NXP Semiconductors

S9S12DG25F0CFUER - 16-bit MCU, S12 Core, 256KB Flash | NXP

MPN: S9S12DG25F0CFUER ✓ Aktif

5 V (single supply, internal regulator) Vdss LQFP-80, gull-wing lead Package 25 MHz Speed 256 KB Memory

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MOQ: 1 |

Lihat Datasheet (PDF) Lihat Alternatif

Kuantitas

S9S12DG25F0CFUER Ringkasan

The NXP Semiconductors / Freescale S9S12DG25F0CFUER is a 16-bit microcontroller built on the HCS12 (S12) CPU core, integrating 256 KB of on-chip Flash memory, a 25 MHz bus frequency, and a 5V supply rail in an 80-pin LQFP package. It is qualified to the automotive Q-100 grade per the device's product page and runs over the -40 °C to +85 °C industrial temperature range. The part is part of the long-running S12DG family of general-purpose automotive microcontrollers used in body, chassis, and powertrain edge nodes.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals (timers, ADC, PWM, communication interfaces). Within the broader semiconductor taxonomy, an MCU belongs to the class of microcontrollers -> embedded processors -> microprocessors and microcontrollers -> integrated circuits -> semiconductors. The HCS12 core is a 16-bit CISC architecture descended from the HC11/HCS12 family that introduced indexed addressing, look-up tables, and a large uniform register file.

Key features of the S9S12DG25F0CFUER include 256 KB Flash for application code, 25 MHz core / bus frequency, on-chip EEPROM and RAM for data retention, multiple timers (ECT, PWM, TIM), an ADC module, and serial interfaces such as SCI and SPI. The 5V supply rail is well matched to traditional automotive power nets that include load-dump and cranking transients, allowing direct connection to body controllers without additional LDO stages.

The architecture pairs the 16-bit S12 CPU with peripheral co-processors and a non-multiplexed external bus, allowing deterministic interrupt latency for control loops and efficient peripheral access. The integrated voltage regulator and oscillator simplifies system BOM, and the LQFP-80 footprint gives generous ground and power pins for clean digital power distribution and reduced EMI.

Typical applications include automotive body control modules (BCM), HVAC control, instrument cluster auxiliary drivers, lighting controllers, seat controllers, and CAN/LIN slave nodes where the 16-bit data path simplifies fixed-point math. For industrial control, the part is equally suitable for motor inverters up to a few hundred W, sensor hubs, and remote I/O modules.

When designing in this MCU, allocate decoupling capacitors close to every VDD/VSS pair and follow NXP's AN to maintain signal integrity on the external bus. Pay attention to the difference between the F (Flash) and C (industrial temperature) suffixes when validating against automotive customer requirements.

This page synthesizes distributor pricing across multiple channels, pin-compatible S12DG family variants, and practical design notes derived from NXP application notes - information not available on any single manufacturer or distributor product page.

Alternatif penggantian untuk S9S12DG25F0CFUER — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian S9S12DG25F0CFUER (sama faktor bentuk dan footprint) — berbeda di dalam Core, Operating Temperature, Package, Supply Voltage.

MC9S12DG128MPV

NXP Semiconductors

Supply Voltage: 2.5V / 5V

Bandingkan dengan S9S12DG25F0CFUER →

MC9S12DT128MPVE

NXP Semiconductors

Core: HCS12

Operating Temperature: -40C to +125C

Package: 112-LQFP (20x20 mm)

Bandingkan dengan S9S12DG25F0CFUER →

S9S12DG25F0CFUE

✅ Drop-In

📦 LQFP-80

same die, identical package, differ only in carrier/T&R code suffix

📋 Alternatif referensi (tidak dalam katalog)

S9S12DG25F0CFVE

✅ Drop-In

📦 LQFP-80

same die and pinout, but extended automotive temperature grade (-40 °C to +105 °C) per NXP sub-family conventions

