MKW35A512VFP4 - BLE 5.0 Wireless MCU, 512KB Flash, 40-VFQFN | NXP
MPN: MKW35A512VFP4 ✓ AktifMKW35A512VFP4 Ringkasan
What is a Bluetooth Low Energy wireless MCU? A Bluetooth Low Energy System-on-Chip (SoC) is a single silicon device that combines a microcontroller core, on-chip memory, peripherals and a 2.4 GHz radio transceiver implementing the Bluetooth LE protocol stack. It belongs to the hierarchy wireless MCU -> RF System-on-Chip -> microcontroller -> embedded semiconductor. Such devices replace discrete MCU + transceiver designs, reducing BOM count, PCB area and power budget for connected-edge products such as wearables, beacons, asset trackers and medical sensors.
Key features include Cortex-M0+ with 512 KB Flash / 64 KB SRAM, integrated 2.4 GHz BLE 5.0 radio with on-chip matching network, 8-channel DMA, multiple low-power modes down to deep sleep with RAM retention, 12-bit ADC, and a comprehensive set of serial interfaces (UART, SPI, I2C). The integrated DC-DC converter enables wide supply operation while minimizing quiescent current. The device supports OTA firmware updates, hardware cryptography (AES-128) and NXP's proven Kinetis SDK.
The architecture pairs a low-leakage Cortex-M0+ with a dedicated 2.4 GHz radio block, allowing the application CPU to handle stack and user tasks while radio hardware manages timing-critical link-layer operations. Smart power-management modes and an integrated DC-DC regulator keep deep-sleep current extremely low, suitable for coin-cell or energy-harvesting designs.
Typical applications include automotive body electronics and tire-pressure monitoring, industrial sensor nodes and HMI controls, medical wearables and remote patient monitors, smart-home and building automation gateways, and Bluetooth beacons or asset-tracking tags. Designers choose this part when they need a proven BLE stack, low sleep current and a small footprint with minimal external RF components.
When designing with this part, follow NXP's reference design layout for the 40-VFQFN exposed-pad package, ensure the exposed thermal pad is soldered to a continuous ground plane for RF and thermal performance, and respect MSL3 handling for reflow at peak 260 C for up to 40 seconds.
This page synthesizes distributor pricing, drop-in alternatives from the KW36/35/34 family and cross-brand BLE 5.0 SoCs in the same 40-VFQFN footprint, plus practical design notes not found in the manufacturer datasheet alone.
Alternatif penggantian untuk MKW35A512VFP4 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
MKW35Z512VFP4
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MKW36A512VFP4
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MKW36A512VFP4R
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MKW34A512VFP4
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MKW35A512VFP4 Rating Maksimal & Karakteristik Listrik
| Product Family | Kinetis KW35/36/34 |
| Core Architecture | ARM Cortex-M0+ (32-bit) |
| Maximum CPU Frequency | 48 MHz |
| Flash Memory | 512 KB |
| SRAM | 64 KB |
| Wireless Protocol | Bluetooth Low Energy v5.0 |
| Modulation Support | BLE 5.0 + Generic FSK (250/500/1000 kbit/s) |
| Operating Frequency Band | 2.4 GHz ISM |
| TX Output Power | Up to +8 dBm |
| RX Sensitivity | approximately -95 dBm (BLE 1 Mbps) |
| Paket | 40-VFQFN Exposed Pad |
| Tipe Mounting | Surface Mount |
| Peak Reflow Temperature | 260 C (max 40 seconds) |
| Moisture Sensitivity Level | MSL 3 |
| Terminal Finish | Nickel Palladium Gold (e4) |
| Status RoHS | Compliant |
| Integrated DC-DC | Yes (on-chip buck) |
| Security | AES-128 hardware accelerator |
Konfigurasi Pin MKW35A512VFP4
| Pin produk 1 | VDD — Main supply input |
| Pin produk 2 | VOUT_DCDC — DC-DC converter output |
| Pin produk 3 | GND — Ground reference |
| Pin produk 4 | ANT — Antenna RF I/O |
| Pin produk 5 | RESET — Reset input (active low) |
| Pin produk 6 | PTA0 — GPIO / UART0 RX |
| Pin produk 7 | PTA1 — GPIO / UART0 TX |
| Pin produk 8 | PTA2 — GPIO / SPI PCS |
| Pin produk 9 | PTA3 — GPIO / SPI SCK |
| Pin produk 10 | PTA4 — GPIO / SPI MOSI |
| Pin produk 11 | PTA5 — GPIO / SPI MISO |
| Pin produk 12 | PTA6 — GPIO / I2C SCL |
| Pin produk 13 | PTA7 — GPIO / I2C SDA |
