PIC32MZ0512EFE124-E/TL - 32-bit MCU 200MHz 512KB Flash 124-VTLA | Microchip
部品番号: PIC32MZ0512EFE124-E/TL ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $13.5 | $13.50 |
| 10 | $12.15 | $121.50 |
| 100 | $10.8 | $1,080.00 |
| 500 | $9.45 | $4,725.00 |
| 1,000 | $8.1 | $8,100.00 |
PIC32MZ0512EFE124-E/TL 概要
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash), working memory (RAM), and a rich set of on-chip peripherals (timers, ADC/DAC, communication controllers) into a single device. The PIC32MZ EF family sits at the top of the PIC32 hierarchy and is engineered for high-performance embedded applications requiring both connectivity and rich analog/mixed-signal integration.
Key features include a 200 MHz / 330 DMIPS core with 252 MHz headroom in the family, 512 KB Flash with Dual Panel Live Update, 128 KB SRAM, Hi-Speed USB 2.0 (480 Mbps) with on-chip PHY, 10/100 Ethernet MAC with IEEE 1588 PTP support, Serial Quad Interface (SQI) for external flash, up to 97 I/O lines, multiple 12-bit ADC and DAC channels, DMA controllers, and PWM peripherals suited for motor control. The VTLA-124 (9x9 mm) laminate package exposes a large die-attach pad for low thermal resistance in space-constrained designs.
Architecturally, the device combines a 5-stage MIPS pipeline with tightly-coupled SRAM, hardware multiply-accumulate DSP extensions, and dedicated peripherals (USB, ENET, SQI, CAN, I2S) that offload the CPU. This balanced compute-and-connectivity integration eliminates the need for an external PHY or bus-marshalling CPLD in many designs.
Typical applications include industrial automation, automotive connectivity gateways, IoT edge nodes, HMI/graphics terminals, audio processing with I2S/USB streaming, and motor control. The wide peripheral mix supports HMI + connectivity + analog sensing on a single chip.
Designers should verify the Live Update dual-panel firmware sequence in MPLAB Harmony before field deployment and budget sufficient PCB copper under the exposed pad to honor thermal limits at high MIPS loads.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: PIC32MZ0512EFE124-E/TL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ0512EFE124-E/TL （同一形状・フットプリント） — 相違点: FPU, Package, Operating Temperature, Core Architecture, ADC.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ1024EFE124-E/TL
✅ ドロップイン✓ 在庫あり
$8.91 / 個
データシートを見る →PIC32MZ0512EFE124-I/TL
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$5.72 / 個
データシートを見る →PIC32MZ0512EFE124T-E/TL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ1024EFE124T-E/TL
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC32MZ0512EFF124-E/TL
✅ ドロップイン✓ 在庫あり
$8.95 / 個
データシートを見る →PIC32MZ0512EFE124-E/TL 最大定格＆電気的特性
| Core Architecture | MIPS32® M-Class (Warrior M-class) |
| データバス幅 | 32-bit |
| Maximum CPU Speed | 200 MHz (252 MHz family max) |
| DMIPS | 330 DMIPS |
| FPU | IEEE 754 single-precision |
| DSP Extensions | 4x 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 128 KB |
| 動作温度 | -40C to +125C (automotive grade) |
| パッケージ | 124-VTLA (9x9 mm) |
| 実装タイプ | Surface Mount |
| I/O Lines | Up to 97 |
| USB | Hi-Speed USB 2.0 with on-chip PHY |
| Ethernet | 10/100 MAC with IEEE 1588 PTP |
| SQI (Serial Quad Interface) | Yes |
| Crypto Engine | No |
| RoHS ステータス | Compliant |
PIC32MZ0512EFE124-E/TL 124-vtla (9x9 mm) ピン配置ガイド
PIC32MZ0512EFE124-E/TL (124-vtla (9x9 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MZ0512EFE124-E/TL.
詳細は データシート をご参照ください。
主な用途
PIC32MZ0512EFE124-E/TL の用途: 6 件s: Industrial IoT Gateway, Automotive Connectivity Module, HMI / Graphics Terminal, Audio Processing / USB Streaming, BLDC / PMSM Motor Control, Edge Sensor Hub / Wearable.
Industrial IoT Gateway
The PIC32MZ0512EFE124-E/TL fits industrial IoT gateways thanks to its 10/100 Ethernet MAC with IEEE 1588 PTP, Hi-Speed USB 2.0 device/host, and SQI interface for external serial flash. The 200 MHz MIPS M-class core with FPU handles TLS/Modbus/OPC-UA framing plus edge analytics on a single device. The 124-VTLA laminate keeps the footprint small enough for DIN-rail enclosures while exposing up to 97 GPIO for sensor aggregation, RS-485 transceivers, and isolated digital inputs.