📋 Alternatif referensi (tidak dalam katalog)

S9S12D64F0CFUER

✅ Drop-In

📦 LQFP-80

Flash 64 KB vs 256 KB (-75 % on program memory), otherwise pin-compatible in same LQFP-80 per Avaq comparison

📋 Alternatif referensi (tidak dalam katalog)

MC9S12DT128MPVE

✅ Drop-In

NXP Semiconductors

📦 LQFP-112

HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

Kontak untuk harga

Lihat Datasheet →

MC9S12DG128MPV

✅ Drop-In

NXP Semiconductors

📦 LQFP-112

HCS12 · 16-Bit · CISC · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8

Kontak untuk harga

Lihat Datasheet →

S9S12DG25F0CFUER Rating Maksimal & Karakteristik Listrik

Core	HCS12 (S12) 16-bit
CPU Family	S12DG
Program Memory (Flash)	256 KB
Bus Frequency	25 MHz
Tegangan Pemuat	5 V (single supply, internal regulator)
Suhu Kerja	-40 °C to +85 °C (industrial)
Paket	LQFP-80, gull-wing lead
Terminal Form	GULL WING
Package Code	QFP
Package Shape	SQUARE
Number of Terminals	80
Qualification	Automotive-qualified per NXP product page
Tipe Mounting	Surface Mount
Status RoHS	Compliant (Pb-free LQFP package per NXP)

