EPF10K30ATC144-2N - FLEX-10KA 30K-Gate FPGA, 144-TQFP | Intel / Altera
部品番号: EPF10K30ATC144-2N ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $44.2 | $442.00 |
| 100 | $39.85 | $3,985.00 |
| 500 | $36.1 | $18,050.00 |
| 1,000 | $33.4 | $33,400.00 |
EPF10K30ATC144-2N 概要
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the high integration of an ASIC with the flexibility of software-reconfigurable logic. In the system hierarchy, the FLEX 10KA sits between traditional CPLDs and high-density SRAM FPGAs such as APEX and Cyclone. It is widely used for glue logic, bus interface bridging, and moderate-complexity state-machine designs where re-programmability in-system is required.
Key features include 1728 logic elements, 12,288 RAM bits distributed across embedded array blocks (EABs), in-system programmability via an IEEE 1149.1 (JTAG) interface, multi-volt I/O support (2.5 V or 3.3 V), and 102 maximum user I/O pins. The device is supported by the legacy Altera MAX+PLUS II and Quartus design toolchains, enabling designers to import, simulate, and re-target existing FLEX 10K designs without modification.
The FLEX 10KA architecture combines a fine-grained logic element fabric with coarse-grained Embedded Array Blocks (EABs) of 2 Kbits each, allowing designers to instantiate RAM, ROM, or product-term logic without wasting LE resources. Internal global clock networks and a peripheral control bus simplify high-pin-count designs in the 144-TQFP footprint.
Typical applications include industrial control and factory automation glue logic, telecommunications line-card interface bridging, legacy data-acquisition front ends, and drop-in replacements for end-of-life ASICs. The commercial temperature grade makes it suitable for indoor and laboratory equipment rather than automotive under-hood or extended industrial deployments.
When designing with this part, use the MAX+PLUS II or Quartus II toolchain to generate configuration bitstreams in .sof or .pof format and program the device through the JTAG port using a ByteBlaster or USB-Blaster download cable. Pay attention to the I/O bank supply rails - 3.3 V banks must not exceed 4.0 V during hot-plug events, otherwise input clamps can latch-up.
This page synthesizes distributor pricing, drop-in alternatives from the same FLEX 10KA family, and practical configuration notes not found in the manufacturer datasheet.
ドロップイン代替品: EPF10K30ATC144-2N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF10K30ATC144-2N （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Process Technology, Family, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
EPF10K30ATC144-2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EPF10K30ATC144-3
✅ ドロップイン✓ 在庫あり
$17.8 / 個
データシートを見る →EPF10K30ATC144-1N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$16.5 / 個
データシートを見る →EPF10K30AQI240-1
✅ ドロップイン✓ 在庫あり
$22.4 / 個
データシートを見る →EPF10K30AQC240-3
✅ ドロップイン✓ 在庫あり
$16.85 / 個
データシートを見る →EPF10K30ATC144-2N 最大定格＆電気的特性
| Series | FLEX 10KA |
| Logic Elements | 1728 |
| Typical Gates | 30,000 |
