PIC32MZ0512EFF064T-I/MR
PIC32MZ0512EFF064T-I/MR - 200MHz 32-bit MCU, 512KB Flash | Microchip
The Microchip Technology PIC32MZ0512EFF064T-I/MR is a high-performance 32-bit MIPS32 M-Class microcontroller from the PIC32MZ EF family, delivering up to 200 MHz CPU performance with 512 KB of Flash program memory and 128 KB of SRAM, housed in a 64-pin QFN (9x9 mm) package with exposed thermal pad. It integrates a hardware Floating Point Unit (FPU), HS USB 2.0 PHY, 10/100 Ethernet MAC, dual CAN 2.0b controllers, and a Serial Quad Interface (SQI) for high-speed external serial Flash, making it a single-chip connectivity platform for industrial, IoT, and graphical HMI designs.
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory, RAM, and a rich set of peripherals on a single die, enabling standalone embedded control. Within the broader semiconductor taxonomy, an MCU is a sub-category of microprocessors optimized for low power, deterministic real-time I/O, and small form-factor PCB integration. The PIC32MZ EF family specifically targets high-performance connected embedded designs that previously required a discrete MPU plus external peripherals.
The PIC32MZ0512EFF064T-I/MR features 46 user I/O lines, multiple communication peripherals (UART, SPI, I2C, SQI, USB-HS, Ethernet, CAN), a 12-bit ADC with up to 48 channels, DMA with eight independent channels, and a 200 MHz core capable of 330 DMIPS and 1.5 DMIPS/MHz. The integrated FPU accelerates single- and double-precision floating-point math, simplifying sensor fusion, motor control, and audio DSP code. Live-Update Flash allows two independent Flash banks for in-field firmware upgrades without downtime, a key requirement for connected industrial and IoT endpoints.
Architecturally, the PIC32MZ0512EFF064T-I/MR pairs the MIPS M-Class core with a multi-layer bus matrix that lets CPU, DMA, and the Ethernet MAC access RAM without contention. The 200 MHz operation with HS USB 2.0 (480 Mbps), 10/100 Ethernet MAC, dual CAN, and SQI delivering up to 80 MB/s to external Flash make this part a complete industrial connectivity node. The 9 mm x 9 mm QFN package with 0.5 mm pitch and an exposed pad supports compact PCB layouts while maintaining the thermal envelope required for industrial environments.
Typical applications include industrial Ethernet gateways, USB audio class devices, CAN-based motor control nodes, graphical HMI panels, secure IoT edge nodes with encrypted firmware updates, multi-protocol industrial sensors, and automotive body/HMI subsystems requiring the same connectivity peripherals. The wide peripheral set eliminates external bridges, lowering both BOM cost and PCB area. When designing with this MCU, observe the 3.3 V (2.1 V to 3.6 V) supply window, route the exposed pad to a continuous ground plane, and provide separate analog and digital supply domains to maximize ADC accuracy. The Live-Update Flash feature requires careful linker-script planning to balance code across both banks. This page consolidates distributor pricing, parametric data, drop-in alternatives, and design notes beyond what is found in the manufacturer datasheet.
USD $2.55
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