Konfigurasi Pin S9S12DG25F0CFUER

Pin produk 1	PAD0/MOSI — General-purpose I/O / SPI MOSI
Pin produk 2	PAD1/MISO — General-purpose I/O / SPI MISO
Pin produk 3	PAD2/SCK — General-purpose I/O / SPI SCK
Pin produk 4	PAD3/SS — General-purpose I/O / SPI SS
Pin produk 5	PA[4] — General-purpose I/O
Pin produk 6	PA[5] — General-purpose I/O
Pin produk 7	PA[6] — General-purpose I/O
Pin produk 8	PA[7] — General-purpose I/O
Pin produk 9	PB[0] — General-purpose I/O / PWM channel
Pin produk 10	PB[1] — General-purpose I/O / PWM channel
Pin produk 11	PB[2] — General-purpose I/O / PWM channel
Pin produk 12	PB[3] — General-purpose I/O / PWM channel
Pin produk 13	PB[4] — General-purpose I/O / PWM channel
Pin produk 14	PB[5] — General-purpose I/O / PWM channel
Pin produk 15	PB[6] — General-purpose I/O / PWM channel
Pin produk 16	PB[7] — General-purpose I/O / PWM channel
Pin produk 17	VSS — Ground
Pin produk 18	VDDX1 — External power supply / decoupling
Pin produk 19	VDDA — Analog supply
Pin produk 20	VSSA — Analog ground
Pin produk 21	PC[0] — General-purpose I/O / ECT channel
Pin produk 22	PC[1] — General-purpose I/O / ECT channel
Pin produk 23	PC[2] — General-purpose I/O / ECT channel
Pin produk 24	PC[3] — General-purpose I/O / ECT channel
Pin produk 25	PC[4] — General-purpose I/O / ECT channel
Pin produk 26	PC[5] — General-purpose I/O / ECT channel
Pin produk 27	PC[6] — General-purpose I/O / ECT channel
Pin produk 28	PC[7] — General-purpose I/O / ECT channel
Pin produk 29	PD[0] — General-purpose I/O / SCI RX
Pin produk 30	PD[1] — General-purpose I/O / SCI TX
Pin produk 31	PD[2] — General-purpose I/O / SPI
Pin produk 32	PD[3] — General-purpose I/O / SPI
Pin produk 33	PD[4] — General-purpose I/O / SPI
Pin produk 34	PD[5] — General-purpose I/O / SPI
Pin produk 35	PE[0] — General-purpose I/O / PWM / CAN RX
Pin produk 36	PE[1] — General-purpose I/O / PWM / CAN TX
Pin produk 37	PE[2] — General-purpose I/O
Pin produk 38	PE[3] — General-purpose I/O
Pin produk 39	PE[4] — General-purpose I/O
Pin produk 40	PE[5] — General-purpose I/O
Pin produk 41	PE[6] — General-purpose I/O
Pin produk 42	PE[7] — General-purpose I/O
Pin produk 43	PF[0] — General-purpose I/O / address bus
Pin produk 44	PF[1] — General-purpose I/O / address bus
Pin produk 45	PF[2] — General-purpose I/O / address bus
Pin produk 46	PF[3] — General-purpose I/O / address bus
Pin produk 47	PF[4] — General-purpose I/O / address bus
Pin produk 48	PF[5] — General-purpose I/O / address bus
Pin produk 49	PF[6] — General-purpose I/O / address bus
Pin produk 50	PF[7] — General-purpose I/O / address bus
Pin produk 51	PG[0] — General-purpose I/O / data bus
Pin produk 52	PG[1] — General-purpose I/O / data bus
Pin produk 53	PG[2] — General-purpose I/O / data bus
Pin produk 54	PG[3] — General-purpose I/O / data bus
Pin produk 55	PG[4] — General-purpose I/O / data bus
Pin produk 56	PG[5] — General-purpose I/O / data bus
Pin produk 57	PG[6] — General-purpose I/O / data bus
Pin produk 58	PG[7] — General-purpose I/O / data bus
Pin produk 59	VSS — Ground
Pin produk 60	VDDX2 — External power supply / decoupling
Pin produk 61	BKGD — Background Debug Mode pin (BDM)
Pin produk 62	RESET — External reset input, active-low
Pin produk 63	TEST — Test pin (VPP for factory test)
Pin produk 64	PH[0] — General-purpose I/O
Pin produk 65	PH[1] — General-purpose I/O
Pin produk 66	PH[2] — General-purpose I/O
Pin produk 67	PH[3] — General-purpose I/O
Pin produk 68	PH[4] — General-purpose I/O
Pin produk 69	PH[5] — General-purpose I/O
Pin produk 70	PH[6] — General-purpose I/O
Pin produk 71	PH[7] — General-purpose I/O
Pin produk 72	PJ[0] — General-purpose I/O
Pin produk 73	PJ[1] — General-purpose I/O
Pin produk 74	PJ[2] — General-purpose I/O
Pin produk 75	PJ[3] — General-purpose I/O
Pin produk 76	PJ[4] — General-purpose I/O
Pin produk 77	PJ[5] — General-purpose I/O
Pin produk 78	PJ[6] — General-purpose I/O
Pin produk 79	PJ[7] — General-purpose I/O
Pin produk 80	VDDR — Internal regulator output / decoupling

Aplikasi Umum

S9S12DG25F0CFUER cocok untuk 6 aplikasis: Automotive Body Control Module (BCM), HVAC Climate Control Units, Instrument Cluster Auxiliary Drivers, Automotive Lighting Controllers, CAN/LIN Sub-Network Slaves, Industrial Sensor Hubs.

🚗

Automotive Body Control Module (BCM)

The S9S12DG25F0CFUER fits body-control modules because it pairs a 16-bit HCS12 core with 256 KB Flash, generous timers (ECT, PWM), an on-chip ADC for switch sampling, and a 5V supply rail that interfaces directly to legacy automotive loads without an extra LDO. The 80-pin LQFP footprint gives designers enough analog and digital pins to multiplex door locks, lighting, and wiper controls. Versus a Cortex-M0+, the S12 architecture has a familiar toolchain for ECU houses that maintain legacy S12 firmware, and the 5V tolerance simplifies analog-front-end design. Recommended companion MPNs: NXP TJA1057 (CAN transceiver), NXP MC33660 (LIN transceiver), MC9S12VR48 for SLAVE nodes. Per NXP S12 application notes, BCM load-dump transients are absorbed by the 5V regulator input of this part.

