FPGA & CPLD
製品 (6666)
EP2A40F1020I8N - APEX II FPGA 1.5M Gates FC-FBGA-1020 | Intel
The Intel EP2A40F1020I8N is a high-density APEX II family Field-Programmable Gate Array (FPGA) integrating 1.5 million system gates and 38,400 logic elements in a 1020-pin Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) package. Manufactured on a 0.15-micron CMOS process, the device operates from a 1.5 V core supply and is offered in the industrial -40 C to +100 C temperature grade as denoted by the I8 suffix. The APEX II architecture combines Look-Up Table (LUT)-based logic with embedded system blocks (ESBs) for memory and specialized functions, enabling high-throughput datapath and DSP-style designs. A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic function is defined by user-loaded configuration data rather than fixed mask metallization. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which also include CPLDs, PALs, and GALs, and they occupy the high-density end of that hierarchy. APEX II devices are positioned between classical gate-array ASICs and software-programmed microcontrollers, providing hardware-level parallelism for signal processing, glue logic, and accelerator functions where deterministic latency and high I/O count matter more than per-unit cost. Key specifications of the EP2A40F1020I8N include a maximum internal operating frequency around 376 MHz, embedded memory in the form of embedded system blocks, multiple Phase-Locked Loops (PLLs) for clock synthesis, and 735 user I/O pins supporting a wide range of single-ended and differential I/O standards. The FC-FBGA-1020 package is a high-density surface-mount BGA designed for high-speed signal integrity through short, controlled-impedance traces and a large ball-count footprint. Because the FC-FBGA package exposes the silicon die directly to the PCB through flip-chip solder bumps, thermal performance and PCB stack-up planning are critical design considerations. Typical applications for the EP2A40F1020I8N include telecommunications line cards, high-speed serial protocol bridging, ASIC prototyping, and high-performance DSP pipelines in industrial and test equipment. The high logic capacity and 735 I/Os make it well suited to system-on-chip prototyping where multiple interface controllers can be integrated into a single device. Designers frequently pair APEX II FPGAs with external SRAM, SDRAM, or DDR memory controllers and clock-generation PLLs to build complete system prototypes before committing to mask-programmed silicon. When designing with the EP2A40F1020I8N, engineers should plan for the FC-FBGA-1020 land pattern using multi-layer PCB stack-ups with buried vias or microvias to fan out the dense BGA ball field. Power integrity requires multiple dedicated 1.5 V core and 3.3 V I/O decoupling capacitors placed as close as possible to the package balls, along with a separate PLL analog supply filtered to minimize jitter. Signal-integrity simulations are recommended for all high-speed differential pairs, and JTAG access must be brought out for in-system programming and boundary-scan testing. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the original Altera APEX II datasheet, helping engineers evaluate the EP2A40F1020I8N for both new designs and legacy maintenance.
EP2A40F1020I9 - APEX II FPGA, 1.5M Gates, 1020-BGA | Altera
The Altera EP2A40F1020I9 is a high-density APEX II family field-programmable gate array (FPGA) delivering 1.5M system gates, 38,400 logic elements (cells), and a maximum operating frequency of 366 MHz, fabricated on a 0.15 µm process with a 1.5 V core supply, and housed in a 1020-pin FC-FBGA (flip-chip fine-pitch BGA) package. The "I9" suffix denotes the industrial temperature grade (-40 °C to +100 °C junction), making the part suitable for harsh-environment designs that require extended thermal headroom over commercial grades. As a member of the APEX II family, the EP2A40F1020I9 integrates embedded system blocks (ESBs) for dual-port RAM, ROM, and first-in/first-out (FIFO) buffering alongside a four-input look-up table (LUT) architecture and a true multi-level interconnect network that scales efficiently across large designs. Per the manufacturer classification, the device belongs to the Programmable Logic Devices, Field Programmable Gate Arrays - FPGAs category. An FPGA (field-programmable gate array) is a type of programmable logic device (PLD) that combines configurable logic blocks (CLBs), programmable routing, and I/O cells on a single silicon die. The hierarchy extends: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. FPGAs differ from CPLDs (complex programmable logic devices) in that FPGAs use distributed RAM-based LUTs and richer interconnect fabric, enabling higher logic density at the cost of volatile configuration storage (typically SRAM-based, requiring external boot PROM). APEX II devices specifically add embedded system blocks (ESBs) and support for high-speed differential I/O standards, positioning the family for ASIC-prototyping, telecom line-card, and DSP-front-end applications. Key features of the EP2A40F1020I9 include 1.5M system gates, 38,400 logic cells, embedded system blocks for distributed memory and FIFO operation, multi-level high-speed interconnect with up to 366 MHz internal performance, support for multiple I/O standards including LVDS, PCI, and GTL+, and in-system programmability through an IEEE 1149.1 JTAG interface or passive serial/parallel configuration modes. The 1020-pin FC-FBGA package delivers high pin count for wide parallel interfaces and dense memory buses. The APEX II architecture combines a four-input LUT-based logic element with embedded system blocks, allowing each ESB to be configured as dual-port RAM, single-port RAM, ROM, or FIFO with up to 4 Kbits per block. The interconnect hierarchy uses DirectDrive technology for predictable timing closure across the full device. Typical applications include ASIC prototyping and emulation, high-speed telecommunications line cards with multi-channel SERDES interfaces, DSP co-processing front-ends for software-defined radio, complex state machines for industrial automation, and high-density glue-logic replacement. The industrial temperature grade extends the device's reach into outdoor telecom, military, and aerospace platforms. When designing with this device, plan for an external configuration PROM (such as an EPC2 or EPC16) because APEX II SRAM-based FPGAs lose their bitstream on power-down. Decoupling must follow Altera's AN 74 application-note guidelines for 1020-pin FC-FBGA layouts, with bulk and high-frequency ceramic capacitors placed within 100 mils of every power pin. This page synthesizes distributor pricing, drop-in same-brand alternatives from the APEX II family, and practical design notes that augment the manufacturer's datasheet and Pin Information tables.
EP2A40F1020I9N - APEX II 1.5M Gates FPGA | Intel (Altera) | BGA-1020
The Intel (formerly Altera) EP2A40F1020I9N is a high-density APEX II Family Field-Programmable Gate Array (FPGA) featuring 1.5M system gates and 38,400 logic cells, fabricated on a 0.15 micrometer all-layer copper-metal process (up to eight metal layers). The device operates from a 1.5 V core supply and is packaged in a 1020-pin flip-chip FineLine BGA (FC-FBGA) supporting industrial temperature range (I9 suffix), with a maximum internal clock frequency of 366 MHz. An FPGA (Field-Programmable Gate Array) is a programmable logic IC belonging to the broader category of programmable logic devices (PLDs). Within the taxonomy it sits under: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. APEX II devices combine look-up table (LUT)-based logic elements, embedded system blocks (ESBs) for memory and dedicated arithmetic, and a high-speed interconnect, enabling single-chip implementations of complex datapaths, bus interfaces, and DSP functions that previously required multiple ASICs or discrete logic. Key features of the EP2A40F1020I9N include 735 bidirectional I/O lines, support for multiple I/O standards including 1 Gbps True-LVDS, LVPECL, pseudo-current mode logic (PCML), and HyperTransport signaling, plus on-chip memory and PLL-based clock management. The embedded system blocks provide True-Dual-Port RAM, single-port RAM, ROM, and CAM (Content-Addressable Memory) at densities up to 491,520 RAM bits depending on configuration. Typical applications include high-speed telecom and datacom line cards, multi-protocol bridge/router designs, DSP co-processing front-ends, video/image processing pipelines, and ASIC prototyping. The 1 Gbps serial I/O capability makes it well suited for backplane and chip-to-chip interconnect in switch fabrics and serializer/deserializer (SERDES) companion designs, while the large logic capacity supports wide datapath implementations such as Forward Error Correction (FEC) engines. Designers should plan thermal management carefully because the FC-FBGA package requires a heatsink or forced-air cooling at sustained high toggle rates; signal-integrity work on 735 user I/Os is also mandatory. Configuration is performed via Altera/Intel serial (Passive Serial) or parallel (Passive Parallel Asynchronous / Synchronous) modes using an EPC configuration device or a microprocessor, with JTAG (IEEE 1149.1) available for boundary-scan and in-system programming. This page synthesizes distributor pricing, drop-in APEX II family alternatives, and practical design notes that go beyond the manufacturer datasheet to accelerate your evaluation and BOM decisions.
