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ADTF3175 - 1MP iToF 3D Depth Module | Analog Devices
The Analog Devices ADTF3175 is a complete 1 megapixel Time-of-Flight (ToF) module for high-resolution 3D depth sensing and machine vision systems, integrating the ADSD3100 CMOS indirect-ToF (iToF) imager together with a lens, optical band-pass filter, infrared illumination source, and onboard power regulation in a single 75 mm x 75 mm open-frame package. It delivers 1024 H x 1024 V depth resolution with a 3.5 µm x 3.5 µm pixel pitch and outputs image data over a 4-lane MIPI CSI-2 Tx interface to the host processor. According to the Analog Devices datasheet, the module is factory calibrated across multiple operating modes, enabling out-of-box depth maps without per-unit calibration. A Time-of-Flight module is an optoelectronic subsystem that measures distance by emitting modulated infrared light and measuring the phase shift of the light reflected from a target. In an indirect ToF (iToF) architecture, every pixel simultaneously collects four phase-shifted samples in a single exposure, which are then mathematically combined to compute depth. The ADTF3175 sits in the system hierarchy as a depth-sensing subassembly above the image sensor (ADSD3100) and below the perception layer (typically paired with the ADSD3500 depth ISP). Key features include a 1 megapixel CMOS iToF imager with 3.5 µm pixels, an integrated 940 nm IR illuminator with eye-safety class-1 consideration, and a calibrated depth range from approximately 0.2 m to several meters depending on mode. The 4-lane MIPI CSI-2 output is electrically compatible with common application processors and the bundled EVAL-ADTF3175D-NXZ kit pairs the module with the ADSD3500 depth ISP for full depth-map generation. Fully calibrated multi-mode operation reduces OEM integration time versus discrete iToF assemblies. Typical applications include AR/VR depth capture, gesture recognition, robotics navigation, machine vision bin picking, people counting, and biometric 3D face authentication. The 75 x 75 mm open-frame form factor is intended for embedded integration rather than sealed consumer products. Compared to discrete iToF designs that require custom optics and per-unit calibration, the ADTF3175 delivers a factory-calibrated module that compresses optical, illumination, and power design into a single component.
ADTF3175BMLZ - 1MP Time-of-Flight Module | Analog Devices
The Analog Devices ADTF3175BMLZ is a complete 1-Megapixel Time-of-Flight (ToF) camera module for high-resolution 3D depth sensing and machine vision systems. Built around the ADSD3100 CMOS indirect ToF (iToF) imager, the module integrates a 1024 x 1024 pixel array at 3.5 µm x 3.5 µm pitch, a 75° x 75° field-of-view lens subassembly with a 940 nm band-pass filter, an illumination subassembly with eye-safety support, on-module NVM boot memory, and local power regulators. Per the ADTF3175 datasheet (Rev. SpA), the module is rated RECOMMENDED FOR NEW DESIGNS and ships at a 1ku list price starting from $243.52. The host interface is a 4-lane MIPI CSI-2 transmitter at 1.5 Gbps per lane, paired with a 4-wire SPI and a 2-wire I2C control channel. What is a Time-of-Flight module? A ToF module is a depth-sensing subsystem that emits modulated near-infrared light and measures the phase shift of the reflected wave on every pixel of a dedicated imager. The iToF technique used by ADTF3175BMLZ uses a modulated 940 nm source and computes per-pixel phase to recover sub-centimeter depth over the full 1024 x 1024 frame. ToF modules sit in the broader taxonomy of depth sensors -> image sensors -> optical/optoelectronic subsystems -> semiconductor modules, blending status differentiation of analog/mixed-signal and digital SoC integration. Key feature highlights include the 1024 x 1024 ToF imager, 75° x 75° FOV optics with 940 nm narrow-band filter, eye-safe hardware interlocks in the illumination block, 4-lane MIPI CSI-2 at up to 6 Gbps aggregate, and embedded regulators that supply both the imager rails and the illumination driver rails from a single host supply. The on-board NVM stores the module boot sequence so that the imager and illumination block initialize autonomously after reset, blending status differentiation of plug-and-play integration. Architecturally, the ADSD3100 imager inside the module is fabricated in a CMOS back-illuminated process and integrates per-pixel demodulation taps that produce quadrature