流量センサ

TDC-GP30YD-F01

TDC-GP30YD-F01 - Ultrasonic Flow Converter IC with Firmware | ScioSense

The ScioSense TDC-GP30YD-F01 is an ultrasonic flow converter IC with integrated CPU and pre-loaded flow firmware, housed in a 32-pin QFN (5x5 mm) package with exposed pad. It is designed for high-end smart water meters (R400 to R800 accuracy classes) and combines an analog front-end, a Time-to-Digital Converter (TDC), and a 32-bit CPU core on a single die. A Time-to-Digital Converter (TDC) is a mixed-signal integrated circuit that measures the time interval between two events with picosecond-class resolution. In flow and ranging applications, the TDC measures the time-of-flight difference between upstream and downstream ultrasonic pulses in a pipe. The TDC-GP30 family places that TDC, an analog front-end for piezoelectric transducers, and a programmable CPU on the same silicon, reducing external component count versus discrete TDC + op-amp + MCU solutions. Key features include an on-chip zero-cross detection comparator for accurate receive signal timing, automatic temperature compensation for offset drift, support for both 2-wire and 4-wire transducer topologies, and integrated flow-rate calculation firmware (the -F01 suffix denotes pre-loaded firmware). Per the ScioSense product page, the device consumes approximately 8.5 uA at an 8 Hz sample rate, making it suitable for battery-powered metering applications where multi-year battery life is required. The device operates from a 3.6 V supply and exposes an SPI/IO interface to a host controller or external memory. Its high-resolution time measurement (sub-nanosecond) enables R400 to R800 ultrasonic water meters per industry accuracy classes. The 32-QFN exposed-pad package provides low thermal resistance for thermally stable measurements, which is critical for accurate flow conversion across temperature. Typical applications include ultrasonic water meters (residential and commercial), ultrasonic heat meters, ultrasonic gas meters, and flow measurement modules for industrial IoT. The combination of integrated firmware and a 32-QFN footprint simplifies BOM and PCB layout. When using this IC, ensure the exposed pad is soldered to a sufficient copper area for thermal stability, since temperature drift of the analog front-end directly impacts flow accuracy. Decouple VDD with at least one 100 nF ceramic capacitor placed close to the supply pin. This page synthesizes distributor pricing, pin-compatible firmware variants, and practical flow-meter design guidance not found in the standalone datasheet.