Altera

EPF6024AQI208-2 - FLEX 6000 PLD 24K Gates 208-PQFP | Altera

MPN: EPF6024AQI208-2 ⚠ Waktu Beli Terakhir

5.0 V Vdss PQFP-208 (QFP208,1.2SQ,20), gull-wing, 0.500 mm pitch Package 153 MHz Speed

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EPF6024AQI208-2 Ringkasan

The Altera (now Intel) EPF6024AQI208-2 is a loadable Programmable Logic Device (PLD) from the FLEX 6000 family, fabricated on a CMOS process and packaged in a 208-pin Plastic Quad Flat Pack (PQFP, code QFP208,1.2SQ,20) with 0.500 mm terminal pitch. It delivers 24,000 usable gates, 1,960 logic elements (LEs), and 171 configurable I/O lines plus 4 dedicated inputs, organized as 171 inputs and 171 outputs for high-density glue-logic integration.

What is a PLD? A Programmable Logic Device is a generic term for a digital IC whose logic function and interconnect are defined after manufacture by the end user. PLDs sit within the broader taxonomy of programmable logic: simple PLD (SPLD, e.g. PAL/GAL) -> complex PLD (CPLD) -> field-programmable gate array (FPGA), with FPGAs occupying the highest density tier. The FLEX 6000 series occupies the CPLD/early-FPGA boundary, optimized for high I/O count and predictable timing rather than register-rich datapath synthesis.

Key features of the EPF6024AQI208-2 include a maximum clock frequency of 153 MHz, in-system programmability via SRAM configuration cells (requiring a configuration device on power-up), 5 V tolerant I/O (the 'I' speed grade), and an industrial operating temperature range of -40 C to +85 C. Embedded array blocks (EABs) provide on-chip ROM/RAM for look-up tables and small FIFOs, while each logic element contains a 4-input look-up table and a programmable flip-flop.

Architecturally the FLEX 6000 uses a continuous-routing FastTrack interconnect that delivers predictable, compiler-driven delay rather than the segmented routing of later FPGA families. This makes timing closure straightforward at the cost of slightly higher propagation delay per gate compared with Look-Up-Table FPGAs of the same vintage. The PQFP-208 footprint offers through-hole-compatible hand-solderability for prototype and legacy repair, in contrast with the BGA-only options of later Cyclone families.

Typical applications include industrial glue logic replacement, bus-interface bridges (e.g. PCI/ISA to local microcontroller), motor-control state machines, legacy telecom backplane glue, and instrumentation front-ends where 5 V I/O tolerance simplifies interfacing to analog front ends. The high I/O count (171 user I/O plus 4 dedicated inputs) suits designs that previously required multiple 84-pin PLDs.

When designing with this part, note that FLEX 6000 devices are SRAM-based and lose configuration on power-down; pair with an Altera EPC configuration PROM (EPC1441/EPC1) for non-volatile boot. The PQFP-208 package requires a 1.2 mm pitch PCB footprint with a 30.6 mm body and exposed lead fingers - allocate at least four PCB layers for clean power and ground return paths beneath the package.

This page synthesizes distributor stock, package-footprint drop-in variants, and design notes not found in the original datasheet.

Alternatif penggantian untuk EPF6024AQI208-2 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF6024AQI208-2 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Operating Temperature, Configuration Method, Device Type.

EPF6016QI208-3

Intel

Operating Temperature: 0 °C to 85 °C (commercial)