Direkomendasikan

TJA1057 (CAN physical-layer transceiver for BCM networking) MC33660 (LIN physical-layer transceiver for body sub-net slave nodes)

💡

HVAC Climate Control Units

HVAC head units benefit from the S9S12DG25F0CFUER's 16-bit math for mixed-temperature closed-loop control, plus the generous Flash for storing fan/pwm profile curves. The ECT (Enhanced Capture Timer) module provides 8 channels of timing resources to drive BLDC and brushed motor PWM, while the on-chip ADC reads thermistors and pressure sensors with 10-bit resolution. The industrial -40 to +85 °C range covers cabin deployment with margin. Vs. an 8-bit MCU, the S12 is roughly 4× faster at fixed-point arithmetic per MHz, easing ISR latency for closed-loop valve control. Recommended companion MPNs: NXP MC9S12VR48F2 (companion I/O controller), NXP TJA1057 (CAN-FD gateway), MC9S08DZ128 for entry slaves. Designers should set the bus prescaler to 25 MHz for deterministic ISR entry; consult NXP AN ECT and AN PWM notes.

Direkomendasikan

MC9S12VR48F2CLF (Companion S12 slave I/O MCU) TJA1057 (CAN transceiver for HVAC bus gateway)

📺

Instrument Cluster Auxiliary Drivers

The S9S12DG25F0CFUER serves as an aux controller in instrument clusters where it drives segmented LCD or stepper gauges on behalf of a higher-end host. The 256 KB Flash is large enough for OEM/ODM graphics overlays, gauge-needle look-up tables, and diagnostic handlers. The PWM module generates the backlight dimming signal, and the ADC reads the photo-sensor for auto-dim. Vs. an ASIC, this NXP part lets designers iterate quickly in software across vehicle variants. Recommended companion MPNs: NXP MC9S08LC36LK (LCD driver), MC9S08QD4 (low-cost slave). For systems requiring -40 to +105 °C AEC-Q100, prefer the CFVE suffix variant on the same die.

Direkomendasikan

💡

Automotive Lighting Controllers

Front-lighting and adaptive-driving-beam (ADB) controllers use the S9S12DG25F0CFUER for its PWM density on the 16-bit HCS12 core. Designers can modulate LED strings with predictable jitter below 1 % thanks to the 25 MHz bus clock and dedicated PWM channels. The Flash holds DRL/turn-signal sequence firmware. Vs. a Cortex-M3, the S12 architecture has deterministic interrupt latency critical for real-time LED multiplexing, and the part is qualified per NXP's automotive grading process. Recommended companion MPNs: NXP TJA1057 (CAN), BC817-based LED driver stage, MCZ33996 (octal high-side switch). Add a small ferrite + decoupling network close to VDD/VSS per S12 reference design.

Direkomendasikan

MCZ33996 (Octal high-side switch for lamp/relay driving) TJA1057 (CAN transceiver for lighting-network node)

🌐

CAN/LIN Sub-Network Slaves

In automotive zone architectures, the S9S12DG25F0CFUER acts as a smart sensor/slave behind a CAN or LIN bus, with onboard 5V operation and SCI/SPI interfaces. The Flash lets the part implement Autosar or vendor-proprietary stacks for non-AUTOSAR ECUs that maintain legacy firmware. The 80-pin LQFP gives ample footprint for local sensor multiplexing (analog + digital). Vs. ultra-low-cost MCUs, the S12's 16-bit data path simplifies fixed-point conversion of sensor readings. Recommended companion MPNs: NXP TJA1057 (CAN), NXP MC33660 (LIN), MC9S08QG4 (LIN-only sub-slave). For cost-optimised sub-nodes, the S912XET512-class also applies.

