XC7Z100-2FFG900I - Zynq-7000 SoC, Kintex-7 FPGA, 444K Logic Cells | AMD
部品番号: XC7Z100-2FFG900I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3446.46 | $3,446.46 |
| 10 | $3308.6 | $33,086.00 |
| 50 | $3130 | $156,500.00 |
| 100 | $2890 | $289,000.00 |
| 250 | $2680 | $670,000.00 |
XC7Z100-2FFG900I 概要
A Zynq-7000 SoC is a heterogeneous multiprocessor device that fuses a Processing System (PS) - a dual ARM Cortex-A9 with NEON SIMD engines, caches, MMU, and standard peripherals - with Programmable Logic (PL) equivalent to a Kintex-7 FPGA. The PS boots first and configures the PL at start-up, allowing software designers to use familiar Cortex-A9 toolchains (GCC, Linux, FreeRTOS) while hardware designers accelerate critical paths in the PL. The XC7Z100 sits at the top of the Zynq-7000 family, sharing the Kintex-7 fabric with the Z-7045 but adding extra logic, DSP, and block RAM resources.
Key features include 2x ARM Cortex-A9 cores at up to 800 MHz, 444K logic cells, 26.5 Mb block RAM, 1540 DSP48E1 slices, 16 GTX transceivers at up to 6.25 Gb/s, dual 12-bit 1 MSPS ADCs (XADC), 4x PCIe Gen2 hard blocks, and 2x USB 2.0 OTG ports. The integrated CoreSight debug enables multicore trace, and security features include AES, SHA, and RSA hardware accelerators alongside secure boot.
Typical applications include high-performance embedded vision (machine-learning inference, ADAS front cameras), 8K video processing, software-defined radio baseband, industrial motor control with deterministic real-time loops, and avionics/medical imaging. The Kintex-7 PL is well suited to DSP-heavy algorithms like FFT, LDPC, and H.265 codec blocks.
When designing, allocate decoupling and bulk capacitors close to each power rail (VCCPINT, VCCPAUX, VCCO, VCCAUX, MGTAVCC); use the AMD-recommended power-on/-off sequencing; and adopt the UG865 ASCII package files when laying out the 900-ball FCBGA. For evaluation, the ZC706 board (XC7Z045 in FFG900) is pin-compatible with the XC7Z100 FFG900 footprint, which AMD documents as an authorized Z-7100 reference platform.
ドロップイン代替品: XC7Z100-2FFG900I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC7Z100-2FFG900I （同一形状・フットプリント）.
クイック比較ツール — 並列比較する代替部品を選択:
XC7Z100-2FFG900I4507
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7Z100-3FFG900I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XQ7Z100-2FFG900I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7Z100-2FFG900I 最大定格＆電気的特性
| Device Family | Zynq-7000 All Programmable SoC |
| Architecture | ARM Cortex-A9 dual-core MPCore + Kintex-7 FPGA |
| Logic Cells (PL) | 444K |
| Block RAM | 26.5 Mb |
| DSP Slices | 1540 (DSP48E1) |
| Processor Cores | 2x ARM Cortex-A9 MPCore with CoreSight |
| Max Processor Frequency | 800 MHz (up to 1 GHz with -3 speed grade) |
| Transceivers | 16x GTX up to 6.25 Gb/s |
| PCIe Hard Blocks | 4x Gen2 (Root Complex or Endpoint) |
| Memory Interfaces | DDR3, DDR3L, DDR2, LPDDR2 (16-bit and 32-bit; ECC on PS side) |
| Ethernet MACs | 2x 10/100/1000 Mbps GEM |
| USB | 2x USB 2.0 OTG |
| Security | AES, SHA-256, RSA, secure boot, JTAG disable |
| ADC | Dual 12-bit 1 MSPS XADC |
| 動作温度 | -40C to +100C (Industrial) |
| パッケージ | 900-ball FCBGA (FFG) 31x31 mm |
| Speed Grade | -2 (mid-performance) |
| Temperature Grade | I (Industrial) |
XC7Z100-2FFG900I 900-ball fcbga (ffg) 31x31 mm ピン配置ガイド
XC7Z100-2FFG900I (900-ball fcbga (ffg) 31x31 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC7Z100-2FFG900I.
