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XC6SLX16-N3FT256I - Spartan-6 LX FPGA, 14,579 Cells | AMD
XC6SLX16-N3FT256I

XC6SLX16-N3FT256I - Spartan-6 LX FPGA, 14,579 Cells | AMD

The AMD Xilinx XC6SLX16-N3FT256I is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 186 I/O, 45 nm semiconductor technology, and a 1.2 V core supply, housed in a 256-LBGA package. It combines programmable logic, block RAM, and digital signal processing resources in one reconfigurable device. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, and processing blocks are configured after manufacture. FPGA technology sits within programmable logic devices and combines configurable parallel processing, high-speed I/O, and system integration functions. The Spartan-6 LX family is intended for cost-sensitive embedded systems that require substantial programmable logic without the resources of a larger FPGA. The XC6SLX16 device provides 14,579 logic cells and 186 I/O in a 256-LBGA package. Its 45 nm fabrication process supports a compact, high-performance implementation for industrial embedded applications. The N3 ordering code identifies this -3 speed-grade configuration, while FT256I denotes the 256-ball package and industrial-temperature option. Exact block-RAM, DSP, and performance details should be selected from the device-specific Spartan-6 documentation. The device combines three principal programmable resource types: logic cells for Boolean and sequential functions, block RAM for data buffering, and DSP resources for arithmetic-intensive signal processing. These resources allow control logic, data acquisition, communications, and embedded processing to be consolidated in one package, reducing component count compared with a design assembled from separate programmable and fixed-function devices. Typical applications include industrial automation, embedded control, communications equipment, instrumentation, video processing, and sensor acquisition systems. A design can place acquisition logic, protocol handling, filtering, and control functions into one FPGA while using external memory for larger data structures. The 186 available I/O also allow direct connection to external converters, transceivers, memories, and control interfaces. The primary design consideration is package-accurate planning. Use the AMD Spartan-6 package pinout files and device-specific tables when assigning balls, configuring power rails, and routing high-speed interfaces. Differential pairs and clock inputs require controlled layout, while BGA assembly demands thermal analysis and via patterns appropriate to the board stack-up. This page consolidates the verified device identity, package information, source links, practical application guidance, and same-package replacement candidates into an engineering-focused reference. It also distinguishes documented device attributes from parameters that require selection from the full AMD datasheet and configuration tables.

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XC6SLX25-2CSG324C - 24,051-Cell Spartan-6 LX FPGA | AMD
XC6SLX25-2CSG324C

XC6SLX25-2CSG324C - 24,051-Cell Spartan-6 LX FPGA | AMD

The AMD Xilinx XC6SLX25-2CSG324C is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 958,464 bits of block RAM, and 226 user I/O, packaged in a 324-ball CSPBGA. The device is manufactured on 45 nm CMOS, operates from a 1.2 V core supply, and is offered in the -2 performance grade. Its package measures approximately 15 mm by 15 mm with a 0.8 mm ball pitch. A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor whose logic, memory, and I/O resources can be programmed after manufacture. Within the device hierarchy, an FPGA belongs to programmable logic rather than fixed-function logic or microcontrollers. The Spartan-6 LX family combines configurable logic, block RAM, digital clock managers, programmable I/O, and embedded MicroBlaze processor resources for systems requiring flexible hardware functions and efficient product customization. The XC6SLX25 provides 1,879 configurable logic blocks, 24,051 logic cells, and 958,464 bits of block RAM according to the manufacturer device documentation. Its 226 user I/O support high-volume parallel interfaces, while integrated digital clock management and differential clock resources simplify clocking and high-speed interface designs. The -2 speed grade provides a 667 MHz maximum figure identified in the device documentation. The 45 nm CMOS implementation is designed to balance programmable functionality, performance, and power in cost-sensitive embedded systems. This device combines considerably more logic and memory than a basic programmable logic device while retaining a high I/O count for control, data acquisition, communications, and signal-processing designs. The industrial design also supports the MicroBlaze soft-processor architecture where a programmable control core is useful. Typical applications include industrial automation controllers, data-acquisition systems, embedded communications equipment, video and image-processing pipelines, instrument control, and low-power embedded processors. The 226-I/O count is especially useful when a board must connect multiple sensors, converters, memories, communications transceivers, and display or control peripherals without using a larger package. PCB implementation requires careful attention to the CSPBGA escape routing and the manufacturer’s package pinout file. Confirm power sequencing, decoupling, clock, configuration, and I/O standards against the device datasheet. Review bitstream compatibility, temperature requirements, and any board-level interface changes before releasing a production design. This page organizes the device’s core specifications, application guidance, package considerations, and same-footprint Spartan-6 options. It also highlights the parameters engineers should compare when determining whether another -grade or temperature-grade member can replace the XC6SLX25-2CSG324C without redesigning the PCB.