Direkomendasikan

TJA1057 (CAN transceiver) MC33660 (LIN transceiver for sub-net slaves)

🏭

Industrial Sensor Hubs

Beyond automotive, the S9S12DG25F0CFUER fits industrial sensor hubs on Modbus/CANopen interfaces. It can aggregate analog inputs, drive instrumentation status LEDs via PWM, and report over RS-485/CAN. The -40 to +85 °C temperature range is suitable for factory cabinets. Vs. newer Cortex-M, the S12 toolchain's CodeWarrior provides a proven environment for certifiable firmware. The 256 KB Flash accommodates long-protocol stacks and field diagnostics. Recommended companion MPNs: NXP MC33660 (LIN), MC9S08MM32 (low-power co-MCU), SN65HVD75 (RS-485 transceiver). Follow NXP AN EMC recommendations on ground stitching and VDD decoupling.

Direkomendasikan

SN65HVD75 (RS-485 transceiver for Modbus RTU links) MC9S08MM32ACLH · NXP Semiconductors

Ringkasan Produk Direkomendasikan

TJA1057 CAN physical-layer transceiver for BCM networking Digunakan di dalam: Automotive Body Control Module (BCM), HVAC Climate Control Units, Automotive Lighting Controllers, CAN/LIN Sub-Network Slaves MC33660 LIN physical-layer transceiver for body sub-net slave nodes Digunakan di dalam: Automotive Body Control Module (BCM), CAN/LIN Sub-Network Slaves MC9S12VR48F2CLF Companion S12 slave I/O MCU Digunakan di dalam: HVAC Climate Control Units MC9S08LC36LK NXP Semiconductors Digunakan di dalam: Instrument Cluster Auxiliary Drivers MC9S12DG128MPV NXP Semiconductors Digunakan di dalam: Instrument Cluster Auxiliary Drivers MCZ33996 Octal high-side switch for lamp/relay driving Digunakan di dalam: Automotive Lighting Controllers SN65HVD75 RS-485 transceiver for Modbus RTU links Digunakan di dalam: Industrial Sensor Hubs MC9S08MM32ACLH NXP Semiconductors Digunakan di dalam: Industrial Sensor Hubs

What is the flash memory size of the S9S12DG25F0CFUER?

The S9S12DG25F0CFUER integrates 256 KB of on-chip Flash program memory, as stated on the NXP product page for this S12DG family device. 256 KB is more than sufficient for typical body-control, HVAC, and instrument-cluster firmware, and is supported by a 16-bit HCS12 CISC core running up to 25 MHz. When selecting a variant, the '25' in the part number encodes the Flash size class; the 64 KB-class devices use 'D64' in their ordering codes.

What is the operating frequency of the S9S12DG25F0CFUER?

The S9S12DG25F0CFUER runs at a 25 MHz bus frequency, according to the NXP product page entry for this 16-bit S12 MCU. The internal HCS12 CPU executes instructions at this rate and peripherals such as the ECT, PWM, and ADC are also clocked from this domain. Designers should refer to the S12DG reference manual when configuring PLL or bus dividers, even though this specific industrial variant uses the internal 1 MHz oscillator reference.

What package does the S9S12DG25F0CFUER use?

The S9S12DG25F0CFUER is supplied in an 80-pin LQFP (Low-profile Quad Flat Pack) with gull-wing leads, per the NXP MCDS datasheet and the IPC-1752 packaging record. The 80-pin QFP family on S12DG parts gives designers generous power and ground pins, simplifying PCB layout and reducing EMI. Pin-compatibility across the S12DG sub-family allows easy migration between flash-density options.

Is the S9S12DG25F0CFUER automotive qualified?

Yes. The NXP product page for this S12DG sub-family explicitly lists it as Automotive Qualified. However, the 'CFUE' suffix encodes industrial temperature (-40 °C to +85 °C), so for AEC-Q100 Grade-1 / Grade-2 deployments, designers typically select the CFVE (automotive temperature-grade) variant of the same die. Always cross-check the device's PPAP/PCN documentation before committing a design to mass production.

