FPGA & CPLD
製品 (6666)
EPF10K30AQI240-1 - FLEX 10KA FPGA, 30K Gates, 240-PQFP | Altera
The Altera (now Intel) EPF10K30AQI240-1 is a FLEX 10KA family Field Programmable Gate Array (FPGA) housed in a 240-pin Plastic Quad Flat Pack (PQFP) package, offering approximately 30,000 ASIC-equivalent gates and 1,728 logic elements (LEs) with embedded array blocks. It supports up to 189 user I/O lines, 4 dedicated inputs and 193 total inputs, operates at a maximum clock frequency of 769.23 MHz with a propagation delay of 11 ns, and runs on a 3.3 V core supply in 0.42 um CMOS SRAM technology. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically reconfigured by the designer after manufacturing. The FLEX 10KA family belongs to the hierarchy FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit, and combines a fine-grained Look-Up Table (LUT)-based logic fabric with coarse-grained Embedded Array Blocks (EABs) that can be used as on-chip RAM, ROM, or wide-gate functions. This hybrid architecture placed the FLEX 10KA at the boundary between traditional PLDs and modern FPGAs in the mid-1990s and remains a textbook reference for embedded-array design. Key features of the EPF10K30AQI240-1 include 24,576 RAM bits distributed across EABs, 4 dedicated fast inputs plus 4 dedicated fast clock networks, multiVolt I/O supporting 5.0 V, 3.3 V and 2.5 V interface levels, in-system programmability through the IEEE 1149.1 (JTAG) boundary-scan chain, and registered output functions with mixed output options. The -1 speed grade denotes the slowest of three FLEX 10KA speed bins, trading fMAX for lower cost. Technically, the device is built on a 0.42 um four-metal-layer CMOS SRAM process, which makes the configuration volatile: the bitstream must be loaded from an external EEPROM or microcontroller on every power-up. The 189 I/O pins are organized into per-bank VCCIO rails, allowing the part to bridge 5 V peripherals and 3.3 V ASICs without level shifters. Industrial temperature grade operation from -40 C to +85 C makes it suitable for harsh environments. Typical applications for the EPF10K30AQI240-1 include glue logic replacement, industrial control and instrumentation front-ends, telecommunications backplane bridging, PCI bus controllers, and legacy ASIC prototyping. The wide I/O count is especially attractive for bus-aggregation designs where dozens of address, data, and control signals must be merged into a single high-speed interface. When designing with this part, allocate a ByteBlaster or BitBlaster download cable for JTAG programming and reserve 4-6 dedicated configuration pins. Decoupling must follow the FLEX 10KA reference design: at minimum, one 0.1 uF X7R per VCC pin and one bulk 33 uF tantalum on the 3.3 V core rail. Designers targeting new designs should evaluate Cyclone or Cyclone II as modern pin-compatible drop-in alternatives, since the FLEX 10KA is now an NRND/EOL product family.
EPF10K30ATC144-1N - FLEX 10KA FPGA, 30K Gates, 144-LQFP | Intel
Intel EPF10K30ATC144-1N is a member of the FLEX 10KA family of Field-Programmable Gate Arrays (FPGAs) that delivers 30,000 typical gates, 1,728 logic elements, and 12,288 bits of embedded memory in a 144-pin LQFP (TQFP) surface-mount package. The device is built on a 0.30 micrometer CMOS process, operates from a 3.3 V core supply, and is specified for commercial temperature grade (0 to 70 C). It provides 102 user I/O pins and integrates 216 Logic Array Blocks (LABs), making it suitable for glue-logic, bus-interface, and mid-density state-machine designs. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose logic function is defined after manufacturing by the user. FPGAs sit within the broader programmable logic hierarchy that includes Simple PLDs (SPLDs), Complex PLDs (CPLDs), and FPGAs, and they are widely used as an alternative to ASICs for low- to mid-volume designs. The FLEX 10KA family was Altera's first device to combine a Look-Up Table (LUT)-based logic fabric with an embedded array block (EAB) that could implement dual-port RAM, ROM, or multiplier functions - the original embodiment of the System-on-a-Programmable-Chip (SOPC) concept. Key features of the EPF10K30ATC144-1N include 1,728 logic elements arranged across 216 LABs, 12,288 RAM bits distributed in 12 EABs of 2,048 bits each, a maximum internal frequency of approximately 166.67 MHz, and a pin-to-pin propagation delay as low as 0.6 ns. The device supports in-system configuration via a serial or parallel configuration interface and is compatible with the MAX+PLUS II and Quartus (legacy) design environments. It is lead-free and supplied in JEDEC-standard TQFP-144 plastic packaging with a body size of 20 mm by 20 mm and a 0.5 mm lead pitch. Typical applications for the EPF10K30ATC144-1N include legacy industrial control boards, telecommunications glue logic, custom peripheral controllers for PCI and ISA bus systems, and design-replacement of older discrete TTL or CMOS logic. Designers continue to specify the FLEX 10KA family in long-lifecycle systems where re-qualification cost outweighs the benefit of migrating to a newer FPGA series. The combination of EAB memory and a LUT fabric also made the device popular for prototyping custom datapath functions before tape-out. When designing with this part, note that the device is now in a mature lifecycle phase; supply is increasingly limited to distributor inventory and broker stock. Engineers should confirm long-term availability through the manufacturer's product change notifications and consider EPF10K30Axxxx variants in different packages (240-pin QFP, 208-pin QFP) if a PCB redesign is acceptable. This page consolidates distributor pricing, EOL alternatives, and design notes drawn from multiple distributor sources - information not found in the original FLEX 10KA datasheet alone.
EPF10K30ATC144-2N - FLEX-10KA 30K-Gate FPGA, 144-TQFP | Intel / Altera
The Intel / Altera EPF10K30ATC144-2N is a member of the FLEX 10KA family of SRAM-based Field-Programmable Gate Arrays (FPGAs) delivering 30,000 typical gates (17,200 usable gates) and 1,728 logic elements in a 144-pin TQFP (thin quad flat pack) package. It is built on a 0.3 µm CMOS process and operates from a 3.0 V to 3.6 V supply, with 102 user I/O pins, 12,288 bits of embedded RAM, and 216 logic array blocks (LABs). The 'A' suffix denotes the 3.3 V supply generation; 'C' indicates the commercial 0 °C to 70 °C temperature range; '144' is the pin count; and '-2N' specifies the speed grade and lead-free, NiPdAu lead finish. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the high integration of an ASIC with the flexibility of software-reconfigurable logic. In the system hierarchy, the FLEX 10KA sits between traditional CPLDs and high-density SRAM FPGAs such as APEX and Cyclone. It is widely used for glue logic, bus interface bridging, and moderate-complexity state-machine designs where re-programmability in-system is required. Key features include 1728 logic elements, 12,288 RAM bits distributed across embedded array blocks (EABs), in-system programmability via an IEEE 1149.1 (JTAG) interface, multi-volt I/O support (2.5 V or 3.3 V), and 102 maximum user I/O pins. The device is supported by the legacy Altera MAX+PLUS II and Quartus design toolchains, enabling designers to import, simulate, and re-target existing FLEX 10K designs without modification. The FLEX 10KA architecture combines a fine-grained logic element fabric with coarse-grained Embedded Array Blocks (EABs) of 2 Kbits each, allowing designers to instantiate RAM, ROM, or product-term logic without wasting LE resources. Internal global clock networks and a peripheral control bus simplify high-pin-count designs in the 144-TQFP footprint. Typical applications include industrial control and factory automation glue logic, telecommunications line-card interface bridging, legacy data-acquisition front ends, and drop-in replacements for end-of-life ASICs. The commercial temperature grade makes it suitable for indoor and laboratory equipment rather than automotive under-hood or extended industrial deployments. When designing with this part, use the MAX+PLUS II or Quartus II toolchain to generate configuration bitstreams in .sof or .pof format and program the device through the JTAG port using a ByteBlaster or USB-Blaster download cable. Pay attention to the I/O bank supply rails - 3.3 V banks must not exceed 4.0 V during hot-plug events, otherwise input clamps can latch-up. This page synthesizes distributor pricing, drop-in alternatives from the same FLEX 10KA family, and practical configuration notes not found in the manufacturer datasheet.