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XC6SLX25-2CSG324I - 24,051-Cell Spartan-6 FPGA | AMD
XC6SLX25-2CSG324I

XC6SLX25-2CSG324I - 24,051-Cell Spartan-6 FPGA | AMD

AMD XC6SLX25-2CSG324I is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 226 user I/Os, a 375 MHz operating frequency, and a 324-ball CSBGA package. It operates from a 1.14 V to 1.26 V core supply and is manufactured using 45 nm FPGA process technology. A field-programmable gate array, or FPGA, is a programmable semiconductor in which configurable logic blocks, routing resources, and input/output resources implement a digital system. Within the semiconductor hierarchy, an FPGA sits above fixed-function logic devices because its interconnect and processing architecture can be programmed after manufacture. The Spartan-6 LX family combines programmable logic with system resources such as block RAM, digital clock managers, and PLL blocks. The XC6SLX25 device provides a useful balance of logic density, I/O availability, and power-management flexibility. Its 226 user I/Os support connections to external memory, control interfaces, communications transceivers, and general-purpose digital peripherals. The speed grade 2 designation identifies its timing class within the Spartan-6 product line, while the CSBGA-324 package supports dense board-level integration in space-constrained embedded systems. Spartan-6 devices use configurable logic and routing resources to implement parallel processing, control, protocol handling, and signal conditioning. The XC6SLX25 also incorporates dedicated resources for clock management and on-chip memory. Its 1.14 V to 1.26 V operating-voltage range identifies it as a core-supply device; board designers still need to follow the AMD Spartan-6 power-supply, decoupling, configuration, and signal-integrity guidance for the complete system. Typical applications include industrial control systems, video and image processing, communications infrastructure, instrumentation, consumer electronics, and embedded control platforms. The 226 available I/Os are particularly useful when an existing design requires numerous external buses, status signals, and high-speed serial or parallel interfaces. The device is also suitable for education and prototyping systems that require a large logic fabric and deterministic programmable behavior. A successful implementation depends on matching the selected Spartan-6 device, package, speed grade, and temperature grade to the PCB design. Use the AMD Spartan-6 package pinout files to assign every BGA ball, and follow the DS162 data sheet for DC and switching characteristics. Confirm configuration-memory support, clocking topology, pin constraints, and power sequencing before releasing a production layout. This product record combines the device's principal architecture and package characteristics with practical substitution analysis, application guidance, comparison parameters, and design checks. It is intended to help engineers identify the correct Spartan-6 LX option and distinguish exact-family substitutions from alternatives that require different packages or materially different resources.

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XC6SLX25-2FG484C - 24,051-Cell Spartan-6 LX FPGA | AMD
XC6SLX25-2FG484C

