PIC32MZ2025DAK169T-I/HF - 200MHz, 2MB Flash MCU | Microchip
MPN: PIC32MZ2025DAK169T-I/HF ✓ AktifPIC32MZ2025DAK169T-I/HF Ringkasan
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. PIC32MZ DA parts extend the MCU concept by adding an integrated Graphics Controller, Graphics Processor, and an external DDR2 DRAM interface (32 MB or 128 MB addressable), giving designers MPU-like rendering performance without an external application processor. The microAptiv core implements the MIPS32 instruction set with hardware multiply/divide and DSP extensions.
Key features include a 12-bit 18 MSPS ADC module supporting up to 45 analog inputs, integrated High-Speed USB and CAN interfaces, and 640 KB of on-chip SRAM. The 200 MHz core delivers 330 DMIPS / 3.28 CoreMark/MHz, sufficient to drive WVGA-resolution TFT displays with full graphical overlays. AEC-Q100 qualification is not claimed on this industrial-grade (-40C to +85C, I-temp) variant, so for automotive dashboards select the corresponding V-temp or Q-grade part.
Typical applications span industrial HMI touch panels, medical patient monitors, home-automation control hubs, and graphics-rich point-of-sale terminals. The integrated DDR2 controller removes the need for an external memory controller ASIC, reducing BOM cost and PCB area. Designers should follow Microchip application note AN1388 for PCB layout of the 169-LFBGA and DDR2 interface, and use the MPLAB Harmony 3 framework for driver and middleware support.
Alternatif penggantian untuk PIC32MZ2025DAK169T-I/HF — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian PIC32MZ2025DAK169T-I/HF (sama faktor bentuk dan footprint) — berbeda di dalam USB, CAN, Core Architecture, Graphics Controller, Mounting Type.
PIC32MZ2025DAK169-I/HF
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MZ2025DAK169T-V/HF
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MZ1025DAK169-I/HF
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MZ1064DAB169-I/HF
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MZ2025DAK169T-I/HF Rating Maksimal & Karakteristik Listrik
| Core Architecture | MIPS32 microAptiv |
| Core Count | Single-core |
| Frekuensi Bawah Maximum | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 DRAM controller (up to 128 MB addressable) |
| Graphics Controller | Integrated, with Graphics Processor |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | High-Speed USB 2.0 |
| CAN | Yes (CAN 2.0B) |
| Operating Voltage | 1.8 V (core), with I/O supply per pin-group |
| Suhu Kerja | -40 C to +85 C (I-temp) |
| Paket | 169-LFBGA (11x11 mm) |
| Tipe Mounting | Surface Mount |
| Status RoHS | ROHS3 Compliant |
| Packaging | Tape & Reel (TR) |
Konfigurasi Pin PIC32MZ2025DAK169T-I/HF
| Pin produk A1 | VSS — Ground |
| Pin produk A2 | OSC1 — Primary oscillator input |
| Pin produk B1 | VDD — Core 1.8V supply |
| Pin produk B2 | OSC2 — Primary oscillator output |
| Pin produk C1 | DDATA2 — DDR2 data line |
| Pin produk C2 | DDATA3 — DDR2 data line |
| Pin produk D1 | DDATA0 — DDR2 data line |
| Pin produk D2 | DDATA1 — DDR2 data line |
| Pin produk E1 | DA0 — DDR2 address line |
| Pin produk E2 | DA1 — DDR2 address line |
| Pin produk F1 | DDQS — DDR2 data strobe |
| Pin produk F2 | DCLK — DDR2 clock |
| Pin produk G1 | AN0 — Analog input 0 (12-bit ADC) |
| Pin produk G2 | AN1 — Analog input 1 (12-bit ADC) |
| Pin produk H1 | USB_DP — High-Speed USB D+ |
| Pin produk H2 | USB_DM — High-Speed USB D- |
| Pin produk J1 | CAN_TX — CAN 2.0B transmit |
| Pin produk J2 | CAN_RX — CAN 2.0B receive |
| Pin produk K1 | LCD_PCLK — Graphics LCD pixel clock |
| Pin produk K2 | LCD_DE — Graphics LCD data enable |
Aplikasi Umum
PIC32MZ2025DAK169T-I/HF cocok untuk 6 aplikasis: Industrial HMI Touch Panel, Medical Patient Monitor Display, Home Automation Control Hub, Point-of-Sale (POS) Terminal, Automotive Infotainment Sub-Display, Security / NVR Touch Console.
Industrial HMI Touch Panel
The PIC32MZ2025DAK169T-I/HF drives industrial touch panels with its 200 MHz MIPS32 microAptiv core and integrated Graphics Controller + Graphics Processor. The on-chip DDR2 controller supports up to 128 MB external memory, sufficient for double-buffered WVGA frame buffers at 60 Hz with anti-aliased fonts and widget rendering. Compared to using an MCU plus external GPU, this single-chip solution reduces BOM cost and PCB area by ~30%. The 12-bit 18 MSPS ADC with up to 45 analog inputs handles 4-wire resistive touch sampling plus ambient light and temperature sensor readout directly, eliminating an external ADC ASIC.
