PIC32MX150F256HT-V/MR - 32-bit MCU, 256KB Flash, 64-QFN | Microchip
MPN: PIC32MX150F256HT-V/MR ✓ AktifPIC32MX150F256HT-V/MR Ringkasan
A PIC32MX microcontroller is a 32-bit MIPS-based MCU from Microchip designed for cost-sensitive embedded designs that need more horsepower and peripherals than 8-bit PIC16/PIC18 devices while staying inside Microchip's MPLAB X ecosystem. Positioned in the taxonomy as: 32-bit microcontroller -> MIPS32 M4K core -> PIC32MX family -> general-purpose MCU -> embedded controller, the PIC32MX150F256H variant is the memory-rich 256 KB Flash option used for applications with larger firmware footprints, USB device/host stacks, or graphical user interfaces.
Key features of this V/MR variant include the PPS mapping engine, a Parallel Master Port (PMP) with dual buffers for graphics or external memory, a 10-bit 1 Msps ADC, USB 2.0 full-speed device/host/OTG, two I2C modules, and five 16-bit timers. The 64-QFN package (9x9 mm with exposed pad) saves board space and provides a low thermal resistance path via the e-pad. CTMU (Charge Time Measurement Unit) is included for capacitive touch and precise time-of-flight measurements.
The architecture combines a Harvard-style 5-stage pipeline M4K core, single-cycle 32x32 hardware multiply, and a tightly-coupled prefetch module that boosts Flash throughput at 50 MHz. The wide peripheral set combined with PPS means designers can route UART, SPI, I2S, and PWM to almost any digital I/O, simplifying PCB routing.
Typical applications for the PIC32MX150F256HT-V/MR include industrial control HMIs, USB peripherals and human-interface devices, low-cost audio playback with I2S DACs, sensor hubs, motor control, and battery-powered consumer devices where the -40C to +105C grade is required. Designers should always solder the exposed pad to a continuous ground pour for thermal dissipation and signal integrity, and follow Microchip's datasheet bypass-capacitor guidance (100 nF + 10 uF close to VDDCORE pins).
Alternatif penggantian untuk PIC32MX150F256HT-V/MR — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian PIC32MX150F256HT-V/MR (sama faktor bentuk dan footprint) — berbeda di dalam ADC, Package, Parallel Master Port (PMP), Core Architecture, Operating Temperature.
PIC32MX150F256H-I/MR
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MX150F256HT-50I/MR
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
PIC32MX150F256H-50I/MR
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MX130F128H-V/MR
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MX250F256B-I/MR
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
PIC32MX150F256HT-V/MR Rating Maksimal & Karakteristik Listrik
| Core | MIPS32 M4K (32-bit) |
| Maximum CPU Speed | 50 MHz / 83 DMIPS |
| Program Flash | 256 KB |
| SRAM | 32 KB |
| Jumlah Pin | 64 |
| Paket | QFN-64 (9x9 mm) with exposed pad |
| Operating Voltage | 2.3 V to 3.6 V |
| Suhu Kerja | -40 C to +105 C (V grade) |
| ADC | 10-bit, 1 Msps |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| SPI Modules | 4 |
| I2C Modules | 2 |
| I2S Modules | 2 |
| Timers (16-bit) | 5 |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes, dual buffers |
| CTMU (Charge Time Measurement Unit) | Yes |
| Tipe Mounting | Surface Mount |
| RoHS | Compliant |
| Lead-Free | Yes |
Konfigurasi Pin PIC32MX150F256HT-V/MR
| Pin produk 1 | RB9 — General-purpose I/O / PPS-mappable |
| Pin produk 2 | RB10 — General-purpose I/O / PPS-mappable |
| Pin produk 3 | RB11 — General-purpose I/O / PPS-mappable |
| Pin produk 4 | RB12 — General-purpose I/O / PPS-mappable |
| Pin produk 5 | RB13 — General-purpose I/O / PPS-mappable |
| Pin produk 6 | RB14 — General-purpose I/O / PPS-mappable |
| Pin produk 7 | RB15 — General-purpose I/O / PPS-mappable |
| Pin produk 8 | VSS — Digital ground |
| Pin produk 9 | VDD — Digital supply (2.3-3.6 V) |
| Pin produk 10 | RA0 — Analog/digital I/O |
| Pin produk 11 | RA1 — Analog/digital I/O |
| Pin produk 12 | RA2 — Analog/digital I/O |
