PIC32MX575F256LT-80V/BG - 256KB Flash 32-bit MCU | Microchip
MPN: PIC32MX575F256LT-80V/BG ✓ AktifPIC32MX575F256LT-80V/BG Ringkasan
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash for program code and SRAM for data), and a rich set of peripherals such as timers, communication interfaces, and analog blocks. The PIC32 family sits within the broader taxonomy: microcontroller -> embedded processor -> semiconductor -> integrated circuit. Within Microchip's portfolio, PIC32MX5xx devices target mainstream 32-bit embedded designs that exceed 8-bit PIC16/PIC18 capability without the cost of higher-tier PIC32MZ parts.
Key features of this device include 83 general-purpose I/O lines, multiple DMA channels for peripheral-to-memory transfers without CPU intervention, PWM outputs for motor and power control, and a 10-bit ADC with 1 Msps sampling. It also provides two I2C, two SPI, and two UART interfaces for flexible peripheral connectivity.
Technically, the MIPS32 M4K core delivers 1.56 DMIPS/MHz and supports the MIPS16e instruction set for code density. The 5-stage pipeline and hardware multiply/divide unit accelerate DSP-style operations. The 80 MHz operation yields 105 DMIPS, while the USB-OTG and CAN peripherals are critical for industrial networking and consumer device bridging.
Typical applications include USB peripherals, CAN-connected industrial nodes, graphical user interfaces with external LCD controllers, motor control loops, and consumer audio devices. Designers select this part when balancing Flash size, peripheral set, and cost. The TFBGA package supports compact PCB layouts but requires careful routing due to the 0.8 mm pitch.
When designing, ensure proper decoupling near each VDD/VSS pair, and verify the 80 MHz timing closure with the chosen compiler optimization. The -80V suffix indicates the 80 MHz speed grade and 'V' temperature range; the 'BG' suffix indicates the 121-pin TFBGA package and tape-and-tray packaging.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on standalone datasheet or distributor pages.
Alternatif penggantian untuk PIC32MX575F256LT-80V/BG — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian PIC32MX575F256LT-80V/BG (sama faktor bentuk dan footprint) — berbeda di dalam ADC, Package, CAN, Core Architecture, DMA Channels.
PIC32MX575F256L-80V/BG
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MX575F256L-80I/BG
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MX564F128L-V/BG
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MX360F512L-80V/BG
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MX570F512L-I/BG
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
PIC32MX575F256LT-80V/BG Rating Maksimal & Karakteristik Listrik
| Core | MIPS32 M4K |
| Core Architecture | 32-bit RISC |
| Maximum CPU Frequency | 80 MHz |
| Performance | 105 DMIPS (1.56 DMIPS/MHz) |
| Program Memory (Flash) | 256 KB |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage | 2.5 V to 3.6 V |
| I/O Pins | 83 |
| ADC | 10-bit, 16 channels, 1 Msps |
| USB | USB 2.0 Full-Speed OTG |
| CAN | 1 module |
| UART | 2 |
| SPI | 2 |
| I2C | 2 |
| DMA Channels | 4 |
| PWM Channels | 5 |
| Timers | 5 16-bit |
| Paket | 121-TFBGA (10x10 mm) |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | -40C to +105C (V grade) |
| Status RoHS | Compliant |
Konfigurasi Pin PIC32MX575F256LT-80V/BG
| Pin produk A1 | VSS — Ground reference |
| Pin produk A2 | PMD0 — Parallel Master Port data 0 |
| Pin produk A3 | PMD1 — Parallel Master Port data 1 |
| Pin produk A4 | PMD2 — Parallel Master Port data 2 |
| Pin produk A5 | PMD3 — Parallel Master Port data 3 |
| Pin produk A6 | PMD4 — Parallel Master Port data 4 |
| Pin produk A7 | PMD5 — Parallel Master Port data 5 |
| Pin produk A8 | PMD6 — Parallel Master Port data 6 |
| Pin produk A9 | PMD7 — Parallel Master Port data 7 |
| Pin produk A10 | VDD — Digital supply voltage (2.5V-3.6V) |
| Pin produk B1 | VSS — Ground reference |
| Pin produk B2 | PMD8 — Parallel Master Port data 8 |
| Pin produk B3 | PMD9 — Parallel Master Port data 9 |
| Pin produk B4 | PMD10 — Parallel Master Port data 10 |
| Pin produk B5 | PMD11 — Parallel Master Port data 11 |
| Pin produk B6 | PMD12 — Parallel Master Port data 12 |
| Pin produk B7 | PMD13 — Parallel Master Port data 13 |
| Pin produk B8 | PMD14 — Parallel Master Port data 14 |
| Pin produk B9 | PMD15 — Parallel Master Port data 15 |
| Pin produk B10 | VDD — Digital supply voltage |
Aplikasi Umum
PIC32MX575F256LT-80V/BG cocok untuk 6 aplikasis: USB Human Interface Device (HID), CAN Bus Industrial Nodes, Graphical User Interface Controller, Motor Control and PWM Drives, Portable Data Acquisition, Consumer Audio Devices.
USB Human Interface Device (HID)
The PIC32MX575F256LT-80V/BG's integrated USB 2.0 Full-Speed OTG controller makes it ideal for USB HID peripherals such as keyboards, mice, game controllers, and custom input devices. The 80 MHz MIPS32 M4K core delivers 105 DMIPS, sufficient for HID class drivers plus application logic. With 256 KB Flash, the part accommodates USB stacks (Microchip's MLA library) alongside user firmware, and 64 KB SRAM buffers HID reports comfortably. The 16-channel 10-bit ADC supports analog inputs like joystick axes or potentiometers.
