S9S12DG25F0CFUER - 16-bit MCU, S12 Core, 256KB Flash | NXP
Référence : S9S12DG25F0CFUER ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.1 | $131,00 |
| 100 | $11.2 | $1 120,00 |
| 500 | $9.85 | $4 925,00 |
| 1 000 | $8.75 | $8 750,00 |
S9S12DG25F0CFUER Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals (timers, ADC, PWM, communication interfaces). Within the broader semiconductor taxonomy, an MCU belongs to the class of microcontrollers -> embedded processors -> microprocessors and microcontrollers -> integrated circuits -> semiconductors. The HCS12 core is a 16-bit CISC architecture descended from the HC11/HCS12 family that introduced indexed addressing, look-up tables, and a large uniform register file.
Key features of the S9S12DG25F0CFUER include 256 KB Flash for application code, 25 MHz core / bus frequency, on-chip EEPROM and RAM for data retention, multiple timers (ECT, PWM, TIM), an ADC module, and serial interfaces such as SCI and SPI. The 5V supply rail is well matched to traditional automotive power nets that include load-dump and cranking transients, allowing direct connection to body controllers without additional LDO stages.
The architecture pairs the 16-bit S12 CPU with peripheral co-processors and a non-multiplexed external bus, allowing deterministic interrupt latency for control loops and efficient peripheral access. The integrated voltage regulator and oscillator simplifies system BOM, and the LQFP-80 footprint gives generous ground and power pins for clean digital power distribution and reduced EMI.
Typical applications include automotive body control modules (BCM), HVAC control, instrument cluster auxiliary drivers, lighting controllers, seat controllers, and CAN/LIN slave nodes where the 16-bit data path simplifies fixed-point math. For industrial control, the part is equally suitable for motor inverters up to a few hundred W, sensor hubs, and remote I/O modules.
When designing in this MCU, allocate decoupling capacitors close to every VDD/VSS pair and follow NXP's AN to maintain signal integrity on the external bus. Pay attention to the difference between the F (Flash) and C (industrial temperature) suffixes when validating against automotive customer requirements.
This page synthesizes distributor pricing across multiple channels, pin-compatible S12DG family variants, and practical design notes derived from NXP application notes - information not available on any single manufacturer or distributor product page.
Alternatives de remplacement direct pour S9S12DG25F0CFUER — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S9S12DG25F0CFUER (même facteur de forme et même empreinte) — différant par Core, Operating Temperature, Package, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S9S12DG25F0CFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S9S12DG25F0CFVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S9S12D64F0CFUER
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DT128MPVE
✅ Remplacement direct✓ En stock
$36.5 / unité
Voir la fiche technique →MC9S12DG128MPV
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →S9S12DG25F0CFUER Valeurs maximales et caractéristiques électriques
| Core | HCS12 (S12) 16-bit |
| CPU Family | S12DG |
| Program Memory (Flash) | 256 KB |
| Bus Frequency | 25 MHz |
| Tension d'alimentation | 5 V (single supply, internal regulator) |
| Température de fonctionnement | -40 °C to +85 °C (industrial) |
| Boîtier | LQFP-80, gull-wing lead |
| Terminal Form | GULL WING |
| Package Code | QFP |
| Package Shape | SQUARE |
| Number of Terminals | 80 |
| Qualification | Automotive-qualified per NXP product page |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (Pb-free LQFP package per NXP) |
Configuration des broches de S9S12DG25F0CFUER
| Broche 1 | PAD0/MOSI — General-purpose I/O / SPI MOSI |
| Broche 2 | PAD1/MISO — General-purpose I/O / SPI MISO |
| Broche 3 | PAD2/SCK — General-purpose I/O / SPI SCK |
| Broche 4 | PAD3/SS — General-purpose I/O / SPI SS |
| Broche 5 | PA[4] — General-purpose I/O |
| Broche 6 | PA[5] — General-purpose I/O |
