making the EPF10K130EFC484-3 platform a candidate for avionics, radar signal preprocessing, and ruggedized display controllers. Its embedded array blocks implement FIR filters and FFT twiddle-factor ROMs directly in silicon, saving external memory accesses. Long-term availability through Rochester Electronics supports multi-decade program lifecycles typical of military programs.
추천
Embedded DSP Glue Logic
Between microprocessors, DSPs, and peripherals, the EPF10K130EFC484-3 provides custom bus bridges, DMA engines, and protocol converters without the cost of a full ASIC. With 369 I/Os it can sit on the system bus and connect multiple peripherals simultaneously, while its 65,536 bits of embedded SRAM act as dual-ported buffer memory between clock domains. The -3 speed grade offers sufficient margin for typical 33-66 MHz peripheral interfaces.
추천
Test and Measurement Instrumentation
Digital oscilloscopes, logic analyzers, and protocol testers leverage the EPF10K130EFC484-3's deep I/O count to implement high-speed pattern generators, parallel capture buffers, and protocol decoders (I2C, SPI, UART, CAN) in a single device. The EABs serve as waveform memories and trace FIFOs, while the LE fabric handles real-time triggering logic. Multi-volt I/O simplifies probing 1.8 V to 5 V systems without external level translation.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K130EFC484-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K130EFC484-2N | EPF10K130EFC484-2 | EPF10K130EFC484-1 | EPF10K130EFC484-3N | EPF10K100EFC484-3 | EPF10K100EFC484-3N |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Brand | Intel (formerly Altera) | Intel (same) | Intel (same) | Intel (same) | Intel (same) | Intel (same) | Intel (same) |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Elements | 6,656 | 6,656 (same) | 6,656 (same) | 6,656 (same) | 6,656 (same) | 4,992 (-25%) | 4,992 (-25%) |
| Typical Gate Count | 130K gates | 130K gates | 130K gates | 130K gates | 130K gates | 100K gates (-23%) | 100K gates (-23%) |
| User I/Os | 369 | 369 (same) | 369 (same) | 369 (same) | 369 (same) | 338 (-8%) | 338 (-8%) |
| Embedded Memory (EAB) | 65,536 bits (16 EABs) | 65,536 bits | 65,536 bits | 65,536 bits | 65,536 bits | 49,152 bits (-25%) | 49,152 bits (-25%) |
| Speed Grade | -3 (slowest) | -2 (faster) | -2 (faster) | -1 (fastest) | -3 (same) | -3 (same) | -3 (same) |
주요 차별점
- Pin-compatible capacity headroom within same package (vs EPF10K100EFC484-3)
- Higher I/O count for parallel bus aggregation (vs EPF10K100EFC484-3)
- Mid-density sweet spot in FLEX 10KE family (vs EPF10K200SFC484-3N)
설계 노트
Estimated: at 3.3 V core with typical FLEX 10KE ICCINT of approximately 200-400 mA plus I/O bank current, total board supply must be sized for 1.5-2.5 W steady state plus configuration inrush. Provide at least four 0.1 uF decoupling capacitors directly under the FBGA plus bulk 33-100 uF tantalum or polymer caps near the VCCINT/VCCIO pins. Use a star-ground topology separating analog PLL supplies from digital ground returns.
The 484-FBGA package has relatively poor top-side heat dissipation; bottom-side thermal balls (if present in the package variant) must be soldered to inner-plane copper with thermal vias for heatsinking. Ensure continuous GND copper beneath the device. In enclosed industrial cabinets, derate ambient temperature by 10 C above datasheet maximums to account for FBGA thermal resistance.
Use at least 6-layer PCB stack-up with continuous VCCINT and GND planes for the 484-FBGA fan-out; BGA breakout requires microvia or 4-mil line/space fabrication. Match trace lengths within +/- 150 mil for clocks and high-speed buses. Confirm PCB manufacturer supports your BGA pitch (1.0 mm typical for FineLine BGA) and offers ENIG or OSP surface finish for reliable solder joints.
Common pitfalls: (1) forgetting that FLEX 10KE is SRAM-volatile and needs a configuration device (EPC2/EPC4 family) at every power-up, (2) mixing 5 V and 3.3 V signals on the same I/O bank without proper VCCIO rail selection, (3) exceeding maximum JTAG chain length causing configuration failures, and (4) assuming -3 speed grade meets timing closure for fast DDR interfaces (it generally does not). Always validate timing with the Quartus II design software.
규정 준수 정보
RoHS/REACH status not explicitly stated in verified distributor snippets; lead-free finish confirmed by -3N variant ordering code. AEC-Q100 not applicable to FPGAs.