Direkomendasikan
CAN Bus Industrial Nodes
The integrated CAN 2.0B controller positions the PIC32MX575F256LT-80V/BG for CAN-connected industrial nodes including factory sensors, motor controllers, and building automation endpoints. With -40C to +105C industrial temperature range and 83 GPIO, the part drives multiple sensor channels and CAN transceivers. The DMA controller offloads CAN message buffering from the CPU, freeing 105 DMIPS for application logic. The 256 KB Flash accommodates CANopen or DeviceNet protocol stacks with room for application code.
Direkomendasikan
Graphical User Interface Controller
With 256 KB Flash, 64 KB SRAM, and five PWM channels, the PIC32MX575F256LT-80V/BG can drive external LCD controllers for graphical user interfaces in appliances, instrumentation, and HMI panels. The parallel PMP (Parallel Master Port) interface connects to TFT displays at up to 80 MHz system clock. The DMA channels transfer framebuffer data without CPU intervention, leaving MIPS for touch processing and menu logic. The 10-bit ADC reads touch-screen resistive layers directly.
Direkomendasikan
Motor Control and PWM Drives
The five PWM channels, quadrature encoder interface, and 80 MHz computational throughput make the PIC32MX575F256LT-80V/BG well suited for brushed DC and stepper motor control. The 10-bit ADC samples motor current at 1 Msps for closed-loop control, and DMA moves conversion data without CPU intervention. Sensorless and sensored BLDC algorithms run comfortably at 105 DMIPS. Industrial temperature rating and 83 GPIO support multi-axis systems with limit switches and fault inputs.
Direkomendasikan
Portable Data Acquisition
The PIC32MX575F256LT-80V/BG's 16-channel 10-bit ADC, 256 KB Flash for logging firmware, and 64 KB SRAM for sample buffering suit portable data loggers and instrumentation. DMA-driven ADC sampling at 1 Msps captures multi-channel waveforms without CPU load. USB OTG enables direct file transfer to PCs or USB sticks. Operating voltage down to 2.5V supports battery-powered designs. The compact 121-pin TFBGA (10x10 mm) package minimizes PCB footprint for handheld instruments.
Direkomendasikan
Consumer Audio Devices
The PIC32MX575F256LT-80V/BG integrates I2S support through peripheral libraries, USB OTG for audio streaming, and 256 KB Flash for codec firmware, making it suitable for USB speakers, headphone amps, and consumer audio peripherals. The two I2C buses control audio DACs and amplifiers, while the two SPI buses drive external Flash for sample storage. Five 16-bit timers generate accurate audio clock domains. The DMA channels move audio samples with low CPU overhead, leaving MIPS for DSP effects.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk PIC32MX575F256LT-80V/BG — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | PIC32MX575F256L-80V/BG | PIC32MX575F256L-80I/BG | PIC32MX564F128L-V/BG | PIC32MX360F512L-80V/BG | PIC32MX570F512L-I/BG |
|---|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB | 512 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 32 KB | 128 KB | 64 KB |
| Maximum Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed (no OTG) | USB 2.0 Full-Speed OTG |
| CAN | 1 module | 1 module | 1 module | 1 module | None | 1 module |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +85C | -40C to +105C | -40C to +105C | -40C to +85C |
| GPIO | 83 | 83 | 83 | 83 | 85 | 83 |
Diferensiator Kunci
- USB 2.0 Full-Speed OTG integrated without external PHY (vsPIC32MX360F512L-80V/BG)
- 256 KB Flash with USB OTG and CAN in single chip (vsPIC32MX564F128L-V/BG)
- Industrial +105C temperature range in compact TFBGA (vsPIC32MX575F256L-80I/BG)
Catatan Desain
Place a 10 uF bulk capacitor and a 0.1 uF decoupling capacitor within 5 mm of each VDD/VSS pair on the PIC32MX575F256LT-80V/BG. The 121-pin TFBGA package distributes VDD/VSS across all four edges; missing decoupling causes erratic operation at 80 MHz. AVDD (analog supply) requires a ferrite bead or 10 ohm resistor from VDD plus its own 0.1 uF + 10 uF capacitor network for low ADC noise.
The 121-pin TFBGA (0.8 mm pitch) requires 4-layer PCB with microvia-in-pad for reliable assembly. Escape routing between balls needs 0.4 mm trace width with 0.4 mm spacing. The 10x10 mm package fits a 50 mm x 50 mm 4-layer PCB with all peripherals. Use laser-drilled vias or filled-and-capped vias on BGA pads to reduce solder voiding and improve thermal dissipation.
Do not enable the JTAG pins as GPIO unless JTAG debugging is disabled in configuration bits - leaving JTAG enabled consumes 5 mA additional current and blocks the pins. Configure the oscillator mode (FRC, POSC, SOSC) in configuration bits before code execution. The USB D+/D- lines require 15 kohm pull-downs on the device side per USB spec; missing pull-downs cause enumeration failures.
At 80 MHz full activity, the PIC32MX575F256LT-80V/BG consumes approximately 70 mA (3.3V x 70 mA = 230 mW). The TFBGA package has theta_JA around 30 C/W, giving a 7C temperature increase above ambient at room temperature. No heatsink is required for typical applications, but industrial enclosures above 70C ambient should include thermal vias under the center balls for additional dissipation.
Informasi Konformitas
RoHS compliant per Microchip product page. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020. AEC-Q100 not applicable - choose AEC-Q100-qualified parts for automotive designs.