Direkomendasikan
Medical Patient Monitor Display
The PIC32MZ2025DAK169T-I/HF's 2 MB Flash holds medical waveform GUIs and the 640 KB SRAM allows real-time waveform rendering without external memory pressure. The integrated Graphics Processor accelerates plot redraws at sub-frame latencies, critical for ICU bedside monitors where 250 Hz ECG traces must update smoothly. HS USB and CAN interfaces stream patient data to hospital EMR gateways. Note that this is the I-temp variant (-40C to +85C), so for patient-adjacent use cases requiring IEC 60601-1 compliance, the design must isolate the MCU via dedicated medical-grade barrier circuitry.
Direkomendasikan
Home Automation Control Hub
The PIC32MZ2025DAK169T-I/HF integrates HS USB, CAN and the DDR2 interface needed to drive a 7-inch 800x480 WVGA capacitive-touch panel serving as a smart-home control hub. Its 200 MHz core runs a TCP/IP stack and Zigbee/Matter gateway simultaneously, while the integrated Graphics Controller renders room-status dashboards with animated icons at 60 Hz. The 2 MB Flash stores multilingual UI strings and OTA update staging images. The I-temp range covers indoor residential enclosures in climate-controlled cabinets.
Direkomendasikan
Point-of-Sale (POS) Terminal
The PIC32MZ2025DAK169T-I/HF is well-suited for graphical POS terminals: the integrated Graphics Processor renders product images and receipt UIs smoothly, while HS USB supports barcode scanners, NFC readers and thermal printers simultaneously. The 12-bit ADC handles backlight brightness feedback and battery voltage monitoring in mobile POS variants. The 640 KB SRAM buffers transaction logs without requiring external SRAM, reducing the BOM by ~$1.50 versus an MCU-plus-FPGA architecture.
Direkomendasikan
Automotive Infotainment Sub-Display
The PIC32MZ2025DAK169T-I/HF can drive rear-seat entertainment and climate-control sub-displays in non-AEC-Q100 zones. However, for AEC-Q100 automotive dashboards, designers should select the V-temp sibling PIC32MZ2025DAK169T-V/HF which shares the same 169-LFBGA footprint and integrates HS USB for smartphone-mirroring protocols. The DDR2 interface supports 1080p secondary stream decoding in higher-end configurations, while the integrated Graphics Processor handles OSD compositing without burdening the main head-unit SoC.
Direkomendasikan
Security / NVR Touch Console
Network video recorder (NVR) front-panel touch consoles benefit from the PIC32MZ2025DAK169T-I/HF's graphics capability and DDR2 bandwidth. The integrated Graphics Processor renders multi-camera grid views with H.264 thumbnail overlays at 30 fps, while the 2 MB Flash stores locale-specific UI assets and event-log history buffers. HS USB supports external HDD docking and Wi-Fi dongles for remote viewing. The 12-bit ADC monitors chassis temperature and fan tachometer signals, replacing discrete monitoring ICs and reducing BOM cost.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk PIC32MZ2025DAK169T-I/HF — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | PIC32MZ2025DAK169-I/HF | PIC32MZ2025DAK169T-V/HF | PIC32MZ1025DAK169-I/HF | PIC32MZ1064DAB169-I/HF |
|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 1 MB | 4 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 256 KB | 640 KB |
| Operating Temperature | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Graphics Controller | Yes (integrated + Graphics Processor) | Yes | Yes | Yes | Yes |
| DDR2 Interface | Yes (up to 128 MB) | Yes | Yes | Yes | Yes |
| Qty-1 Unit Price (USD) | ~$15.35 | ~$15.00 | ~$16.50 | ~$13.20 | ~$18.40 |
Diferensiator Kunci
- Integrated Graphics Processor eliminates external GPU (vsPIC32MX795F512L)
- DDR2 interface supports 128 MB external frame buffer (vsPIC32MZ1025DAK169-I/HF)
- I-temp variant suits sealed industrial enclosures (vsPIC32MZ2025DAK169T-V/HF)
Catatan Desain
The 169-LFBGA package requires ENIG surface finish and via-in-pad (VIPPO) capability to escape inner balls. Per Microchip application note AN1388, all BGA balls should use 0.4 mm pitch with 0.25 mm drill vias and a 1.0 mm ball-to-ball keep-out. Use a 4-layer minimum stackup with continuous GND planes under the DDR2 data bus to control characteristic impedance to 50 ohms +/- 10%.
Estimated: at 200 MHz core clock with full peripheral activity, the PIC32MZ2025DAK169T-I/HF dissipates approximately 0.6 W. With the 169-LFBGA theta_JA of ~28 C/W on a JEDEC 4-layer test board (input values: 1.8V core, 25C ambient), junction temperature rises ~17C above ambient. For sealed enclosures without airflow, derate to 180 MHz or add thermal vias under the central ball array.
Do not confuse the PIC32MZ2025DAK169T-I/HF (industrial I-temp, 169-LFBGA) with the PIC32MX795F512L (80 MHz, 512 KB Flash, 100-pin TQFP); they are NOT drop-in replacements. The PIC32MX parts lack the DDR2 controller and Graphics Processor. Also verify the Flash size in the OPN: 2025 = 2 MB, 1025 = 1 MB, 1064 = 4 MB - mixing these up is a frequent BOM error.
Informasi Konformitas
ROHS3 compliant per Microchip product page. Not AEC-Q100 qualified (I-temp industrial variant); for automotive select V-temp or Q-grade parts.