XC6SLX25-2FG484C - 24,051-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX25-2FG484C is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 266 I/O, a 500 MHz internal frequency, and a 484-ball FBGA package. Built on 45 nm CMOS technology and operating from a 1.2 V core supply, it combines programmable logic, 266 user I/O, and embedded block RAM in a single device. The -2 speed grade supports designs requiring predictable general-purpose FPGA performance, while the commercial temperature option covers 0°C to 85°C. A field-programmable gate array, or FPGA, is a semiconductor whose logic, interconnects, and I/O behavior are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, where it sits above fixed-function logic devices and provides parallel hardware implementation for control, signal processing, communications, and interface functions. Its value comes from combining substantial configurable logic density with reusable intellectual property cores, allowing one package to replace multiple conventional logic components. The Spartan-6 LX family provides 24,051 logic cells for this device, 266 I/O, and 45 nm CMOS fabrication. The -2 designation identifies its performance grade, while the 484-ball package supports dense board routing through an array of solder-ball connections. The device is identified as lead-free and RoHS compliant in the supplied component data. These characteristics make it relevant to industrial control, communications, instrumentation, embedded signal processing, and general-purpose prototyping systems. At the architecture level, the Spartan-6 LX FPGA combines configurable logic blocks with dedicated block RAM and programmable I/O resources. This mixed architecture allows parallel datapaths and state machines to be implemented without relying on a processor for every control function. The supplied data identifies a 500 MHz internal frequency, while actual interface and system timing remain dependent on the selected I/O standards, clocking implementation, board-level routing, external memory interface, and the selected design tools. Typical uses include industrial automation controllers, serial and parallel protocol bridges, data-acquisition front ends, communications equipment, and embedded DSP functions. Its 266 I/O count is particularly useful when a design must connect multiple buses, capture parallel sensor data, or bridge legacy peripheral logic to a modern system. The 484-ball FBGA also reduces board area compared with a large leaded package, but it demands careful escape routing and assembly control. A primary design consideration is package and PCB complexity. Unlike a fine-pitch QFP, the 484-ball FBGA is not visually inspectable after assembly and requires appropriate land patterns, via-in-pad or escape-routing rules, X-ray inspection capability, and controlled solder-assembly profiles. Designers should also confirm power sequencing, decoupling, clock integrity, and I/O voltage compatibility against the complete AMD device documentation before layout release. This page consolidates the verified device identity, package information, commercial listing, and cross-reference findings into an engineering-focused product record. It also distinguishes true package-compatible Spartan-6 options from unrelated FPGA families, helping procurement and hardware teams assess interchangeability without assuming that equivalent logic density guarantees interchangeable pinout, timing, or qualification.

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XC6SLX25-2FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD
XC6SLX25-2FG484I

XC6SLX25-2FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD

AMD/Xilinx XC6SLX25-2FG484I is a Spartan-6 LX FPGA with 24,051 logic cells, 266 I/O, 45 nm CMOS technology, 1.2 V operation, and a 484-pin FBGA package. The -2 speed grade is designed for industrial-temperature operation from 0 C to 85 C, as identified in the verified component listings. The device combines programmable logic, block RAM, DSP resources, and programmable I/O in a single FPGA package, making it suitable for embedded control, communications, industrial automation, signal processing, and general-purpose digital design. Its 484-ball package provides a high-density interconnect arrangement for designs requiring numerous external interfaces. The Spartan-6 LX FPGA family is a programmable-logic device family within the broader FPGA and semiconductor hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA allows logic behavior, interfaces, and signal processing to be configured after manufacture. This flexibility supports design revisions, shorter product-development cycles, and consolidation of multiple control functions into one programmable device when appropriate system partitioning and validation are performed. Key verified characteristics include 24,051 logic cells, 266 I/O, 1.2 V operation, 45 nm CMOS construction, and a 484-pin FBGA package. The -2 speed grade provides a defined performance class within the Spartan-6 LX family. The I/O count makes the device suitable for systems requiring parallel buses, multiple control signals, external memory interfaces, converters, and communication transceivers. Because the package is ball-grid and densely routed, PCB layout requires careful ball assignment, power planning, decoupling, and signal-integrity review. Typical uses include industrial PLC and automation controllers, embedded instrumentation, communications equipment, video and image-processing front ends, and low-power control subsystems. The FPGA can implement parallel algorithms, state machines, protocol bridges, and control logic in parallel, reducing reliance on multiple discrete controllers. Its programming flexibility also allows firmware-like field updates when the surrounding flash and configuration architecture are included. Design considerations center on thermal performance, decoupling, configuration, and high-speed board layout. The 1.2 V core and dense 484-ball package require multiple supply rails and careful placement of bypass capacitors. Designers should use the AMD Spartan-6 package pinout and device documentation for exact ball assignments, power sequencing, configuration pins, and I/O standards before layout release. This page combines verified distributor and manufacturer-source information with package, purchasing, and engineering guidance designed to make the XC6SLX25-2FG484I selection process faster.