| Total RAM Bits | 12288 |
| Number of LABs/CLBs | 216 |
| Number of I/O | 102 |
| Voltage Supply | 3.0 V to 3.6 V |
| 動作温度 | 0 °C to 70 °C (Commercial) |
| パッケージ / ケース | 144-LQFP / 144-TQFP |
| 実装タイプ | Surface Mount |
| Process Technology | 0.3 µm CMOS, SRAM-based |
| Propagation Delay | 0.6 ns (per datasheet propagation path) |
| Internal Frequency (max) | 142.86 MHz |
| Programming Interface | JTAG (IEEE 1149.1) via ByteBlaster / USB-Blaster |
| Lead-Free / Finish | Yes (NiPdAu lead finish) |
EPF10K30ATC144-2N ピン構成
| ピン 1 | I/O — User I/O (bank 1) - dual-purpose when configured |
| ピン 2 | I/O — User I/O (bank 1) |
| ピン 3 | I/O — User I/O (bank 1) |
| ピン 4 | I/O — User I/O (bank 1) |
| ピン 5 | I/O — User I/O (bank 1) |
| ピン 6 | I/O — User I/O (bank 1) |
| ピン 7 | VCCINT — Core supply 3.3 V |
| ピン 8 | I/O — User I/O (bank 1) |
| ピン 9 | I/O — User I/O (bank 1) |
| ピン 10 | GND — Ground |
| ピン 11 | I/O — User I/O (bank 1) |
| ピン 12 | I/O — User I/O (bank 1) |
| ピン 13 | I/O — User I/O (bank 1) |
| ピン 14 | I/O — User I/O (bank 1) |
| ピン 15 | TDI — JTAG Test Data In |
| ピン 16 | I/O — User I/O (bank 1) |
| ピン 17 | TMS — JTAG Test Mode Select |
| ピン 18 | I/O — User I/O (bank 1) |
| ピン 19 | TCK — JTAG Test Clock |
| ピン 20 | I/O — User I/O (bank 1) |
| ピン 21 | I/O — User I/O (bank 1) |
| ピン 22 | I/O — User I/O (bank 1) |
| ピン 23 | I/O — User I/O (bank 1) |
| ピン 24 | I/O — User I/O (bank 1) |
| ピン 25 | I/O — User I/O (bank 1) |
| ピン 26 | I/O — User I/O (bank 1) |
| ピン 27 | I/O — User I/O (bank 1) |
| ピン 28 | GND — Ground |
| ピン 29 | I/O — User I/O (bank 1) |
| ピン 30 | DEV_CLRn — Device-wide clear (active low) |
| ピン 31 | I/O — User I/O (bank 1) |
| ピン 32 | I/O — User I/O (bank 1) |
| ピン 33 | I/O — User I/O (bank 1) |
| ピン 34 | I/O — User I/O (bank 1) |
| ピン 35 | VCCIO — I/O supply 3.3 V (bank 1) |
| ピン 36 | I/O — User I/O (bank 1) |
| ピン 37 | I/O — User I/O (bank 1) |
| ピン 38 | I/O — User I/O (bank 1) |
| ピン 39 | I/O — User I/O (bank 1) |
| ピン 40 | I/O — User I/O (bank 1) |
| ピン 41 | I/O — User I/O (bank 1) |
| ピン 42 | GND — Ground |
| ピン 43 | I/O — User I/O (bank 2) |
| ピン 44 | I/O — User I/O (bank 2) |
| ピン 45 | I/O — User I/O (bank 2) |
| ピン 46 | I/O — User I/O (bank 2) |
| ピン 47 | I/O — User I/O (bank 2) |
| ピン 48 | I/O — User I/O (bank 2) |
| ピン 49 | I/O — User I/O (bank 2) |
| ピン 50 | I/O — User I/O (bank 2) |
| ピン 51 | GND — Ground |
| ピン 52 | I/O — User I/O (bank 2) |
| ピン 53 | I/O — User I/O (bank 2) |
| ピン 54 | I/O — User I/O (bank 2) |
| ピン 55 | I/O — User I/O (bank 2) |
| ピン 56 | I/O — User I/O (bank 2) |
| ピン 57 | I/O — User I/O (bank 2) |
| ピン 58 | I/O — User I/O (bank 2) |
| ピン 59 | I/O — User I/O (bank 2) |
| ピン 60 | I/O — User I/O (bank 2) |
| ピン 61 | I/O — User I/O (bank 2) |
| ピン 62 | GND — Ground |
| ピン 63 | I/O — User I/O (bank 2) |
| ピン 64 | I/O — User I/O (bank 2) |
| ピン 65 | I/O — User I/O (bank 2) |
| ピン 66 | I/O — User I/O (bank 2) |
| ピン 67 | I/O — User I/O (bank 2) |
| ピン 68 | I/O — User I/O (bank 2) |
| ピン 69 | I/O — User I/O (bank 2) |
| ピン 70 | VCCIO — I/O supply 3.3 V (bank 2) |