EPF10K30ATC144-3 - FLEX 10KA FPGA, 30K Gates, 144-TQFP | Intel
The Intel (formerly Altera) EPF10K30ATC144-3 is a member of the FLEX 10KA family of embedded programmable logic devices (PLDs), delivering 30,000 typical gates in a 144-pin TQFP package. It integrates 1,728 logic elements and 12,288 RAM bits, providing System-on-a-Programmable-Chip (SOPC) capability through its embedded array architecture. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and I/O cells that can be customized by the designer to implement arbitrary digital circuits. The FLEX 10KA family specifically pioneered embedded memory blocks within the FPGA fabric, combining lookup-table (LUT)-based logic with on-chip dual-port RAM, enabling system-on-chip integration without external memory components for many designs. Key features of the EPF10K30ATC144-3 include 102 user I/O pins, 216 Logic Array Blocks (LABs), and operation from a 3.3V core supply. The device supports CMOS I/O standards and provides a maximum internal frequency of 80 MHz with a propagation delay of approximately 0.6 ns per logic element. The embedded array blocks (EABs) implement true dual-port RAM, ROM, or arithmetic functions, distinguishing FLEX 10KA from earlier FLEX 10K devices. The device's SRAM-based configuration memory allows unlimited reconfiguration in-circuit. Its architecture is organized as rows and columns of LABs interconnected by a continuous, high-performance routing network. The 144-pin TQFP package with 0.5 mm pitch is suitable for surface-mount assembly in prototyping and low-to-medium volume production. Typical applications include digital signal processing front-ends, telecommunications glue logic, industrial control interfaces, and embedded controller glue logic. The device is commonly used in legacy designs, retrofit boards, and as a flexible logic substitute for discrete SSI/MSI logic clusters. When designing with this FPGA, ensure your configuration scheme (e.g., EPC configuration device or JTAG) is compatible with the FLEX 10KA bitstream format. Quartu II or MAX+PLUS II design tools are required; modern Intel Quartus software versions may not natively support FLEX 10KA, so legacy toolchain verification is recommended. This page synthesizes distributor pricing, FLEX 10KA drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPF10K30ATI144-1 - FLEX 10KA FPGA 30K Gates 144-TQFP | Intel
The Intel (Altera) EPF10K30ATI144-1 is a member of the FLEX 10KA embedded programmable logic device family, providing 30,000 typical gates in a 144-pin TQFP (Thin Quad Flat Pack) industrial-temperature package. The device integrates 1,728 logic elements, 216 logic array blocks (LABs), and 12,288 bits of embedded memory across a CMOS SRAM-based architecture with 102 user I/O pins. It operates from a 3.0 V to 3.6 V supply (nominal 3.3 V) and is offered in the -1 speed grade for cost-sensitive designs. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits after PCB fabrication. The FLEX 10KA family belongs to the broader category hierarchy of FPGA -> programmable logic device -> digital IC -> semiconductor, and was the industry-first embedded programmable logic family to provide System-on-a-Programmable-Chip (SOPC) integration through its dedicated embedded array blocks (EABs). This combination of logic and embedded memory enabled designers to build complete subsystems including controllers, datapaths, and small microprocessors on a single programmable die. Key features of the EPF10K30ATI144-1 include 1,728 logic cells, 216 LABs, 12 Kbit embedded array memory, 102 user I/Os, and 4 dedicated inputs, all supplied through a 3.3 V single-rail interface. The device is housed in a 144-pin TQFP surface-mount package suitable for standard reflow assembly. The -1 speed grade offers the slowest timing in the FLEX 10KA lineup but provides the lowest cost point, making it attractive for prototyping, education, and legacy production designs where maximum clock rate is non-critical. Architecturally, the FLEX 10KA combines a fine-grained logic fabric with coarse-grained embedded array blocks, allowing designers to trade off random logic density against memory/RAM capacity on a per-design basis. Each LAB contains eight logic elements, each with a 4-input look-up table, a programmable flip-flop, and dedicated carry and cascade chains for high-speed arithmetic and wide fan-in functions. The embedded array blocks provide true dual-port RAM, ROM, and FIFO primitives up to 2 Kbit per block with parity support, removing the need for external SRAM in many glue-logic applications. Typical applications include industrial control and factory automation, telecommunications glue logic, legacy peripheral controllers, ASIC prototyping, low-volume production bridges, and educational FPGA platforms. Designers migrating from discrete 74-series TTL or PAL/GAL devices frequently chose the EPF10K30A family because it consolidated dozens of small logic functions onto a single re-programmable part. In production the device supports in-system programmability through the IEEE 1149.1 JTAG interface and is configured at power-up from a serial PROM such as the EPC2 or EPC8 configuration device. When designing with this FPGA, allocate sufficient printed-circuit-board area for the configuration PROM and the JTAG header. The 144-pin TQFP has a 0.5 mm pitch and requires careful fan-out; route all global clock and high-fanout signals on inner PCB layers with controlled impedance. For signal integrity, keep clock traces short and isolated, and provide 0.1 uF decoupling on every VCCIO/VCCINT pin pair. Designers must also respect the device's in-rush current during configuration and ensure the 3.3 V rail ramps within the datasheet-specified 100 us window. This page synthesizes distributor availability, parametric specifications, drop-in compatible parts from the same FLEX 10KA family, and practical design notes for the EPF10K30ATI144-1, providing information beyond a single manufacturer datasheet.
EPF10K30ATI144-2 - 30K-Gate FLEX 10KA FPGA, 144-TQFP | Altera
The Altera (Intel Programmable Solutions Group) EPF10K30ATI144-2 is a member of the FLEX 10KA family of CMOS SRAM-based Field-Programmable Gate Arrays (FPGAs) integrating approximately 30,000 typical gates, 1,728 logic elements, and 12,288 RAM bits in a 144-pin Plastic Quad Flat Pack (TQFP) package. The -2 speed grade and 'I' (industrial) temperature suffix make this device a moderate-performance, extended-temperature variant aimed at glue-logic, bus-interface, and state-machine consolidation designs. An FPGA is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected through programmable interconnect and surrounded by programmable I/O cells. Unlike ASICs, FPGAs are manufactured in volume and customized at the customer's bench via a configuration bitstream loaded into on-chip SRAM at power-up. The FLEX 10KA family extends the original FLEX 10K architecture by adding embedded array blocks (EABs) that implement dedicated on-chip memory, doubling usable on-chip RAM to 12,288 bits and enabling true single-chip implementations of small FIFOs, register files, and lookup tables alongside general logic. Key features of the EPF10K30ATI144-2 include 246 user I/O pins distributed across six I/O banks, an embedded array of 12 EABs delivering up to 12,288 bits of fast synchronous RAM, JTAG-based IEEE 1149.1 boundary-scan test support, multi-volt I/O compatibility with 5.0 V, 3.3 V, and 2.5 V interfaces, and in-system programmability through the Altera MAX+PLUS II or Quartus development flow. The 144-pin TQFP footprint offers a compact, low-cost PCB integration path. Typical applications span industrial control, glue logic for microprocessor and DSP subsystems, peripheral and bus interfacing, low-volume prototyping bridges to ASIC migration, and telecommunication line-card glue logic. Compared with later Cyclone families, the FLEX 10KA uses older 0.42 µm CMOS, four-metal-layer process technology and consumes higher static current; it remains attractive only for legacy board respins, long-life industrial platforms, and cost-sensitive retrofits. When designing with this device, provide a clean 5.0 V core supply, decoupling with at least one 0.1 µF ceramic capacitor per supply supply pin, and a configuration PROM or microcontroller to load the bitstream at power-up. Verify all JTAG signals are pulled to defined states during board bring-up to prevent accidental reprogramming in noisy environments. This page synthesizes verified distributor availability, same-family drop-in alternatives, lifecycle context, and practical design guidance not found on a single distributor listing, helping engineers rapidly assess whether the EPF10K30ATI144-2 is still viable for their long-life program.