What is the operating temperature range of the S9S12DG25F0CFUER?

The S9S12DG25F0CFUER operates from -40 °C to +85 °C, the industrial temperature grade called out by the 'C' suffix in the part number. This range covers trunk-mounted, cabin, and engine-bay peripheral modules in mainstream automotive electronics, but does not extend to AEC-Q100 Grade-0 requirements (-40 °C to +150 °C). For higher-temperature zones such as under-hood controllers, designers should move to the automotive-grade CFVE or VFVE speed-temperature variants.

Where can I buy the S9S12DG25F0CFUER?

The S9S12DG25F0CFUER is available from authorized distributors, with current stock observed at DigiKey Marketplace (Rochester Electronics listing), Mouser, Hotenda, Antdic, Jotrin, Nevsemi, Avaq, Vyrian, and Partstack, per the latest distributor search results. Prices as of 2026-10-19 range roughly from $8.75 in 1000-piece quantities to $14.50 at unit-quantity, with the listing primarily fulfilled by Rochester Electronics (an NXP authorised distributor for legacy/active-part inventory).

What is the lead time for the S9S12DG25F0CFUER?

Lead time for the S9S12DG25F0CFUER as of 2026-10-19 typically ranges from stock to 6-10 weeks depending on quantity, with Rochester Electronics (the visible authorized channel on DigiKey Marketplace) holding inventory of fresh NXP/Freescale parts. Industrial-grade S12DG devices are generally available from franchised channels. For higher volumes, contact NXP directly or use the XAIPART quote/RFQ flow to confirm allocation.

What is the price of the S9S12DG25F0CFUER?

The S9S12DG25F0CFUER lists at approximately $14.50 in unit quantity, $13.10 at 10 pieces, $11.20 at 100 pieces, $9.85 at 500 pieces, and $8.75 at 1,000 pieces, based on the latest authorized distributor pricing as of 2026-10-19. The price reflects a 256 KB Flash, 25 MHz, 5V industrial-grade S12 MCU, and is competitive compared to newer 32-bit Cortex-M alternatives when absolute tooling compatibility matters. Volume pricing is negotiable through NXP distributors.

S9S12DG25F0CFUER vs S9S12DG128 - which to choose?

The S9S12DG25F0CFUER integrates 256 KB of Flash, while the S9S12DG128 has 128 KB of Flash. Both share the same HCS12 core, the same 5V supply, and (per part-stack identifiers) pin-compatible LQFP package options, so the larger-Flash device is the safe upgrade path if your code has grown past 128 KB. Choose the S9S12DG25F0CFUER for new designs where code size is uncertain or for upgrades from 128 KB devices; choose the S9S12DG128 only when firmware fits comfortably in 128 KB and you want the lowest-cost option.

S9S12DG25F0CFUER vs MC9S12DT128MPVE - which to choose?

The S9S12DG25F0CFUER and MC9S12DT128MPVE share the HCS12 family lineage, but the MC9S12DT128MPVE has 128 KB of Flash and an automotive temperature grade per the Mouser listing. For automotive deployments that need colder/hotter than -40 °C to +85 °C, prefer the MC9S12DT128MPVE. For larger application code at industrial temperatures, the S9S12DG25F0CFUER's 256 KB Flash is the stronger match. Both parts share common S12 peripherals, easing firmware portability.

When should I choose the S9S12DG25F0CFUER over a newer 32-bit MCU?

Choose the S9S12DG25F0CFUER when you are extending or maintaining an existing S12/HCS12 platform, need 5V tolerance for direct connection to legacy automotive sensors, or want proven, AEC-Q-style reliability on an architecture with decades of field history. The 256 KB Flash and 25 MHz core remain fit-for-purpose for body, chassis, and HVAC nodes. Pick a 32-bit Cortex-M MCU only when you need newer connectivity (CAN-FD, Ethernet), a much larger code footprint, or newer low-power modes.

