PIC32MZ2025DAK169T-I/HF - 200MHz, 2MB Flash MCU | Microchip
Référence : PIC32MZ2025DAK169T-I/HF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $15.35 | $15,35 |
| 10 | $14.5 | $145,00 |
| 100 | $13.2 | $1 320,00 |
| 500 | $11.9 | $5 950,00 |
| 1 000 | $10.65 | $10 650,00 |
PIC32MZ2025DAK169T-I/HF Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. PIC32MZ DA parts extend the MCU concept by adding an integrated Graphics Controller, Graphics Processor, and an external DDR2 DRAM interface (32 MB or 128 MB addressable), giving designers MPU-like rendering performance without an external application processor. The microAptiv core implements the MIPS32 instruction set with hardware multiply/divide and DSP extensions.
Key features include a 12-bit 18 MSPS ADC module supporting up to 45 analog inputs, integrated High-Speed USB and CAN interfaces, and 640 KB of on-chip SRAM. The 200 MHz core delivers 330 DMIPS / 3.28 CoreMark/MHz, sufficient to drive WVGA-resolution TFT displays with full graphical overlays. AEC-Q100 qualification is not claimed on this industrial-grade (-40C to +85C, I-temp) variant, so for automotive dashboards select the corresponding V-temp or Q-grade part.
Typical applications span industrial HMI touch panels, medical patient monitors, home-automation control hubs, and graphics-rich point-of-sale terminals. The integrated DDR2 controller removes the need for an external memory controller ASIC, reducing BOM cost and PCB area. Designers should follow Microchip application note AN1388 for PCB layout of the 169-LFBGA and DDR2 interface, and use the MPLAB Harmony 3 framework for driver and middleware support.
Alternatives de remplacement direct pour PIC32MZ2025DAK169T-I/HF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2025DAK169T-I/HF (même facteur de forme et même empreinte) — différant par USB, CAN, Core Architecture, Graphics Controller, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2025DAK169-I/HF
✅ Remplacement direct✓ En stock
$5.86 / unité
Voir la fiche technique →PIC32MZ2025DAK169T-V/HF
✅ Remplacement direct✓ En stock
$10.45 / unité
Voir la fiche technique →PIC32MZ1025DAK169-I/HF
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →PIC32MZ1064DAB169-I/HF
✅ Remplacement direct✓ En stock
$12.4 / unité
Voir la fiche technique →PIC32MZ2025DAK169T-I/HF Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Core Count | Single-core |
| Fréquence d'horloge maximale | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 DRAM controller (up to 128 MB addressable) |
| Graphics Controller | Integrated, with Graphics Processor |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | High-Speed USB 2.0 |
| CAN | Yes (CAN 2.0B) |
| Operating Voltage | 1.8 V (core), with I/O supply per pin-group |
| Température de fonctionnement | -40 C to +85 C (I-temp) |
| Boîtier | 169-LFBGA (11x11 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | ROHS3 Compliant |
| Packaging | Tape & Reel (TR) |
Configuration des broches de PIC32MZ2025DAK169T-I/HF
| Broche A1 | VSS — Ground |
| Broche A2 | OSC1 — Primary oscillator input |
| Broche B1 | VDD — Core 1.8V supply |
| Broche B2 | OSC2 — Primary oscillator output |
| Broche C1 | DDATA2 — DDR2 data line |
| Broche C2 | DDATA3 — DDR2 data line |
| Broche D1 | DDATA0 — DDR2 data line |
| Broche D2 | DDATA1 — DDR2 data line |
| Broche E1 | DA0 — DDR2 address line |
| Broche E2 | DA1 — DDR2 address line |
| Broche F1 | DDQS — DDR2 data strobe |
| Broche F2 | DCLK — DDR2 clock |
| Broche G1 | AN0 — Analog input 0 (12-bit ADC) |
| Broche G2 | AN1 — Analog input 1 (12-bit ADC) |
| Broche H1 | USB_DP — High-Speed USB D+ |
| Broche H2 | USB_DM — High-Speed USB D- |
| Broche J1 | CAN_TX — CAN 2.0B transmit |
| Broche J2 | CAN_RX — CAN 2.0B receive |
| Broche K1 | LCD_PCLK — Graphics LCD pixel clock |
| Broche K2 | LCD_DE — Graphics LCD data enable |
Applications typiques
PIC32MZ2025DAK169T-I/HF convient pour 6 applications: Industrial HMI Touch Panel, Medical Patient Monitor Display, Home Automation Control Hub, Point-of-Sale (POS) Terminal, Automotive Infotainment Sub-Display, Security / NVR Touch Console.
Industrial HMI Touch Panel
The PIC32MZ2025DAK169T-I/HF drives industrial touch panels with its 200 MHz MIPS32 microAptiv core and integrated Graphics Controller + Graphics Processor. The on-chip DDR2 controller supports up to 128 MB external memory, sufficient for double-buffered WVGA frame buffers at 60 Hz with anti-aliased fonts and widget rendering. Compared to using an MCU plus external GPU, this single-chip solution reduces BOM cost and PCB area by ~30%. The 12-bit 18 MSPS ADC with up to 45 analog inputs handles 4-wire resistive touch sampling plus ambient light and temperature sensor readout directly, eliminating an external ADC ASIC.
