Intel

EPF10K200SRC240-1 - 200K Gate FLEX-10KS FPGA, 240-RQFP | Intel

MPN: EPF10K200SRC240-1 ✗ Akhir Hidup

5.0 V Vdss 240-BFQFP Exposed Pad (RQFP-240) Package -1 (fastest) Speed

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EPF10K200SRC240-1 Ringkasan

The Intel EPF10K200SRC240-1 is a high-density FLEX-10KS series Field-Programmable Gate Array (FPGA) housed in a 240-pin RQFP (BFQFP with exposed pad) package, delivering up to 200,000 typical system gates and 9,984 logic elements backed by 98,304 bits of embedded SRAM. According to the Altera FLEX 10K Embedded Programmable Logic Family Data Sheet, the device provides 1,248 Logic Array Blocks (LABs), 182 user I/Os, and embedded array blocks that implement a wide range of memory and logic functions. The "SRC240-1" suffix indicates the standard 240-pin RQFP package and the -1 speed grade (fastest of the FLEX 10K family at 5.0 V).

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs are positioned above fixed-function ASICs in the silicon hierarchy: ASIC < FPGA < CPLD < programmable SoC < microprocessor. The FLEX 10K family pioneered embedded array blocks (EABs), which are RAM/ROM blocks that can be configured as wide SRAM, FIFO, ROM, or specialized logic, allowing each device to host both gates and megabytes of memory on one die. This makes FLEX 10K devices a bridge between simple glue-logic CPLDs and full-scale microprocessors.

Key features of the EPF10K200SRC240-1 include the FLEX 10K SRAM-based architecture with in-system programmability via IEEE 1149.1 JTAG, multiVolt I/O supporting 5.0 V, 3.3 V, and 2.5 V interfaces, four dedicated clock input pins with on-chip PLL-style clock management, and built-in boundary-scan test. The device integrates 24 EABs totaling 40,960 bits, supports true dual-port RAM configurations, and provides configurable high-drive I/O for backplane driving. Embedded JTAG circuitry adds up to 31,250 gates beyond the listed gate count for boundary-scan and test logic.

The 240-RQFP (32 x 32 mm BFQFP with exposed thermal pad) package exposes a metal pad on the underside for low thermal resistance and board-level grounding. Designers must use the standard FineLine BGA-pin-compatible migration strategy when planning a board that may move between FLEX 10K densities; Altera's datasheet recommends reserving only the I/O pins common to all candidate devices. Programming is performed through the JTAG port using Quartus II or MAX+PLUS II software.

Typical applications include telecom line-card glue logic, industrial control state machines, PCI bridge interfaces, and legacy 5 V prototyping platforms. The exposed-pad package requires a thermal via array and copper pour directly under the part for heat spreading.

When designing with this device, ensure all I/O banks share a common VCCIO if 5 V tolerance is required, since multiVolt I/O is per-bank. Designers migrating from FLEX 10K to FLEX 10KE should review the migration guide because EAB block RAM speeds and LAB interconnect changed between families.

This page synthesizes distributor pricing, drop-in same-package alternatives from the same FLEX 10K family, and practical design notes not found in the manufacturer datasheet alone.

Alternatif penggantian untuk EPF10K200SRC240-1 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF10K200SRC240-1 (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Process Technology, Family, Package, Speed Grade.

EPF10K100EQC240-1N

Intel

Operating Temperature: 0 °C to 70 °C (commercial)

Process Technology: 0.22 µm CMOS