STM32F746IGK7 - 216MHz Cortex-M7 MCU | STMicroelectronics
MPN: STM32F746IGK7 ✓ AktifSTM32F746IGK7 Ringkasan
A microcontroller is a programmable semiconductor system that integrates a CPU, memory, peripherals, and communication interfaces onto one device. The STM32F7 family sits within the hierarchy of microcontrollers, embedded processors, and semiconductor components. Compared with a general-purpose processor, an STM32 MCU provides deterministic peripheral control, embedded flash and RAM, low-power operating modes, and a compact package suitable for industrial and consumer equipment.
Key verified features include a 32-bit Arm Cortex-M7 core operating at up to 216 MHz, 1 MB of program flash, single-core operation, and an L1 cache. Additional listed capabilities include DSP, FPU, SDRAM, TFT, and hardware acceleration for suitable graphics and signal-processing workloads. These features allow the MCU to manage real-time control loops while also executing protocol, display, and data-processing tasks.
The STM32F746IGK7 belongs to the STM32F746IG family, whose Cortex-M7 architecture combines a high-clock-rate core with extensive serial and display-oriented peripherals. The exact RAM size, voltage range, peripheral list, GPIO count, operating-temperature limits, and package dimensions are not included in the supplied verified records and therefore should be confirmed in the official STM32F746IG documentation before design release.
Typical uses include industrial automation equipment, TFT-based human-machine interfaces, connected industrial controllers, audio and communications equipment, and embedded systems requiring 1 MB of local flash. The compact 10x10 mm UFBGA package is useful for space-constrained designs, but its fine pitch and exposed-pad construction require careful PCB layout, stencil design, reflow-profile control, and inspection during manufacturing.
The primary design consideration is PCB implementation. Because this is a fine-pitch ball-grid-array package with 176 device balls plus 25 additional balls, power, ground, decoupling, and high-speed signals must be routed according to the manufacturer's package and board-layout guidance. Use the official STM32CubeMX configuration tools and ST programming tools only after confirming the selected board, clock tree, memory configuration, and peripheral pin assignments.
This page consolidates verified distributor specifications, current pricing information, family-level replacement context, and practical BGA implementation guidance. It also distinguishes confirmed STM32F746IGK7 data from parameters that still require datasheet review, supporting faster procurement and engineering evaluation without presenting unsupported specifications as facts.
Alternatif penggantian untuk STM32F746IGK7 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian STM32F746IGK7 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Mounting Type, Series, Supply Voltage.
STM32F746IGK6
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →STM32F746IGT6
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →STM32F745IGK6
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →STM32F745IGT6
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →STM32F745IGK7
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
STM32F746IGK7 Rating Maksimal & Karakteristik Listrik
| Product Type | 32-bit Arm Cortex-M7 microcontroller |
| Manufacturer | STMicroelectronics |
| CPU Core | Arm Cortex-M7 |
| Instruction Set | 32-bit RISC |
| Maximum CPU Frequency | 216 MHz |
| Core Configuration | Single-core |
| Flash Memory | 1 MB (1M x 8) |
| DSP and FPU Support | DSP and floating-point unit |
| Cache | L1 cache |
| External Memory Interfaces | SDRAM support |
| Display Support | TFT support |
| Hardware Acceleration | Art Accelerator |
| Paket | 176+25 UFBGA (10x10) |
| Tipe Mounting | Surface mount ball-grid array |
| Package Body Size | 10 mm x 10 mm |
| Number of Device Balls | 176 balls plus 25 additional balls |
STM32F746IGK7 10 mm x 10 mm Diamant Konfigurasi Panduan
Konfigurasi pin untuk STM32F746IGK7 (10 mm x 10 mm pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk STM32F746IGK7.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
STM32F746IGK7 cocok untuk 6 aplikasis: Industrial TFT Human-Machine Interface, Industrial Automation Controller, Communications and Network Gateway, Audio Signal Processing, Embedded Data Acquisition System, Smart Connected Device.
Industrial TFT Human-Machine Interface
The STM32F746IGK7 fits an industrial TFT human-machine interface because it combines a 216 MHz Arm Cortex-M7 core with 1 MB of flash, FPU and DSP support, TFT capability, SDRAM support, an L1 cache, and the Art Accelerator. It can execute display-management code, touch-interface processing, communications, and supervisory control functions in one device. The compact 10x10 mm UFBGA also preserves board area, but the design must provide a controlled 176+25-ball land pattern, suitable power and decoupling, and an assembly process capable of handling the fine pitch. Before industrial release, confirm the exact temperature grade, electrical limits, EMC requirements, and long-term product availability from the official datasheet and product page.
Direkomendasikan
Industrial Automation Controller
The STM32F746IGK7 is appropriate for an industrial automation controller requiring deterministic control, network management, and local data processing. Its 216 MHz Cortex-M7 core and FPU accelerate control loops and signal calculations, while the 1 MB flash provides room for protocol stacks, configuration data, and control firmware. Integrated TFT, SDRAM, and Art Accelerator support can also simplify sophisticated operator-panel designs. The primary engineering trade-off is package complexity: the 176+25 UFBGA requires careful escape routing, solid ground-plane continuity, and assembly inspection. Verify the device's exact GPIO assignments, voltage range, temperature rating, watchdog behavior, and peripheral availability before freezing the schematic.
Direkomendasikan
Communications and Network Gateway
The STM32F746IGK7 can serve as the host processor in a communications gateway that combines protocol management, data buffering, and control functions. Its 216 MHz Cortex-M7 core, L1 cache, 1 MB flash, DSP support, and SDRAM capability provide useful headroom for packet handling, filtering, and simultaneous peripheral tasks. The single-core configuration simplifies clock and synchronization planning compared with a heterogeneous implementation, although the designer must still budget memory bandwidth and ensure interrupt latency meets protocol timing. A cross-brand pin-compatible second source was not verified, so supply-risk mitigation should be based on approved STMicroelectronics variants rather than an assumed industry-standard footprint.