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XC6SLX25-2FGG484C - 24K Spartan-6 LX FPGA | AMD
XC6SLX25-2FGG484C

XC6SLX25-2FGG484C - 24K Spartan-6 LX FPGA | AMD

The AMD XC6SLX25-2FGG484C is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 1,879 configurable logic blocks, and a 500 MHz internal frequency, supplied in a lead-free FBGA package. The device uses 45 nm CMOS technology and supports a 1.2 V core supply. Its industrial temperature option is specified for 0°C to 85°C, making it suitable for embedded control, communications, industrial automation, and signal-processing systems requiring a compact, programmable logic implementation. An FPGA is a semiconductor whose digital behavior is configured after manufacture. It belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, memory resources, clocking, and dedicated hard IP into one integrated device. Compared with a fixed-function application-specific integrated circuit, an FPGA permits design revisions, parallel processing, adaptable interfaces, and shorter development cycles when system requirements evolve. The Spartan-6 LX family targets low-cost, low-power programmable designs while retaining a large selection of dedicated resources. The XC6SLX25 provides 24,051 logic cells and 1,879 configurable logic blocks, giving designers more parallel capacity than small CPLDs. Its -2 speed designation identifies the middle Spartan-6 performance option, while the C suffix denotes the commercial operating-temperature grade. The package combines a 484-ball grid with approximately 0.80 mm ball pitch and dimensions listed as 15 mm by 15 mm. Programmable logic is complemented by block RAM, dedicated DSP resources, clock-management circuitry, and high-speed I/O paths. These resources allow designers to implement parallel data paths, protocol bridges, control logic, and fixed-point processing without relying on multiple discrete devices. The internal frequency of 500 MHz establishes the device’s published logic-performance reference, while actual interface throughput depends on the selected I/O standard, clocking, timing constraints, and design implementation. Typical uses include industrial control panels, motor and motion controllers, test equipment, embedded communications, video and image processing, and general-purpose embedded systems. The Spartan-6 architecture is particularly useful when a design requires deterministic parallel logic, numerous peripheral interfaces, or field programmability. It also helps consolidate small CPLD, microcontroller, and discrete logic functions into a single device when board space and inventory reduction are priorities. Board design must account for the dense FBGA footprint, numerous power and ground connections, high-speed I/O constraints, and thermal-management requirements. Use the AMD Spartan-6 package pinout files and the manufacturer’s design-support documentation to assign balls and implement the power grid. Validate power sequencing, decoupling, signal integrity, and timing with the appropriate FPGA implementation flow before releasing the PCB. This page combines device specifications, commercial sourcing guidance, same-package alternatives, comparison criteria, and practical implementation notes. It is intended to help engineers identify the correct Spartan-6 option, assess whether an alternative can replace the target without PCB changes, and plan a robust implementation around the FGG484 package.

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XC6SLX25-2FGG484I - Spartan-6 FPGA 24051 Cells | AMD
XC6SLX25-2FGG484I