| ピン 71 | I/O — User I/O (bank 2) |
| ピン 72 | I/O — User I/O (bank 2) |
| ピン 73 | I/O — User I/O (bank 2) |
| ピン 74 | I/O — User I/O (bank 2) |
| ピン 75 | I/O — User I/O (bank 2) |
| ピン 76 | I/O — User I/O (bank 2) |
| ピン 77 | GND — Ground |
| ピン 78 | I/O — User I/O (bank 3) |
| ピン 79 | I/O — User I/O (bank 3) |
| ピン 80 | I/O — User I/O (bank 3) |
| ピン 81 | I/O — User I/O (bank 3) |
| ピン 82 | I/O — User I/O (bank 3) |
| ピン 83 | I/O — User I/O (bank 3) |
| ピン 84 | I/O — User I/O (bank 3) |
| ピン 85 | I/O — User I/O (bank 3) |
| ピン 86 | GND — Ground |
| ピン 87 | I/O — User I/O (bank 3) |
| ピン 88 | I/O — User I/O (bank 3) |
| ピン 89 | I/O — User I/O (bank 3) |
| ピン 90 | I/O — User I/O (bank 3) |
| ピン 91 | I/O — User I/O (bank 3) |
| ピン 92 | I/O — User I/O (bank 3) |
| ピン 93 | I/O — User I/O (bank 3) |
| ピン 94 | I/O — User I/O (bank 3) |
| ピン 95 | I/O — User I/O (bank 3) |
| ピン 96 | GND — Ground |
| ピン 97 | I/O — User I/O (bank 3) |
| ピン 98 | I/O — User I/O (bank 3) |
| ピン 99 | I/O — User I/O (bank 3) |
| ピン 100 | I/O — User I/O (bank 3) |
| ピン 101 | I/O — User I/O (bank 3) |
| ピン 102 | I/O — User I/O (bank 3) |
| ピン 103 | I/O — User I/O (bank 3) |
| ピン 104 | VCCIO — I/O supply 3.3 V (bank 3) |
| ピン 105 | I/O — User I/O (bank 4) |
| ピン 106 | I/O — User I/O (bank 4) |
| ピン 107 | I/O — User I/O (bank 4) |
| ピン 108 | I/O — User I/O (bank 4) |
| ピン 109 | I/O — User I/O (bank 4) |
| ピン 110 | I/O — User I/O (bank 4) |
| ピン 111 | I/O — User I/O (bank 4) |
| ピン 112 | I/O — User I/O (bank 4) |
| ピン 113 | GND — Ground |
| ピン 114 | I/O — User I/O (bank 4) |
| ピン 115 | I/O — User I/O (bank 4) |
| ピン 116 | I/O — User I/O (bank 4) |
| ピン 117 | I/O — User I/O (bank 4) |
| ピン 118 | I/O — User I/O (bank 4) |
| ピン 119 | I/O — User I/O (bank 4) |
| ピン 120 | I/O — User I/O (bank 4) |
| ピン 121 | I/O — User I/O (bank 4) |
| ピン 122 | I/O — User I/O (bank 4) |
| ピン 123 | GND — Ground |
| ピン 124 | I/O — User I/O (bank 4) |
| ピン 125 | I/O — User I/O (bank 4) |
| ピン 126 | I/O — User I/O (bank 4) |
| ピン 127 | I/O — User I/O (bank 4) |
| ピン 128 | I/O — User I/O (bank 4) |
| ピン 129 | I/O — User I/O (bank 4) |
| ピン 130 | I/O — User I/O (bank 4) |
| ピン 131 | VCCINT — Core supply 3.3 V |
| ピン 132 | I/O — User I/O (bank 4) |
| ピン 133 | I/O — User I/O (bank 4) |
| ピン 134 | MSEL0 — Configuration mode select 0 |
| ピン 135 | MSEL1 — Configuration mode select 1 |
| ピン 136 | MSEL2 — Configuration mode select 2 |
| ピン 137 | nSTATUS — Configuration status (open-drain) |
| ピン 138 | nCONFIG — Configuration start (active low) |
| ピン 139 | DCLK — Configuration clock |
| ピン 140 | DATA0 — Configuration data input |
| ピン 141 | TDO — JTAG Test Data Out |
| ピン 142 | TRST — JTAG Test Reset |
| ピン 143 | DEV_OE — Device-wide output enable (active high) |
| ピン 144 | CONF_DONE — Configuration complete (open-drain) |
主な用途
EPF10K30ATC144-2N の用途: 6 件s: Industrial Control Glue Logic, Telecom Line-Card Interface Bridging, Legacy Data-Acquisition Front End, ASIC Replacement / End-of-Life Bridge, Test & Measurement Instrumentation, Educational / FPGA Training Platforms.