EP2A40F1508 - Altera APEX II 40K LE FPGA, 1508-ball FBGA | Altera
The Altera EP2A40F1508 is a member of the APEX II family of programmable logic devices from Altera (now Intel Programmable Solutions Group), delivering up to 40,000 logic elements in a 1508-ball FineLine BGA package. Built on a 0.18 µm CMOS SRAM process, the APEX II family combines high-density LUT-based logic with embedded multiplier blocks and PLLs, supporting up to 1.5 million system gates of logic density. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic after manufacturing. Within the semiconductor hierarchy, an FPGA belongs to the family of programmable logic devices, sitting alongside CPLDs and PALs but offering higher logic density, more I/O, and embedded memory and multiplier resources. FPGAs typically integrate look-up tables (LUTs), flip-flops, block RAM, DSP blocks, high-speed transceivers, and clock management resources, allowing complex digital systems such as processors, DSP pipelines, and high-speed interfaces to be implemented in a single chip. Key features of the EP2A40F1508 include 40,000 typical logic elements, 1,500 Kbits of embedded system memory (ESBs), twelve embedded multiplier blocks supporting 9x9-bit signed multiplication, four phase-locked loops (PLLs) for clock synthesis, and up to 824 user I/O pins. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, HSTL, SSTL, and LVDS through dedicated I/O structures. The 1.5V core supply with hot-socketing capability makes it suitable for high-availability systems and multi-FPGAs. Architecturally, the APEX II family is organized into rows and columns of embedded system blocks (ESBs), logic array blocks (LABs), and dedicated routing channels. Each LAB contains ten logic elements (LEs), each comprising a 4-input LUT, a programmable register, and dedicated carry/chain logic. The embedded multiplier blocks accelerate DSP functions such as FIR filters and complex FFTs, allowing designers to replace external multiplier ICs. The on-chip PLLs provide frequency synthesis, phase shifting, and clock deskew, essential for high-speed synchronous designs. Typical applications for the EP2A40F1508 include high-speed telecommunications switching, DSP and image processing front-ends, PCI bridge and bus-interface logic, industrial control and factory automation controllers, and military/aerospace signal processing. The combination of large logic capacity and embedded multipliers makes this part well-suited for designs that previously required multiple ASICs or FPGAs. When designing with the EP2A40F1508, careful attention must be paid to power supply sequencing (1.5V core before 3.3V I/O), proper decoupling across the 1508-pin BGA, and thermal management for the 31x31 mm FineLine BGA package. The Altera Quartus II development suite (versions 4.0 through 7.2) is required for design entry, place-and-route, and bitstream generation. This page synthesizes distributor stock data, verified drop-in same-package alternatives from the Altera APEX II family, and design considerations not collected in a single document by the manufacturer. All pricing and stock data are quoted as of 2026-09-08.
EP2A40F33C-7 - Altera APEX II FPGA, 1500K Gates | Altera
The Altera EP2A40F33C-7 is a high-density member of the APEX II programmable logic device family, delivering approximately 1,500,000 system gates in a 33 mm FineLine BGA package with -7 speed grade. It is fabricated on a 0.15 µm CMOS process and combines look-up table (LUT)-based logic, embedded system blocks (ESBs) for dual-port RAM and ROM, and high-speed interconnect to support complex system-on-chip (SoC) integration. The -7 speed grade places it in the mid-performance tier of the APEX II family, suitable for high-clock-rate datapath and DSP-intensive designs. A Field Programmable Gate Array (FPGA) is a programmable logic device that engineers can configure after manufacture to implement custom integrated-circuit functionality. The taxonomy flows: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Within the broader programmable logic hierarchy, FPGAs sit above CPLDs (smaller, non-volatile, typically used for glue logic) and alongside mask-programmed gate arrays and structured ASICs. APEX II is positioned between older APEX 20K series and the later Stratix/Stratix II families, and was Altera's flagship high-density platform before being superseded. The defining features of the EP2A40 include up to 40,960 logic elements (LEs), embedded memory blocks totaling approximately 342 Kbits of dual-port RAM, support for LVDS, LVPECL, and various single-ended I/O standards, and up to four phase-locked loops (PLLs) for clock management. The FineLine BGA-33 package supports high I/O count while preserving signal integrity for high-speed serial and parallel interfaces. The device operates from a 1.5 V core supply with separate VCCIO banks for I/O flexibility across mixed-voltage system designs. Architecturally, APEX II combines a fine-grained logic fabric with ESBs that can be configured as memory, multipliers, or CAM. The LUT-based approach allows efficient mapping of state machines, datapaths, and pipelined arithmetic. The high-speed MultiTrack interconnect minimizes routing congestion for designs that would otherwise require a structured ASIC, making the EP2A40 well-suited for prototyping and low-to-medium volume production. Typical applications include high-speed telecommunications line cards, video and image processing pipelines, ASIC prototyping, DSP co-processing, and networking equipment where parallel processing throughput is essential. It is also used in industrial control and instrumentation requiring rapid custom logic implementation. When designing with the EP2A40F33C-7, ensure proper decoupling on all supply pins (per Altera's AN75 reference), follow IBIS models for signal-integrity analysis on high-speed nets, and use the Quartus II design software (version 6.0 or later, in legacy maintenance mode) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternatives within the APEX II family, and practical design notes that complement the manufacturer datasheet and Quartus II device support files.
EP2A40F33C-8 - 40K LE APEX II FPGA, FBGA-672 | Intel / Altera
The Intel / Altera EP2A40F33C-8 is a member of the APEX II programmable logic device (PLD) family, integrating 40,000 logic elements (LEs) in a 672-ball FineLine BGA (FBGA) package. The APEX II family combines look-up table (LUT)-based logic with embedded system blocks (ESBs) for high-density logic and memory operations, with the F33 package code identifying the 33 mm square FBGA substrate at a -8 speed grade. Field Programmable Gate Arrays (FPGAs) are a class of programmable logic devices that allow designers to configure digital logic after PCB fabrication, enabling rapid prototyping and design iteration. The APEX II family sits within the broader taxonomy of PLD -> CPLD/FPGA -> programmable logic IC -> semiconductor, and is designed for high-performance DSP, communications, and parallel processing applications. EP2A40 variants are typically used where high gate count and embedded dual-port RAM are required. The F33 package designation indicates a 672-ball FineLine BGA substrate at the 33 mm form factor, and the C suffix denotes a commercial operating temperature range (0C to +85C). The -8 speed grade specifies the slowest of three offered grades, which provides cost advantages for non-timing-critical designs. Moisture Sensitivity Level is MSL 3 per JEDEC J-STD-020, with a peak reflow temperature rating of 220C. EP2A40 devices combine four logic element groups, each containing ten LogicArray blocks, plus up to 1.125 Mbit of dual-port RAM implemented via embedded system blocks. Typical applications include PCI bus interfaces, high-speed DSP datapaths, telecommunications backplane bridging, and parallel coprocessing blocks. The 672-ball FBGA provides the I/O density required for wide datapath and external memory interfaces. When designing with this device, ensure MSL 3 handling procedures are followed during PCB assembly, as the plastic BGA absorbs moisture and requires a controlled bake-out before reflow. The -8 speed grade should be reserved for designs where timing margins exceed the slowest timing specifications. Use the Quartus II or MAX+PLUS II toolchain for synthesis, fitting, and timing analysis.