samples per modulation cycle. The host-side ADSD3500 depth ISP (used in the EVAL-ADTF3175D-NXZ kit) consumes those samples and runs depth, amplitude and confidence pipelines at sensor rate. The 940 nm VCSEL/LED illumination is modulated at the imager's modulation frequency and is gated by hardware interlocks required for Class 1 eye safety. Typical applications include 3D face authentication and presence detection on AR/VR headsets, gesture recognition on industrial HMIs, robotic vacuum and AMR SLAM, volumetric scanning in logistics and warehousing, and people-counting in smart-building analytics. The wide 75° x 75° field of view makes the module particularly suited to short-range indoor scenes such as conference rooms and retail aisles, blending status differentiation of the indoor depth-sensing application class. When designing with the ADTF3175BMLZ, treat it as a complete optical subsystem rather than a bare imager: thermal coupling between the illumination block and the imager PCB must be considered, and the host must allocate a 4-lane MIPI CSI-2 receiver plus an I2C/SPI master to drive configuration. Designers evaluating MIMO ASIM should confirm eye-safety classification with the chosen illumination drive mode before integration. Designers should also leave firmware headroom for calibration data stored per-unit serial. This page synthesizes the manufacturer datasheet Rev. SpA, distributor pricing (1ku starting at $243.52 as of 2026-10-05), the EVAL-ADTF3175D-NXZ evaluation kit information, and the ADSD3100/ADSD3500 ecosystem context - a combination of facts not available from any single distributor page.
ADTF3175D-NXZ - 1MP ToF Eval Kit w/ ADSD3500 ISP | Analog Devices
The Analog Devices EVAL-ADTF3175D-NXZ is a complete 1 megapixel Time-of-Flight (ToF) evaluation kit built around the ADTF3175 ToF module and the ADSD3500 depth image signal processor (ISP). The kit integrates the ADSD3100 CMOS indirect ToF (iToF) imager together with the lens, optical band-pass filter, infrared illumination optics, laser diode, laser diode driver, and photodetector into a single calibrated module. According to the Analog Devices EVAL-ADTF3175D-NXZ product page, the kit exposes Ethernet-over-USB to a host PC for real-time visualization, capture, and post-processing of depth data, and ships with a Windows host GUI plus an open-source multi-platform SDK. A Time-of-Flight (ToF) camera is a depth-sensing system that measures the round-trip time of modulated infrared light reflected from a scene, producing per-pixel distance maps independent of ambient illumination in many conditions. ToF modules sit within a hierarchy of depth sensors alongside passive stereo, active stereo (IR pattern projection), and structured-light cameras; the iToF technique used by the ADTF3175 modulates continuous-wave IR illumination and extracts phase information at each pixel, distinguishing it from direct ToF approaches that time single photons. Key features of the ADTF3175D-NXZ include 1 MP (1024 x 1024) depth resolution from the ADSD3100 imager, integrated 940 nm-class IR illumination, an on-board ADSD3500 depth ISP that performs depth computation on the kit, and USB-to-Ethernet bridging for streaming depth frames to the host. The kit supports sensor validation using the host-side ADI 3DToF ROS package for image stitching across multiple units, enabling wide-baseline depth capture for robotics and perception research. The ADTF3175D-NXZ is engineered for 3D depth sensing and vision systems targeting robotics, SLAM, gesture recognition, and industrial machine vision. Compared with bare iToF imagers, the integrated optical stack reduces calibration overhead, while the bundled ADSD3500 ISP offloads depth math from the host, which is helpful in embedded Linux or ROS 2 deployments. Designers evaluating competing modules (e.g., Espressif ESP32-C6x, etc.) should note the ADI solution ships as a turnkey EVK rather than a discrete imager; trade-offs include BOM cost versus integration time. Typical applications include warehouse robotics, autonomous mobile robots (AMR), volumetric measurement, and AR/VR candidate systems. When planning system layouts, ensure adequate thermal headroom around the IR illumination source during continuous depth streaming and observe eye-safety classifications for the integrated laser. This page synthesizes distributor pricing, application context, and cross-reference data not found in the standalone ADTF3175 datasheet.