Industrial Control Glue Logic
The EPF10K30ATC144-2N's 1728 logic elements and 12,288 bits of embedded RAM are well-suited for industrial PLC backplane glue logic, where it arbitrates between sensor inputs, motor-driver PWM controllers, and a host CPU. Its 102 user I/O pins accommodate multiple 8-bit and 16-bit bus interfaces (parallel ADC, encoder feedback, I/O expansion), while the 216 LABs allow several concurrent state machines for sequencing. Commercial 0-70°C rating matches indoor control-panel environments. Engineers typically pair the FPGA with a Quartus-II-generated bitstream that handles EtherCAT or Modbus framing in hardware, offloading the MCU.
おすすめ
Telecom Line-Card Interface Bridging
In legacy telecom line cards, the EPF10K30ATC144-2N serves as a multi-protocol bridge between T1/E1 framers, HDB3 line codecs, and the central backplane serializer. Its 142.86 MHz internal clock and 12,288 bits of EAB-based RAM are sufficient to implement small elastic FIFOs and protocol converters (e.g., UART-to-HDLC, I²C-to-SPI). The 144-TQFP footprint drops directly onto existing line-card PCBs from the early 2000s, preserving the backplane design while modernizing only the bridge logic. The 3.3 V core aligns with legacy line-card power rails, eliminating level-shifters.
おすすめ
Legacy Data-Acquisition Front End
The EPF10K30ATC144-2N is widely deployed in mid-2000s data-acquisition systems as the timing-and-trigger controller that sequences parallel ADCs, manages DMA handshakes with the host CPU, and pre-processes samples in on-chip RAM. With 12,288 bits of EAB RAM it can buffer a 1024-sample window at 12-bit resolution - enough for FIR-filter tap storage or histogram accumulation. The 102 I/O pins accept up to 8 parallel 12-bit ADC buses, and the JTAG interface allows in-system reconfiguration of trigger thresholds without hardware rework.
おすすめ
ASIC Replacement / End-of-Life Bridge
Many EOL ASICs in industrial and medical instruments can be functionally replicated by the EPF10K30ATC144-2N, using its SRAM-based reconfigurability to absorb late-stage design changes that would otherwise force a respin. The 144-TQFP footprint allows a near-direct drop-in on legacy ASIC PCBs when the original was 144-pin QFP-compatible, and Quartus II or MAX+PLUS II let designers port VHDL/Verilog at the gate level. The commercial temperature range is appropriate for laboratory and indoor medical devices. Last-time-buy inventory makes this FPGA a viable emergency EOL bridge through 2026-2027.
おすすめ
Test & Measurement Instrumentation
Bench-top instruments - logic analyzers, protocol exercisers, and digital stimulus generators - historically used the EPF10K30ATC144-2N for pattern generation and capture. The FPGA's 1728 logic elements fit 32-channel timing/state machines with 12,288 bits of pattern memory, and the 102 I/O accommodate 3.3 V LVCMOS/LVTTL stimulus lines directly. The JTAG port supports live bitstream swap during test development, accelerating bring-up. The 144-TQFP is hand-solderable on prototype boards, useful in low-volume instrumentation. Commercial temperature grade matches laboratory environments.
