XC7Z100-1FF900I - Dual Cortex-A9 Zynq SoC | AMD
部品番号: XC7Z100-1FF900I ✓ 生産中XC7Z100-1FF900I 概要
A Zynq-7000 system on chip is an FPGA and ARM processor integration. In the product hierarchy, it is a system on chip, programmable logic device, FPGA, and embedded processor platform. The processor subsystem executes operating-system-level and application software, while the Kintex-7 programmable logic fabric implements parallel data paths, interfaces, signal processing, and other hardware-specific functions. This combination enables hardware/software partitioning without requiring two separate chips and associated interconnects.
The verified device description identifies two Arm Cortex-A9 MPCore processors and CoreSight technology. It provides 444K logic cells for programmable FPGA resources and lists a 667 MHz operating frequency for the processor configuration. The 900-FCBGA package offers 900 solder balls in a 31 x 31 mm footprint. The listed LCSC price is $9,547.7967 as of October 28, 2026, reflecting the scale and specialized nature of this programmable SoC.
Technically, the XC7Z100 belongs to the Zynq-7000 family and combines an ARM hard-processing subsystem with Xilinx Kintex-7 FPGA logic. CoreSight provides integrated processor debug and trace visibility. The same silicon package can support designs that divide work between sequential software and parallel programmable hardware, reducing external component count when application requirements align with the integrated architecture.
Typical uses include industrial control, machine vision, network infrastructure, test and measurement, embedded signal processing, and communications equipment. Developers can implement hardware acceleration, custom interfaces, protocol handling, and data acquisition alongside application code. The 444K logic-cell fabric is especially useful where deterministic parallel operations, custom I/O, or high-throughput data paths are required.
Design planning must include a 900-ball PCB land pattern, power and multi-rail sequencing, decoupling, thermal management, and programming-device support. Differential I/O and high-speed memory interfaces also require controlled routing and verification. A new layout should be compared directly with AMD package-pinout files rather than inferred from generic BGA conventions.
This page combines the verified distributor data, official AMD datasheet link, package-pinout resource, and engineering-focused selection guidance. It also distinguishes the verified 667 MHz target from faster same-family alternatives and clearly identifies where distributor-specific electrical, lifecycle, or package details require confirmation before procurement.
ドロップイン代替品: XC7Z100-1FF900I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC7Z100-1FF900I (同一形状・フットプリント) — 相違点: Architecture, Device Family, Package, Temperature Grade.
XC7Z100-2FFG900I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC7Z100-2FF900I
✅ ドロップイン ⚠️ 仕様未検証価格はお問い合わせください
データシートを見る →XC7Z100-2FFG900E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
XC7Z100-2FF900E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
XC7Z100-1FFG900E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
XC7Z100-1FF900I 最大定格&電気的特性
| Product Type | Zynq-7000 system on chip |
| Processor Configuration | Dual Arm Cortex-A9 MPCore |
| Processor Operating Frequency | 667 MHz |
| FPGA Logic Cells | 444K logic cells |
| FPGA Architecture | Kintex-7 |
| Debug and Trace | CoreSight |
| Package Type | 900-FCBGA |
| Package Dimensions | 31 x 31 mm |
| Package Ball Count | 900 balls |
| Device Family | Zynq-7000 |
| Architecture | Dual-core ARM Cortex-A9 with Kintex-7 programmable logic |
| RoHS ステータス | RoHS |
| 実装タイプ | Surface mount |
XC7Z100-1FF900I 900 balls ピン配置ガイド
XC7Z100-1FF900I (900 balls パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC7Z100-1FF900I.
詳細は データシート をご参照ください。
主な用途
XC7Z100-1FF900I の用途: 6 件s: Industrial Machine Control, Machine Vision and Industrial Imaging, Network Infrastructure Equipment, Test and Measurement Systems, Communications and Signal Processing, Embedded Data Acquisition.
Industrial Machine Control
The XC7Z100-1FF900I fits industrial machine-control systems that need both a conventional control processor and programmable logic close to the I/O. Its dual Arm Cortex-A9 MPCore configuration can run control software, while the 444K Kintex-7 logic cells can implement parallel motion, timing, or signal-conditioning functions. The 667 MHz processor rating provides headroom for network protocols and supervisory logic without separating the processor from accelerator fabric. In a controller, the programmable logic can implement deterministic motor-control loops, encoder interfaces, or safety interlocks while the processor handles diagnostics, configuration, and communications. The principal design trade-off is the 900-FCBGA layout, which requires a dense multilayer PCB, careful decoupling, and rigorous signal-integrity validation.
おすすめ
Machine Vision and Industrial Imaging
The XC7Z100-1FF900I is suitable for machine-vision controllers that combine image acquisition, preprocessing, and higher-level inspection logic. The 444K programmable logic cells can implement parallel pixel pipelines, frame synchronization, thresholding, or hardware-assisted filtering, while the dual Cortex-A9 processors execute camera control, exposure management, classification, and communications. At the listed 667 MHz processor rating, the SoC can divide work between sequential software and parallel hardware rather than forcing every operation through the processor. A camera-facing implementation can place acquisition logic in the FPGA fabric and reserve processor resources for image processing and results handling. The tradeoff is a demanding 900-ball PCB footprint and the need to balance processor and fabric power across industrial temperature conditions.