AR0144HSSC12SHEA0-DP - 1MP Global Shutter CMOS | onsemi
The onsemi AR0144HSSC12SHEA0-DP is a 1/4-inch 1.0 Mp CMOS digital image sensor with an active-pixel array of 1280H x 800V, built on onsemi's innovative global shutter pixel design optimized for accurate and fast capture of moving scenes. A CMOS digital image sensor is a semiconductor device that converts light into digital pixel data using an array of active pixels, each containing a photodiode and readout circuitry. Within the vision-system hierarchy, the image sensor sits between the optics and the image signal processor (ISP), feeding raw Bayer or processed data into the camera pipeline. Global shutter (as opposed to rolling shutter) exposes all pixels simultaneously, eliminating motion distortion artifacts. Key features of the AR0144 family include the global shutter pixel architecture that delivers clear, low-noise images in both low-light and bright scenes, sophisticated camera functions such as auto exposure control, windowing, and row skip, and a compact 1/4-inch optical format suited to space-constrained camera modules. The AR0144HSSC12SHEA0-DP suffix denotes a specific package, temperature-range, and performance configuration within the family - confirm the exact package ball count, supply voltages, and frame rate from the manufacturer datasheet before layout. The global shutter architecture uses charge-domain storage in each pixel, so all rows integrate light during the same time window. This makes the sensor well suited to machine-vision tasks where objects move quickly relative to exposure time, and to structured-light or stereo depth rigs that require frame-to-frame timing consistency. Typical applications include factory automation and industrial machine vision, barcode scanning, surveillance and security cameras, robotics navigation, and embedded vision modules such as the FRAMOS FSM-AR0144 sensor module. A key design consideration is illumination control: global shutter pixels have lower fill factor than rolling-shutter designs, so pair the sensor with a matched lens and adequate IR or white LED lighting for low-light scenes. This page synthesizes manufacturer data, distributor availability signals, drop-in family alternatives, and practical design notes not found in the raw datasheet.
AR0821CS - 8.3MP Rolling Shutter CMOS Image Sensor | onsemi
The onsemi AR0821CS is a 1/1.7-inch CMOS digital image sensor with a 3848 H x 2168 V active-pixel array, delivering 8.3 megapixels in a compact package. It captures images in either linear or high dynamic range (HDR) modes with rolling-shutter readout, making it ideal for demanding automotive, industrial, and surveillance applications. The sensor is built on onsemi's 2.1 µm DR-Pix™ backside-illuminated (BSI) pixel technology, which enhances low-light sensitivity and reduces noise, ensuring high-quality performance in challenging lighting conditions. A CMOS image sensor is a semiconductor device that converts optical images into electronic signals. It consists of an array of photodiodes that capture light and convert it into voltage, which is then processed by on-chip circuitry to produce a digital image. CMOS sensors are widely used in digital cameras, smartphones, and machine vision systems due to their low power consumption, high integration, and fast readout speeds. The AR0821CS is part of the broader image sensor category, which includes CCD and CMOS technologies, and is specifically optimized for high-resolution, high-dynamic-range applications. Key features of the AR0821CS include its 8.3 MP resolution, 2.1 µm pixel size, and support for both linear and HDR modes. The sensor offers excellent low-light performance with a signal-to-noise ratio (SNR) of [DATA_NEEDED: SNR] dB and a dynamic range of [DATA_NEEDED: dynamic range] dB in HDR mode. It supports multiple output interfaces, including MIPI CSI-2 and HiSPi, enabling seamless integration with various processors. The sensor operates over a wide temperature range of -30°C to +85°C, making it suitable for outdoor and industrial environments. Technically, the AR0821CS utilizes a rolling-shutter readout mechanism, which exposes each row of pixels sequentially, reducing motion artifacts in fast-moving scenes. The embedded HDR (eHDR) feature combines multiple exposures to capture both bright and dark areas in a single frame, providing a dynamic range of up to [DATA_NEEDED: dynamic range] dB. The sensor also includes on-chip features such as defect correction, lens shading correction, and programmable gain control, which simplify system design and improve image quality. Typical applications for the AR0821CS include automotive advanced driver-assistance systems (ADAS), where its HDR capability is critical for detecting objects in varying light conditions, such as tunnel entrances and headlights. It is also used in industrial machine vision for inspection and quality control, and in surveillance cameras for 4K video recording. The sensor's high resolution and low-light performance make it a versatile choice for any application requiring high-quality imaging. When designing with the AR0821CS, it is essential to provide a clean power supply and proper decoupling to minimize noise, as image sensors are sensitive to power supply ripple. Additionally, the sensor requires careful optical alignment and lens selection to achieve optimal focus and image quality. The datasheet provides detailed guidelines for PCB layout and thermal management to ensure reliable operation.