EP2A40F33C-9 - APEX II 40K FPGA, F33 FBGA-672 | Intel / Altera
The Intel / Altera EP2A40F33C-9 is a member of the APEX II family of programmable logic devices, providing up to 1.6 million equivalent system gates and 65 Kbytes of embedded RAM in a 672-ball FineLine BGA (F33) package with commercial temperature grade and -9 speed grade. According to manufacturer naming convention decoded by multiple distributors, the part is built on a 0.15 micrometer CMOS process with multi-core architecture supporting up to 1,690 Kbits of dedicated RAM and 16 high-speed LVDS channels. An FPGA (Field Programmable Gate Array) is a reprogrammable integrated circuit that contains an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks, all of which can be reconfigured by the designer after manufacturing. FPGAs sit at the boundary between general-purpose processors and ASICs: unlike microcontrollers they execute logic in hardware parallelism, and unlike ASICs they ship as blank silicon that customers customize in minutes rather than months. APEX II was Altera's high-density flagship prior to the Stratix era, targeting ASIC replacement, high-speed DSP datapaths, and bus-interface bridging. Key features of the EP2A40F33C-9 include 1.6 million maximum system gates, 65 Kbytes of embedded memory, four Delay-Locked Loops (PLLs) for clock conditioning, multi-voltage I/O support, and embedded LVDS channels capable of gigabit-per-second signaling. The F33 FineLine BGA package provides 672 balls on a 1.27 mm pitch, supporting dense board layouts and high pin-count signaling for parallel buses and memory interfaces. The -9 speed grade sits in the middle of the APEX II speed binning, balancing performance and power for cost-sensitive applications. The architecture is built on a Look-Up Table (LUT)-based fabric combined with dedicated multiplier, memory, and I/O elements. Embedded CAM blocks enable content-addressable memory applications such as network lookups and translation tables. The device supports hot-socketing, in-system programmability via JTAG, and configuration via serial PROM or parallel flash, allowing field updates without removing the device from its socket. Typical applications include ASIC prototyping and replacement, telecommunications switching equipment, high-speed serial protocol bridging, image and video processing pipelines, and military/aerospace control systems where legacy Altera design IP must remain supported. The wide I/O count makes it well suited to parallel processor glue logic and backplane interface bridging. When designing with this device, pay attention to the FineLine BGA breakout: 1.27 mm pitch requires at least 4-layer PCB stackup with microvias or HDI technology. The APEX II architecture requires the Quartus II (or MAX+PLUS II legacy) design software; verify tool support status before committing the design to a new schematic, since APEX II was classified NRND/EOL several years ago and many newer tool versions no longer target it. This page synthesizes distributor pricing for surplus stock, drop-in alternatives from the same Altera APEX II family that share the F33 FBGA-672 footprint, and practical design notes that go beyond what the manufacturer datasheet provides in isolation.
EP2A40F33I-7 - APEX II FPGA 33FBGA, Intel / Altera, Industrial
The Intel / Altera EP2A40F33I-7 is a high-density APEX II family Field Programmable Gate Array (FPGA) housed in a 33-ball Fine-pitch Ball Grid Array (FBGA) package, rated for industrial temperature range. It belongs to the APEX II programmable logic device family designed for high-performance, system-on-chip integration with embedded logic, memory, and high-speed interconnect. An FPGA (Field Programmable Gate Array) is a type of programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O that can be reconfigured by the designer after manufacturing. In the broader taxonomy, FPGAs sit under programmable logic -> logic ICs -> integrated circuits, offering ASIC-class performance with NRE-free development cycles. The APEX II family is positioned for high-density data-path and communication designs, sitting between earlier APEX 20K and later Stratix families in Altera's roadmap. Key features of the EP2A40F33I-7 include peak reflow compatibility up to 220 C (Pb-free reflow profile), Moisture Sensitivity Level 3 (MSL3) per JEDEC J-STD-020, and an industrial temperature grade (-40 C to +85 C ambient). The 33-ball FBGA package is optimized for compact board layouts while still supporting high I/O density. The device is part of Altera's APEX II family - the '40' suffix indicates the high-density member of that generation with the largest logic capacity in its class. Technically, the APEX II family combines Look-Up Table (LUT)-based logic with embedded system blocks and high-speed interconnect, supporting megafunction IP cores for memory controllers, DSP pipelines, and bus interfaces. Designers typically use the Quartus design suite to synthesize, place-and-route, and program the device via JTAG or configuration flash. The 33-ball FBGA offers the smallest footprint in the APEX II lineup while preserving the family's high-speed I/O capabilities. Typical applications include telecommunications infrastructure (line cards, backplanes), high-speed serial protocol bridging, industrial control and factory automation backplanes, ASIC prototyping, and test & measurement instrumentation. The industrial temperature grade supports deployment in uncontrolled thermal environments without derating. When designing with this part, note that MSL3 requires floor-life management: bake-out or re-bag with desiccant if exposed beyond 168 hours. Use a Pb-free reflow profile peaking at 220 C and ensure BGA pad design follows the IPC-7351 nominal-density land pattern for 0.8 mm-pitch FBGA to avoid joint defects. This page synthesizes distributor availability, verified package and qualification data, drop-in same-family alternatives from the Site MPN list, and practical MSL/reflow handling notes not aggregated in any single datasheet.
EP2A40F33I-8 - APEX II FPGA, 1.5M gates, 672 IO, F33 BGA
The Altera (now Intel) EP2A40F33I-8 is a high-density APEX II family Field-Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA (F33) package with speed grade -8 and industrial temperature rating. Built on a 0.18 µm SRAM-look-up-table architecture with embedded MultiCore Interconnect (MCI), the device delivers up to 1,500,000 typical gates, 40,960 logic elements (LEs), and 425,984 bits of embedded system memory for high-performance programmable logic designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. APEX II FPGAs belong to the broader programmable-logic hierarchy: FPGA -> programmable logic device (PLD) -> digital logic IC -> integrated circuit. They differ from CPLDs (Complex Programmable Logic Devices) by offering higher logic density, distributed RAM, dedicated DSP blocks, and high-speed I/O, making them the platform of choice for parallel datapath and high-bandwidth designs. Key features include four phase-locked loops (PLUs), four high-speed clock networks, support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, HSTL, LVDS, LVPECL), and 16 high-speed clock pins. Embedded system memory can be configured as FIFO, RAM, or ROM with parity support. The F33 package exposes 672 user I/O pins, providing massive pin density for memory-rich interfaces and parallel processing fabrics. The EP2A40F33I-8's architecture combines Look-Up Table (LUT) based logic elements with dedicated carry chains, cascade chains, and embedded memory blocks. This hybrid datapath is well suited to DSP, filtering, and bus-bridging applications that exceed the capacity of smaller FPGAs such as the Cyclone family. Configuration is volatile SRAM-based, requiring a serial or parallel configuration PROM such as the Altera EPC16 or EPC8 at power-up. Typical applications include high-speed telecommunications line cards, parallel image-processing pipelines, ASIC prototyping, bus-bridging between processor and high-speed memory, and industrial control designs that benefit from abundant I/O. Designers commonly pair the EP2A40F33I-8 with Altera Quartus II design software for synthesis, place-and-route, and timing analysis. When designing with the EP2A40F33I-8, ensure that the 672-ball FineLine BGA land pattern is matched by the PCB and that an appropriate external configuration device is selected for SRAM-based volatile configuration. Industrial temperature grade (-40 °C to +85 °C) and moisture sensitivity level 3 (MSL3) with peak reflow temperature of 220 °C per JEDEC J-STD-020 require controlled storage and reflow profiles. This page synthesizes verified distributor pricing, drop-in same-brand variants from the same Altera APEX II family, and practical PCB-layout and configuration-design notes that complement - rather than duplicate - the official Altera APEX II datasheet.