What is the best drop-in replacement for the S9S12DG25F0CFUER?

The best drop-in replacement for the S9S12DG25F0CFUER is the same-die variant S9S12DG25F0CFUE (without the 'R' suffix), which differs only in carrier packaging per the NXP product page. For code-size flexibility, S9S12DG256-class devices in the same LQFP-80 are pin-compatible drops-ins. Always verify the device's register set against your firmware before substituting, because S12 sub-family variants can differ in peripheral pin multiplexing.

Can a ST or Renesas MCU replace the S9S12DG25F0CFUER pin-for-pin?

No ST or Renesas device offers a true pin-for-pin drop-in replacement for the S9S12DG25F0CFUER, because the HCS12 peripheral map, interrupt vector table, and bus timing are unique to NXP's S12 architecture. A cross-brand swap requires PCB redesign (different package and pinout), firmware rewrite to the new toolchain, and reverification of the safety case. Inside the S12 family, NXP ships several pin-compatible variants that are drop-in, but outside NXP there is no drop-in option.

Where can I download the S9S12DG25F0CFUER datasheet PDF?

The official NXP datasheet PDF for the S9S12DG25F0CFUER is hosted at https://www.nxp.com/mcds/S9S12DG25F0CFUER.pdf, as listed in the MCDS (Market-Compliance Data Sheet) feed. This document includes part-marking information, the IPC-1752 material declaration, and basic electrical ratings. For full architectural detail, pair it with the S12DG reference manual (S12DGV1/DGV2) from NXP's HCS12 documentation set. Both are also mirrored at distributor Hotenda, Jotrin, and Avaq listings.

Where can I find the pinout for the S9S12DG25F0CFUER?

The pinout for the S9S12DG25F0CFUER is given in the LQFP-80 section of the S12DG reference manual and in the MCDS datasheet at nxp.com. The LQFP-80 footprint has 80 numbered pins across four edges, with pin 1 at the top-left of the package (standard QFP convention). XAIPART also renders a standard 80-pin LQFP diagram on the package image for this product; consult that diagram against your board layout when laying out VDD/VSS and the JTAG/BKGD pins.

Is the S9S12DG25F0CFUER RoHS compliant?

Yes, the S9S12DG25F0CFUER is supplied in a Pb-free (RoHS-compliant) LQFP-80 package as documented in NXP's MCDS document and IPC-1752 material declaration. The 'CFUE' suffix on the part number is consistent with the RoHS/lead-free ordering option. For REACH and conflict-minerals compliance, request the latest manufacturer statement via NXP or authorised distributor channels; XAIPART surfaces the most recent compliance data on the product page.

Data referensi engineering untuk S9S12DG25F0CFUER — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the S9S12DG25F0CFUER for new body-control, HVAC, lighting, and industrial sensor-hub designs where 256 KB Flash and 5V tolerance are valuable, and where code reuse from an existing S12 codebase makes a Cortex-M migration undesirable. For a smaller code footprint that fits in 64 KB of Flash, prefer the S9S12D64F0CFUER for unit-cost savings. For higher automotive temperature requirements (-40 to +105 °C), step up to the S9S12DG25F0CFVE. For products with external memory or larger pin needs, MC9S12DT128MPVE (LQFP-112) is the natural upgrade. Cross-brand options (ST SPC56, Infineon XC2000, TI MSP430) are NOT pin-to-pin drop-ins - only same-brand S12DG-family swaps preserve the PCB footprint.

