XA7A75T-1CSG324Q - Automotive Artix-7 FPGA | AMD
MPN: XA7A75T-1CSG324Q ✓ AktifXA7A75T-1CSG324Q Ringkasan
An FPGA is a programmable semiconductor whose logic blocks, I/O, memory, and clock resources can be configured after manufacture. It sits within the programmable-logic hierarchy as a field-programmable gate array, alongside CPLDs and other programmable-logic devices. Unlike a fixed-function application-specific integrated circuit, an FPGA allows designers to implement parallel data paths, control logic, protocol bridges, sensor fusion, and hardware accelerators while retaining the flexibility to revise functionality through configuration updates.
The XA7A75T-1CSG324Q combines 210 inputs with 210 outputs and a maximum clock frequency of 1098 MHz. Its 324-terminal S-PBGA arrangement provides a high pin count in a 15 x 15 mm surface-mount package. The 0.80 mm ball pitch creates a demanding but standardized land pattern that requires careful ball-placement review, fine-pitch PCB construction, and assembly-process control. Its -40°C to 125°C rating and AEC-Q100 compliance align it with automotive temperature and quality requirements.
The Artix-7 XA architecture is intended for compact, low-power programmable systems where higher-end FPGA resources would add unnecessary size, power, or complexity. At the device level, maximum clock capability describes the highest characterized operating condition rather than the frequency at which every user design can run. Actual timing performance depends on the selected clock, resource utilization, I/O standards, routing, voltage, and timing constraints in the completed design.
Typical automotive uses include advanced driver-assistance electronics, sensor-processing and fusion nodes, infotainment control, vehicle networking, camera and radar interfaces, gateway logic, and centralized electrical systems. The combination of automotive qualification, broad temperature support, configurable parallel logic, and a 210-I/O interface is useful when a system requires deterministic hardware behavior and design flexibility without a larger application-specific ASIC.
For PCB implementation, use the AMD Artix-7 package pinout files and the device-specific schematic and layout guidance before assigning power, ground, configuration, clock, and I/O pins. Treat the 324-ball footprint as a high-density BGA assembly and validate escape routing, via-in-pad strategy, solder-mask design, reflow profile, and continuity testing. Confirm the selected configuration bitstream against the exact device revision before production programming.
This product record combines the XA7A75T-1CSG324Q electrical identity, package characteristics, application guidance, qualified comparison options, and practical implementation notes. It is intended to help engineers evaluate the device quickly while still using the AMD datasheet, UG475 package guidance, and official package pinout files for design release.
Alternatif penggantian untuk XA7A75T-1CSG324Q — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian XA7A75T-1CSG324Q (sama faktor bentuk dan footprint) — berbeda di dalam Automotive Qualification, Device Type.
XA7A75T-1CSG324I
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
XA7A75T-1CSG324E
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
XA7A75T-1CSG324C
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
XA7A75T-2CSG324I
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →XA7A75T-2CSG324Q
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
XA7A75T-1CSG324Q Rating Maksimal & Karakteristik Listrik
| Device Type | Artix-7 XA field-programmable gate array (FPGA) |
| Total Input Count | 210 inputs |
| Total Output Count | 210 outputs |
| Total I/O Count | 210 I/O |
| Frekuensi Bawah Maximum | 1098 MHz |
| Package Type | 324-terminal S-PBGA |
| Package Code | CSG324 |
| Package Dimensions | 15 x 15 mm |
| Ball Pitch | 0.80 mm |
| Terminal Count | 324 terminals |
| Package Shape | Square |
| Tipe Mounting | Surface-mount ball-grid array |
| Rentang Suhu Kerja | -40°C to +125°C |
| Automotive Qualification | AEC-Q100 compliant |
| Temperature Grade | Automotive grade |
XA7A75T-1CSG324Q square Diamant Konfigurasi Panduan
Konfigurasi pin untuk XA7A75T-1CSG324Q (square pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk XA7A75T-1CSG324Q.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
XA7A75T-1CSG324Q cocok untuk 6 aplikasis: Automotive Sensor Fusion and Control, Advanced Driver-Assistance Electronics, Vehicle Network Gateway, Automotive Infotainment Control, Industrial and Automotive Control Platform, Secure Communications and Protocol Conversion.
Automotive Sensor Fusion and Control
The XA7A75T-1CSG324Q fits compact sensor-fusion and vehicle-control nodes that combine camera, radar, or environmental sensor inputs. Its 210 I/O provide substantial connectivity for parallel sensor buses, digital interfaces, and control signals, while the 1098 MHz maximum clock supports demanding timing paths. The -40°C to +125°C range and AEC-Q100 compliance align the FPGA with automotive environmental expectations. Use the programmable logic for data conditioning, timestamp handling, sensor monitoring, and real-time control, while confirming timing closure for every implemented path.
Direkomendasikan
Advanced Driver-Assistance Electronics
The XA7A75T-1CSG324Q is suitable for ADAS sub-systems requiring flexible hardware, extensive I/O, and automotive temperature support. Its configurable logic can implement sensor arbitration, object-detection pipeline control, video timing, and communication adaptation without fixing the hardware function permanently. The 210-I/O count simplifies parallel connectivity among image sensors, automotive transceivers, processors, and memory interfaces. The 1098 MHz device-level maximum supports demanding designs, but engineers must establish application-specific timing with the selected clock and design resources.