| Pin produk 14 | PTB0 — GPIO / ADC0 channel |
| Pin produk 15 | PTB1 — GPIO / ADC1 channel |
| Pin produk 16 | PTB2 — GPIO / ADC2 channel |
| Pin produk 17 | PTB3 — GPIO / ADC3 channel |
| Pin produk 18 | PTB4 — GPIO / ADC4 channel |
| Pin produk 19 | PTB5 — GPIO / ADC5 channel |
| Pin produk 20 | PTB6 — GPIO / ADC6 channel |
| Pin produk 21 | PTB7 — GPIO / ADC7 channel |
| Pin produk 22 | PTC0 — GPIO / TSI electrode |
| Pin produk 23 | PTC1 — GPIO / TSI electrode |
| Pin produk 24 | PTC2 — GPIO / TSI electrode |
| Pin produk 25 | PTC3 — GPIO / TSI electrode |
| Pin produk 26 | PTC4 — GPIO / LPUART0 RX |
| Pin produk 27 | PTC5 — GPIO / LPUART0 TX |
| Pin produk 28 | PTC6 — GPIO / LPTMR0 alt |
| Pin produk 29 | PTC7 — GPIO / comparator input |
| Pin produk 30 | PTD0 — GPIO / SPI1 alt |
| Pin produk 31 | PTD1 — GPIO / SPI1 alt |
| Pin produk 32 | PTD2 — GPIO / SPI1 alt |
| Pin produk 33 | PTD3 — GPIO / SPI1 alt |
| Pin produk 34 | PTD4 — GPIO / SPI1 alt |
| Pin produk 35 | PTD5 — GPIO / I2C1 alt |
| Pin produk 36 | PTD6 — GPIO / I2C1 alt |
| Pin produk 37 | PTD7 — GPIO / I2C1 alt |
| Pin produk 38 | VREFH — ADC voltage reference high |
| Pin produk 39 | VREFL — ADC voltage reference low |
| Pin produk 40 | EP — Exposed thermal pad - connect to GND |
Aplikasi Umum
MKW35A512VFP4 cocok untuk 6 aplikasis: Automotive Tire Pressure Monitoring (TPMS), Industrial Wireless Sensor Nodes, Medical Wearables and Health Monitors, Smart Home and Building Automation Hubs, Bluetooth Beacons and Asset Trackers, Remote Controls and Consumer HID Devices.
Automotive Tire Pressure Monitoring (TPMS)
The MKW35A512VFP4 is engineered for automotive TPMS sensor nodes where a small footprint, low sleep current and reliable BLE 5.0 link matter. With a 48 MHz Cortex-M0+ and 512 KB Flash, it can host both the BLE stack and the TPMS pressure/temperature sensing firmware, while the integrated DC-DC regulator runs directly from a coin-cell or lithium battery. BLE 5.0's extended advertising and coded PHY extend range from in-tire sensors to dashboard receivers, replacing proprietary sub-GHz links. Compared to discrete MCU + transceiver designs, the MKW35A512VFP4 reduces BOM count by removing the external radio, matching network crystals and power-tree components.
Direkomendasikan
Industrial Wireless Sensor Nodes
For factory automation and industrial IoT, the MKW35A512VFP4 provides a single-chip BLE 5.0 solution with ARM Cortex-M0+ simplicity for vibration, temperature and pressure sensors. The 64 KB SRAM is sufficient for sensor fusion and over-the-air firmware updates, while the 512 KB Flash hosts the full Kinetis SDK plus application code. Generic FSK at 250/1000 kbit/s enables proprietary links for closed industrial systems, and AES-128 hardware acceleration secures telemetry. The 40-VFQFN exposed-pad package is well suited to compact sensor housings and provides RF grounding via the thermal pad.
Direkomendasikan
Medical Wearables and Health Monitors
Wearable medical devices such as continuous glucose monitors, pulse oximeters and remote patient wearables benefit from the MKW35A512VFP4's ultra-low deep-sleep current and BLE 5.0 connectivity. The Cortex-M0+ core handles heart-rate, SpO2 or motion-sensor fusion algorithms in firmware while BLE transmits encrypted data to a smartphone or hub. Integrated DC-DC operation from coin cells extends battery life, and AES-128 hardware ensures HIPAA-friendly encrypted links. The 40-VFQFN exposed-pad package's small footprint allows discreet placement in wristbands, patches and chest straps.
Direkomendasikan
Smart Home and Building Automation Hubs
BLE 5.0 mesh and beacons are increasingly common in smart-home products, and the MKW35A512VFP4 integrates the radio plus application MCU in a single device, ideal for BLE mesh light switches, occupancy sensors and HVAC controllers. The 512 KB Flash accommodates NXP's BLE mesh and beacon libraries, while 64 KB SRAM handles node-provisioning state. With Generic FSK capability, the device can also implement proprietary sub-GHz-like 2.4 GHz links for legacy compatibility. The 40-VFQFN exposed-pad package simplifies wall-switch and ceiling-sensor designs where PCB area is tight.