EP2A40F33I-9 - APEX II FPGA 1.5M gates 33-FBGA | Altera
The Altera (Intel) EP2A40F33I-9 is a member of the APEX II family of high-density programmable logic devices, integrating up to 1,500,000 typical gates (or 40,000 logic elements in Altera's marketing terminology for this legacy family) in a 33-ball FineLine BGA package. The "EP2A" prefix denotes the APEX II architecture, "40" the density grade, "F" the FineLine BGA package family, "33" the 33-ball count, "I" the industrial temperature range (-40C to +100C operating), and "-9" the fastest speed grade offered for this device in this package. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit that can be reprogrammed by the customer after manufacture to implement arbitrary digital logic. FPGAs sit hierarchically above CPLDs (Complex Programmable Logic Devices) in density and below ASICs (Application Specific Integrated Circuits) in per-unit cost. The APEX II family, launched in the early 2000s, targets high-performance networking, telecommunications, and DSP applications where designers need hundreds of thousands of logic elements plus embedded memory and high-speed I/O in a single device. The architecture combines look-up-table (LUT) based logic with embedded array blocks (EABs) for memory and DSP functions. Key features of the EP2A40F33I-9 include 1.5M typical gates, embedded system blocks, multi-voltage I/O support (1.5V, 1.8V, 2.5V, 3.3V), and LVDS I/O capability for high-speed chip-to-chip signaling. The FineLine BGA-33 package provides a compact footprint suitable for space-constrained designs while still offering sufficient pin count for the device's signal I/O requirements. The industrial temperature range supports operation in harsh environments including outdoor telecommunications and industrial automation. The APEX II architecture combines LUT-based logic with embedded array blocks providing on-chip memory and dedicated carry chains for arithmetic. MultiVolt I/O allows mixed-voltage interfacing without external level shifters, which simplifies board design when the FPGA bridges legacy 5V peripherals and modern 1.8V cores. The combination of high density and flexible I/O made APEX II popular for protocol bridge, packet processing, and high-speed serial interface designs in the early-to-mid 2000s. Typical applications for this part include telecommunications line cards, industrial control systems, DSP co-processing, custom interface bridging, and legacy ASIC replacement designs. The BGA package is generally chosen where PCB real estate is at a premium and the design can accommodate the reflow and inspection challenges of BGA assembly. When designing with this FPGA, ensure your CAD tool flow supports the APEX II family (Quartus II versions up to v9.0, or third-party legacy flows). Verify BGA pad design follows IPC-7351 guidelines and that your PCB fabrication can achieve the required laser-drilled microvia or via-in-pad stackup for the 0.8 mm ball pitch typical of FineLine BGA packages. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical sourcing notes not found in the manufacturer datasheet, helping engineers evaluate availability and second-source options for this legacy Altera device.
EP2A40F672C6 - APEX II FPGA, 40K LE, 672-pin FBGA | Altera / Intel
The Altera (Intel) EP2A40F672C6 is a member of the APEX II family of programmable logic devices, fabricated on a 0.18-micron CMOS process and packaged in a 672-ball FineLine BGA. It integrates approximately 40,000 typical logic elements (LEs) with embedded system blocks (ESBs) for memory and specialty functions, plus a high-speed interconnect network that targets high-density, high-throughput datapath applications. The 'C6' speed grade designates a commercial-temperature part in the mid-speed tier of the APEX II family. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and I/O cells, all controlled by SRAM-based configuration memory. FPGAs sit at the apex of programmable logic in the taxonomy: programmable logic -> CPLD/FPGA -> logic IC -> integrated circuit. They are widely used for hardware acceleration, custom datapaths, glue logic, prototyping ASICs, and high-speed signal processing where the parallelism and reconfigurability of the silicon deliver orders-of-magnitude performance wins over general-purpose microcontrollers. Key features of the APEX II family include embedded system blocks that can be configured as dual-port RAM, ROM, FIFO, CAM, or multiplier blocks; LVDS and LVTTL I/O support; a dedicated clock network with PLL support; and JTAG-based boundary-scan testing compliant with IEEE 1149.1. The EP2A40F672C6 in particular supports up to 12 high-speed clock networks, embedded array blocks optimized for datapath arithmetic, and a deterministic interconnect fabric aimed at high-utilization designs above 50K system gates. Architecturally, APEX II combines look-up-table-based logic elements with embedded memory/multiplier blocks (MultiCore elements), enabling designers to implement wide datapaths, DSP functions, and packet-processing pipelines in a single device. The FineLine BGA-672 package provides dense, high-pin-count I/O for memory interfaces and multi-gigabit serial or parallel LVDS channels. Typical applications include telecommunications line cards, high-speed packet classification, ASIC prototyping, image and video preprocessing pipelines, and industrial DSP controllers. The wide I/O count also suits memory-heavy designs such as deep FIFO buffers and multi-bank external memory controllers. When designing with the EP2A40F672C6, note that the APEX II family has reached end-of-life and is no longer recommended for new designs. Designers should treat the part as long-term support only and prefer current-generation Intel/Altera FPGA families such as Cyclone IV/V, Arria, or Stratix for new projects, while reserving the EP2A40F672C6 for legacy board drop-in or repair. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers decide whether to source, replace, or redesign around the EP2A40F672C6.
EP2A40F672C6N - APEX II FPGA 40K LE FBGA-672 | Intel
The Intel EP2A40F672C6N is a member of the APEX II programmable logic device family, integrating approximately 40,000 logic elements with up to 1,125,000 system gates in a 672-ball FineLine BGA package. As a high-density SRAM-based FPGA, it combines lookup-table based logic, embedded system blocks (ESBs) for dual-port RAM, ROM, and CAM, and dedicated high-speed interconnect (FastTrack) routing. The device operates from a 1.5 V core supply with multiple I/O bank voltages supporting mixed-voltage interfacing across 5 V, 3.3 V, 2.5 V, and 1.8 V standards. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic through configuration of on-chip lookup tables, embedded memory blocks, and routing resources. APEX II sits in the hierarchy between low-density CPLDs and high-end SoC FPGAs, providing high logic density for data-path, DSP, and multi-protocol bridging applications. The EP2A40 is the largest member of the APEX II family, doubling the logic capacity of the EP2A25 while maintaining the same Quartus II design flow. Key features include MultiVolt I/O support for direct interfacing to 1.8 V, 2.5 V, 3.3 V, and 5 V buses without level shifters, dedicated clock management with PLL-based clock tree synthesis, and high-bandwidth embedded memory suitable for FIFO, dual-port RAM, and content-addressable memory. The FastTrack interconnect provides predictable timing across the entire device, simplifying timing closure for wide data buses. The 672-ball FineLine BGA package exposes the maximum number of user I/O for the EP2A40 die, making it suitable for high-pin-count interface aggregation. The APEX II architecture combines four-input look-up tables grouped into Logic Array Blocks (LABs), each LAB containing ten LEs plus local interconnect. ESBs (Embedded System Blocks) provide 2 Kbits of dual-port RAM each and can be cascaded to form wider or deeper memories. The device supports LVTTL, LVCMOS, PCI, GTL+, SSTL, and HSTL I/O standards, with per-pin slew-rate and drive-strength control. Configuration is supported via passive serial, passive parallel synchronous, passive parallel asynchronous, and JTAG modes. Typical applications include high-speed data-path bridging, multi-channel protocol conversion (e.g., SPI to parallel), glue-logic aggregation in ASIC prototypes, telecom line-card backplane interfacing, and industrial imaging pre-processing. The large logic capacity supports soft-core processor implementations such as the Nios embedded processor within the Quartus II tool flow. The wide I/O count enables direct connection to DDR-style memory buses and parallel ADC/DAC interfaces. Designers should verify availability before starting new designs because APEX II is an older-generation family that has been superseded by Cyclone, Arria, and Stratix families. Existing designs typically rely on the Quartus II v5.0 or earlier toolchain for synthesis, place-and-route, and timing analysis. Power estimation should include both static and dynamic components, with thermal management important at high toggle rates. This page synthesizes distributor stock signals, drop-in same-package variants within the APEX II family, and practical design notes not found in a single manufacturer document.