EPF10K30ATI144-3N - 30K Gate FLEX-10KA FPGA, 102 I/O, TQFP-144
The Altera (now Intel) EPF10K30ATI144-3N is a member of the FLEX 10KA family of embedded programmable logic devices, delivering 30,000 typical gates, 1,728 logic cells, and 12,288 bits of embedded SRAM in a 144-pin TQFP surface-mount package. Operating from a 3.3 V core supply, the device provides 102 user I/O pins and supports system clock rates up to 125 MHz, targeting glue-logic, bus-interface, and low-to-mid density state-machine designs. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can wire up after manufacture to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy (PLA -> CPLD -> FPGA) and offer higher density, richer memory, and faster I/O than CPLDs. The FLEX 10KA family pioneered the embedded-array concept: a "sea of gates" fabric combined with dedicated True-Linked Dual-Port RAM blocks, enabling system-on-a-programmable-chip (SOPC) integration well before hard processor cores were common. Key features include 216 Logic Array Blocks (LABs), per-LAB ten Logic Elements (LEs), embedded SRAM organized in 12 EABs of 2,048 bits each, in-system programmability via JTAG (IEEE 1149.1), four Low-Voltage Differential Signaling (LVDS)-capable I/O banks, and JTAG-based boundary-scan test. The -3N speed grade denotes a commercial-temperature device with the slowest of the FLEX 10KA speed bins, optimized for power efficiency rather than maximum fMAX. Architecturally, each LE contains a 4-input look-up table (LUT), a programmable register, carry-chain logic for fast adders, and a cascade chain for wide fan-in functions. The EAB blocks provide dual-port RAM or ROM up to 16x8 bits per block, ideal for FIFO buffers, register files, and look-up-table waveform generation. Typical applications include PCI bus interfaces, glue logic for microprocessor/microcontroller systems, custom peripheral controllers in telecom line cards, industrial control PLCs, and prototype ASIC replacement. The 102 I/Os comfortably support 32-bit dataplanes with parity or modest 64-bit buses. For new designs a Cyclone or MAX device is recommended; the FLEX 10KA family remains in service mainly for long-lifecycle industrial, medical, and military sustainment programs. Design considerations: plan for 3.3 V VCCINT and a separate VCCIO bank supply (3.3 V or 2.5 V depending on the I/O standard chosen). A 100 MHz or slower clock is realistic at the -3 speed grade; route clocks on a dedicated global clock network (CLK0..CLK3) and place a 0.1 µF decoupling cap on every VCC/VCCIO pin pair. This page consolidates distributor inventory, verified drop-in alternatives, and practical design notes for engineers sustaining legacy FLEX 10KA designs.
EPF10K30EFC256-1 - FLEX 10KE FPGA, 30K Gates, 256-BGA | Intel
The Intel (formerly Altera) EPF10K30EFC256-1 is a member of the FLEX 10KE family of FPGAs delivering 30,000 typical gates and 1,728 logic elements in a 256-ball FineLine BGA package. It operates from a 2.5 V core supply (2.375 V to 2.625 V), supports 176 user I/O pins, and is graded for commercial temperature operation (0C to +70C). The FLEX 10KE series uses a 0.22 µm SRAM-based look-up table (LUT) architecture with embedded array blocks (EABs) for on-chip RAM and ROM, enabling integration of logic and memory in a single device. What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits after PCB fabrication. Within the broader semiconductor taxonomy, an FPGA sits above fixed-function ASICs and below microcontrollers in terms of design flexibility: FPGAs can be reconfigured indefinitely via SRAM configuration memory, while microcontrollers execute software instructions. The FLEX 10KE family specifically introduced embedded array blocks (EABs), bridging the gap between pure logic FPGAs and earlier CPLDs that lacked dedicated memory. Key specifications include 24,576 logic cells (typical gate-equivalent), 1,728 flip-flops, embedded RAM organized in EABs, multi-volt I/O support, and JTAG-based in-system programmability via the ByteBlaster or BitBlaster configuration interface. The -1 speed grade provides a balance between cost and performance for general-purpose digital designs. The device architecture combines four-input LUT-based logic elements (LEs) with EABs that provide up to 2 Kbits of true dual-port RAM each, ideal for FIFO buffers, register files, and small lookup tables. Each LE contains a four-input LUT, a programmable flip-flop, and dedicated carry and cascade chains for high-speed arithmetic and wide fan-in functions. Typical applications include digital signal processing front-ends, telecommunications glue logic, industrial control interfaces, prototyping for ASIC designs, and legacy system maintenance where 5 V-tolerant multi-volt I/O is required. The 256-pin BGA package enables high I/O density on compact boards. When designing with this part, designers must supply a stable 2.5 V core and configure the device through a serial or parallel PROM at every power-up because SRAM-based FPGAs are volatile. JTAG boundary-scan support simplifies board test, while in-system programmability allows field upgrades without component replacement. This page synthesizes distributor stock data, drop-in alternatives, and practical design notes for engineers maintaining FLEX 10KE designs or sourcing legacy FPGAs through authorized distributors.
EPF10K30EFC256-1X - FLEX 10KE FPGA, 30K Gates, 256-BGA | Intel / Altera
The Intel (formerly Altera) EPF10K30EFC256-1X is a member of the FLEX 10KE family of SRAM-based FPGAs, providing 30,000 typical gates and 1728 logic elements (LEs) housed in a 256-ball FineLine BGA package. The device implements the FLEX 10KE architecture with 216 logic array blocks (LABs), 176 user I/O pins, and embedded array blocks (EABs) for distributed RAM and ROM. According to the Altera FLEX 10KE datasheet, the -1X speed grade offers the fastest commercial-grade timing with internal frequencies up to 250 MHz in 0.22 µm CMOS technology. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacture to implement custom digital logic functions. FPGAs sit within the broader programmable logic device (PLD) family, which also includes SPLDs and CPLDs. FPGAs like the FLEX 10KE sit at the top of the PLD hierarchy, providing the highest logic density and the richest interconnect. FPGAs occupy the position of programmable logic in the system hierarchy: ASIC < structured ASIC < FPGA < general-purpose microprocessor/DSP, with FPGAs delivering higher integration than CPLDs at lower NRE cost than full-cell ASICs. Key features include 24,576 bits of embedded memory distributed across EABs, four phase-locked loops (PLLs) for clock management, MultiVolt I/O supporting 2.5V/3.3V/5V interfaces, and in-system programmability via the IEEE 1149.1 JTAG interface. The 256-pin FBGA package provides a 17 mm x 17 mm body with 1.0 mm ball pitch, optimized for high-density surface-mount designs. Each EAB provides 4 Kbits of RAM, giving the device approximately 6 Kbits of usable RAM per EAB configuration. The FLEX 10KE architecture combines a fine-grained gate-array fabric (logic elements organized in LABs of 8 LEs each) with coarse-grained embedded array blocks for memory-intensive functions. The interconnect uses a hierarchical FastTrack routing structure with row and column channels, allowing predictable timing closure across typical logic utilization levels. The 0.22 µm CMOS process places the device in the legacy SRAM-FPGA tier that powered Altera's programmable logic roadmap from 1998 onwards. Typical applications include industrial control logic, telecommunications interface bridges, glue logic replacement, and prototype ASIC verification. The 176 user I/Os support abundant parallel buses, making the device suitable for legacy peripheral interfacing and custom state machines in test equipment. The combination of 30K gates and embedded memory also fits DSP pre/post-processing pipelines and protocol conversion cards in legacy industrial backplanes. When designing with this device, note that the FLEX 10KE family requires 2.5V core supply and supports 2.5V/3.3V/5V MultiVolt I/O. JTAG programming is mandatory because the SRAM configuration cell is volatile. The 256-BGA FineLine package demands careful PCB design with controlled-impedance routing and matched-length clock traces. This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE family, and practical design notes not found in the original Altera datasheet, providing information gain beyond standard product listings.