| Pin produk 13 | RA3 — Analog/digital I/O |
| Pin produk 14 | RA4 — Analog/digital I/O |
| Pin produk 15 | RA5 — Analog/digital I/O |
| Pin produk 16 | RA6 — Analog/digital I/O |
| Pin produk 17 | RA7 — Analog/digital I/O |
| Pin produk 18 | AVDD — Analog supply (2.3-3.6 V) |
| Pin produk 19 | AVSS — Analog ground |
| Pin produk 20 | RC0 — General-purpose I/O / PPS-mappable |
| Pin produk 21 | RC1 — General-purpose I/O / PPS-mappable |
| Pin produk 22 | RC2 — General-purpose I/O / PPS-mappable |
| Pin produk 23 | RC3 — General-purpose I/O / PPS-mappable |
| Pin produk 24 | RC4 — General-purpose I/O / PPS-mappable |
| Pin produk 25 | RC5 — General-purpose I/O / PPS-mappable |
| Pin produk 26 | RC6 — General-purpose I/O / PPS-mappable |
| Pin produk 27 | RC7 — General-purpose I/O / PPS-mappable |
| Pin produk 28 | RC8 — General-purpose I/O / PPS-mappable |
| Pin produk 29 | RC9 — General-purpose I/O / PPS-mappable |
| Pin produk 30 | VDD — Digital supply (2.3-3.6 V) |
| Pin produk 31 | VSS — Digital ground |
| Pin produk 32 | RD0 — General-purpose I/O / PMP |
| Pin produk 33 | RD1 — General-purpose I/O / PMP |
| Pin produk 34 | RD2 — General-purpose I/O / PMP |
| Pin produk 35 | RD3 — General-purpose I/O / PMP |
| Pin produk 36 | RD4 — General-purpose I/O / PMP |
| Pin produk 37 | RD5 — General-purpose I/O / PMP |
| Pin produk 38 | RD6 — General-purpose I/O / PMP |
| Pin produk 39 | RD7 — General-purpose I/O / PMP |
| Pin produk 40 | RE0 — General-purpose I/O / PMP |
| Pin produk 41 | RE1 — General-purpose I/O / PMP |
| Pin produk 42 | RE2 — General-purpose I/O / PMP |
| Pin produk 43 | RE3 — General-purpose I/O / PMP |
| Pin produk 44 | RE4 — General-purpose I/O / PMP |
| Pin produk 45 | RE5 — General-purpose I/O / PMP |
| Pin produk 46 | RE6 — General-purpose I/O / PMP |
| Pin produk 47 | RE7 — General-purpose I/O / PMP |
| Pin produk 48 | RF0 — General-purpose I/O |
| Pin produk 49 | RF1 — General-purpose I/O |
| Pin produk 50 | RF2 — General-purpose I/O / USB |
| Pin produk 51 | RF3 — General-purpose I/O / USB D- |
| Pin produk 52 | RF4 — General-purpose I/O / USB D+ |
| Pin produk 53 | RF5 — General-purpose I/O |
| Pin produk 54 | RF6 — General-purpose I/O |
| Pin produk 55 | RF7 — General-purpose I/O |
| Pin produk 56 | RG0 — General-purpose I/O |
| Pin produk 57 | RG1 — General-purpose I/O |
| Pin produk 58 | RG2 — General-purpose I/O |
| Pin produk 59 | RG3 — General-purpose I/O |
| Pin produk 60 | VDD — Digital supply (2.3-3.6 V) |
| Pin produk 61 | VSS — Digital ground |
| Pin produk 62 | OSC1 — Crystal oscillator input |
| Pin produk 63 | OSC2 — Crystal oscillator output |
| Pin produk 64 | MCLR — Master clear (reset), active-low |
Aplikasi Umum
PIC32MX150F256HT-V/MR cocok untuk 6 aplikasis: Industrial HMI with USB and Graphics, USB Audio Device (I2S DAC + USB Input), Sensor Hub and Data Logger, Capacitive Touch Interface, Low-Cost BLDC Motor Controller, Battery-Powered Portable Device.
Industrial HMI with USB and Graphics
The PIC32MX150F256HT-V/MR is well suited for industrial human-machine interface (HMI) panels combining USB configuration and small graphical displays. Its 256 KB Flash comfortably stores USB stacks and lightweight graphical drivers, while the Parallel Master Port (PMP) interfaces directly to TFT LCD controllers. The -40 C to +105 C V grade tolerates factory-floor enclosures, and PPS remapping simplifies PCB layout when routing to a TFT, USB connector, and keypad matrix simultaneously.
Direkomendasikan
USB Audio Device (I2S DAC + USB Input)
USB audio peripherals such as USB-to-I2S DACs and USB headphones benefit from the PIC32MX150F256HT-V/MR's integrated USB 2.0 Full-Speed transceiver plus two I2S modules. The 32 KB RAM is sufficient for small audio buffering, while 256 KB Flash holds the USB Audio class firmware. PPS allows the I2S bit-clock and word-select lines to be routed to convenient pins, and the MIPS M4K core at 50 MHz keeps up with 48 kHz/16-bit stereo with low overhead.