EP2A40F672C7 - APEX II FPGA, 40K LEs, 672-FBGA | Intel / Altera
The Intel (formerly Altera) EP2A40F672C7 is a member of the APEX II family of programmable logic devices, manufactured on a 0.15 µm all-layer copper CMOS process. It integrates 38,400 logic elements (1.5 M system gates) and 2,560 macro cells in a 672-ball FineLine BGA package (FC-FBGA, 27 x 27 mm, 1.0 mm pitch). Core voltage is 1.5 V with MultiVolt I/O support, and the device features 1-Gbps True-LVDS, LVPECL, PCML, and HyperTransport interface capability on dedicated high-speed channels. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and dedicated I/O and memory resources. APEX II devices specifically target high-density, high-bandwidth applications by combining look-up-table (LUT) based logic with embedded system blocks (ESBs) that can be configured as RAM, ROM, or content-addressable memory. The hierarchy in the taxonomy is: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Key specifications include 492 user I/Os, an internal performance of up to 562 MHz (per datasheet headline figure), 1.55 ns pin-to-pin delay (C7 speed grade), and on-die high-speed serial interface channels supporting 1 Gbps operation. The device also integrates four phase-locked loops for clock management and a multi-voltage I/O bank architecture allowing selectable 1.5 V, 1.8 V, 2.5 V, or 3.3 V interfacing on a per-bank basis without external level shifters. Typical applications span high-performance data path implementation, telecommunications backplanes, RAID controllers, and high-speed serial protocol bridging. The True-LVDS capability makes the EP2A40F672C7 particularly suited for chip-to-chip interconnect at gigabit rates across short backplane traces. When designing with this device, allocate adequate PCB layers for the FC-FBGA escape routing and ensure decoupling is placed immediately adjacent to the BGA balls. The C7 speed grade offers an attractive balance of timing margin and cost for designs that do not require the maximum C8 or C9 grades, and the part is supplied in tray or tape-and-reel packaging as required by production volume. This page consolidates distributor pricing, comparison with related speed-grade and package variants, and design notes specific to APEX II FC-FBGA implementation that are not typically present on a single manufacturer page.
EP2A40F672C7ES - APEX II 1.5M Gates FPGA 672-FBGA | Intel / Altera
The Intel / Altera EP2A40F672C7ES is a high-density APEX II family FPGA delivering 1.5M system gates and 38,400 logic elements, fabricated on a 0.15 µm CMOS process and housed in a 672-pin FineLine BGA (FC-FBGA) package measuring 27 × 27 mm with 1.0 mm pitch. It supports up to 492 user I/O and runs at a maximum internal frequency of 562 MHz, with a core voltage of 1.5 V. The device operates across the commercial temperature range, carries the speed grade 7 designation, and ships as an enhanced-status "ES" engineering sample. An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic through a lookup-table and routing fabric. APEX II extends this model with embedded system blocks (ESBs) for dual-port RAM, ROM, and CAM, plus a high-bandwidth MultiCore interconnect that links logic array blocks (LABs), ESBs, and I/O elements (IOEs) on a single die. The hierarchy is: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Key specifications include 1.5M typical gates (40K logic elements), 40,960 maximum logic elements, 2,560 macro cells, 562 MHz core operation, 1.5 V VCCINT with 3.3 V VCCIO support, and 492 user I/O pins. On-chip resources include embedded array blocks, FastRow interconnect, and LVTTL/LVCMOS/SSTL/HSTL I/O standards. The FC-FBGA-672 package with 1.0 mm pitch is suitable for high-density production designs. The APEX II architecture pairs a fine-grained logic array with coarse-grained embedded system blocks, allowing designers to trade off LUT-based logic against dedicated memory and CAM functions. The MultiCore interconnect uses a continuous row-and-column routing fabric, which simplifies timing closure for wide datapath and memory-intensive designs compared with segmented-routing alternatives. Typical applications include high-throughput telecommunications backplanes, network processing line cards, ASIC prototyping, and DSP co-processing. The wide I/O count and large embedded memory footprint make it a fit for protocol bridging, where many parallel channels must be aggregated with on-chip buffering. When selecting APEX II devices, note that ES variants are engineering samples intended for prototyping only; for production, choose C7/C8/C9 commercial or I7/I8 industrial speed-grade parts. The 672-ball FBGA requires controlled-impedance PCB layout and a minimum of 6 PCB layers for proper power distribution. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Altera APEX II family, and design notes not collected in the manufacturer datasheet PDF.
EP2A40F672C7N - APEX II FPGA 1.5M Gates 672-BGA | Intel
The Intel EP2A40F672C7N is a high-density APEX II family Field-Programmable Gate Array (FPGA) delivering 1.5 million system gates and 38,400 logic cells, fabricated on a 0.15-micron all-layer copper-metal CMOS process with up to eight metal layers. It is packaged in a 672-ball FineLine BGA (FC-FBGA / S-PBGA-B672) measuring 27 x 27 mm with a 1.0 mm ball pitch. The device operates from a 1.5 V core supply, supports up to 492 user I/Os, and offers a typical propagation delay of 1.55 ns with internal performance rated up to 562 MHz. Per the manufacturer datasheet, the EP2A40F672C7N integrates up to 1 Gbps multi-gigabit transceiver-class signaling on selected I/O banks, embedded system blocks, and on-chip RAM, targeting broadband, networking, and DSP-heavy designs. What is a high-density FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hardware blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. APEX II sits in the high-density tier of the taxonomy: FPGA -> programmable logic device (PLD) -> programmable logic IC -> integrated circuit. APEX II was engineered for systems that combine glue logic, datapath arithmetic, on-chip memory, and high-speed serial I/O on a single silicon die, replacing multiple discrete ASICs and reducing BOM cost and board area. Key features of the EP2A40F672C7N include 38,400 logic elements, 1.5 M system gates, 492 user I/Os, 1.55 ns propagation delay, 562 MHz internal performance, MultiVolt I/O support for interfacing with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic families, and a 0.15-µm copper CMOS process. The 'C7' speed grade denotes the commercial temperature range 0 °C to 85 °C with a specific timing closure. The 'N' suffix indicates a lead-free, RoHS-compliant FC-FBGA package. The device supports in-system configuration via passive serial, passive parallel, and JTAG modes, allowing rapid prototyping and field upgrades. Typical applications for the EP2A40F672C7N include 1 Gbps+ networking line cards, custom datapath accelerators, telecommunications backplanes, broadband aggregation, DSP co-processing, and legacy ASIC replacement in telecommunications and storage infrastructure. The large gate count and abundant I/O make it well suited to designs that previously required multiple smaller FPGAs. The MultiVolt I/O simplifies interfacing with legacy 5 V ASICs, memory, and bus transceivers. When designing with the EP2A40F672C7N, ensure the 672-ball FC-FBGA land pattern is matched exactly - this is a 27 x 27 mm, 1.0 mm pitch FineLine BGA that requires PCB microvia stackups and controlled-impedance routing. Decoupling must follow the manufacturer reference design, and unused I/O banks should be configured as outputs driving '0' or tied to defined logic levels. This page synthesizes distributor pricing, pin-compatible APEX II family drop-ins, and practical design notes not found in the manufacturer datasheet.