XC6SLX25-2FGG484I - Spartan-6 FPGA 24051 Cells | AMD

The AMD XC6SLX25-2FGG484I is a Field Programmable Gate Array (FPGA) from the Spartan-6 LX family, built on a mature 45 nm low-power copper process technology. It delivers 24,051 logic cells, 958,464 bits of block RAM, and 266 user I/O pins in a 484-ball FBGA package (23x23 mm, 1 mm pitch). The device operates at a core voltage of 1.2V and supports internal clock frequencies up to 500 MHz, with a -2 speed grade providing a balanced performance-power trade-off. An FPGA is an integrated circuit that can be programmed after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between ASICs and general-purpose processors in the semiconductor hierarchy. They offer reconfigurability, parallel processing, and low non-recurring engineering costs, making them ideal for prototyping, low-to-mid volume production, and applications requiring hardware flexibility. Key features of the XC6SLX25-2FGG484I include 24,051 logic cells, 52 DSP48A1 slices, 958,464 bits of block RAM, and support for multiple I/O standards including LVCMOS, LVDS, and SSTL. The device also features integrated memory controllers, clock management tiles (CMT) with PLL and DCM, and support for PCI Express (in LXT variants). The -2 speed grade offers a balance between performance and power consumption, with a maximum internal frequency of 500 MHz. The Spartan-6 family is designed for high-volume, cost-sensitive applications, offering half the power consumption of previous Spartan families. The 45 nm process technology enables high logic density and low static power. The device includes advanced power management features such as suspend mode and partial reconfiguration support, allowing dynamic power optimization in battery-powered systems. Typical applications include industrial automation, automotive infotainment, medical imaging, communications infrastructure, and video processing. The 484-ball FBGA package provides ample I/O for interfacing with external memory, ADCs, DACs, and high-speed serial transceivers (in LXT variants). The industrial temperature grade (-40°C to +100°C) makes it suitable for harsh environments. When designing with this FPGA, ensure proper decoupling of the 1.2V core supply and 2.5V/3.3V auxiliary supplies. Use the configuration pins (MODE, DONE, PROG_B) for reliable device programming. The device supports multiple configuration modes including Master SPI, Slave SelectMAP, and JTAG, providing flexibility in system design.

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XC6SLX25-2FT256I - Spartan-6 LX FPGA, 24K Logic Cells | AMD
XC6SLX25-2FT256I

XC6SLX25-2FT256I - Spartan-6 LX FPGA, 24K Logic Cells | AMD

The AMD (formerly Xilinx) XC6SLX25-2FT256I is a Spartan-6 LX Field-Programmable Gate Array (FPGA) integrating 24,051 logic cells, 1,879 Configurable Logic Blocks (CLBs), and 958 Kbits of block RAM in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA-256) package. It is built on a 45 nm CMOS process, supports up to 186 user I/O, and runs at internal frequencies up to 500 MHz in this -2 (standard performance) and -I (industrial temperature, -40C to +100C) grade. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and clock-management tiles (CMTs). FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers: they deliver ASIC-class parallelism and data-path throughput while remaining fully re-programmable in the field. The Spartan-6 LX family is positioned at the low-cost, low-power end of the AMD/Xilinx FPGA portfolio and is widely used in bridging, motor control, video processing, and industrial automation. Key features of the XC6SLX25-2FT256I include 24,051 logic cells, 1,879 CLBs, 4,824 Kbits of distributed RAM, 38 DSP48A1 slices running up to 390 MHz, 2 CMTs for PLL-based clock management, and a 32-bit MultiBoot configuration controller. Industrial temperature grade -I supports -40C to +100C operation. The FT256 package provides 186 user I/O across 256 balls with 1.0 mm pitch and 17 x 17 mm body. The -2 speed grade offers the standard balance of performance and power consumption for cost-sensitive embedded designs. The architecture pairs 6-input Look-Up Tables (LUT6) with dual flip-flops per slice, enabling efficient state-machine and pipelined datapath implementations. The Memory Controller Block (MCB) supports DDR, DDR2, DDR3, and LPDDR external memories at up to 800 Mb/s, while the SelectIO technology supports voltages from 1.2 V to 3.3 V on the same bank. Typical applications include industrial control and bridging, automotive infotainment head units, motor and servo drive feedback, low-cost video processing, custom glue logic replacement, and consumer electronics requiring low-power parallel DSP. The wide temperature grade also makes it suitable for factory automation and outdoor display systems. When designing with this part, note that Spartan-6 FPGAs require a separate configuration memory or JTAG programming interface; the device does not boot from internal flash. Plan the bank I/O voltage ahead of placement to avoid level-shifter overhead. This page consolidates distributor pricing for the AMD XC6SLX25-2FT256I, drop-in FT256 Spartan-6 variants, and practical design notes that go beyond the manufacturer datasheet summary.