おすすめ
Network Infrastructure Equipment
The XC7Z100-1FF900I can support network-infrastructure equipment requiring line-rate programmable packet handling alongside a hosted control plane. The 444K Kintex-7 fabric can implement custom packet classification, data-plane pipelines, or high-speed interface adaptation, while the dual Cortex-A9 processors run network management, configuration, telemetry, and security services. The 667 MHz rating provides capability for control-plane tasks without eliminating the advantage of dedicated parallel hardware. In an appliance, programmable logic can reduce the need for external FPGAs or network ASICs when interfaces are project-specific. Engineers must still verify the required transceivers, memory interfaces, protocol timing, and thermal margin because those detailed limits are not included in the supplied distributor summary.
おすすめ
Test and Measurement Systems
The XC7Z100-1FF900I is appropriate for modular test and measurement systems where instrument control, signal processing, and user interfaces must share one programmable platform. Its dual Cortex-A9 MPCore processors can handle operating-system software, instrument control, and data transfer, while the 444K FPGA cells can implement timing, triggering, filtering, or custom acquisition functions. The listed 667 MHz processor speed leaves capacity for control software while programmable hardware handles deterministic operations. A typical analyzer could partition its front end into the Kintex-7 fabric and its user interface into processor-side software. The main engineering considerations are clocking, high-speed I/O implementation, power sequencing for multiple rails, and obtaining the complete 900-FCBGA symbol and mechanical data before PCB release.
おすすめ
Communications and Signal Processing
The XC7Z100-1FF900I supports communications equipment that needs a flexible combination of protocol processing, digital filtering, and embedded control. The 444K Kintex-7 logic cells can implement parallel filters, symbol processing, framing logic, or interface adaptation, while the dual Cortex-A9 processors execute higher-level protocol stacks and supervisory functions. The 667 MHz processor rating allows the architecture to allocate repetitive low-latency operations to programmable logic instead of relying entirely on software. In a radio or baseband controller, this separation can reduce data-movement overhead and allow field-programmable updates. The design must account for the SoC's substantial package complexity, synchronous design constraints across processor and fabric, and thermal performance at the verified $9,547.7967 unit price as of October 28, 2026.
おすすめ
Embedded Data Acquisition
The XC7Z100-1FF900I fits embedded data-acquisition systems that combine sensor capture, local processing, and network or storage output. The programmable fabric can implement multiple high-speed acquisition channels, triggering, digital filtering, and data packing, while the dual Cortex-A9 processors manage configuration, buffering, calibration, and data transfer. Its 444K logic cells allow a project-specific acquisition pipeline to coexist with the embedded processor rather than requiring a separate FPGA. A practical deployment can preprocess or reduce samples in hardware before transferring results to the processor, limiting software load and data-transfer bandwidth. Because the available evidence does not state the complete pinout, voltage limits, or I/O counts, engineers must use AMD's official package files and DS191 datasheet before finalizing channels, memories, and external interfaces.
おすすめ
エンジニアリング参考データ: XC7Z100-1FF900I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC7Z100-2FFG900I | XC7Z100-2FF900I | XC7Z100-2FFG900E | XC7Z100-2FF900E | XC7Z100-1FFG900E |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 900-FCBGA (31 x 31 mm) | 900-FCBGA (31 x 31 mm) - same | 900-FCBGA (31 x 31 mm) - same | 900-FCBGA (31 x 31 mm) - same | 900-FCBGA (31 x 31 mm) - same | 900-FCBGA (31 x 31 mm) - same |
| Processor Speed | 667 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 667 MHz |
| Architecture | Zynq-7000 with Kintex-7 FPGA fabric | Zynq-7000 | Zynq-7000 | Zynq-7000 | Zynq-7000 | Zynq-7000 |
| Temperature Suffix | I | I | I | E | E | E |
主な差別化要因
- Lower processor speed than the verified -2 family alternative (vs XC7Z100-2FFG900I)
- Same integrated processor and FPGA architecture (vs XC7Z100-2FFG900I)
- Industrial-oriented I suffix retained on the verified target (vs XC7Z100-2FFG900E)
設計ノート
Do not assign the 900-FCBGA footprint from a generic BGA library. According to AMD's Zynq-7000 package-device pinout resources, package data is supplied in TXT and CSV formats and interpreted through the framework described in UG865. Start the layout from the exact XC7Z100-1FF900I package file, verify every power, ground, configuration, clock, and user I/O ball, and compare the symbol against the DS191 datasheet before fabrication release.
Treat processor and FPGA power as separate design domains until the manufacturer rail requirements are confirmed. The supplied sources do not state the exact voltage ranges, sequencing rules, or current limits, so do not infer them from the 667 MHz or 444K logic-cell ratings. Use the AMD datasheet to define each rail, then include local bulk and high-frequency decoupling, verify startup ordering, and budget regulator headroom for the complete processor-plus-fabric workload rather than either block in isolation.
Validate thermal performance at the selected processor speed and temperature grade using the actual board construction. The verified data identifies a 31 x 31 mm, 900-FCBGA package but provides no thermal resistance, maximum junction temperature, or processor-only power dissipation. Those figures must not be estimated from package area. Use the manufacturer thermal data with the intended multilayer PCB, copper distribution, enclosure airflow, and worst-case processor and fabric activity before selecting the package and cooling strategy.
Develop clock, memory, serial, and other high-speed interfaces against the exact voltage and timing specifications in DS191. The verified 667 MHz processor rating does not establish the maximum operating rate of any individual I/O. Account for package-ball transitions, reference-plane return paths, length matching where required, and connector or transceiver launch losses in simulation. Use AMD's package files to confirm whether a proposed signal is available on the selected 900-ball pattern.
コンプライアンス情報
RoHS status is identified in the verified LCSC listing. The supplied sources do not separately verify REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status.