詳細は データシート をご参照ください。
主な用途
XC7Z100-2FFG900I の用途: 7 件s: Embedded Machine Vision / ADAS Front Camera, 8K Video Broadcast Encoder, Software-Defined Radio Baseband, Industrial Motor Control / Servo Drive, Medical Imaging (Ultrasound / Endoscopy), Avionics Mission Computer, 5G DU/RU Fronthaul Gateway.
Embedded Machine Vision / ADAS Front Camera
The XC7Z100-2FFG900I fits 4K automotive front-camera systems because its dual ARM Cortex-A9 PS runs Linux/ADAS perception stacks while the 444K-cell Kintex-7 PL accelerates image rectification, CNN inference, and sensor fusion in hardware. With 1540 DSP48E1 slices it handles H.264 encode and lane-detection FFTs in real time, while 16 GTX lanes feed multi-Gigabit serializer/deserializer camera links. The -2 industrial temperature grade and secure boot are critical for production automotive ECUs that must boot trusted firmware only.
おすすめ
8K Video Broadcast Encoder
The XC7Z100-2FFG900I accelerates 8K HEVC/H.265 encoding at broadcast-grade bitrates thanks to its 1540 DSP48E1 slices and 26.5 Mb block RAM, both of which carry motion-estimation and CABAC paths that would starve a CPU. The PS runs Linux stack for network I/O and codec control while the PL pipelines 8K pixel rates. PCIe Gen2 x4 hard blocks attach external capture cards without additional glue logic, and the industrial temp grade ensures thermal headroom in rack-mounted encoder chassis.
おすすめ
Software-Defined Radio Baseband
The XC7Z100-2FFG900I is well matched to LTE/5G small-cell baseband processing because its GTX transceivers run up to 6.25 Gb/s for CPRI/eCPRI fronthaul links to radio units. The 444K logic cells host PHY-layer LDPC/turbo encoders at full 20 MHz channel bandwidth, while the dual Cortex-A9 PS executes the MAC scheduler and OpenAirInterface / srsRAN stack. Hardware AES/SHA in the PS accelerates encryption at L1, offloading the PL for baseband DSP work.
おすすめ
Industrial Motor Control / Servo Drive
The XC7Z100-2FFG900I gives servo drives deterministic torque loops: the Kintex-7 PL runs field-oriented control at microsecond rates on dedicated fabric, while the Cortex-A9 PS hosts the Linux supervisory layer for EtherCAT master, HMI, and safety logic. The hardware FPU and NEON SIMD accelerate trajectory generators, and the integrated XADC samples shunt currents without an external ADC. The wide industrial temperature range suits cabinet-mount drives.
おすすめ
Medical Imaging (Ultrasound / Endoscopy)
The XC7Z100-2FFG900I powers portable ultrasound and endoscopy platforms because the dual Cortex-A9 PS runs the imaging user interface on Linux while the PL handles beamforming and Doppler processing across thousands of channels in parallel. Hardware AES-256 in the PS protects patient data and enforces FDA cybersecurity guidance, and the integrated XADC simplifies analog front-end design. The compact 900-ball FCBGA lets designers keep a small handheld footprint.
おすすめ
Avionics Mission Computer
The XC7Z100-2FFG900I (with XQ ruggedized variant for flight) integrates sensor fusion, ARINC 429 / MIL-STD-1553 bridges, and route planning in one device: ARINC/MIL-STD IP cores run in the PL, while the Cortex-A9 PS hosts a DO-178C certifiable RTOS. Hardware secure boot and JTAG disable satisfy RTCA DO-326 airworthiness security guidance. The Z-7100's high logic count enables multi-redundant lanes within a single SoC, simplifying LRU weight and power.