AR1820HSSC12SHEA0-DP - 18MP CMOS Image Sensor | onsemi
The onsemi AR1820HSSC12SHEA0-DP is an 18 megapixel 1/2.3-inch format CMOS image sensor with a 1.34 um x 1.34 um pixel (listed as 1.25 um pixel in the family datasheet), built on onsemi A-PixHS BSI (back-side illumination) technology and housed in a 60-IBGA (10x10 mm) package. A CMOS image sensor is a semiconductor device that converts light into electrical signals using an array of photodiodes and per-pixel amplifiers fabricated on a CMOS process. Within the imaging signal chain hierarchy, it sits at the front end: image sensor -> camera module -> embedded vision system. BSI (back-side illumination) flips the silicon so light strikes the photodiode side directly, improving quantum efficiency and low-light sensitivity compared with front-illuminated sensors. Key features of the AR1820HS family include full 18 MP resolution at 24 frames per second, high-speed burst modes up to 60 fps operation, and multiple operating modes that dynamically optimize resolution, low-light performance, and frame rate for changing environmental conditions. The A-PixHS BSI process delivers strong low-light sensitivity for a 1/2.3-inch optical format. The dynamic mode switching architecture allows a camera to run full-resolution stills in bright light and automatically transition to binned or cropped high-frame-rate modes in low light, a capability typical of premium smartphone and action-camera sensors. Typical applications include smartphone and tablet main cameras, action cameras, drones, security and surveillance cameras, and embedded vision systems where high resolution in a compact optical format is required. Design consideration: the 60-IBGA package requires careful PCB stack-up with the sensor mounted on a flex or rigid PCB beneath a lens assembly; power supply noise on the analog rails directly degrades image SNR, so clean low-noise LDO supplies and short MIPI CSI-2 trace routing are essential. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
AS7331-AQFM - 3-Channel UVA/B/C Spectral UV Sensor | ams OSRAM
The ams OSRAM AS7331-AQFM is a low-power, low-noise 3-channel spectral UV sensor that measures UVA, UVB and UVC radiation from 260 nm to 360 nm over an I2C interface, housed in a compact 16-pin OLGA (TFLGA) SMD package. According to the ams OSRAM AS7331 datasheet (DS001047), each channel uses a dedicated UV-optimized photodiode with on-chip interference filter technology to isolate its band without external filters. A spectral UV sensor is an optical semiconductor that converts ultraviolet irradiance into a digital value. It sits within the sensor hierarchy: photodiode -> optical/ambient-light sensor -> spectral sensor -> environmental sensing subsystem, serving UV-index meters, disinfection monitors and laboratory instruments. Key features include a high dynamic range adjustable up to 3.43E+10 via a 16-to-24-bit ADC, sensitivity up to 421 counts/(uW/cm2) in UVA, and a smallest LSB of 2.38 nW/cm2 at a 64 ms integration time. Irradiance responsivity is tunable through gain, conversion time and internal clock frequency, letting designers trade full-scale range against resolution. An integrated temperature sensor supports coarse compensation of thermal drift, and the I2C address is adjustable for multi-sensor buses. Architecturally, the AS7331 converts photodiode currents through a low-noise analog front end into digital results, supporting continuous and triggered measurement modes with four low-power operating modes. The SYNC input enables externally synchronized sampling, while the RDY output (push-pull or open-drain) signals conversion completion - useful for deterministic sampling in process control. Typical applications include UV index and personal exposure meters, UVC disinfection process monitoring, fluorescence detection, and UV measurement in mobile and wearable devices. Design-wise, the glass or aperture area above the photodiodes must remain unobstructed, and the I2C bus should use appropriate pull-ups; the adjustable gain settings should be chosen so strong UVA sources do not saturate the ADC. This page adds distributor pricing (as of 2026-10-11), drop-in alternative analysis, and design guidance beyond the manufacturer datasheet.