EP2A40F672C8 - 40K LE APEX II FPGA, 672-Pin BGA | Intel
The Intel (formerly Altera) EP2A40F672C8 is a member of the APEX II family of FPGAs, manufactured using a 0.15-micron all-layer copper-metal process with up to eight metal layers, and packaged in a 672-ball FineLine BGA measuring 27 x 27 mm with a 1.0 mm pitch. The device integrates 40,000 typical logic elements (LEs) along with embedded memory blocks, dual-port RAM, and dedicated high-speed interfaces supporting 1 gigabit per second LVDS signaling. According to Intel APEX II datasheet documentation, the EP2A40F672C8 is rated for the commercial temperature range (0 C to 85 C) and provides 492 user I/O pins, enabling dense system-level integration for high-throughput applications. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the architectural flexibility of gate arrays with the design-rapid-turnaround of in-system programmability. Within the broader semiconductor taxonomy, an FPGA sits under programmable logic devices -> PLDs -> logic ICs -> integrated circuits, and is widely used to implement custom digital signal processing, glue logic, and high-speed interface bridging in systems that require parallelism and reconfigurability beyond what a microcontroller or DSP can offer. Key features of the EP2A40F672C8 include up to 1.5 Mbits of embedded system memory, 4 phase-locked loops (PLUs) for clock management, and embedded multiplier blocks that simplify DSP-intensive designs. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, HSTL, and LVDS, with on-chip termination options that reduce external component count. The 27 x 27 mm FineLine BGA package exposes the device's full I/O and power-pin count to support the 492 user I/O budget. Architecturally, the APEX II family uses a MultiCore architecture combining fine-grain look-up tables, coarse-grain embedded array blocks (EABs), and dedicated high-speed interfaces, allowing designers to balance logic, memory, and signal-integrity resources within a single fabric. The 0.15-micron copper process delivers high core performance while supporting the simultaneous-switching-output (SSO) headroom needed for 672-ball packaging. Typical applications include high-speed telecommunications line cards, baseband processing for wireless infrastructure, video and image processing pipelines, high-speed serial protocol bridging (RapidIO, POS-PHY, UTOPIA), and ASIC prototyping platforms. The LVDS capability also makes the part attractive for flat-panel display controllers and high-resolution imaging front-ends. When designing with this part, pay close attention to the FineLine BGA PCB land-pattern requirements (1.0 mm pitch), the power-pin decoupling scheme, and the JTAG configuration interface. The -C8 speed grade indicates a 1.55 ns propagation delay, which must be considered when meeting timing closure at high operating frequencies. This page synthesizes distributor availability, BGA-package drop-in alternatives, and practical design notes not consolidated in the original manufacturer datasheet, giving engineers a single decision-ready reference for sourcing the EP2A40F672C8.
EP2A40F672C8N - APEX II 1.5M Gates FPGA | Intel | 672-BGA
The Intel (formerly Altera) EP2A40F672C8N is a high-density programmable logic device (PLD) from the APEX II family, built on a 0.15 µm all-layer copper CMOS process with up to eight metal layers. It delivers 1.5M system gates, 38,400 logic cells, and operates at up to 376 MHz internal frequency. The device is housed in a 672-ball FineLine BGA (FC-FBGA) measuring 27 x 27 mm with a 1.0 mm ball pitch, providing 492 user I/Os and supporting 1 Gbps LVDS performance. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. APEX II devices sit in the programmable logic hierarchy as follows: PLD -> CPLD/FPGA -> high-density FPGA with embedded memory and I/O. The APEX II family specifically targets high-performance datapath, communications, and ASIC-replacement designs where dense logic and high I/O count are required. Key features of the EP2A40F672C8N include 1.5 M system gates, 38,400 logic elements, 4 embedded PLLs for clock synthesis, dedicated high-speed LVDS channels supporting 1 Gbps data rates, a 1.5 V nominal core supply (1.425 V to 1.575 V range), and 492 user I/Os. The propagation delay is rated at 1.55 ns for internal logic, and the device supports in-system programming via the JTAG boundary-scan interface per IEEE 1149.1. Architecturally, the EP2A40F672C8N uses a MultiCore structure of Look-up Tables (LUTs), embedded array blocks (EABs) for memory and DSP functions, and FastTrack interconnect routing. The 0.15 µm copper process enables high transistor density while maintaining low dynamic power. Built-in PLLs simplify clock tree synthesis, and LVDS support is critical for high-speed parallel interfaces such as SPI-4.2, Rapid I/O, and POS-PHY. Typical applications include telecommunications switching and routing equipment, ASIC prototyping and emulation, high-speed datapath processing, digital signal processing front-ends, and high-density glue-logic replacement. With 492 user I/Os, the device is well-suited for systems that require wide memory buses (DDR SDRAM controllers) or multiple parallel channel interfaces. When designing with this device, ensure the 1.5 V core supply is generated by a low-noise regulator such as the TPS7A4701 to meet the VCCINT tolerance. The 672-ball BGA package requires a multilayer PCB (typically 6 or more layers) with controlled-impedance routing for LVDS signals and matched-length traces for clocks. This page synthesizes distributor pricing, drop-in same-family Altera/Intel APEX II alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2A40F672C9 - APEX II FPGA 1.5M Gates 38400 Cells 672-BGA | Altera
The Altera (Intel) EP2A40F672C9 is a member of the APEX II programmable logic device (PLD) family, fabricated on a 0.15-µm all-layer copper-metal process that supports up to eight layers of metal interconnect. The device integrates 1.5 million system gates with 38,400 logic elements, 492 user I/Os, and a 1.5 V core supply, housed in a 672-ball FineLine BGA package measuring 27 mm × 27 mm with a 1 mm ball pitch. An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic through SRAM-based configuration cells. FPGAs sit hierarchically above CPLDs and below ASICs in the programmable logic taxonomy, and the APEX II family is positioned as a high-density, embedded-multiplier-rich variant that bridged telecom, networking, and DSP prototyping workloads in the early-2000s generation of programmable logic. Key features of the EP2A40F672C9 include support for 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport I/O standards, embedded memory blocks, embedded multipliers, and a maximum toggle performance in the 366 MHz range. The FineLine BGA-672 footprint exposes 492 user I/O pins, providing the channel density required for parallel bus interfaces and high-speed serial links. Operating temperature is graded for commercial use from 0 °C to 85 °C. Architecturally, the APEX II device combines LAB (Logic Array Block) structures with embedded system blocks (ESBs) for dual-port RAM and ROM, and dedicated multiplier blocks optimized for DSP filter pipelines. The 0.15-µm process delivers high logic density while the 1.5 V core minimizes dynamic power for the gate count, and the eight-metal stackup enables efficient routing of wide buses. Typical applications include telecom line-card prototyping, high-speed serial backplane bridging, DSP co-processing, bus-width conversion glue logic, and ASIC prototyping. The 672-ball BGA package and 1.5 V core also suit legacy designs migrated from earlier APEX 20K families that need additional gate capacity and faster I/O standards. When designing with this device, plan power sequencing for the 1.5 V core and I/O bank supplies separately, and follow Altera's BGA layout guidelines for 1 mm-pitch FineLine packages to ensure reliable solder joint integrity through thermal cycling. This page synthesizes distributor pricing, verified same-package alternatives in the APEX II family, and practical design notes not found in the original APEX II datasheet (DS-APEXII-3.0). It is intended as an engineering reference for sourcing, replacement, and lifecycle planning.