EPF10K30EFC256-2 - FLEX 10KE FPGA, 30K Gates, 256-FBGA | Altera
The Altera (Intel) EPF10K30EFC256-2 is a member of the FLEX 10KE family of FPGAs delivering approximately 30,000 system gates with 1,728 logic elements and 24,576 RAM bits in a 256-ball FineLine BGA package. It operates at a core voltage of 2.5 V (2.375 V to 2.625 V) and provides 176 user I/Os at up to 80 MHz internal frequency with 0.6 ns propagation delay, balancing logic density and I/O bandwidth for mid-complexity programmable designs. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory that designers can re-configure in-system via SRAM lookup tables. Within the broader hierarchy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) as the high-density branch of programmable logic; the FLEX 10KE family is a 0.22 um CMOS SRAM-based architecture that pioneered embedded array block (EAB) integration, foreshadowing modern System-on-a-Programmable-Chip (SoPC) designs. The EPF10K30E distinguishes itself with embedded dual-port RAM blocks, a 2.5 V core, and PCI compliance for bus-interface applications. Key features include 1728 logic elements, 24,576 RAM bits distributed across embedded array blocks (EABs), 216 logic array blocks (LABs), 176 usable I/O pins, and a peak operating frequency around 200 MHz according to family specifications. The FLEX 10KE architecture supports in-system programmability via the IEEE 1149.1 JTAG interface and passive serial configuration, enabling rapid prototyping. With SRAM-based configuration, the device must be reconfigured at each power-up using an external configuration PROM such as the EPC2 or EPC8 series. The EPF10K30E combines look-up-table (LUT)-based logic cells with embedded dual-port RAM, making it suitable for glue logic, bus interfaces, custom state machines, and moderate-density signal processing front-ends. Its embedded array blocks can implement FIFOs, ROM tables, and small DSP functions without consuming general-purpose logic. The 0.22 um CMOS process at 2.5 V core gives it better power efficiency than earlier 5 V FLEX 10K devices while preserving a familiar Quartus/MAX+PLUS II design flow. Typical applications include PCI bus interfaces, telecommunications line cards, industrial control logic, glue logic for ASIC/ASSP replacement, and prototype systems that need a moderate gate count and a high I/O count. The 176 I/O pins accommodate wide data buses and parallel peripheral interfaces, while the embedded RAM blocks enable protocol buffering and lookup-table acceleration. When designing with this FPGA, ensure the configuration PROM is sized appropriately for the bitstream and that JTAG chain integrity is validated before relying on in-system updates. Because the FLEX 10KE family is a mature, mature-generation part, lead-time risk is significant; verify distributor stock and lifecycle status before committing to a long-lifecycle design.
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
The Intel (formerly Altera) EPF10K30EFC256-2N is a member of the FLEX 10KE embedded programmable logic family, delivering approximately 30,000 typical gates with 1,728 logic elements (LEs) and 24,576 RAM bits in a 256-ball FineLine BGA package (17 x 17 mm, 1.0 mm pitch). It is implemented in a 0.22 µm CMOS SRAM process and supports in-system configuration via a built-in serial configuration interface. The '2N' speed grade corresponds to a propagation delay of approximately 0.6 ns at the register-to-register path, with a commercial operating temperature range of 0 °C to +70 °C. A FLEX 10KE device is an SRAM-based FPGA that combines a logic array fabric with an Embedded Array Block (EAB), enabling true System-on-a-Programmable-Chip (SOPC) integration. Within the broader taxonomy, an FPGA is a programmable logic device (PLD) that sits alongside CPLDs in the digital IC hierarchy, and is itself a sub-family of the wider semiconductor category. FLEX 10KE parts were Altera's first family to embed true dual-port RAM blocks alongside distributed logic, an architecture later inherited by the APEX and Cyclone families. Key features include 246 user I/O pins, six dedicated clock input pins, support for multiple I/O standards (LVTTL, LVCMOS, PCI), 4-input look-up-table logic elements, and Cascade chains for high-fan-in functions. The device supports MultiVolt I/O for interfacing to 5.0 V, 3.3 V, and 2.5 V buses. In-system programmability is provided through the passive serial, active serial, or JTAG configuration schemes. Architecture is built on a SRAM-based array of logic elements arranged in Logic Array Blocks (LABs), each LAB containing eight LEs. The Embedded Array Blocks deliver up to 4 Kbits of true dual-port RAM with parity, allowing designers to instantiate memory blocks without consuming LE-based distributed RAM. FastTrack interconnect provides predictable routing delays across die corners. Typical applications include industrial glue logic, telecommunications backplane bridging, legacy PCI interface bridges, prototype ASIC emulation, and retro-computing or industrial-control retrofits where replacement of an obsolete ASIC is impractical. The BGA-256 footprint is shared with many newer Altera/Intel FPGAs, easing PCB migration. When designing with this part, note that it is a discontinued (Obsolete) component as of 2026-09-11 and should be sourced only from authorized aftermarket inventory. Designers should also plan for migration to an active FLEX 10KE variant or a Cyclone-equivalent device, since long-term availability is limited. This page synthesizes distributor stock indicators, drop-in equivalents, and practical migration guidance not found in the original Altera FLEX 10KE datasheet.
EPF10K30EFC256-2X - 30K FLEX-10KE FPGA 1728 Cells 256-BGA | Intel / Altera
The Intel / Altera EPF10K30EFC256-2X is a member of the FLEX-10KE embedded programmable logic family, delivering 30,000 gates and 1,728 logic elements on a 0.22 µm CMOS process in a 256-ball FineLine BGA package measuring 17x17 mm. It operates from a 2.375 V to 2.625 V (2.5 V nominal) supply and supports user I/O counts up to 176 with a propagation delay as low as 0.6 ns and internal frequency up to 200 MHz. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that can be configured by the designer after manufacturing to implement custom digital logic. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs -> embedded-block FPGAs. The FLEX-10KE family pioneered embedded array blocks, integrating RAM and logic to enable System-on-a-Programmable-Chip (SOPC) designs that combine glue logic, FIFOs, and state machines on a single device. Key features include 24,576 bits of embedded SRAM distributed across EABs (Embedded Array Blocks), 216 Logic Array Blocks (LABs), 0.22 µm CMOS technology, and a -2 speed grade. The FineLine BGA package provides high I/O density for designs requiring many parallel interfaces in a compact footprint, suitable for legacy telecom, industrial control, and ASIC prototyping systems. Typical applications include ASIC prototyping, glue-logic consolidation, custom DSP pre-processing, telecom interface bridges, and industrial bus controllers. The device is also used in test equipment, military/aerospace (when properly screened), and legacy communications infrastructure where the FLEX-10KE architecture is well-supported by mature toolchains such as Quartus II and MAX+PLUS II. When designing with this device, ensure proper decoupling per FLEX-10KE guidelines and verify configuration mode support (e.g., passive serial, JTAG) against the toolchain version. Note that this part is now legacy hardware - confirm long-term availability with authorized distributors before committing to new designs.