Direkomendasikan
Vehicle Network Gateway
The XA7A75T-1CSG324Q can support gateway logic that bridges vehicle networks and coordinates communication among domains. Its 210 I/O provide ample parallel signal access, and its programmable architecture allows protocol conversion, filtering, routing, and diagnostic functions to be adjusted through configuration changes. Automotive qualification and operation across -40°C to +125°C support use in temperature-exposed vehicle electronics. Place appropriate automotive transceivers beside the FPGA and validate protocol timing, fault containment, and network behavior under representative operating conditions.
Direkomendasikan
Automotive Infotainment Control
The XA7A75T-1CSG324Q can handle control, arbitration, and interface logic in automotive infotainment systems where programmable behavior and high I/O density are useful. The Artix-7 XA device supports 210 I/O for touch panels, audio routing, display control, external media interfaces, and internal vehicle networks. Its -40°C to +125°C operating range suits automotive cabin and electronics environments, while AEC-Q100 compliance provides an appropriate qualification baseline. Designers should partition graphics processing from time-critical control functions and verify EMC, display timing, and thermal requirements at system level.
Direkomendasikan
Industrial and Automotive Control Platform
The XA7A75T-1CSG324Q also fits high-speed industrial or mobile control platforms that benefit from a broad temperature range and extensive programmable I/O. It can coordinate motor and sensor interfaces, implement timing-critical control sequences, and adapt to changing production requirements without a board respin. The 210-I/O device reduces external glue logic for wide parallel buses and discrete interfaces. The 1098 MHz maximum clock provides substantial headroom for complex control paths, while final timing performance must be verified against actual routing and utilization.
Direkomendasikan
Secure Communications and Protocol Conversion
The XA7A75T-1CSG324Q can serve as a programmable protocol-conversion or communications-control engine in automotive and industrial equipment. Its 210 I/O allows multiple serial, parallel, and memory-facing interfaces to be consolidated, while the FPGA architecture supports fixed-latency datapaths and hardware-assisted filtering. Automotive qualification and the -40°C to +125°C operating range are valuable where the assembly sees vehicle temperature excursions. Designers should use the 1098 MHz maximum only as a device capability and close timing for the actual clocking, I/O standards, and implemented datapath.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk XA7A75T-1CSG324Q — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | XA7A75T-1CSG324I | XA7A75T-1CSG324E | XA7A75T-1CSG324C | XA7A75T-2CSG324I | XA7A75T-2CSG324Q |
|---|---|---|---|---|---|---|
| Package | 324-terminal S-PBGA (CSG324) | 324-terminal S-PBGA (CSG324) | 324-terminal S-PBGA (CSG324) | 324-terminal S-PBGA (CSG324) | 324-terminal S-PBGA (CSG324) | 324-terminal S-PBGA (CSG324) |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Artix-7 XA | Artix-7 XA | Artix-7 XA | Artix-7 XA | Artix-7 XA | Artix-7 XA |
| I/O Count | 210 I/O | 210 I/O | 210 I/O | 210 I/O | 210 I/O | 210 I/O |
| Speed Grade | -1 | -1 | -1 | -1 | -2 | -2 |
| Package Dimensions | 15 x 15 mm | 15 x 15 mm | 15 x 15 mm | 15 x 15 mm | 15 x 15 mm | 15 x 15 mm |
| Ball Pitch | 0.80 mm | 0.80 mm | 0.80 mm | 0.80 mm | 0.80 mm | 0.80 mm |
Diferensiator Kunci
- Automotive-grade ordering option (vsXA7A75T-1CSG324I)
- Higher speed grade within the same package (vsXA7A75T-2CSG324Q)
- High-density automotive interface capacity (vsXC7A12T-2CPG238C)
Catatan Desain
Treat the CSG324 land pattern as a fine-pitch 324-ball BGA rather than a conventional leaded package. Use the AMD package pinout files and board-design guidance to establish ball assignments, power and ground planes, decoupling, and via structures. The 0.80 mm pitch requires a PCB fabrication and assembly process with sufficient registration accuracy, and the layout should be reviewed for solder-mask definition, via-in-pad use, and component placement orientation.
Assign power and ground balls using the exact pin-description and power-decoupling guidance in the manufacturer datasheet and package files. Place local ceramic decoupling close to the corresponding device balls, preserve the intended ground-plane connectivity, and verify that power sequencing matches the selected configuration method. Do not infer ball functions from neighboring positions because CSG324 power, ground, configuration, clock, and user-I/O assignments are package-specific.
Do not treat the 1098 MHz figure as an automatic operating frequency for every FPGA design. The usable frequency depends on the clocking architecture, selected resources, routing, voltage, I/O standards, and timing constraints. Build the design with Vivado, apply timing constraints for board-level clocks and interfaces, and review timing at the operating temperature range before treating the configuration as production-ready.
Plan configuration access, clock distribution, high-speed I/O, and functional high-speed interfaces independently from the power network. Keep sensitive clock and interface routing short, provide clean return paths, and observe the AMD fanout and simultaneous-switching-noise guidance for the selected resources. Validate signal integrity with the actual board stack-up and account for connector, package, and PCB losses during implementation.
Informasi Konformitas
The device is identified as AEC-Q100 compliant with an operating temperature range of -40°C to +125°C. RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations are not specified in the cited device information.