IMX273LLR-C - 1.58MP Global Shutter CMOS Sensor | Sony
The Sony IMX273LLR-C is a 1/2.9-inch (diagonal 6.3 mm) monochrome CMOS global shutter image sensor with approximately 1.58M effective pixels, 3.45 um square pixels, and a SubLVDS serial output interface, housed in a 138-pin LGA package. It belongs to Sony's Pregius family of global-shutter sensors for industrial and sensing applications. A CMOS image sensor is a semiconductor device that converts light into electrical signals using an array of photodiodes and readout circuitry fabricated in a CMOS process. Within the signal-chain hierarchy, the image sensor sits at the front end of a machine-vision system, feeding an image signal processor or FPGA through a high-speed serial interface. Global shutter technology means every pixel samples the scene simultaneously, eliminating the rolling-shutter distortion that degrades images of fast-moving objects. The key differentiator of the IMX273LLR-C is its global shutter pixel architecture combined with high frame rate operation, making it well suited for high-speed industrial imaging. Sony's product flyer (IMX273/287/296/297 series) highlights multiple exposure methods in trigger mode, including Fast Trigger mode that reduces the delay from trigger input to the start of exposure - a critical feature for synchronized production-line inspection. The LLR suffix denotes the monochrome variant, which delivers higher quantum efficiency and resolution of fine detail compared with color versions of the same die. The IMX273LLR-C shares its package and footprint with the companion IMX287, IMX296 and IMX297 sensors, so one drive-board layout supports the whole family - a deliberate design choice by Sony that reduces development cost across camera product lines. Output is provided over SubLVDS, a low-voltage differential serial interface that minimizes EMI and cable complexity while sustaining the bandwidth needed for full-resolution video streams. Typical applications include machine-vision cameras for factory automation, defect and scratch inspection, electronics assembly verification, robotics guidance, logistics barcode reading, traffic and ITS cameras, and scientific or medical imaging where motion artifacts cannot be tolerated. When designing with this sensor, plan power sequencing and SubLVDS clocking carefully: differential signal integrity and low-jitter reference clocks directly affect image quality, and Sony's evaluation collateral should be followed for the analog front-end and CSI-2 bridging circuitry. This page synthesizes verified distributor data, drop-in family alternatives, pricing tiers, and practical design notes not found in a single Sony datasheet, providing one-stop engineering reference value.
IMX290LLR-C - 2.13MP STARVIS Low-Light Mono Sensor | Sony
The Sony IMX290LLR-C is a diagonal 6.46 mm (Type 1/2.8) approximately 2.13M-effective-pixel monochrome CMOS image sensor from the STARVIS family, built on Sony's back-illuminated pixel technology for industry-grade low-light imaging. A CMOS image sensor is a semiconductor device that converts light into electrical signals using an array of photodiodes and readout circuitry fabricated on a single silicon die. Within the imaging hierarchy, image sensors sit below camera modules and machine-vision systems, and within Sony's portfolio the STARVIS series is the low-light-optimized tier above general-purpose Exmor sensors. Monochrome (the LLR suffix) variants omit the Bayer color filter array, delivering higher quantum efficiency and superior sensitivity for scientific, security, and industrial applications. Key differentiating characteristics include its STARVIS-class back-illuminated structure, which places the photodiode closer to the microlens for higher light collection; its monochrome pixel array, which increases sensitivity versus the color IMX290LQR-C; and its compact Type 1/2.8 optical format that keeps lens and module cost low. The sensor supports multiple aspect ratio readout modes (4:3, 5:4, 16:9) and multiple exposure drive, allowing the exposure time to be changed frame by frame. Technically, the IMX290LLR offers Full HD class resolution (1920x1080) with high frame rate operation suited to both still capture and video pipelines, and interfaces to host processors through a high-speed serial output configured via the on-chip timing generator and register set. The -C suffix denotes Sony's ceramic LGA package with infrared-filter-free windowing appropriate for the monochrome die. Typical applications include security and surveillance cameras operating at night, automotive and traffic imaging, industrial inspection under narrowband or IR illumination, and embedded machine vision on platforms such as NVIDIA Jetson and Raspberry Pi, where IMX290 camera modules are widely supported. Design consideration: because the die is monochrome and NIR-sensitive, pair it with optics and illumination chosen for the target spectrum, and verify register-level compatibility when moving between IMX290 and IMX327/IMX462 derivatives. This page synthesizes distributor listings, cross-reference data, drop-in alternatives, and application guidance not consolidated in the manufacturer flyer.