EPF10K30EFC256-2XN - 30K FLEX-10KE FPGA, 256-BGA, Industrial | Altera
The Intel (formerly Altera) EPF10K30EFC256-2XN is a member of the FLEX 10KE family of Field Programmable Gate Arrays (FPGAs), delivering 30,000 typical gates (17,280 usable logic elements / 1,728 logic cells) in a 256-ball FineLine BGA (FBGA) package. Built on a 0.22 micrometer CMOS SRAM process with four-layer metal interconnect, this device operates from a 2.5 V core supply (2.375 V to 2.625 V) and supports 176 user I/O pins, with internal frequency performance up to 200 MHz depending on design. The '-2X' speed grade and 'N' suffix denote an industrial temperature range (-40 C to +85 C) and lead-free / Pb-free packaging. An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that can be re-programmed to implement arbitrary digital logic functions. FPGAs sit above fixed-function ASICs and microcontrollers in flexibility, occupying the niche between software-defined microcontrollers and fully custom silicon - enabling rapid prototyping, low-volume production, and hardware-reconfigurable signal processing. The FLEX 10KE family introduced embedded array blocks (EABs) for on-chip RAM and ROM, making it suitable for designs requiring distributed memory alongside logic. Key features include 24,576 bits of embedded RAM (6 EABs of 4,096 bits each), multi-volt I/O support (3.3 V and 5.0 V tolerant), in-system programmability via JTAG, and built-in PCI compliance for bus-interface designs. The 256-FBGA 17x17 mm package provides high pin density for compact board layouts, with all 176 user I/Os available at standard logic levels. The architecture combines 1,728 logic elements (each containing a 4-input LUT and a register) with embedded array blocks for synchronous memory, allowing single-chip implementation of glue logic, state machines, bus bridges, and DSP datapaths. MultiVolt I/O lets the device interface directly with 5 V, 3.3 V, and 2.5 V peripherals without external level shifters, a significant advantage in mixed-voltage systems. Typical applications include telecom interface cards, industrial control and automation, legacy PCI bridge logic, motor control, and glue logic replacement in telecom and embedded systems where the FLEX 10KE remains in long-lifecycle production. The industrial temperature range and EOL-managed mature-node silicon also suit it for defense and aerospace programs requiring stable, multi-decade component availability. When designing with this part, remember the FLEX 10KE requires 2.5 V core; plan a separate regulator from any 3.3 V or 5 V rails. The device is configured via JTAG or an Altera EPC configuration EEPROM, and Quartus II (legacy versions) or MAX+PLUS II software is used for design entry. For new designs, consider Cyclone IV or MAX 10 as modern, lower-power, higher-density drop-in-compatible replacements in many applications. This page synthesizes distributor pricing, drop-in alternatives, lifecycle notes, and practical design guidance for engineers maintaining FLEX 10KE-based systems, information not consolidated in the manufacturer datasheet alone.
EPF10K30EFC256-3 - 30K FLEX 10KE FPGA, 1728 Cells, 256-BGA | Intel
The Intel (formerly Altera) EPF10K30EFC256-3 is a member of the FLEX 10KE family of SRAM-based Field Programmable Gate Arrays (FPGAs), offering 30,000 typical gates, 1,728 logic cells (LEs), and 24,576 RAM bits in a 256-ball FineLine BGA package at a -3 (faster) speed grade. Built on a 0.22 micrometer CMOS process and operating from a 2.5 V core supply, this device delivers system frequencies up to 200 MHz while exposing 176 user I/O pins for high-density glue-logic and bus-interface designs. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that combines gate-array-equivalent logic density with configurable interconnect, embedded memory blocks, and an I/O ring that can be programmed for multiple voltage and timing standards. FPGAs belong to the broader hierarchy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> look-up-table (LUT) + embedded-block architecture. The FLEX 10KE family pioneered embedded array block (EAB) integration for on-chip RAM and ROM, enabling single-chip implementation of memory-intensive functions like FIFOs and DSP datapaths. Key features of the EPF10K30EFC256-3 include 216 logic array blocks (LABs), a built-in Joint Test Action Group (JTAG) boundary-scan interface (IEEE Std 1149.1 compliant), multi-voltage I/O standards support (LVTTL, LVCMOS, PCI), and the Altera SameFrame pin-compatibility migration path that allows board reuse across the 256-pin FineLine BGA family. The -3 speed grade targets designs where the highest toggle rates and shortest combinatorial delays are required. Architecturally, the FLEX 10KE device connects each LAB through a continuous FastTrack Interconnect routing fabric, while embedded array blocks provide true dual-port RAM capability. Compared with pure gate-array ASICs, the FLEX 10KE family offers instant prototyping, in-system reconfigurability through the serial configuration device interface, and significantly lower non-recurring engineering (NRE) cost for low-to-medium-volume production. Typical applications include telecommunications line cards, industrial control and factory automation backplanes, networking routers and switches, PCI bus bridges, and legacy ASIC-replacement designs. The 256-FBGA footprint and SameFrame pin migration also enable straightforward board reuse across the FLEX 10K family density ladder. When designing with the EPF10K30EFC256-3, ensure that the configuration EPROM (EPC8 or equivalent) is correctly sized for the device bitstream and that all 2.5 V VCCINT and 3.3 V VCCIO rails are properly decoupled with bulk and high-frequency ceramic capacitors near the BGA balls. This page synthesizes distributor pricing, SameFrame drop-in alternatives within the FLEX 10K family, and practical design notes that supplement the manufacturer datasheet to accelerate component selection.