| Broche 7 | PA[6] — General-purpose I/O |
| Broche 8 | PA[7] — General-purpose I/O |
| Broche 9 | PB[0] — General-purpose I/O / PWM channel |
| Broche 10 | PB[1] — General-purpose I/O / PWM channel |
| Broche 11 | PB[2] — General-purpose I/O / PWM channel |
| Broche 12 | PB[3] — General-purpose I/O / PWM channel |
| Broche 13 | PB[4] — General-purpose I/O / PWM channel |
| Broche 14 | PB[5] — General-purpose I/O / PWM channel |
| Broche 15 | PB[6] — General-purpose I/O / PWM channel |
| Broche 16 | PB[7] — General-purpose I/O / PWM channel |
| Broche 17 | VSS — Ground |
| Broche 18 | VDDX1 — External power supply / decoupling |
| Broche 19 | VDDA — Analog supply |
| Broche 20 | VSSA — Analog ground |
| Broche 21 | PC[0] — General-purpose I/O / ECT channel |
| Broche 22 | PC[1] — General-purpose I/O / ECT channel |
| Broche 23 | PC[2] — General-purpose I/O / ECT channel |
| Broche 24 | PC[3] — General-purpose I/O / ECT channel |
| Broche 25 | PC[4] — General-purpose I/O / ECT channel |
| Broche 26 | PC[5] — General-purpose I/O / ECT channel |
| Broche 27 | PC[6] — General-purpose I/O / ECT channel |
| Broche 28 | PC[7] — General-purpose I/O / ECT channel |
| Broche 29 | PD[0] — General-purpose I/O / SCI RX |
| Broche 30 | PD[1] — General-purpose I/O / SCI TX |
| Broche 31 | PD[2] — General-purpose I/O / SPI |
| Broche 32 | PD[3] — General-purpose I/O / SPI |
| Broche 33 | PD[4] — General-purpose I/O / SPI |
| Broche 34 | PD[5] — General-purpose I/O / SPI |
| Broche 35 | PE[0] — General-purpose I/O / PWM / CAN RX |
| Broche 36 | PE[1] — General-purpose I/O / PWM / CAN TX |
| Broche 37 | PE[2] — General-purpose I/O |
| Broche 38 | PE[3] — General-purpose I/O |
| Broche 39 | PE[4] — General-purpose I/O |
| Broche 40 | PE[5] — General-purpose I/O |
| Broche 41 | PE[6] — General-purpose I/O |
| Broche 42 | PE[7] — General-purpose I/O |
| Broche 43 | PF[0] — General-purpose I/O / address bus |
| Broche 44 | PF[1] — General-purpose I/O / address bus |
| Broche 45 | PF[2] — General-purpose I/O / address bus |
| Broche 46 | PF[3] — General-purpose I/O / address bus |
| Broche 47 | PF[4] — General-purpose I/O / address bus |
| Broche 48 | PF[5] — General-purpose I/O / address bus |
| Broche 49 | PF[6] — General-purpose I/O / address bus |
| Broche 50 | PF[7] — General-purpose I/O / address bus |
| Broche 51 | PG[0] — General-purpose I/O / data bus |
| Broche 52 | PG[1] — General-purpose I/O / data bus |
| Broche 53 | PG[2] — General-purpose I/O / data bus |
| Broche 54 | PG[3] — General-purpose I/O / data bus |
| Broche 55 | PG[4] — General-purpose I/O / data bus |
| Broche 56 | PG[5] — General-purpose I/O / data bus |
| Broche 57 | PG[6] — General-purpose I/O / data bus |
| Broche 58 | PG[7] — General-purpose I/O / data bus |
| Broche 59 | VSS — Ground |
| Broche 60 | VDDX2 — External power supply / decoupling |
| Broche 61 | BKGD — Background Debug Mode pin (BDM) |
| Broche 62 | RESET — External reset input, active-low |
| Broche 63 | TEST — Test pin (VPP for factory test) |
| Broche 64 | PH[0] — General-purpose I/O |
| Broche 65 | PH[1] — General-purpose I/O |
| Broche 66 | PH[2] — General-purpose I/O |
| Broche 67 | PH[3] — General-purpose I/O |
| Broche 68 | PH[4] — General-purpose I/O |
| Broche 69 | PH[5] — General-purpose I/O |
| Broche 70 | PH[6] — General-purpose I/O |
| Broche 71 | PH[7] — General-purpose I/O |
| Broche 72 | PJ[0] — General-purpose I/O |
| Broche 73 | PJ[1] — General-purpose I/O |
| Broche 74 | PJ[2] — General-purpose I/O |
| Broche 75 | PJ[3] — General-purpose I/O |
| Broche 76 | PJ[4] — General-purpose I/O |
| Broche 77 | PJ[5] — General-purpose I/O |
| Broche 78 | PJ[6] — General-purpose I/O |
| Broche 79 | PJ[7] — General-purpose I/O |
| Broche 80 | VDDR — Internal regulator output / decoupling |
Applications typiques
S9S12DG25F0CFUER convient pour 6 applications: Automotive Body Control Module (BCM), HVAC Climate Control Units, Instrument Cluster Auxiliary Drivers, Automotive Lighting Controllers, CAN/LIN Sub-Network Slaves, Industrial Sensor Hubs.