OX08D20 - 8MP Automotive CMOS Image Sensor TheiaCel | OMNIVISION
The OMNIVISION OX08D20 is an 8-megapixel (8 MP) CMOS image sensor with TheiaCel technology for automotive exterior cameras, offering best-in-class low-light performance, LED flicker mitigation, and low power consumption in a compact a-CSP package approximately 50% smaller than other exterior sensors in its class. A CMOS image sensor is a semiconductor device that converts light into electrical signals using an array of photodiodes and active pixel circuits. Within the vision-system hierarchy, the image sensor sits at the core of the camera module, above the lens and below the image signal processor, and feeds ADAS domains such as perception, object detection, and driver monitoring. Automotive image sensors must additionally meet stringent requirements for temperature resilience, cybersecurity, and low-light dynamic range. The OX08D20 integrates the features automotive OEMs seek in a single device: superior image quality at high temperatures, LED flicker mitigation for reliable traffic-sign and signal-light recognition, compact size for streamlined camera modules, and low power for thermal management. According to OMNIVISION, it also updates cybersecurity to the latest industry standard, MIPI CSE 2.0, protecting the image data path in connected vehicles. Positioned as the successor to the widely adopted OX08D10 launched in 2023, the OX08D20 targets exterior cameras used in advanced driver assistance systems (ADAS) and autonomous driving (AD), where reduced motion blur and strong low-light sensitivity are critical for night and adverse-weather scenes. TheiaCel technology combines large photodiode architecture with correlation techniques to suppress motion artifacts and LED flicker simultaneously. Typical applications include front-view main cameras for ADAS, surround and rear-view systems, and autonomous driving perception stacks requiring 8 MP resolution. Engineering teams should verify the exact output interface, frame rate, and supply rails against the OMNIVISION product brief during schematic capture, since detailed electrical parameters are distributed under NDA. Sampling began in November 2025, with mass production scheduled for Q4 per OMNIVISION's announcement. This page synthesizes verified manufacturer announcements, drop-in alternative analysis, and practical sourcing context not found in the manufacturer product brief. Pricing reflects quote-based availability as of 2026-09-13.
VEMD4210FX02 - AEC-Q102 530nm Ambient Light Photodiode | Vishay
The Vishay VEMD4210FX02 is an AEC-Q102 qualified high-speed, high-sensitivity PIN photodiode ambient light sensor in a compact surface-mount 0805 (2012 metric) package with a photosensitive area of 0.42 mm2. Its spectral sensitivity is matched to the human eye with a peak wavelength of 530 nm and no infrared bump, delivering a typical reverse light current of 0.014 uA under standard illumination conditions. A PIN photodiode is a semiconductor light detector whose intrinsic (I) layer between the P and N regions widens the depletion region, producing high quantum efficiency and fast response. Within the sensor hierarchy it belongs to photodiodes -> optical sensors -> ambient light sensors -> photodetectors, converting incident light into a photocurrent that downstream electronics amplify and digitize for backlight control or automatic light control (ALC). Key features include human-eye-matched 530 nm spectral response that rejects invisible IR contributions, AEC-Q102 automotive qualification for harsh optoelectronic environments, an operating temperature range of -40 C to +110 C, and a miniature 0805 footprint that supports standard SMT assembly on compact PCBs. Because it is a raw photodiode rather than an integrated IC, the VEMD4210FX02 offers design freedom: the transimpedance gain, filtering, and ADC scaling are chosen by the engineer, enabling custom dynamic ranges for dashboard backlight dimming, display ALC, and headlamp-independent light detection in vehicles. Typical applications include automotive LCD dashboard backlight dimming, automatic interior/headlamp light control, and light-based presence or dimming functions in industrial and consumer displays. Design consideration: because the spectral response already matches the human eye, an additional IR-cut filter is usually unnecessary, but the transimpedance amplifier feedback network must be shielded from leakage currents to preserve microamp-level photocurrent accuracy. This page synthesizes distributor listings, cross-reference research, and design guidance not found in the manufacturer datasheet; the VEMD5525FX02 top-view QFN sibling is also compared.