EPF10K30EFC256-3N - FLEX 10KE 30K-Gate FPGA | Intel/Altera
The Intel (formerly Altera) EPF10K30EFC256-3N is a 30,000-gate FLEX 10KE family FPGA with 1,728 logic elements, fabricated on a 0.22 um CMOS process and supplied in a 256-pin FineLine BGA (FBGA) package. It is the industry's first embedded programmable logic device family to provide System-on-a-Programmable-Chip (SOPC) integration through embedded array blocks (EABs) that implement megafunctions such as efficient memory and specialized logic functions. The device operates with a 2.5 V core supply, supports MultiVolt I/O for 2.5 V/3.3 V/5.0 V interfacing, and offers PCI-compliant 3.3 V operation at 33 or 66 MHz. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric is built from an array of configurable logic blocks (CLBs) connected by programmable interconnect. Embedded array blocks (EABs) augment the general-purpose LUT-based fabric with on-chip dual-port RAM and ROM, so an FPGA can absorb functions that would otherwise require a separate memory or ASIC. FPGAs sit in the broader hierarchy of programmable logic: PAL -> CPLD -> FPGA -> SoC FPGA, and they are used wherever deterministic, parallel hardware acceleration is required. Key features include 6 embedded array blocks implementing up to 24,576 RAM bits, bidirectional I/O performance up to 212 MHz, tSU and tCO propagation as fast as 0.6 ns, full PCI SIG 2.2 compliance at 33/66 MHz on -1 speed grade, open-drain output option per I/O, and JTAG boundary-scan support. MultiVolt I/O enables mixed-voltage interfacing with 2.5 V, 3.3 V, and 5.0 V devices without external translation buffers. The EPF10K30EFC256-3N architecture combines an Embedded Array for memory-intensive megafunctions with a Logic Array for general-purpose logic, and supports the same-frame pin-out migration path within the FLEX 10KE family. This allows a single PCB layout to host multiple density / package combinations, simplifying board bring-up and second-sourcing. Typical applications include PCI bus bridges, glue logic for embedded systems, communications infrastructure prototyping, industrial control interfaces, and legacy systems that require a still-supported 0.22 um CMOS FPGA. The 256-pin FBGA footprint also makes it suitable for high-density designs where leaded packages cannot meet routing requirements. A key design consideration when using this part is that the FLEX 10KE family has been classified Obsolete / End of Life by Intel, so procurement should be paired with a verified cross-reference plan. Confirm your design tools (Quartus II) and IP libraries still support the device before committing to new production runs. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPF10K30EFC484-1 - FLEX 10KE FPGA, 30K Gates, 484-BGA | Altera
The Intel (formerly Altera) EPF10K30EFC484-1 is a FLEX 10KE-series Field Programmable Gate Array (FPGA) integrating 30,000 typical gates and 1728 logic elements in a 484-ball FineLine BGA package. The device delivers up to 220 user I/Os and 24,576 bits of embedded RAM in a commercial 0C to 70C temperature grade, optimized for high-volume glue-logic and bus-interface designs. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device whose logic functionality is defined by a user-supplied configuration bitstream rather than at wafer fabrication. FPGAs sit between discrete TTL logic and Application-Specific Integrated Circuits in the programmable logic hierarchy, which itself belongs to the broader category of programmable logic devices (PLDs) within the integrated circuit family. The FLEX 10KE family was Altera's second-generation embedded-block SRAM FPGA, providing dedicated array blocks (EABs) for true dual-port memory, making them suitable for systems-on-a-programmable-chip (SOPC) integration. Key features of the EPF10K30EFC484-1 include 1728 logic elements, 216 logic array blocks (LABs), 24576 embedded RAM bits, 6.0 ns typical pin-to-pin propagation delay, and 80 MHz internal performance. The device supports MultiVolt I/O (operating with mixed 2.5V/3.3V/5.0V signaling rails through independent VCCIO banks), PCI-compliant I/O with on-chip clamping diodes, slew-rate control, and open-drain output options configurable on a per-pin basis. JTAG boundary-scan test (IEEE 1149.1) is provided for board-level test access. The FLEX 10KE architecture combines a fine-grained logic element fabric with coarse-grained Embedded Array Blocks (EABs), allowing efficient implementation of wide functions, multipliers, and small FIFOs without consuming general-purpose logic. The 5x5 mm FineLine BGA package supports SameFrame pin migration to other 10KE densities in the 484-pin BGA family, simplifying design portability across the series. Typical applications include telecommunications interface cards, industrial glue logic and bus bridges, PCI bus interface glue, test and measurement backplanes, and legacy system upgrades. The 484-ball BGA footprint supports dense PCB layouts while preserving a moderate pincount. When designing with this part, verify the Altera Quartus MAX+PLUS II design toolchain compatibility and the legacy PCN status before committing to new designs. Several Altera MAX+PLUS II and Quartus versions do not support FLEX 10KE in current releases. This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE family and Xilinx competitors, and practical design notes not aggregated in a single datasheet source.
EPF10K30EFC484-2 - 30K FLEX-10KE FPGA, 220 I/O, 484-BGA | Intel / Altera
The Intel (formerly Altera) EPF10K30EFC484-2 is a member of the FLEX 10KE family of SRAM-based field-programmable gate arrays, providing 30,000 typical gates, 1,728 logic elements (LEs), and 24,576 RAM bits in a 484-ball FineLine BGA package. It is offered in the -2 speed grade with 220 user I/O pins, targeting high-volume logic integration, datapath acceleration, and glue-logic consolidation on a single programmable device. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that can be reconfigured by the designer after manufacture. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy: integrated circuit -> programmable logic -> FPGA -> SRAM-based FPGA -> FLEX 10KE family. Unlike ASICs, FPGAs ship as blank silicon and are programmed using HDL flows (VHDL/Verilog) via tools such as Altera/Intel Quartus, enabling rapid prototyping and low-NRE design cycles. Key features of the EPF10K30EFC484-2 include 216 logic array blocks (LABs), 1728 LEs, 24,576 embedded SRAM bits organized as EABs (Embedded Array Blocks), 220 user I/Os, and support for LVTTL, LVCMOS, PCI, and other single-ended I/O standards through its configurable I/O elements. The device operates from a 2.5V core supply with separate VCCIO banks for I/O flexibility, and the -2 speed grade indicates a mid-range performance bin suitable for general-purpose datapath and control logic. The FLEX 10KE architecture combines a row/column interconnect with distributed Look-Up Table (LUT) logic and dedicated EAB memory, allowing designers to instantiate RAM, ROM, multiplier functions, and FIFO buffers alongside glue logic. The 484-FBGA package maximizes I/O count while minimizing board area, making the device attractive for designs that would otherwise require multiple CPLDs or discrete logic. Typical applications include telecommunications line cards, industrial control backplanes, low-density prototyping platforms, and legacy system upgrades where the FLEX 10KE is already deployed. Engineers also use it for educational platforms and as a stepping stone before migrating designs to Cyclone or MAX series devices. When designing with this part, attention must be paid to I/O bank voltage grouping, JTAG configuration mode selection, and the fact that the FLEX 10KE family is now classified NRND/end-of-life by Intel. Designers should plan a migration path to a current-generation Cyclone or MAX device if long-term availability is required. This page synthesizes distributor pricing, parametric datasheet values, drop-in alternative guidance, and practical design notes not found in the standalone manufacturer datasheet.
EPF10K30EQC208-1 - 30K Gates, 147 I/O FLEX 10KE FPGA | Intel
The Intel EPF10K30EQC208-1 is a high-density, high-performance FLEX 10KE Field Programmable Gate Array delivering 30,000 typical gates, 1,728 logic elements, and 216 logic array blocks (LABs) in a 208-pin BQFP package with 147 user I/Os. Operating from a 2.5 V core supply (2.375 V–2.625 V) with 5.0 V tolerant I/O, the device integrates 24,576 bits of embedded SRAM and supports system frequencies up to 80 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor IC built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed in-system to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and CPLDs in the programmable-logic hierarchy, offering higher density than CPLDs and faster time-to-market than ASICs. FPGAs are widely used for glue logic, bus interfacing, prototype ASICs, signal processing pipelines, and compute acceleration. Key features of the EPF10K30EQC208-1 include 0.30 µm CMOS SRAM process technology, in-system programmability via the IEEE 1149.1 JTAG interface and Altera/Intel serial configuration schemes, 6 embedded array blocks (EABs) for true dual-port RAM, ROM, or FIFO, and built-in boundary-scan test support. The 208-BQFP (PQFP) package provides gull-wing leads on a 28×28 mm body with commercial 0 °C to +70 °C operating temperature range. Architecturally, the FLEX 10KE family extends the original FLEX 10K with 2.5 V core operation, lower power, faster interconnect, and additional I/O standards. Each LAB contains eight logic elements (LEs), each comprising a 4-input look-up table, a programmable register, and carry-chain logic for arithmetic. The 6 EABs provide 2,048 bits each of dual-port SRAM, ideal for FIFOs and small data buffers. Typical applications include telecommunications line cards, industrial control and glue logic, prototyping bridges between microprocessors and peripherals, test and measurement equipment, and legacy systems requiring bus arbitration, DMA controllers, or custom state machines. Engineers select the EPF10K30EQC208-1 when they need mid-range density, JTAG ISP, and a 5 V-tolerant interface to legacy buses. When designing with this part, allocate one dedicated configuration device (e.g., EPC2) or use JTAG download for prototyping. Verify I/O bank voltage compatibility before mixing 3.3 V and 5.0 V peripherals, and use Altera/Intel Quartus II or MAX+PLUS II for synthesis, fitting, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE and FLEX 10KA families, and practical design notes drawn from Intel/Altera legacy documentation, providing context beyond the original datasheet alone.