おすすめ
Educational / FPGA Training Platforms
Universities and embedded-systems training programs continue to use the EPF10K30ATC144-2N on legacy Altera development boards because of the rich MAX+PLUS II teaching materials and student familiarity with the FLEX 10K architecture. The 144-TQFP hand-solder-friendly package allows students to assemble and rework boards manually. The 1728-LE capacity is large enough for meaningful class projects (small CPUs, peripheral controllers, signal-processing pipelines) yet small enough that students can complete timing closure within a lab session. The 3.3 V I/O is forgiving for breadboard-based external interfaces.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF10K30ATC144-2N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF10K30ATC144-2 | EPF10K30ATC144-3 | EPF10K30ATC144-1N | EPF10K30AQI240-1 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 144-TQFP | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 240-PQFP - different |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 |
| Total RAM Bits | 12288 | 12288 | 12288 | 12288 | 12288 |
| Speed Grade | -2 (mid) | -2 (mid) | -3 (fastest) | -1 (slowest) | -1 (slow) |
| Temperature Range | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) | -40°C to 85°C (Industrial) |
| Lead Finish | Lead-free NiPdAu | SnPb (non-RoHS) | Lead-free NiPdAu | Lead-free NiPdAu | Lead-free NiPdAu |
| User I/O | 102 | 102 | 102 | 102 | 189 |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
主な差別化要因
- Lead-free NiPdAu finish for RoHS-compliant assemblies （vs EPF10K30ATC144-2)
- Mid-range speed grade balances timing margin and dynamic power （vs EPF10K30ATC144-3)
- 144-TQFP package is the highest-volume, hand-reworkable FLEX 10KA footprint （vs EPF10K30AQI240-1)
設計ノート
The EPF10K30ATC144-2N requires a clean 3.3 V core supply (VCCINT) plus a separate 3.3 V I/O supply (VCCIO) for each bank. Use a ferrite bead or L-C filter between the system 3.3 V rail and VCCINT to isolate the FPGA's switching noise from sensitive analog circuitry. Decouple every VCC/VCCIO pin with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a bulk 10 µF tantalum per bank. The FLEX 10KA's I/O banks do not support hot-plug; ensure VCCIO is present before driving any I/O pin to avoid latch-up.
Route all four global clock inputs (GCLK0-GCLK3) on the inner PCB layers with controlled impedance (50 Ω to ground), and keep them away from I/O switching lines to avoid crosstalk. The JTAG chain (TCK, TMS, TDI, TDO, TRST) requires 10 kΩ pull-ups on TMS, TDI, and TRST per Altera's FLEX 10KA JTAG specification - omitting these pull-ups causes unreliable configuration. Reserve room on the board for a 2x5 pin JTAG header even if not populated, to allow post-assembly programming and boundary-scan testing.
The 144-TQFP package has exposed paddle area under the package that must NOT be soldered to the board - it is a thermal pad with no electrical connection on this package variant. Confusing the EPF10K30ATC144 with the 144-pin BGA-356 EPF10K30ABI356 will result in PCB rework, as the BGA footprint is incompatible. According to Altera FLEX 10KA configuration guidelines, the nSTATUS pin must be pulled up to VCCIO with a 10 kΩ resistor; otherwise the FPGA will fail to enter configuration mode after power-up. Lastly, do not use the Quartus Prime (modern) toolchain - it dropped FLEX 10K support after version 13.0; use Quartus II 13.0 or MAX+PLUS II instead.
コンプライアンス情報
Lead-free NiPdAu finish ('-N' suffix) supports RoHS / REACH compliance per Altera product documentation. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC; FLEX 10KA was never AEC-qualified). Halogen-free and conflict-mineral declarations not found in verified web data and marked unknown.
