XA7A75T-1CSG324Q - Automotive Artix-7 FPGA | AMD
MPN: XA7A75T-1CSG324Q ✓ NakahandaXA7A75T-1CSG324Q Ulas
An FPGA is a programmable semiconductor whose logic blocks, I/O, memory, and clock resources can be configured after manufacture. It sits within the programmable-logic hierarchy as a field-programmable gate array, alongside CPLDs and other programmable-logic devices. Unlike a fixed-function application-specific integrated circuit, an FPGA allows designers to implement parallel data paths, control logic, protocol bridges, sensor fusion, and hardware accelerators while retaining the flexibility to revise functionality through configuration updates.
The XA7A75T-1CSG324Q combines 210 inputs with 210 outputs and a maximum clock frequency of 1098 MHz. Its 324-terminal S-PBGA arrangement provides a high pin count in a 15 x 15 mm surface-mount package. The 0.80 mm ball pitch creates a demanding but standardized land pattern that requires careful ball-placement review, fine-pitch PCB construction, and assembly-process control. Its -40°C to 125°C rating and AEC-Q100 compliance align it with automotive temperature and quality requirements.
The Artix-7 XA architecture is intended for compact, low-power programmable systems where higher-end FPGA resources would add unnecessary size, power, or complexity. At the device level, maximum clock capability describes the highest characterized operating condition rather than the frequency at which every user design can run. Actual timing performance depends on the selected clock, resource utilization, I/O standards, routing, voltage, and timing constraints in the completed design.
Typical automotive uses include advanced driver-assistance electronics, sensor-processing and fusion nodes, infotainment control, vehicle networking, camera and radar interfaces, gateway logic, and centralized electrical systems. The combination of automotive qualification, broad temperature support, configurable parallel logic, and a 210-I/O interface is useful when a system requires deterministic hardware behavior and design flexibility without a larger application-specific ASIC.
For PCB implementation, use the AMD Artix-7 package pinout files and the device-specific schematic and layout guidance before assigning power, ground, configuration, clock, and I/O pins. Treat the 324-ball footprint as a high-density BGA assembly and validate escape routing, via-in-pad strategy, solder-mask design, reflow profile, and continuity testing. Confirm the selected configuration bitstream against the exact device revision before production programming.
This product record combines the XA7A75T-1CSG324Q electrical identity, package characteristics, application guidance, qualified comparison options, and practical implementation notes. It is intended to help engineers evaluate the device quickly while still using the AMD datasheet, UG475 package guidance, and official package pinout files for design release.
Mga alternatibo na pwedeng ilagay na XA7A75T-1CSG324Q — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok XA7A75T-1CSG324Q (parehas na form factor at footprint) — pagkakaiba sa Automotive Qualification, Device Type.
XA7A75T-1CSG324I
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
XA7A75T-1CSG324E
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
XA7A75T-1CSG324C
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
XA7A75T-2CSG324I
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →XA7A75T-2CSG324Q
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
XA7A75T-1CSG324Q Mga Pinakamataas na Rating at Electrical Characteristics
| Device Type | Artix-7 XA field-programmable gate array (FPGA) |
| Total Input Count | 210 inputs |
| Total Output Count | 210 outputs |
| Total I/O Count | 210 I/O |
| Maksimum na Taktiko ng Oras | 1098 MHz |
| Package Type | 324-terminal S-PBGA |
| Package Code | CSG324 |
| Package Dimensions | 15 x 15 mm |
| Ball Pitch | 0.80 mm |
| Terminal Count | 324 terminals |
| Package Shape | Square |
| Uri ng Pagpapasok | Surface-mount ball-grid array |
| Hanay ng Temperature na Operasyon | -40°C to +125°C |
| Automotive Qualification | AEC-Q100 compliant |
| Temperature Grade | Automotive grade |
Gabay sa Pin Configuration ng XA7A75T-1CSG324Q square
Pin configuration para sa XA7A75T-1CSG324Q (square package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa XA7A75T-1CSG324Q.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
XA7A75T-1CSG324Q ay nararapat para sa 6 aplikasyons: Automotive Sensor Fusion and Control, Advanced Driver-Assistance Electronics, Vehicle Network Gateway, Automotive Infotainment Control, Industrial and Automotive Control Platform, Secure Communications and Protocol Conversion.
Automotive Sensor Fusion and Control
The XA7A75T-1CSG324Q fits compact sensor-fusion and vehicle-control nodes that combine camera, radar, or environmental sensor inputs. Its 210 I/O provide substantial connectivity for parallel sensor buses, digital interfaces, and control signals, while the 1098 MHz maximum clock supports demanding timing paths. The -40°C to +125°C range and AEC-Q100 compliance align the FPGA with automotive environmental expectations. Use the programmable logic for data conditioning, timestamp handling, sensor monitoring, and real-time control, while confirming timing closure for every implemented path.
Inirekomenda
Advanced Driver-Assistance Electronics
The XA7A75T-1CSG324Q is suitable for ADAS sub-systems requiring flexible hardware, extensive I/O, and automotive temperature support. Its configurable logic can implement sensor arbitration, object-detection pipeline control, video timing, and communication adaptation without fixing the hardware function permanently. The 210-I/O count simplifies parallel connectivity among image sensors, automotive transceivers, processors, and memory interfaces. The 1098 MHz device-level maximum supports demanding designs, but engineers must establish application-specific timing with the selected clock and design resources.