EPF10K30EQC208-1N - FLEX 10KE FPGA, 30K Gates, PQFP-208 | Intel
The Intel (formerly Altera) EPF10K30EQC208-1N is a FLEX 10KE family Field-Programmable Gate Array (FPGA) featuring 30,000 typical gates, 1,728 logic elements, and 24,576 bits of embedded RAM, housed in a 208-pin Power Quad Flat Pack (PQFP/BFQFP) surface-mount package. The 'E' suffix denotes the 2.5V core supply variant, the 'C' denotes commercial 0 to 70 C operating range, the '208' is the PQFP-208 pin count, the '-1' indicates the speed grade, and the trailing 'N' marks a lead-free / RoHS-compliant finish. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and I/O cells on a single silicon die. FPGAs sit within the broader taxonomy of digital semiconductors: PLD -> FPGA -> SRAM-based FPGA. The FLEX 10KE family specifically pioneered embedded array blocks (EABs) that integrate dedicated RAM, ROM, or multiplier functions alongside the general logic fabric, enabling System-on-a-Programmable-Chip (SOPC) integration of glue logic, state machines, register files, and small FIFOs in a single device. Key features of the EPF10K30EQC208-1N include 147 user I/O pins, 216 logic array blocks / configurable logic blocks, an internal clock frequency up to 250 MHz, 0.22 µm CMOS process technology, 2.5V core VCCINT with 3.3V or 5V tolerant I/O via VCCIO banks, in-system programmability via SRAM configuration cells, and JTAG (IEEE 1149.1) boundary-scan support. The device retains its configuration in volatile SRAM and must be reconfigured at every power-up from an external PROM or flash, which is characteristic of the FLEX 10KE architecture. Typical applications for the EPF10K30EQC208-1N include legacy industrial glue logic replacement, PCI bus interface bridging, telecommunications channel cards, prototyping of ASIC designs prior to tape-out, and educational / laboratory digital design platforms where the through-hole-friendly PQFP package simplifies socket-based programming and rework. Because this device is now mature and discontinued, surviving inventory is typically allocated to long-life-cycle industrial, military, and aerospace sustainment programs. When designing with this FPGA, plan a 5V or 3.3V I/O supply on VCCIO pins and a tightly regulated 2.5V supply on VCCINT, with bulk decoupling near each supply pin. Allow adequate configuration time during power-up and consider JTAG-based ISP for field updates rather than relying solely on parallel EPC configuration. The PQFP-208 package is suitable for socketed development but is increasingly rare in new designs; for production, prefer a BGA-packaged FLEX 10KE variant such as the EPF10K30EBC356-1 or the equivalent. This page synthesizes distributor stock levels, drop-in alternatives, and design considerations not found in the manufacturer datasheet alone.
EPF10K30EQC208-1X - 30K-Gate FLEX 10KE FPGA, 147 I/O, PQFP-208 | Intel
The Intel (formerly Altera) EPF10K30EQC208-1X is a FLEX 10KE family Field Programmable Gate Array (FPGA) offering 30,000 typical gates, 1,728 logic elements, and 24,576 RAM bits in a 208-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. According to the manufacturer datasheet, the device operates from a 2.5 V core supply (2.375 V to 2.625 V), supports up to 147 user I/O pins, and is rated for commercial temperature (0 C to 70 C). A field programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory arrays, and programmable interconnects. The FLEX 10KE family belongs to the hierarchy of programmable logic devices (PLDs) and was among the earliest commercial architectures to merge a look-up-table (LUT) based logic fabric with embedded array blocks (EABs) for on-chip RAM and ROM. Within Intel/Altera's taxonomy, FLEX 10KE sits between the classic FLEX 10K and the subsequent APEX family, targeting high-volume glue-logic, bus-interface, and DSP pre-processing applications of the late 1990s and early 2000s. Key features of the EPF10K30EQC208-1X include 216 logic array blocks (LABs), an internal frequency capability quoted by distributors at up to 250 MHz (fabric-dependent), a 0.22 micrometer CMOS process, embedded array blocks for distributed RAM/ROM, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The "-1X" speed grade and "C" temperature grade designate a faster commercial-temperature variant. Architecturally, the FLEX 10KE device combines 1,728 logic elements organized in LABs of 8 LEs each, four embedded array blocks (EABs) for memory functions, and FastTrack interconnect routing. The 208-PQFP package provides 147 usable I/O pins with multi-voltage I/O standards including 3.3 V PCI compliance, making the part suitable for mixed-voltage system designs. Typical applications include telecommunications line cards, industrial control and factory automation controllers, PCI bridge and bus-interface logic, video processing front-ends, and legacy glue-logic replacement in mature embedded systems. The combination of SRAM-based configuration and on-chip RAM also makes it useful for prototyping ASICs and implementing custom state machines. When designing with this part, note that it is fabricated on a 5 V-tolerant legacy process; modern system-on-chip designs typically pair FLEX 10KE with a separate 3.3 V/5 V interface transceiver. Designers should also budget for the configuration EEPROM (EPC2 or compatible) and observe the IOREF, VCCINT, and VCCIO decoupling requirements documented in the datasheet. This page synthesizes distributor pricing from DigiKey, Mouser, Octopart and Rochester Electronics, same-brand FLEX 10KE drop-in alternatives, and practical design guidance not found in the manufacturer datasheet alone.
EPF10K30EQC208-2 - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
The Intel (formerly Altera) EPF10K30EQC208-2 is a member of the FLEX 10KE family of SRAM-based Field Programmable Gate Arrays (FPGAs) that integrates 30,000 typical gates, 1,728 logic elements, and 24,576 bits of embedded array memory in a 208-pin Plastic Quad Flat Pack (PQFP) package. It operates at 2.5 V core with a -2 speed grade targeting commercial temperature ranges, and is built on a 0.22 µm CMOS process that delivers up to 200 MHz internal performance. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement custom digital logic. Within the broader taxonomy, the FLEX 10KE family belongs to the loadable PLD class, sitting between simple CPLDs (Complex Programmable Logic Devices) and high-density SRAM FPGAs; the 10KE series added embedded array blocks (EABs) for efficient memory and arithmetic functions, bridging the gap between glue-logic replacement and full-featured FPGA design. Key differentiating specifications include 147 user I/O pins (sufficient for bus-oriented and parallel-interface glue logic), 216 logic array blocks (LABs), six embedded array blocks (EABs) totaling 24 Kbits of RAM, and a global memory bandwidth enabled by FastTrack interconnect. The PQFP-208 footprint with 0.5 mm pitch and 30.6 mm × 30.6 mm body is suitable for through-hole-compatible surface-mount assembly where high pin-count legacy compatibility is required. Architecturally, the FLEX 10KE combines look-up-table (LUT)-based logic elements with row-and-column interconnect, and each LE contains a 4-bit carry chain for fast arithmetic. Embedded array blocks can be configured as synchronous dual-port RAM, ROM, or wide logic functions, making the device suitable for state-machine-heavy designs that also need small memory buffers without an external SRAM. Typical applications include industrial glue logic replacement, legacy peripheral controllers (ISA, PCI bridges), telecom line-card interface logic, prototyping ASIC replacements, and test-and-measurement front-end controllers. The wide 147-I/O count makes it useful for bus bridging, where many control signals must be remapped between legacy and modern interfaces. When designing with this part, plan for the 2.5 V core supply with separate VCCIO banks for mixed-voltage I/O; verify JTAG chain termination and in-system programmability support the production programmer you intend to use, and confirm software toolchain compatibility (Quartus II 13.0 or earlier with FLEX 10KE device support). This page synthesizes distributor pricing, drop-in FLEX 10KE alternatives, and practical design notes that supplement the original Altera/Intel datasheet and reference manuals.