Direkomendasikan
Audio Signal Processing
The STM32F746IGK7 fits audio signal-processing applications that benefit from a high-speed Cortex-M7 core with FPU and DSP support. At up to 216 MHz, it can combine audio decoding or filtering, user-interface control, communications, and data logging within one embedded platform. The 1 MB flash supports larger firmware and fixed tables, while SDRAM support can be valuable when waveform or display buffering exceeds internal-memory requirements. The implementation should account for deterministic interrupt timing, memory latency, and analog-to-digital or digital-to-analog signal-chain errors, which are separate from the MCU's digital processing capability. Verify the exact supported audio peripherals and DMA configuration in the manufacturer datasheet.
Direkomendasikan
Embedded Data Acquisition System
The STM32F746IGK7 is useful for a compact embedded data-acquisition system requiring local control, signal conditioning supervision, buffering, and communications. The 216 MHz Cortex-M7 core can execute DSP algorithms, the FPU supports floating-point calculations, and the 1 MB flash accommodates acquisition firmware and calibration data. Its L1 cache can improve code execution in data-intensive routines, while SDRAM support permits larger sample or display buffers where needed. The design must partition acquisition timing from non-real-time communication tasks and verify DMA, cache-coherency, and interrupt priorities. Because the supplied records do not specify the complete ADC characteristics, analog accuracy and channel performance must be evaluated from the official STM32F746IG documentation.
Direkomendasikan
Smart Connected Device
The STM32F746IGK7 can support a smart connected device that combines local UI processing, protocol handling, and real-time control. Its 1 MB flash, FPU, DSP, TFT, SDRAM, and Art Accelerator features provide a flexible platform for connected industrial products, premium controls, and compact edge nodes. The 10x10 mm UFBGA reduces footprint but makes PCB and assembly capability a critical constraint; a design without proven fine-pitch BGA assembly should evaluate a higher-pin-count or leaded package alternative. For connected equipment, validate boot security, peripheral update methods, communication timing, brownout behavior, and the exact package pin map before production. No verified cross-brand drop-in MCU was found, reducing the practicality of a footprint-only second-source strategy.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk STM32F746IGK7 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | STM32F746IGK6 | STM32F746IGT6 | STM32F745IGK6 | STM32F745IGT6 | STM32F745IGK7 |
|---|---|---|---|---|---|---|
| Manufacturer | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 176+25 UFBGA (10x10) | 176+25 UFBGA (10x10) - same | 176+25 UFBGA (10x10) - same | 176+25 UFBGA (10x10) - same | 176+25 UFBGA (10x10) - same | 176+25 UFBGA (10x10) - same |
| CPU Core | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 |
| Maximum CPU Frequency | 216 MHz | 216 MHz | 216 MHz | 216 MHz | 216 MHz | 216 MHz |
| Architecture | 32-bit RISC | 32-bit RISC | 32-bit RISC | 32-bit RISC | 32-bit RISC | 32-bit RISC |
Diferensiator Kunci
- Confirmed F746 feature set for display-oriented embedded systems (vsSTM32F745IGK7)
- Same package family with a 216 MHz Cortex-M7 performance target (vsSTM32F746IGK6)
- Compact 10x10 mm package with high-performance single-core control (vsSTM32F745IGT6)
Catatan Desain
Use the official STM32F746IG package drawing and recommended PCB land pattern rather than deriving a generic 176+25 UFBGA layout. The 10x10 mm footprint has fine pitch and requires uniform power and ground connections, short return paths, and careful via placement. Keep sensitive clocks and communication routes away from noisy switching nodes, provide local bulk and high-frequency decoupling at each supply group, and preserve continuous ground-plane coverage beneath the device. Validate escape-routing and solder-joint inspection rules with the selected board fabricator before release.
Estimate power dissipation from the actual operating mode rather than using the 216 MHz headline frequency alone. The Cortex-M7 core, cache, external memory, display peripherals, and I/O activity can each contribute dynamic power, while the UFBGA package relies heavily on its thermal-via and copper-land arrangement for heat removal. Review junction-temperature limits for the selected voltage and temperature grade, place thermal vias according to the manufacturer recommendation, and use a board-level thermal test at maximum workload. Exact thermal resistance and maximum junction temperature are unavailable in the supplied records and must be taken from the official datasheet.
Plan the clock, power, reset, boot, and debug paths before assigning general-purpose I/O. Keep the 216 MHz clock distribution clean and controlled, route sensitive analog or communication signals away from switching-node copper, and use the L1 cache only with firmware and memory placement that account for cache-coherency and DMA behavior. Because SDRAM is listed as a capability, its trace topology, reference plane, impedance, and controller configuration must follow STMicroelectronics layout guidance. A successful schematic does not by itself validate signal integrity at the intended clock or memory bandwidth.
Do not treat a shared family name as proof that an alternative is a drop-in replacement. Before substituting any listed STM32F7 candidate, compare the complete order code, pin names, power pins, exposed-ball assignments, flash and RAM size, peripheral availability, temperature grade, clock limits, and firmware-support status. The supplied search results do not expose the full 201-ball pin map or complete electrical tables, so the official STM32 documentation and STM32CubeMX configuration must be used to verify compatibility.
Informasi Konformitas
The supplied verified records do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for STM32F746IGK7. These fields require confirmation from the current STMicroelectronics product page or declaration documents.