Inirekomenda
Vehicle Network Gateway
The XA7A75T-1CSG324Q can support gateway logic that bridges vehicle networks and coordinates communication among domains. Its 210 I/O provide ample parallel signal access, and its programmable architecture allows protocol conversion, filtering, routing, and diagnostic functions to be adjusted through configuration changes. Automotive qualification and operation across -40°C to +125°C support use in temperature-exposed vehicle electronics. Place appropriate automotive transceivers beside the FPGA and validate protocol timing, fault containment, and network behavior under representative operating conditions.
Inirekomenda
Automotive Infotainment Control
The XA7A75T-1CSG324Q can handle control, arbitration, and interface logic in automotive infotainment systems where programmable behavior and high I/O density are useful. The Artix-7 XA device supports 210 I/O for touch panels, audio routing, display control, external media interfaces, and internal vehicle networks. Its -40°C to +125°C operating range suits automotive cabin and electronics environments, while AEC-Q100 compliance provides an appropriate qualification baseline. Designers should partition graphics processing from time-critical control functions and verify EMC, display timing, and thermal requirements at system level.
Inirekomenda
Industrial and Automotive Control Platform
The XA7A75T-1CSG324Q also fits high-speed industrial or mobile control platforms that benefit from a broad temperature range and extensive programmable I/O. It can coordinate motor and sensor interfaces, implement timing-critical control sequences, and adapt to changing production requirements without a board respin. The 210-I/O device reduces external glue logic for wide parallel buses and discrete interfaces. The 1098 MHz maximum clock provides substantial headroom for complex control paths, while final timing performance must be verified against actual routing and utilization.
Inirekomenda
Secure Communications and Protocol Conversion
The XA7A75T-1CSG324Q can serve as a programmable protocol-conversion or communications-control engine in automotive and industrial equipment. Its 210 I/O allows multiple serial, parallel, and memory-facing interfaces to be consolidated, while the FPGA architecture supports fixed-latency datapaths and hardware-assisted filtering. Automotive qualification and the -40°C to +125°C operating range are valuable where the assembly sees vehicle temperature excursions. Designers should use the 1098 MHz maximum only as a device capability and close timing for the actual clocking, I/O standards, and implemented datapath.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for XA7A75T-1CSG324Q — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | XA7A75T-1CSG324I | XA7A75T-1CSG324E | XA7A75T-1CSG324C | XA7A75T-2CSG324I | XA7A75T-2CSG324Q |
|---|---|---|---|---|---|---|
| Package | 324-terminal S-PBGA (CSG324) | 324-terminal S-PBGA (CSG324) | 324-terminal S-PBGA (CSG324) | 324-terminal S-PBGA (CSG324) | 324-terminal S-PBGA (CSG324) | 324-terminal S-PBGA (CSG324) |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Artix-7 XA | Artix-7 XA | Artix-7 XA | Artix-7 XA | Artix-7 XA | Artix-7 XA |
| I/O Count | 210 I/O | 210 I/O | 210 I/O | 210 I/O | 210 I/O | 210 I/O |
| Speed Grade | -1 | -1 | -1 | -1 | -2 | -2 |
| Package Dimensions | 15 x 15 mm | 15 x 15 mm | 15 x 15 mm | 15 x 15 mm | 15 x 15 mm | 15 x 15 mm |
| Ball Pitch | 0.80 mm | 0.80 mm | 0.80 mm | 0.80 mm | 0.80 mm | 0.80 mm |
Pangunahing mga Pagkakaiba
- Automotive-grade ordering option (kumpara saXA7A75T-1CSG324I)
- Higher speed grade within the same package (kumpara saXA7A75T-2CSG324Q)
- High-density automotive interface capacity (kumpara saXC7A12T-2CPG238C)
Talaan ng Disenyo
Treat the CSG324 land pattern as a fine-pitch 324-ball BGA rather than a conventional leaded package. Use the AMD package pinout files and board-design guidance to establish ball assignments, power and ground planes, decoupling, and via structures. The 0.80 mm pitch requires a PCB fabrication and assembly process with sufficient registration accuracy, and the layout should be reviewed for solder-mask definition, via-in-pad use, and component placement orientation.
Assign power and ground balls using the exact pin-description and power-decoupling guidance in the manufacturer datasheet and package files. Place local ceramic decoupling close to the corresponding device balls, preserve the intended ground-plane connectivity, and verify that power sequencing matches the selected configuration method. Do not infer ball functions from neighboring positions because CSG324 power, ground, configuration, clock, and user-I/O assignments are package-specific.
Do not treat the 1098 MHz figure as an automatic operating frequency for every FPGA design. The usable frequency depends on the clocking architecture, selected resources, routing, voltage, I/O standards, and timing constraints. Build the design with Vivado, apply timing constraints for board-level clocks and interfaces, and review timing at the operating temperature range before treating the configuration as production-ready.
Plan configuration access, clock distribution, high-speed I/O, and functional high-speed interfaces independently from the power network. Keep sensitive clock and interface routing short, provide clean return paths, and observe the AMD fanout and simultaneous-switching-noise guidance for the selected resources. Validate signal integrity with the actual board stack-up and account for connector, package, and PCB losses during implementation.
Impormasyon ng Pagsunod sa Kautusan
The device is identified as AEC-Q100 compliant with an operating temperature range of -40°C to +125°C. RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations are not specified in the cited device information.