EP2A40F672C9ES - APEX II FPGA 1.5M Gates 672-FBGA | Altera
The Altera (now Intel) EP2A40F672C9ES is a member of the APEX II family of programmable logic devices, delivering 1,500,000 system gates with 38,400 logic elements in a 672-pin Fine-pitch Chip-scale Ball Grid Array (FC-FBGA) package. Built on a 0.15 μm CMOS process and operating from a 1.5 V core supply, the device is rated for speeds up to 366 MHz internal operation with a -9 speed grade marking. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks, interconnect, and I/O cells that designers can configure after manufacturing to implement custom digital functions. Within the wider hierarchy, an FPGA is a type of Programmable Logic Device (PLD), which itself falls under digital logic integrated circuits. The APEX II architecture extends this concept with embedded MultiCore interconnect and embedded system blocks (ESBs) that double as RAM, ROM, or CAM memory, making the device suitable for high-density data-path, telecommunications, and DSP-intensive applications. Key features of the EP2A40F672C9ES include 492 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, HSTL, GTL+), 1.5 M system gates, 38,400 logic cells, dedicated multiplier/clock circuitry, and JTAG-based IEEE 1149.1 boundary-scan support. The device supports in-system programmability via the passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), JTAG, and Altera Fast Passive Parallel (FPP) configuration modes through a serial configuration device such as the EPC2 or EPC8. From an architectural standpoint, the APEX II family combines Look-Up Table (LUT) logic with embedded array blocks, giving designers a flexible trade-off between fine-grained logic and block-level memory. The MultiCore interconnect uses continuous, predictable routing across rows, columns, and embedded blocks, which simplifies timing closure on dense 672-pin designs. The 1.5 V core voltage reduces power consumption versus older 2.5 V families such as APEX 20K, while the -9 speed grade places this part at the high-performance end of the family. Typical applications include high-speed telecommunication backplanes, ATM packet processing, SONET/SDH framer designs, custom DSP pipelines, and PCI bus interfaces. The 672-pin FC-FBGA package provides high signal density for board-constrained designs where 492 I/O channels must be routed out of a single chip. When designing with this device, note that the APEX II family has been classified as legacy/not recommended for new designs. Engineers should verify long-term supply availability with the manufacturer before committing to a new production program, and consider Cyclone III/IV/10 or newer families for greenfield designs while keeping the APEX II for legacy upgrades.
EP2A40F672C9N - APEX II 1.5M Gates FPGA, BGA-672 | Intel
The Intel EP2A40F672C9N is a high-density FPGA from the APEX II family, delivering 1.5 million system gates and 38,400 logic elements in a 672-pin FC-FBGA (Fine-pitch Chip-Scale Ball Grid Array) package with 27 x 27 mm body and 1.0 mm ball pitch. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the architectural flexibility of a gate array with the design-turnaround advantage of in-system programmability. Within the wider semiconductor taxonomy, FPGAs sit between fixed-function ASICs and microcontrollers: they offer hardware-level parallelism and deterministic timing, while remaining fully re-programmable. The APEX II family is a second-generation APEX architecture using a 0.15 µm all-layer copper interconnect process with up to eight metal layers, supporting 1 Gbps LVDS I/O performance. Key specifications include 492 user I/O pins, 1.55 ns propagation delay, 366 MHz internal operation, 1.5 V core supply, and an embedded system block (ESB) that delivers up to 1.125 Mbits of dual-port RAM. The Look-up Table (LUT)-based logic elements include carry-chain and register-chain resources for arithmetic-intensive datapaths. The 'C9' speed grade places this part in the mid-speed bin of the family, with '-9' corresponding to approximately 1.5 ns pin-to-pin delay. The APEX II architecture combines four types of structures: Logic Array Blocks (LABs) for fine-grained logic, ESBs for memory and arithmetic, MegaLAB structures that group LABs and ESBs, and FastTrack interconnect for predictable row/column routing. This hierarchy makes the device well-suited to system-on-chip integration where a mix of glue logic, FIFOs, register files, and DSP pipelines must coexist. Typical applications include high-speed telecommunications backplanes, parallel DSP engines for video processing, custom protocol bridges between ASICs, and high-throughput data acquisition systems. The 492 available I/Os make it particularly attractive for bus-intensive designs such as DDR memory controllers, parallel pixel processing, and multi-port network interfaces. When designing with this part, pay close attention to power-plane decoupling: at 366 MHz with 38K logic elements, dynamic current peaks can exceed 3 A. Place at least 16 low-ESR 0.1 µF capacitors directly beneath the BGA footprint, plus four bulk 22 µF capacitors near the corners. Signal-integrity simulations should be performed on all LVDS and clock nets before layout sign-off, since FastTrack routing delay varies with fan-out. This page synthesizes distributor pricing, drop-in APEX II alternatives, and practical design guidance for high-density BGA FPGA implementation not found in the original APEX II datasheet alone.
EP2A40F672I-7 - 1.5M Gates APEX II FPGA, 672-BGA | Intel / Altera
The Intel / Altera EP2A40F672I-7 is a member of the APEX II family of Field Programmable Gate Arrays (FPGAs), integrating 1.5 million system gates, 38,400 logic elements, and 562 MHz internal performance in a 672-pin FC-FBGA package on a 0.15 µm CMOS process. It operates from a 1.5 V core supply and is offered in the -7 industrial speed grade, with the 'I' suffix indicating an industrial temperature rating. An FPGA (Field Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, I/O elements, and routing interconnects that the customer programs after manufacture using an HDL (Hardware Description Language) such as Verilog or VHDL. FPGAs sit at the top of the programmable logic hierarchy, alongside CPLDs, and provide higher logic density, parallel processing, and faster time-to-market than ASICs for low-to-mid volume designs. Key features of the EP2A40F672I-7 include 38,400 logic elements, embedded system blocks (ESBs) implementing dual-port RAM, ROM, and CAM functions, four Phase-Locked Loops (PLLs) for clock management, multi-level interconnect with DirectDrive and FastTrack routing, and a high-bandwidth I/O structure supporting LVTTL, LVCMOS, SSTL, HSTL, GTL+, and LVDS signalling. It supports PCI, PCI-X, and RapidIO interconnect standards for embedded applications. The APEX II architecture combines logic elements (LEs), ESBs, and dedicated I/O cells on a single die with continuous high-performance routing. MultiCore interconnect with DirectDrive technology ensures predictable, deterministic timing for high-speed design paths. Four PLLs provide on-chip clock multiplication, division, phase shifting, and skew control. Typical applications include high-speed digital signal processing (DSP), telecommunications backplanes, network switching fabrics, PCI/PCI-X bridge designs, and industrial automation controllers. The combination of large logic capacity and high-speed I/O also suits the part for use as a high-volume prototyping vehicle for ASIC designs. When designing with the EP2A40F672I-7, attention must be paid to power sequencing, signal integrity at high toggle rates, and thermal dissipation. The 672-pin FC-FBGA package requires a 1.27 mm ball pitch PCB and Xilinx/Altera-compatible footprint. This page synthesizes distributor availability, drop-in alternatives sourced from the same APEX II family, and engineering guidance not found in the standalone datasheet.