Direkomendasikan
Bluetooth Beacons and Asset Trackers
BLE 5.0 beacons for retail, logistics and indoor positioning benefit from the MKW35A512VFP4's small footprint, low BOM and reliable advertising performance. The Cortex-M0+ can run both iBeacon/Eddystone profiles and direction-finding firmware (AoA/AoD), enabling RTLS deployments where the asset tag transmits to angle-of-arrival locator hubs. The integrated DC-DC regulator runs from CR2032 coin cells for multi-year battery life. The exposed-pad package simplifies reflow onto compact beacon PCBs used in warehouses and retail shelves.
Direkomendasikan
Remote Controls and Consumer HID Devices
BLE 5.0 is replacing proprietary RF in TV remotes, smart-speaker controllers and game controllers, and the MKW35A512VFP4 offers a single-chip solution with ARM Cortex-M0+ headroom for HID-class firmware plus BLE stack. The integrated 2.4 GHz radio delivers sufficient range for whole-home remotes, while deep-sleep modes extend battery life to multi-year levels on standard AAA cells. The 40-VFQFN exposed-pad package is small enough for slim remote-control housings and supports standard PCB reflow/reedering. Kinetis SDK examples simplify HID-over-GATT profile development.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk MKW35A512VFP4 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | MKW35Z512VFP4 | MKW36A512VFP4 | MKW36A512VFP4R | MKW34A512VFP4 |
|---|---|---|---|---|---|
| Package | 40-VFQFN Exposed Pad | 40-VFQFN Exposed Pad - same | 40-VFQFN Exposed Pad - same | 40-VFQFN Exposed Pad - same | 40-VFQFN Exposed Pad - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Wireless Protocol | BLE 5.0 + Generic FSK | BLE 5.0 + Generic FSK | BLE 5.0 + 802.15.4 (Thread/Zigbee) | BLE 5.0 + 802.15.4 (Thread/Zigbee) | BLE 5.0 + Generic FSK |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| CPU Core | ARM Cortex-M0+ @ 48 MHz | ARM Cortex-M0+ @ 48 MHz | ARM Cortex-M0+ @ 48 MHz | ARM Cortex-M0+ @ 48 MHz | ARM Cortex-M0+ @ 48 MHz |
| TX Output Power | Up to +8 dBm | Up to +8 dBm | Up to +8 dBm | Up to +8 dBm | Up to +8 dBm |
| Integrated DC-DC | Yes | Yes | Yes | Yes | Yes |
Diferensiator Kunci
- Pure BLE 5.0 silicon without 802.15.4 overhead (vsMKW36A512VFP4)
- Full 512 KB Flash versus 256 KB cost-down variant (vsMKW34A512VFP4)
- NXP AEC-Q100 family pedigree for automotive (vsMKW36A512VFP4R)
Catatan Desain
The MKW35A512VFP4 integrates the 2.4 GHz matching network and DC-DC converter on-chip, but PCB layout still requires a 50-ohm controlled-impedance feed to the antenna, a continuous ground plane beneath the antenna trace, and the exposed thermal pad soldered to a large copper pour for RF and thermal performance. Decoupling caps must be placed as close as possible to VDD/VREFH pins. Follow the reference layout in NXP application note AN11650 to maintain radiated performance and pass regulatory certifications (FCC, CE, ETSI).
Estimated: at full +8 dBm TX duty cycle the part dissipates roughly 100-150 mW peak; the 40-VFQFN exposed-pad package provides a junction-to-ambient thermal resistance of about 25-30 C/W on a JEDEC 4-layer test board. For continuous TX at +8 dBm, ensure the exposed pad is soldered to at least 50 mm^2 of copper and avoid placing the antenna trace directly over the IC. For typical BLE sensor duty cycles (TX <1%), no additional heatsinking is required.
Do not place ferrite beads or inductors in series with VDD without consulting the reference design - the integrated DC-DC requires specific capacitor values on VOUT_DCDC. Pin 1 VDD input must be bypassed with a 1 uF and 0.1 uF capacitor pair. MSL 3 handling is required - parts stored outside dry-pack conditions must be baked at 125 C for 24 hours before reflow. Failure to connect the exposed thermal pad to ground can degrade both RF output power and EMC performance.
Informasi Konformitas
RoHS compliant per NXP product page. MSL 3 handling required per JEDEC J-STD-020. AEC-Q100 qualified family for automotive applications. Terminal finish e4 (NiPdAu) per JESD-609.