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XC6SLX25-2FTG256I - 24K Cell Spartan-6 FPGA | AMD
XC6SLX25-2FTG256I

XC6SLX25-2FTG256I - 24K Cell Spartan-6 FPGA | AMD

AMD XC6SLX25-2FTG256I is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 1,879 configurable logic blocks, 3,758 adaptive logic modules, and 186 user I/Os in a 256-ball FTG256 lead-free BGA package. The -2 speed grade targets a 375 MHz operating performance class, while the industrial suffix indicates an intended operating temperature range of 0°C to 85°C. A field-programmable gate array is a semiconductor whose digital logic, memory, interfaces, and signal paths are configured after manufacture. Within the product hierarchy, an FPGA sits above programmable logic devices and system-programmable semiconductor devices, combining configurable logic, block RAM, digital clock managers, and programmable I/O in one device. The Spartan-6 LX family targets cost-sensitive industrial, consumer, communications, and embedded-control systems requiring substantial parallel processing capability. The XC6SLX25-2FTG256I provides 24,051 logic cells organized into 1,879 CLBs and 3,758 ALMs, along with 186 I/Os. Its integrated DCM and PLL resources support clock generation and phase-shifted clock distribution, while the core supply range is 1.14 V to 1.26 V. The 45 nm CMOS implementation and 256-ball package support dense board layouts without requiring a larger-footprint package. The device is categorized as a Spartan-6 LX FPGA with 3,758 adaptive logic modules and 24,051 logic elements. A comparison listing identifies 1,879 CLBs and a 667 MHz figure for the broader device record, while another specification source describes the target -2 grade at 375 MHz. Designers should therefore use the AMD Spartan-6 family data sheet and the selected speed-grade tables when establishing timing constraints rather than treating aggregate comparison figures as interchangeable timing guarantees. Typical uses include industrial control and factory automation, parallel sensor aggregation, communications infrastructure, display and video interfaces, embedded instrumentation, and compact control systems with many parallel I/O requirements. The 186 available I/Os make the device suitable for bridging external memory, capturing parallel sensor data, and coordinating multiple digital peripherals without requiring several discrete logic devices. When laying out the PCB, follow AMD's FTG256 package pinout files, verify all bank power and ground connections, and decouple each supply rail close to its package pins. Because unused balls can differ across Spartan-6 device densities, use the package files for the exact XC6SLX25 variant and review no-connect assignments before finalizing the board design. This product page combines the XC6SLX25-2FTG256I specifications, package and temperature details, speed-grade alternatives, practical design guidance, and application-specific engineering context to support faster component selection and PCB planning.

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XC6SLX25-3CSG324I - Spartan-6 LX FPGA, 324 CSBGA | AMD/Xilinx
XC6SLX25-3CSG324I

