XC7Z045-2FF900I
XC7Z045-2FF900I - 350K Zynq SoC | AMD | Industrial FPGA
AMD XC7Z045-2FF900I is a Zynq-7000 Kintex-7 FPGA system on chip with 350,000 logic cells, 800 MHz processing capability, 19,558 Kb of block RAM, 900 DSP slices, and a 900-FCBGA (31 x 31 mm) package. The -2 ordering code identifies speed grade 2, while the I suffix identifies the industrial temperature option. Its industrial junction-temperature range is -40 °C to 100 °C.
A Zynq-7000 SoC is a heterogeneous programmable-logic device that combines ARM Cortex-A9 processing hardware with Kintex-7 FPGA fabric in one package. This integration places a hard processor subsystem, programmable logic, programmable I/O, memory resources, and DSP resources within a single mixed-signal device. It belongs to the FPGA and SoC hierarchy and can consolidate control processing, parallel data acquisition, and programmable signal processing into one board-level platform.
The XC7Z045 provides approximately 350,000 logic cells, 19,558 Kb of block RAM, and 900 DSP slices. Its dual-core ARM Cortex-A9 subsystem is suitable for standalone control software, while the Kintex-7 fabric can implement parallel datapaths, interface logic, protocol handling, and custom accelerators. The 800 MHz figure and CoreSight support identify a high-performance embedded processing configuration designed for demanding control and signal-processing systems.
The FF900 package provides 900 solderable FCBGA positions in a 31 x 31 mm land pattern. This high pin count supports the device's extensive power, ground, signal, configuration, and high-speed I/O requirements. The package also creates demanding PCB-layout, assembly, thermal, and decoupling obligations, particularly around power delivery to the processor, FPGA fabric, memory interfaces, and transceiver-related I/O.
Typical applications include industrial machine vision, industrial automation, communications infrastructure, test and measurement, embedded signal processing, and high-performance control systems. In these systems, the ARM subsystem can execute operating-system or bare-metal software while the programmable logic handles deterministic acquisition, filtering, protocol parsing, and data movement without relying solely on software execution.
Designers should preserve the XC7Z045 power rails, decoupling network, configuration interface, clocking scheme, and DDR memory topology defined by the AMD hardware design guidance. The 900-FCBGA package also requires adequate thermal design and assembly process control. Package, operating-temperature, and several detailed electrical specifications remain unavailable in the supplied verified dataset and are therefore identified rather than estimated.
This product record combines verified AMD and distributor data with package-aware alternatives, comparison parameters, and practical design guidance. It distinguishes exact same-package order variants from candidates requiring further qualification, helping engineers make sourcing and design decisions without treating electrical similarity as proof of drop-in compatibility.
見積もり
お問い合わせ