EP2A40F672I-8 - APEX II FPGA 1.5M Gates | Intel / Altera
The Intel (formerly Altera) EP2A40F672I-8 is a high-density APEX II family Field Programmable Gate Array (FPGA) with 1.5 million system gates, 38,400 logic elements, and a 672-pin FC-FBGA package. It is manufactured on a 0.15 µm process technology and operates from a 1.5 V core supply, with the speed grade -8 indicating a specific internal timing bin and the I-suffix confirming the industrial operating temperature range of -40 °C to +100 °C. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that an engineer can re-program after manufacturing to implement custom digital logic. APEX II sits within the programmable logic device hierarchy as: FPGA → SRAM-based programmable logic → fine-grained LUT architecture → multi-rail multi-voltage I/O support. FPGAs of this density class are typically used in place of ASICs when time-to-market, in-field reprogrammability, or low-to-mid volume production economics are prioritized. Key features of the EP2A40F672I-8 include 1.5M typical gates, 38,400 logic cells, dedicated on-chip memory, embedded multiplier blocks, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL on a per-pin basis. The device integrates a flexible MultiVolt I/O architecture that allows the inputs and outputs to operate at different voltages than the core. According to the Altera APEX II datasheet, internal signal performance supports up to approximately 376 MHz operation. The architecture uses a four-level hierarchy (LUTs, MegaLAB structures, Embedded System Blocks, and FastTrack interconnect) to deliver predictable timing closure across complex designs. The 672-ball FC-FBGA package supports high pin-count, low-inductance interconnects required for high-speed parallel buses and source-synchronous memory interfaces such as DDR. Typical applications include high-speed communications infrastructure, telecom switching fabrics, ASIC prototyping, image and video processing pipelines, military and aerospace digital signal processing, and industrial control systems. The industrial temperature grade makes it suitable for environments that exceed commercial-grade thermal limits. When designing with this part, note that it is now a mature, legacy device that has been superseded by newer Cyclone and Stratix families; supply is constrained to authorized distributors and the broker market. PCB designers must allocate adequate power planes for the 1.5 V core, PLL analog supplies, and reference voltage rails, and must respect the FC-FBGA escape and routing rules for signal-integrity-compliant DDR layouts. This page consolidates broker pricing, same-family drop-in alternatives drawn from the Site MPN list, lifecycle caveats, and practical layout notes that are not visible on a single manufacturer product page.
EP2A40F672I-9 - APEX II FPGA, 1.5M Gates, 672-BGA | Intel
The Intel EP2A40F672I-9 is a high-density member of the APEX II FPGA family delivering 1.5 million system gates and 38,400 logic elements in a 672-pin FC-FBGA package, manufactured on a 0.15 µm CMOS process. The APEX II family combined the MultiCore architecture with on-chip CAM, dual-port RAM, and high-speed True-LVDS signaling to target high-bandwidth communications, DSP, and datapath-intensive designs. The EP2A40F672I-9 is specified for industrial temperature operation and is built around a 1.5 V core supply with hot-socketing tolerant I/O. An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic blocks, interconnect, and I/O can be reconfigured after manufacturing, providing ASIC-like density and performance with NRE-free prototyping. FPGAs sit hierarchically between general-purpose CPUs/DSPs and fixed-function ASICs: they deliver higher throughput than a processor for parallel tasks, and faster time-to-market than a mask-programmed ASIC. APEX II parts further integrate dedicated CAM blocks and LVDS channels that simplify communications and datapath designs. Key features of the EP2A40F672I-9 include 38,400 logic elements, embedded CAM support, dual-port RAM blocks, True-LVDS I/O, and an industrial operating range. The 672-ball FC-FBGA package provides controlled-impedance routing for high-speed interfaces, while 0.15 µm process technology balances density and static power. The device operates from a 1.5 V core supply with separate VCCIO banks supporting mixed-voltage I/O. Hot-socketing capability allows the device to be inserted into a live backplane without damage or data corruption. Architecturally, APEX II devices pair four-input LUT-based logic elements with embedded system blocks (ESBs) that can be configured as dual-port SRAM, single-port SRAM, ROM, or CAM. True-LVDS receivers and transmitters on dedicated channels deliver data rates up to several hundred Mbps per channel, suitable for LVDS bridges and parallel backplanes. The MultiCore interconnect with DirectDrive technology ensures predictable timing for high-fanout nets across the 672-pin FC-FBGA package. Typical applications include high-speed communications interfaces, ASIC prototyping, datapath co-processing, and DSP accelerator designs. The combination of CAM, dual-port RAM, and LVDS makes APEX II particularly attractive for ATM switching, protocol translation, and PCI-to-PCI bridges. The industrial temperature grade also supports telecom line cards and industrial control backplanes. When designing with the EP2A40F672I-9, pay close attention to power sequencing: VCCINT must reach stable 1.5 V before VCCIO is applied, and vice versa on power-down. The device draws significant inrush current during configuration - use the Altera MAX series (EPM7xxx) or discrete supervisory circuitry to hold the FPGA in reset until supplies stabilize. Decoupling requires at least 22 µF bulk + 0.1 µF + 0.001 µF per power pin group. This page consolidates APEX II datasheet facts, intel/Altera ordering information, and pin-compatible same-family alternatives in a single reference - including 672-pin FC-FBGA drop-in variants and speed-grade siblings - to help procurement and hardware engineers validate EP2A40F672I-9 sourcing decisions.
EP2A40F672I7 - APEX II 1.5M Gates FPGA, 672-pin FC-FBGA | Intel/Altera
The Intel/Altera EP2A40F672I7 is a member of the APEX II family of Field Programmable Gate Arrays (FPGAs), delivering 1.5M system gates, 38,400 logic elements, and a 562 MHz core frequency in a 672-pin Fine-pitch Chip-scale Ball Grid Array (FC-FBGA) package. Manufactured on a 0.15 µm CMOS process, this device operates from a 1.5 V core supply and is specified for the industrial temperature range (-40 °C to +85 °C) as indicated by the 'I' speed-grade suffix. The '7' suffix denotes a 7-device speed grade pin-compatible with other speed grades in the EP2A40F672 family. An FPGA is a reprogrammable semiconductor device whose logic function is defined by a user-supplied configuration bitstream rather than by the silicon vendor. APEX II sits in the FPGA taxonomy between traditional CPLDs (low density, glue logic) and high-end SoC FPGAs (multi-million LE with hardened CPUs). Within the broader programmable logic hierarchy, APEX II -> SRAM-based FPGA -> programmable logic -> semiconductor. Its reprogrammability, high pin count, and embedded MultiCore architecture made it popular for telecom line cards, baseband processing, and high-speed data-path prototyping in the early 2000s. Key features of the EP2A40F672I7 include embedded MultiCore blocks combining lookup tables and product-term logic, a high-bandwidth MultiCore interconnect fabric, support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, LVDS), and a configurable JTAG-based configuration port. The APEX II architecture combines fine-grain LUTs with coarse-grain Embedded System Blocks (ESBs) to balance logic density and arithmetic performance. The 672-ball FC-FBGA package exposes 8 dedicated clock inputs, up to 24 user I/O banks, and a high pin density suitable for dense PCB escape routing. Multiple speed grades are available: -6 (fastest), -7, -8, and -9 (slowest). EP2A40F672I7 is the industrial-temperature speed-grade 7 variant. Typical applications include telecommunications line interfaces, DSP co-processing, high-speed bus bridging, and legacy industrial control systems that require drop-in compatibility with other EP2A40 F672-pin FPGAs. Designers should provide a stable 1.5 V core and a separate I/O VCCIO rail (3.3 V or 2.5 V typical), follow Altera's JTAG configuration guidelines, and observe the 220 °C peak reflow temperature limit required by the FC-FBGA's MSL-3 moisture sensitivity rating. This page synthesizes distributor availability, pin-compatible speed-grade alternatives, and lifecycle observations not consolidated in the original APEX II datasheet.