XC6SLX25-3CSG324I - Spartan-6 LX FPGA, 324 CSBGA | AMD/Xilinx

The AMD/Xilinx XC6SLX25-3CSG324I is a Spartan-6 LX field-programmable gate array in a 324-pin CSBGA package. The device is identified as the -3 speed grade and contains 24,051 programmable logic cells, with an internal frequency listed as 500 MHz. Its 15 x 15 mm lead-free package uses a 0.80 mm pitch and is designated MO-275. A field-programmable gate array is a reconfigurable digital semiconductor used to implement control logic, interfaces, signal processing, and embedded system functions after fabrication. The Spartan-6 family belongs to the FPGA and CPLD hierarchy and combines programmable logic, configurable I/O, memory resources, and clocking resources in one device. This makes the XC6SLX25 useful when a design needs programmable hardware rather than a fixed application-specific integrated circuit. The XC6SLX25-3CSG324I provides 24,051 logic cells and a stated internal frequency of 500 MHz. Its -3 speed designation identifies the highest-performance Spartan-6 LX speed grade described in the product information. The device is offered in a 324-CSBGA package with 0.80 mm pitch, so the PCB land pattern, via arrangement, assembly process, and thermal design must be based on the AMD Spartan-6 package documentation. The device is identified as operating from 0 C to 85 C in the product listing. The lead-free package designation is important for manufacturing environments using controlled soldering processes and solder-material requirements. The device is intended for designers creating parallel logic, embedded control, communications, instrumentation, and industrial automation systems with programmable FPGA architectures. Typical design considerations include high-speed board routing, careful power and ground distribution, BGA assembly capability, and validation of the exact pinout and package files before PCB release. The AMD Spartan-6 package pinout files should be used for the physical implementation, while the Spartan-6 FPGA Data Sheet DS162 should be used for DC and switching characteristics. This page combines the device specifications, package information, sourcing guidance, comparison points, and practical design notes needed to evaluate the XC6SLX25-3CSG324I for an FPGA-based system.

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XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx
XC6SLX25-3FG484C

XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx

Advanced Micro Devices, Inc. XC6SLX25-3FG484C is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 24,051 configurable logic cells, a 1.2 V core supply, and a 500 MHz internal frequency in a 15 x 15 mm lead-free CSBGA package. The -3 speed grade is identified as the highest-performance Spartan-6 LX grade in the supplied technical documentation. A field-programmable gate array, or FPGA, is a programmable logic device that combines configurable logic, programmable I/O, and dedicated processing resources on one semiconductor die. FPGAs occupy the programmable-logic hierarchy between fixed-function logic ICs and higher-end adaptive computing devices. They allow hardware functions to be revised through configuration bitstreams rather than redesigning a custom ASIC, reducing prototype cycles and supporting field upgrades. The XC6SLX25-3FG484C provides 24,051 logic cells and 1,879 configurable logic blocks, according to the indexed Spartan-6 comparison data. Its 500 MHz internal-frequency listing makes it suitable for parallel logic, state-machine, control, interface, and signal-processing designs that require deterministic hardware operation. The 484-BBGA package also exposes substantially more connection options than a small quad-flat package. The device combines configurable logic with DSP48 processing resources and dedicated block RAM for filtering, transforms, communications encoding, and other data-intensive functions. Its 45 nm CMOS implementation and 1.2 V core voltage place it in the Spartan-6 generation designed to balance programmable logic capacity, I/O connectivity, power efficiency, and cost for cost-sensitive, high-volume equipment. Typical uses include industrial automation and control, video-processing pipelines, communications infrastructure, instrumentation, embedded systems, and interface consolidation. The 24,051-cell Spartan-6 LX device is particularly appropriate when parallel datapath logic, moderate DSP requirements, and extensive package I/O are needed without moving immediately to a larger FPGA or developing a custom ASIC. Design planning must account for the BGA escape routing, decoupling, clock integrity, configuration memory, and thermal performance of a 484-ball package. Although the indexed operating-temperature range is 0 to 85 °C, thermal design should be evaluated for the actual board, enclosure, airflow, and activity level rather than relying only on the commercial temperature designation. This product record combines verified distributor availability, exact package and device identifiers, Spartan-6 family specifications, drop-in same-package comparisons, and procurement-oriented guidance. It distinguishes confirmed data from unavailable numeric pricing, pin-by-pin mapping, and detailed power characteristics so engineers can make sourcing and design decisions without relying on inferred values.