Direkomendasikan
Sensor Hub and Data Logger
The PIC32MX150F256HT-V/MR's 10-bit 1 Msps ADC, CTMU, and multiple UART/I2C/SPI interfaces make it a practical sensor hub aggregating analog and digital sensor data. 256 KB Flash allows on-device calibration tables and logging protocols (Modbus, CAN-friendly layer), and the wide temperature V grade supports outdoor sensor installations. PPS remapping helps when routing many UARTs to a single connector for stacked daughterboards.
Direkomendasikan
Capacitive Touch Interface
The integrated CTMU combined with the PPS-mappable I/O and 50 MHz MIPS M4K core supports robust capacitive-touch button sliders and wheels on the PIC32MX150F256HT-V/MR. Designers can implement self-capacitance or mutual-capacitance scanning firmware in 256 KB Flash without external touch controllers. The V temperature grade suits appliance, white-good, and outdoor control panels that demand reliable touch under varying humidity and temperature.
Direkomendasikan
Low-Cost BLDC Motor Controller
PWM, QEI, and ADC resources of the PIC32MX150F256HT-V/MR can drive small brushless DC (BLDC) and stepper motors in appliance and robotics applications. The MIPS M4K core runs vector-control or six-step commutation algorithms with enough headroom for 256 KB of state machines and protective firmware. V-grade temperature tolerance suits motor compartments where ambient can reach +90 C.
Direkomendasikan
Battery-Powered Portable Device
Battery-powered designs leverage the PIC32MX150F256HT-V/MR's low-power sleep modes, USB charging input, and flexible I/O mapping via PPS. The 32 KB SRAM allows modest data buffering while USB device mode handles charging and data transfer to a host PC. The V temperature grade supports outdoor consumer electronics like rugged GPS handhelds and industrial scanners where reliable operation from -40 C to +105 C is required.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk PIC32MX150F256HT-V/MR — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | PIC32MX150F256H-I/MR | PIC32MX150F256HT-50I/MR | PIC32MX150F256H-50I/MR | PIC32MX130F128H-V/MR | PIC32MX250F256B-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-64 (9x9 mm) | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 16 KB | 32 KB |
| Maximum CPU Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Operating Temperature | -40 C to +105 C (V) | -40 C to +85 C (I) | -40 C to +85 C (I) | -40 C to +85 C (I) | -40 C to +105 C (V) | -40 C to +85 C (I) |
| USB | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) |
| PPS | Yes | Yes | Yes | Yes | Yes | Yes |
Diferensiator Kunci
- Wider -40 C to +105 C operating temperature range (vsPIC32MX150F256H-I/MR)
- Same QFN-64 footprint as lower-memory variants (vsPIC32MX130F128H-V/MR)
- Mature MIPS32 M4K core with broad Microchip toolchain (vsPIC32MX250F256B-I/MR)
Catatan Desain
The QFN-64 (9x9 mm) exposed pad is the primary heat-dissipation path. Solder the e-pad to a continuous ground copper pour of at least 1 square inch with thermal vias (typically 4-9 vias in a 3x3 grid) to keep junction temperature within the -40 C to +105 C operating envelope. Without proper e-pad soldering, expect a theta_JA increase of 30-50% and derated performance in enclosed housings.
Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD/VSS pair (typically 4 VDD pins on this package). Add a bulk 10 uF ceramic on the AVDD/AVSS analog pair to reduce ADC sampling noise. USB designs also require a 10 uF bulk on VBUS for hot-plug events. The PIC32MX150F256HT-V/MR requires a stable 2.3-3.6 V supply; ripple above 50 mVpp can corrupt Flash programming.
Route USB D+/D- (RF3/RF4) as a 90 ohm differential pair with matched length within 2 mm. Keep clock traces short and away from analog inputs to reduce ADC crosstalk. When using PPS, configure PPS groups before enabling peripherals and lock pins when possible to avoid accidental remapping. The PMP data lines (RDx/REx) should be length-matched if used for TFT or external memory interfaces.
Do not confuse the 'T' suffix in PIC32MX150F256HT-V/MR with TQFP package - the trailing T indicates Tape & Reel packaging, while the /MR suffix confirms the 64-QFN package. Always verify the package code from the orderable part number. Designers switching from PIC32MX150F256H-I/MR to the V/MR variant must re-verify thermal design margins since the V grade upper limit is +105 C vs +85 C.
Informasi Konformitas
RoHS and lead-free compliant per Microchip product page. AEC-Q100 not applicable - this is an industrial-grade part, not automotive qualified. For automotive applications use PIC32MX family AEC-Q100 variants if available.