おすすめ
Automotive Connectivity Module
The -E suffix denoting -40C to +125C operation and the integrated Hi-Speed USB plus 10/100 Ethernet make this MCU a natural fit for automotive telematics control units (TCUs) and V2X edge nodes. The 330 DMIPS MIPS M-class core runs AUTOSAR MCAL drivers and security stacks at the wire rate, while the Dual Panel Live Update firmware architecture supports fail-safe OTA campaigns required by ISO 26262 functional-safety workflows.
おすすめ
HMI / Graphics Terminal
HMI terminals benefit from the 200 MHz core, parallel display interface (EPI/ PMP), and 128 KB SRAM that drives small TFT-LCDs at 30+ fps. The PIC32MZ EF family integrates dedicated graphics peripherals and the I2S audio block, enabling combined video + audio playback from a single chip. The 124-VTLA package exposes sufficient GPIO for capacitive touch controllers and backlight PWM while remaining under 9x9 mm.
おすすめ
Audio Processing / USB Streaming
Audio DAC/amplifier products use the PIC32MZ0512EFE124-E/TL to bridge Hi-Speed USB audio streaming (UAC2) to I2S codecs. The integrated Hi-Speed USB PHY eliminates an external ULPI chip, and the 200 MHz MIPS core handles SRC and effect DSP via the four 64-bit accumulators. The DMA engine moves audio samples without CPU intervention, freeing MIPS for user DSP algorithms while the FPU accelerates biquad filter calculations.
おすすめ
BLDC / PMSM Motor Control
Field-oriented control of BLDC and PMSM motors demands deterministic PWM generation, fast ADC sampling, and DSP throughput - all delivered by the PIC32MZ0512EFE124-E/TL. The PWM peripheral with complementary outputs and dead-band generation drives three-phase inverters up to 50 kHz switching frequency, while the 12-bit 28 MSPS ADC samples phase currents synchronized to the PWM cycle. The FPU and DSP extensions run Park/Clarke transforms at 200 MHz with sub-microsecond loop latency.
おすすめ
Edge Sensor Hub / Wearable
Wearable sensor hubs use the PIC32MZ0512EFE124-E/TL as the central processor to aggregate IMU, bio-sensor, and BLE radio data through the on-chip I2C/SPI controllers. The 200 MHz core runs always-on sensor fusion while the integrated 10/100 Ethernet (when connected to a docking cradle) offloads data at gigabit rates. The 124-VTLA 9x9 mm package is small enough for wrist-mounted form factors while exposing adequate GPIO for multi-sensor I/O.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ0512EFE124-E/TL — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ1024EFE124-E/TL | PIC32MZ0512EFE124-I/TL | PIC32MZ0512EFE124T-E/TL | PIC32MZ1024EFE124T-E/TL | PIC32MZ0512EFF124-E/TL |
|---|---|---|---|---|---|---|
| Package | 124-VTLA (9x9 mm) | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 512 KB | 1024 KB | 512 KB | 512 KB | 1024 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Temperature Grade | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (industrial) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) |
| Crypto Engine | No | No | No | No | No | Yes (AES/SHA) |
| Core Speed (max) | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Hi-Speed USB + Ethernet | Yes | Yes | Yes | Yes | Yes | Yes |
主な差別化要因
- Dual Panel Live Update firmware architecture （vs PIC32MX795F512LT-80I/PF)
- Hi-Speed USB 2.0 with on-chip PHY （vs PIC32MX795F512LT-80I/PF)
- Higher MIPS density with FPU （vs PIC32MX795F512LT-80I/PF)
設計ノート
The 124-VTLA laminate package dissipates up to approximately 1 W typical when running core benchmarks; the exposed die-attach pad must be soldered to a continuous copper land pattern with an array of thermal vias (recommended 0.3 mm drill, 0.5 mm pitch) to a 2 oz inner-plane copper pour. Without proper thermal attachment the junction temperature will exceed 125 C at +85 C ambient during sustained MIPS workloads. Cross-check with the family datasheet section 35 (Packaging Information) for the exact land pattern dimensions.
Route the Hi-Speed USB D+/D- lines as a 90 ohm differential pair with length matching within 150 mil; keep the on-chip PHY decoupling capacitors (100 nF + 4.7 uF) within 2 mm of the VUSB pin. For Ethernet RMII, match the 50 MHz reference clock trace to within 50 mil of the data lines to minimize jitter. SQI signals require 50 ohm characteristic impedance with a 33 ohm series damping resistor near the MCU.
When using Dual Panel Live Update firmware, ensure the bootloader uses CRC32 verification on each panel before swapping the CPU vector base; failure to do so can brick the device if the inactive panel is corrupted by brown-out during programming. Also note that the -E suffix denotes -40C to +125C automotive grade and the -I suffix denotes -40C to +85C industrial; mixing them in production boards will cause thermal shutdown at high ambient.
コンプライアンス情報
RoHS and lead-free compliant per Microchip product page. AEC-Q100 qualification not separately listed for this part number though it carries the automotive -E temperature grade; check with Microchip for full automotive PPAP documentation.