おすすめ
5G DU/RU Fronthaul Gateway
The XC7Z100-2FFG900I is suited for high-density DU/RU gateway platforms where CPRI/eCPRI traffic is forwarded between fiber and Ethernet backhaul. Its 16 GTX lanes and 4x PCIe Gen2 hard blocks enable multi-port 10G/25G fronthaul aggregation without an external switch ASIC, while the Kintex-7 PL implements forward-error correction, packet timing, and sync-E. The dual Cortex-A9 PS handles OpenFlow/SONiC management planes, reducing bill-of-materials cost in dense radio deployments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC7Z100-2FFG900I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC7Z045-2FFG900I | XC7Z100-2FFG900I4507 | XC7Z100-3FFG900I | XQ7Z100-2FFG900I |
|---|---|---|---|---|---|
| Package | 900-ball FCBGA (FFG900) | 900-ball FCBGA (FFG900) - same | 900-ball FCBGA (FFG900) - same | 900-ball FCBGA (FFG900) - same | 900-ball FCBGA (FFG900) - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells (PL) | 444K | 350K (-21%) | 444K (same) | 444K (same) | 444K (same) |
| Block RAM | 26.5 Mb | 19.2 Mb (-28%) | 26.5 Mb (same) | 26.5 Mb (same) | 26.5 Mb (same) |
| DSP Slices | 1540 | 900 (-42%) | 1540 (same) | 1540 (same) | 1540 (same) |
| Max Processor Frequency | 800 MHz | 800 MHz (same) | 800 MHz (same) | 1 GHz (+25%) | 800 MHz (same) |
| Speed Grade | -2 (mid) | -2 (mid) | -2 (mid, factory-tested) | -3 (high) | -2 (mid, ruggedized) |
| Ruggedization / Temperature Grade | Industrial (I) -40C to +100C | Industrial (I) - same | Industrial (I) - same | Industrial (I) - same | Ruggedized extended screening |
主な差別化要因
- Highest-density Zynq-7000 SoC with 444K logic cells in FFG900 （vs XC7Z045-2FFG900I)
- 16 GTX transceivers at 6.25 Gb/s and 4x PCIe Gen2 hard blocks （vs XC7Z020-1CLG484I)
- Hardware AES-256, SHA-256, RSA accelerators with secure boot （vs XC7K325T-2FFG900I)
設計ノート
The XC7Z100-2FFG900I requires multiple rails (VCCPINT 1.0V, VCCPAUX 1.8V, VCCO 1.5-3.3V, VCCAUX 1.8V, VCCAUX_IO, MGTAVCC 1.0V, MGTAVTT 1.2V, MGTVCCAUX 1.8V) sequenced per DS191. Use TPS54560QDDAQ1 wide-VIN buck for 1.0V core and TPS7A7002DDA LDO for low-noise MGTAVTT. Estimated worst-case PS rail current at full PL utilization: ~3 A on VCCPINT; budget at least 4 A headroom.
Estimated: at 5W PL dissipation, the FCBGA 900 package needs at least 4 thermal vias in the center array plus a 6-layer PCB with solid ground plane. Without a heatsink or top-side heat spreader, junction temperature can exceed 100C in enclosed enclosures. Compute theta_JA from the UG865 thermal model in Vivado before locking the mechanical enclosure.
Per AMD UG865, use the 1.0 mm pitch BGA fanout with microvia-stack-up. Route all 16 GTX differential pairs with intra-pair skew under 5 ps and length-matched within 0.25 mm. Place a 100 nF decoupling cap per power pin within 1 mm; bulk 47 uF per rail at the source. Common pitfall: forgetting VCCBRAM, which is separate from VCCPINT and must be filtered independently.
A common mistake is using ISE 14.7 for Z-7100 production builds - it lacks PCIe Gen2 and GTX hard-block IP and may fail timing closure. Use Vivado 2018.3 or later (or 2023.x). Also, do not assume MIO boot mode pins are interchangeable with the XC7Z045 - double-check MIO bank voltage on the boot strapping resistors. The ZC706 reference schematic is officially compatible with Z-7100 but verify PL power section before reuse.
Place boot mode pins (MIO[2:8]) in fixed pull-up/pull-down configuration that matches the chosen boot device (QSPI, SD, NAND, JTAG). Routed traces must not exceed 50 ohm impedance to the boot ROM. Keep BOOT_MODE pin traces short to avoid noise-induced boot failures. Use Vivado Board File Generator to lock pin assignments before PCB fabrication.
コンプライアンス情報
RoHS and lead-free confirmed per AMD/Xilinx product environmental compliance program. The XQ7Z100 variant is the formal military/avionics screening tier. AEC-Q100 not formally qualified but automotive designers often pair Z-7100 with external ASIL-D controllers.