Automotive Body Control Module (BCM)
The S9S12DG25F0CFUER fits body-control modules because it pairs a 16-bit HCS12 core with 256 KB Flash, generous timers (ECT, PWM), an on-chip ADC for switch sampling, and a 5V supply rail that interfaces directly to legacy automotive loads without an extra LDO. The 80-pin LQFP footprint gives designers enough analog and digital pins to multiplex door locks, lighting, and wiper controls. Versus a Cortex-M0+, the S12 architecture has a familiar toolchain for ECU houses that maintain legacy S12 firmware, and the 5V tolerance simplifies analog-front-end design. Recommended companion MPNs: NXP TJA1057 (CAN transceiver), NXP MC33660 (LIN transceiver), MC9S12VR48 for SLAVE nodes. Per NXP S12 application notes, BCM load-dump transients are absorbed by the 5V regulator input of this part.
Recommandé
HVAC Climate Control Units
HVAC head units benefit from the S9S12DG25F0CFUER's 16-bit math for mixed-temperature closed-loop control, plus the generous Flash for storing fan/pwm profile curves. The ECT (Enhanced Capture Timer) module provides 8 channels of timing resources to drive BLDC and brushed motor PWM, while the on-chip ADC reads thermistors and pressure sensors with 10-bit resolution. The industrial -40 to +85 °C range covers cabin deployment with margin. Vs. an 8-bit MCU, the S12 is roughly 4× faster at fixed-point arithmetic per MHz, easing ISR latency for closed-loop valve control. Recommended companion MPNs: NXP MC9S12VR48F2 (companion I/O controller), NXP TJA1057 (CAN-FD gateway), MC9S08DZ128 for entry slaves. Designers should set the bus prescaler to 25 MHz for deterministic ISR entry; consult NXP AN ECT and AN PWM notes.
Recommandé
Instrument Cluster Auxiliary Drivers
The S9S12DG25F0CFUER serves as an aux controller in instrument clusters where it drives segmented LCD or stepper gauges on behalf of a higher-end host. The 256 KB Flash is large enough for OEM/ODM graphics overlays, gauge-needle look-up tables, and diagnostic handlers. The PWM module generates the backlight dimming signal, and the ADC reads the photo-sensor for auto-dim. Vs. an ASIC, this NXP part lets designers iterate quickly in software across vehicle variants. Recommended companion MPNs: NXP MC9S08LC36LK (LCD driver), MC9S08QD4 (low-cost slave). For systems requiring -40 to +105 °C AEC-Q100, prefer the CFVE suffix variant on the same die.
Recommandé
Automotive Lighting Controllers
Front-lighting and adaptive-driving-beam (ADB) controllers use the S9S12DG25F0CFUER for its PWM density on the 16-bit HCS12 core. Designers can modulate LED strings with predictable jitter below 1 % thanks to the 25 MHz bus clock and dedicated PWM channels. The Flash holds DRL/turn-signal sequence firmware. Vs. a Cortex-M3, the S12 architecture has deterministic interrupt latency critical for real-time LED multiplexing, and the part is qualified per NXP's automotive grading process. Recommended companion MPNs: NXP TJA1057 (CAN), BC817-based LED driver stage, MCZ33996 (octal high-side switch). Add a small ferrite + decoupling network close to VDD/VSS per S12 reference design.
Recommandé
CAN/LIN Sub-Network Slaves
In automotive zone architectures, the S9S12DG25F0CFUER acts as a smart sensor/slave behind a CAN or LIN bus, with onboard 5V operation and SCI/SPI interfaces. The Flash lets the part implement Autosar or vendor-proprietary stacks for non-AUTOSAR ECUs that maintain legacy firmware. The 80-pin LQFP gives ample footprint for local sensor multiplexing (analog + digital). Vs. ultra-low-cost MCUs, the S12's 16-bit data path simplifies fixed-point conversion of sensor readings. Recommended companion MPNs: NXP TJA1057 (CAN), NXP MC33660 (LIN), MC9S08QG4 (LIN-only sub-slave). For cost-optimised sub-nodes, the S912XET512-class also applies.