EPF10K30EQC208-2N - FLEX 10KE FPGA, 30K Gates, 208-PQFP | Intel
The Intel (formerly Altera) EPF10K30EQC208-2N is a FLEX 10KE family Field Programmable Gate Array delivering 30,000 typical gates, 1,728 logic elements, and 147 user I/Os in a 208-pin Plastic Quad Flat Pack (PQFP-208) package. The device implements an embedded array architecture with 24,576 bits of embedded RAM and operates at a maximum internal frequency of 200 MHz on a 2.5 V core supply using 0.22 µm CMOS technology. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the high density of gate arrays with the flexibility of in-system configuration. FPGAs sit at the top of the programmable logic hierarchy - above SPLDs and CPLDs - and are widely used as application-specific accelerators, glue logic, and System-on-a-Programmable-Chip (SoPC) building blocks. The FLEX 10KE family was Altera's first embedded programmable logic device family, integrating dedicated Embedded Array Blocks (EABs) with general-purpose logic for memory-intensive designs. Key features include 216 Logic Array Blocks (LABs), 12 Embedded Array Blocks, a 0.6 ns propagation delay per logic element, and SRAM-based configuration. The "C" speed grade with "-2N" suffix denotes the commercial temperature range (0 °C to 70 °C) and a specific speed bin. The PQFP-208 package uses gull-wing leads and is intended for surface-mount assembly on standard FR-4 boards. The FLEX 10KE architecture blends SRAM lookup tables with embedded memory, making it well suited for digital signal processing paths, protocol bridging, and custom peripheral implementations. Its 2.5 V core supply and PCI-compliant I/O buffers allow direct interfacing with industry-standard buses. Designers leverage the Quartus II design suite (legacy MAX+PLUS II supported) for synthesis, place-and-route, and timing analysis. Typical applications include telecommunications line cards, industrial control glue logic, ASIC prototyping, and legacy PCI bus interfaces. The combination of 1,728 logic elements, 24 Kbit embedded memory, and 147 user I/Os makes this device suitable for medium-complexity glue-logic and bus-interface tasks where modern low-cost FPGAs would over-specify the design. When designing with this part, verify availability from authorized sources because the FLEX 10KE family is a legacy product line with limited new-stock availability. Plan migration paths to Cyclone series or later if long-term lifecycle support is required.
EPF10K30EQC208-3 - 30K-Gate FLEX 10KE FPGA, 208-PQFP | Altera
The Intel (formerly Altera) EPF10K30EQC208-3 is a FLEX 10KE family Field Programmable Gate Array (FPGA) IC integrating approximately 30,000 gates, 1,728 logic elements (cells), and 24,576 bits of embedded memory in a 208-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. Speed grade -3 and an internal frequency up to 200 MHz support commercial-temperature digital logic designs where the FLEX 10KE embedded array block (EAB) provides on-chip SRAM for System-on-a-Programmable-Chip (SOPC) integration. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that designers can re-program in the field to implement arbitrary digital logic. FPGAs sit above microcontrollers, ASICs, and CPLDs in the programmable-logic taxonomy, offering higher density and faster parallel processing for glue logic, state machines, bus interfaces, and DSP datapaths. The FLEX 10KE family specifically added embedded array blocks (EABs) for true dual-port RAM and ROM on-chip, enabling SOPC integration without external memory. Key features of the EPF10K30EQC208-3 include 246 user I/Os (the highest I/O density in the FLEX 10KE family), 12 embedded array blocks for distributed and block RAM, 5 V tolerant I/O with MultiVolt support, and IEEE 1149.1 JTAG boundary-scan testing. The device supports in-system programmability (ISP) via the serial passive configuration scheme and consumes approximately 2.5 V core from an external regulator. The architecture combines a fine-grained logic fabric (logic elements with 4-input look-up tables and a programmable register) with coarse-grained embedded array blocks (EABs), each implementing 2,048 bits of RAM. The -3 speed grade corresponds to roughly 0.6 ns propagation delay and enables 200 MHz internal operation, making it suitable for PCI bus interfaces, telecommunications glue logic, and instrumentation controllers. Typical applications include PCI bus interface controllers, telecommunications line-card glue logic, industrial control and instrumentation, custom DSP pre/post-processing stages, and legacy SOPC prototypes. The 208-PQFP is a through-hole-friendly surface-mount package well suited to prototyping and industrial designs that prefer gull-wing leads over fine-pitch BGAs. When designing with this part, plan for an external 2.5 V core regulator and 5 V or 3.3 V I/O bank supplies via MultiVolt. Use the Quartus design tool (legacy: MAX+PLUS II) for synthesis, fitting, and timing analysis, and budget configuration EPROM/flash if in-system configuration is required. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the standalone manufacturer datasheet.
EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
The Intel EPF10K30EQC208-3N is a member of the FLEX 10KE family of Field Programmable Gate Arrays (FPGAs), delivering 30,000 typical gates, 1,728 logic elements, and 24,576 RAM bits in a 208-pin Power Quad Flat Pack (PQFP/BFQFP) package. Operating at a core voltage of 2.5 V on a 0.22 µm CMOS process, the device supports internal clock rates up to 200 MHz with a typical propagation delay of 0.6 ns and offers 147 user I/Os for board-level integration. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that the user can program to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the system hierarchy: digital logic IC -> programmable logic -> FPGA -> System-on-Chip (SoC) FPGA. The FLEX 10KE family was Intel's (originally Altera's) industry-first embedded programmable logic device family with on-chip SRAM blocks, enabling System-on-a-Programmable-Chip (SOPC) integration via its embedded array blocks (EABs). Key features include 216 Logic Array Blocks (LABs) organized across the device fabric, embedded array blocks providing dedicated SRAM for true dual-port or single-port memory functions, in-system programmability via the IEEE 1149.1 JTAG interface, and multi-voltage I/O support allowing 2.5 V, 3.3 V, or 5 V interfaces on the same die. The device's CMOS SRAM-based configuration memory supports unlimited reconfiguration cycles, making it ideal for prototyping and design iteration. The commercial temperature grade (0 °C to 70 °C) targets mainstream industrial and consumer embedded designs. Typical applications include glue logic replacement, bus-bridging interfaces, custom state-machine controllers, DSP co-processing front-ends, and legacy system refresh designs where a programmable logic upgrade path is desired. The on-chip EABs allow implementation of small FIFOs, dual-port RAM, and ROM look-up tables without consuming general-purpose logic. When designing with this part, remember that the SRAM configuration memory must be loaded on every power-up via a configuration PROM (EPC2, EPC8, or EPC16) or a microcontroller host. Pin compatibility within the FLEX 10KE family allows design migration across speed grades and package options on the same PCB footprint, simplifying inventory and second-source planning.