Intel

EPF10K30RI240-4N - 30K FLEX-10K FPGA, 189 I/O, 240-BFQFP | Intel

Name: EPF10K30RI240-4N - 30K FLEX-10K FPGA, 189 I/O, 240-BFQFP | Intel
Brand: Intel
SKU: EPF10K30RI240-4N

MPN: EPF10K30RI240-4N ✗ Akhir Hidup

5 V Vdss 240-BFQFP Exposed Pad (RQFP-240) Package -4 Speed

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EPF10K30RI240-4N Ringkasan

The Intel (formerly Altera) EPF10K30RI240-4N is a member of the FLEX 10K family of SRAM-based Field-Programmable Gate Arrays (FPGAs), delivering approximately 30,000 typical gates and 1,728 logic elements (LEs) organized into 216 Logic Array Blocks (LABs) with 12,288 bits of embedded memory. Housed in a 240-pin BFQFP (RQFP) exposed-pad package, this -4 speed-grade device operates from a 5 V core supply with MultiVolt I/O support and provides 189 user I/O pins for high-density glue-logic and bus-interface designs.

An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells, all defined by a user-loaded SRAM configuration bitstream. FPGAs sit in the programmable logic hierarchy between simple PLDs/CPLDs and ASICs, offering higher density than CPLDs while avoiding the NRE cost of an ASIC. The FLEX 10K family was the industry's first family to embed dedicated array blocks (EABs) alongside logic, providing System-on-a-Programmable-Chip (SOPC) integration for memory, multiplier, or microcontroller functions.

Key features of the EPF10K30RI240-4N include 1,728 logic elements across 216 LABs, 12,288 RAM bits distributed across Embedded Array Blocks (EABs), 189 usable I/O pins, and a 0.42 µm CMOS SRAM process. The device supports in-system JTAG (IEEE 1149.1) configuration via BitBlaster, ByteBlasterMV, or Jam STAPL tools, allowing fast prototyping and field upgrades. Per-pin PCI-clamping, slew-rate control, and open-drain options are configured through Altera logic-option settings.

Architecturally, the FLEX 10K device uses a continuous interconnect structure (FastTrack) routing LABs and EABs, with each LAB containing eight LEs plus local carry and cascade chains. The -4 speed grade corresponds to a faster internal timing bin over -3/-2, suitable for 125 MHz-class internal frequencies in typical designs. The MultiVolt I/O feature lets VCCIO be tied to 3.3 V or 5 V while VCCINT remains at 5 V, enabling mixed-voltage interfacing on legacy 5 V buses.

Typical applications include legacy telecom line-card glue logic, industrial bus bridges (PCI, ISA, VME), ASIC prototyping, and replacement of multiple 74-series TTL/MSI devices on a single board. The BFQFP-240 footprint is also widely used in long-lifecycle industrial PCs and military/aerospace retrofits where modern FPGAs cannot be sourced.

Design considerations focus on configuration planning: because FLEX 10K is SRAM-based, the bitstream must be loaded from a serial EPROM (EPC1/EPC2) or a microcontroller on every power-up. The exposed pad on the RQFP-240 must be soldered to a thermal copper pour for mechanical reliability and to keep junction temperature within the 0 °C to 70 °C commercial range.

This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.

Alternatif penggantian untuk EPF10K30RI240-4N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF10K30RI240-4N (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Family, Package, Process Technology, Series.

EPF10K130EQI240-2

Intel

Operating Temperature: -40C to +85C

Family: FLEX 10KE (SRAM-based FPGA)

Series: FLEX 10KE