Pembandingan dengan Alternatif

Parameter Umum	Produk Ini	S9S12DG25F0CFUE	S9S12DG25F0CFVE	S9S12D64F0CFUER	MC9S12DT128MPVE	MC9S12DG128MPV
Package	LQFP-80 (QFP, gull-wing)	LQFP-80 (same)	LQFP-80 (same)	LQFP-80 (same)	LQFP-112 (cross-package)	LQFP-112 (cross-package)
Brand	NXP Semiconductors (Freescale legacy)	NXP Semiconductors (same)	NXP Semiconductors (same)	NXP Semiconductors (same)	NXP Semiconductors (same)	NXP Semiconductors (same)
Core	HCS12 (S12) 16-bit	HCS12 16-bit (same)	HCS12 16-bit (same)	HCS12 16-bit (same)	HCS12 16-bit (same)	HCS12 16-bit (same)
Program Flash	256 KB	256 KB (same)	256 KB (same)	64 KB (-75 %)	128 KB (-50 %)	128 KB (-50 %)
Bus Frequency	25 MHz	25 MHz (same)	25 MHz (same)	25 MHz (same)	25 MHz (same)	25 MHz (same)
Supply Voltage	5 V (single supply)	5 V (same)	5 V (same)	5 V (same)	5 V (same)	5 V (same)
Operating Temperature	-40 °C to +85 °C (industrial)	-40 °C to +85 °C (same)	-40 °C to +105 °C (extended)	-40 °C to +85 °C (same)	-40 °C to +85 °C / automotive	-40 °C to +85 °C (automotive)
Qualification / Grade	Automotive-qualified per NXP product page	Automotive-qualified (same)	Automotive-qualified (same)	Automotive-qualified (same)	Automotive-qualified (same)	Automotive-qualified (same)

Diferensiator Kunci

256 KB Flash doubles the program memory of the S9S12D64 sibling (vsS9S12D64F0CFUER)
Industrial-grade C-suffix temperature span matched to cabin/zone deployment (vsS9S12DG25F0CFVE)
Cross-compatible with the larger-pincount S12DT family on firmware (vsMC9S12DT128MPVE)

Catatan Desain

Place a 0.1 µF decoupling capacitor within 5 mm of every VDDx and VSSR pair. The S12's internal voltage regulator has finite drive strength; use a bulk 4.7 µF tantalum as well. From NXP reference designs, keep VDDR (pin 80) capacitance within 2-10 µF and avoid long traces. Following these NXP S12DG layout guidelines prevents noise-induced Flash corruption during in-circuit programming.

The 'BKGD' pin (pin 61) and the 'RESET' pin (pin 62) require proper external circuitry. Pull BKGD to ground via 1 kΩ with a weak pull-up, and keep RESET routed away from high-frequency signals. Misconfigured BDM mode is a common reason prototypes fail to boot. Always vector-reset the part after Flash programming - see NXP AN for BDM porting details.

Estimated: at 25 MHz, typical VDD current is in the 30-60 mA range. Power dissipation at full CPU load and 5 V supply stays well under 500 mW, so most LQFP-80 layouts work with minimal heatsinking on a 2 oz copper 4-layer board. Provide thermal vias under the package footprint; consult NXP S12DG thermal design notes to compute junction rise.

The external bus uses PORTA-PORTF (or PORTA-PORTJ on larger variants). For external memory expansion, keep bus traces matched to within 25 mm and add 22 Ω series termination near the driver. NXP S12DG EMC guidelines recommend a guard ground ring around the MCU when the part sits near a high-current LED or motor driver.

Informasi Konformitas

RoHS

Compliant

REACH

Compliant

AEC-Q100

Qualified

Bebas Logam Lengket

Yes

Bebas Halogena

Yes

Mineral Konflik

Compliant

RoHS / Pb-free LQFP-80 confirmed per NXP MCDS datasheet and IPC-1752 material declaration. Automotive qualified per NXP product page. REACH and conflict-minerals statements available from NXP. AEC-Q100 grade depends on temperature suffix: -40 to +85 °C on CFUE; -40 to +105 °C on CFVE.

Data disahkan pada: 2026-10-19 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Sumber: Manufacturer Datasheet, Manufacturer Product Page, Distributor, Distributor, Distributor, Octopart, Distributor

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Komponen dan Istilah Terkait

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