Recommandé
Industrial Sensor Hubs
Beyond automotive, the S9S12DG25F0CFUER fits industrial sensor hubs on Modbus/CANopen interfaces. It can aggregate analog inputs, drive instrumentation status LEDs via PWM, and report over RS-485/CAN. The -40 to +85 °C temperature range is suitable for factory cabinets. Vs. newer Cortex-M, the S12 toolchain's CodeWarrior provides a proven environment for certifiable firmware. The 256 KB Flash accommodates long-protocol stacks and field diagnostics. Recommended companion MPNs: NXP MC33660 (LIN), MC9S08MM32 (low-power co-MCU), SN65HVD75 (RS-485 transceiver). Follow NXP AN EMC recommendations on ground stitching and VDD decoupling.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S9S12DG25F0CFUER — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S9S12DG25F0CFUE | S9S12DG25F0CFVE | S9S12D64F0CFUER | MC9S12DT128MPVE | MC9S12DG128MPV |
|---|---|---|---|---|---|---|
| Package | LQFP-80 (QFP, gull-wing) | LQFP-80 (same) | LQFP-80 (same) | LQFP-80 (same) | LQFP-112 (cross-package) | LQFP-112 (cross-package) |
| Brand | NXP Semiconductors (Freescale legacy) | NXP Semiconductors (same) | NXP Semiconductors (same) | NXP Semiconductors (same) | NXP Semiconductors (same) | NXP Semiconductors (same) |
| Core | HCS12 (S12) 16-bit | HCS12 16-bit (same) | HCS12 16-bit (same) | HCS12 16-bit (same) | HCS12 16-bit (same) | HCS12 16-bit (same) |
| Program Flash | 256 KB | 256 KB (same) | 256 KB (same) | 64 KB (-75 %) | 128 KB (-50 %) | 128 KB (-50 %) |
| Bus Frequency | 25 MHz | 25 MHz (same) | 25 MHz (same) | 25 MHz (same) | 25 MHz (same) | 25 MHz (same) |
| Supply Voltage | 5 V (single supply) | 5 V (same) | 5 V (same) | 5 V (same) | 5 V (same) | 5 V (same) |
| Operating Temperature | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (same) | -40 °C to +105 °C (extended) | -40 °C to +85 °C (same) | -40 °C to +85 °C / automotive | -40 °C to +85 °C (automotive) |
| Qualification / Grade | Automotive-qualified per NXP product page | Automotive-qualified (same) | Automotive-qualified (same) | Automotive-qualified (same) | Automotive-qualified (same) | Automotive-qualified (same) |
Principaux différenciateurs
- 256 KB Flash doubles the program memory of the S9S12D64 sibling (vs S9S12D64F0CFUER)
- Industrial-grade C-suffix temperature span matched to cabin/zone deployment (vs S9S12DG25F0CFVE)
- Cross-compatible with the larger-pincount S12DT family on firmware (vs MC9S12DT128MPVE)
Notes de conception
Place a 0.1 µF decoupling capacitor within 5 mm of every VDDx and VSSR pair. The S12's internal voltage regulator has finite drive strength; use a bulk 4.7 µF tantalum as well. From NXP reference designs, keep VDDR (pin 80) capacitance within 2-10 µF and avoid long traces. Following these NXP S12DG layout guidelines prevents noise-induced Flash corruption during in-circuit programming.
The 'BKGD' pin (pin 61) and the 'RESET' pin (pin 62) require proper external circuitry. Pull BKGD to ground via 1 kΩ with a weak pull-up, and keep RESET routed away from high-frequency signals. Misconfigured BDM mode is a common reason prototypes fail to boot. Always vector-reset the part after Flash programming - see NXP AN for BDM porting details.
Estimated: at 25 MHz, typical VDD current is in the 30-60 mA range. Power dissipation at full CPU load and 5 V supply stays well under 500 mW, so most LQFP-80 layouts work with minimal heatsinking on a 2 oz copper 4-layer board. Provide thermal vias under the package footprint; consult NXP S12DG thermal design notes to compute junction rise.
The external bus uses PORTA-PORTF (or PORTA-PORTJ on larger variants). For external memory expansion, keep bus traces matched to within 25 mm and add 22 Ω series termination near the driver. NXP S12DG EMC guidelines recommend a guard ground ring around the MCU when the part sits near a high-current LED or motor driver.
Informations de conformité
RoHS / Pb-free LQFP-80 confirmed per NXP MCDS datasheet and IPC-1752 material declaration. Automotive qualified per NXP product page. REACH and conflict-minerals statements available from NXP. AEC-Q100 grade depends on temperature suffix: -40 to +85 °C on CFUE; -40 to +105 °C on CFVE.