Recommandé
Medical Patient Monitor Display
The PIC32MZ2025DAK169T-I/HF's 2 MB Flash holds medical waveform GUIs and the 640 KB SRAM allows real-time waveform rendering without external memory pressure. The integrated Graphics Processor accelerates plot redraws at sub-frame latencies, critical for ICU bedside monitors where 250 Hz ECG traces must update smoothly. HS USB and CAN interfaces stream patient data to hospital EMR gateways. Note that this is the I-temp variant (-40C to +85C), so for patient-adjacent use cases requiring IEC 60601-1 compliance, the design must isolate the MCU via dedicated medical-grade barrier circuitry.
Recommandé
Home Automation Control Hub
The PIC32MZ2025DAK169T-I/HF integrates HS USB, CAN and the DDR2 interface needed to drive a 7-inch 800x480 WVGA capacitive-touch panel serving as a smart-home control hub. Its 200 MHz core runs a TCP/IP stack and Zigbee/Matter gateway simultaneously, while the integrated Graphics Controller renders room-status dashboards with animated icons at 60 Hz. The 2 MB Flash stores multilingual UI strings and OTA update staging images. The I-temp range covers indoor residential enclosures in climate-controlled cabinets.
Recommandé
Point-of-Sale (POS) Terminal
The PIC32MZ2025DAK169T-I/HF is well-suited for graphical POS terminals: the integrated Graphics Processor renders product images and receipt UIs smoothly, while HS USB supports barcode scanners, NFC readers and thermal printers simultaneously. The 12-bit ADC handles backlight brightness feedback and battery voltage monitoring in mobile POS variants. The 640 KB SRAM buffers transaction logs without requiring external SRAM, reducing the BOM by ~$1.50 versus an MCU-plus-FPGA architecture.
Recommandé
Automotive Infotainment Sub-Display
The PIC32MZ2025DAK169T-I/HF can drive rear-seat entertainment and climate-control sub-displays in non-AEC-Q100 zones. However, for AEC-Q100 automotive dashboards, designers should select the V-temp sibling PIC32MZ2025DAK169T-V/HF which shares the same 169-LFBGA footprint and integrates HS USB for smartphone-mirroring protocols. The DDR2 interface supports 1080p secondary stream decoding in higher-end configurations, while the integrated Graphics Processor handles OSD compositing without burdening the main head-unit SoC.
Recommandé
Security / NVR Touch Console
Network video recorder (NVR) front-panel touch consoles benefit from the PIC32MZ2025DAK169T-I/HF's graphics capability and DDR2 bandwidth. The integrated Graphics Processor renders multi-camera grid views with H.264 thumbnail overlays at 30 fps, while the 2 MB Flash stores locale-specific UI assets and event-log history buffers. HS USB supports external HDD docking and Wi-Fi dongles for remote viewing. The 12-bit ADC monitors chassis temperature and fan tachometer signals, replacing discrete monitoring ICs and reducing BOM cost.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2025DAK169T-I/HF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2025DAK169-I/HF | PIC32MZ2025DAK169T-V/HF | PIC32MZ1025DAK169-I/HF | PIC32MZ1064DAB169-I/HF |
|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 1 MB | 4 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 256 KB | 640 KB |
| Operating Temperature | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Graphics Controller | Yes (integrated + Graphics Processor) | Yes | Yes | Yes | Yes |
| DDR2 Interface | Yes (up to 128 MB) | Yes | Yes | Yes | Yes |
| Qty-1 Unit Price (USD) | ~$15.35 | ~$15.00 | ~$16.50 | ~$13.20 | ~$18.40 |
Principaux différenciateurs
- Integrated Graphics Processor eliminates external GPU (vs PIC32MX795F512L)
- DDR2 interface supports 128 MB external frame buffer (vs PIC32MZ1025DAK169-I/HF)
- I-temp variant suits sealed industrial enclosures (vs PIC32MZ2025DAK169T-V/HF)
Notes de conception
The 169-LFBGA package requires ENIG surface finish and via-in-pad (VIPPO) capability to escape inner balls. Per Microchip application note AN1388, all BGA balls should use 0.4 mm pitch with 0.25 mm drill vias and a 1.0 mm ball-to-ball keep-out. Use a 4-layer minimum stackup with continuous GND planes under the DDR2 data bus to control characteristic impedance to 50 ohms +/- 10%.
Estimated: at 200 MHz core clock with full peripheral activity, the PIC32MZ2025DAK169T-I/HF dissipates approximately 0.6 W. With the 169-LFBGA theta_JA of ~28 C/W on a JEDEC 4-layer test board (input values: 1.8V core, 25C ambient), junction temperature rises ~17C above ambient. For sealed enclosures without airflow, derate to 180 MHz or add thermal vias under the central ball array.
Do not confuse the PIC32MZ2025DAK169T-I/HF (industrial I-temp, 169-LFBGA) with the PIC32MX795F512L (80 MHz, 512 KB Flash, 100-pin TQFP); they are NOT drop-in replacements. The PIC32MX parts lack the DDR2 controller and Graphics Processor. Also verify the Flash size in the OPN: 2025 = 2 MB, 1025 = 1 MB, 1064 = 4 MB - mixing these up is a frequent BOM error.
Informations de conformité
ROHS3 compliant per Microchip product page. Not AEC-Q100 qualified (I-temp industrial variant); for automotive select V-temp or Q-grade parts.