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XC6SLX25-3FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD
XC6SLX25-3FG484I

XC6SLX25-3FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD

AMD/Xilinx XC6SLX25-3FG484I is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 266 I/O, and 500 MHz internal frequency, supplied in a 484-BBGA package. The -3 speed grade represents the highest-performance Spartan-6 LX grade identified in the verified product data. Its 45 nm CMOS construction and 484-ball surface-mount package support compact industrial, communications, control, and embedded-processing systems where programmable logic is required. A field-programmable gate array is a semiconductor whose digital logic, interconnect, and peripheral functions are configured after manufacture. The FPGA hierarchy extends from configurable logic blocks and programmable interconnect to FPGA, programmable logic device, and digital semiconductor. Compared with a fixed-function application-specific integrated circuit, an FPGA allows interface changes, parallel processing, and hardware customization to be implemented in a single device while retaining the flexibility of field updates. The XC6SLX25-3FG484I combines 24,051 logic cells with 266 available I/O in a 484-BBGA package. The verified data identifies a 500 MHz internal frequency, a -3 speed designation, and operation from 0°C to 85°C. Its 484-ball format supports substantially denser board routing than a low-pin-count FPGA package, while the 15 mm by 15 mm body and 0.80 mm ball pitch provide a practical high-density footprint for multilayer PCB layouts. The Spartan-6 LX architecture is positioned between fixed logic and higher-end programmable SoC devices. Its logic resources can implement parallel data acquisition, protocol conversion, control state machines, and interface bridging, while its I/O count allows multiple external buses and high-speed links to converge on one package. The -3 grade favors designs in which timing performance is more important than the lower power or lower cost associated with slower speed grades. Typical uses include industrial automation, embedded control, communications equipment, test and measurement systems, signal processing, and generic embedded processing. The 266 I/O are useful when a design must connect external memories, transceivers, converters, and control peripherals. The 500 MHz internal frequency also provides a meaningful clocking target for pipelined logic, provided that board-level timing closure is completed with the selected toolchain and design constraints. Engineers should treat the 484-BBGA as a demanding fine-pitch package. PCB design must provide adequate escape routing, power and ground planes, via access, and thermal spreading. The verified sources expose a pinout-file resource, but the complete 484-ball pin map and exact power requirements were not included in the supplied data; those details must therefore be confirmed against the manufacturer package files and datasheet before release. This product record combines verified distributor availability information, exact device identity, package characteristics, and practical design considerations with same-family replacement guidance. It distinguishes confirmed facts from unresolved parameters and avoids presenting an unverifiable pinout, price schedule, or cross-vendor equivalence as established data.

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XC6SLX25-3FGG484C - 24,051-Cell Spartan-6 FPGA | AMD
XC6SLX25-3FGG484C

XC6SLX25-3FGG484C - 24,051-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX25-3FGG484C is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 24,051 logic cells, 266 I/O, a 1.2 V supply, and a 484-pin FBGA package. It combines programmable logic, dedicated DSP resources, block RAM, and selectable I/O standards in one device. The -3 speed designation identifies the higher-performance Spartan-6 LX grade, while the FGG484C suffix identifies the commercial-temperature, lead-free 484-ball package configuration. An FPGA is a semiconductor whose digital logic is configured after manufacture. Within the product hierarchy, the XC6SLX25-3FGG484C is a Spartan-6 LX FPGA, a programmable-logic device, and an integrated circuit. This classification places it between fixed-function logic and software-driven processors: parallel processing elements can execute filtering, control, protocol, and interface tasks concurrently after the device is programmed. The principal device-level characteristics are 24,051 logic cells, 266 user I/O, 45 nm CMOS fabrication, and a 1.2 V core supply. Its integrated system integration features allow a compact implementation to combine multiple digital functions without requiring separate logic devices. Block RAM supports data buffering and storage, while DSP resources accelerate arithmetic-heavy signal-processing pipelines. The broad I/O count also makes the device suitable for designs requiring substantial external connectivity. Spartan-6 devices use selectable I/O standards and programmable logic resources to balance performance, power, and cost. The -3 grade is intended for designs that prioritize operating speed over the lower-speed family members. Because the exact I/O-standard list, memory quantities, DSP-slice counts, differential-I/O limits, and performance timing values are not established by the product listing, engineers should confirm those details against the Spartan-6 family documentation before finalizing a high-speed or I/O-intensive design. Typical uses include industrial control, video and image processing, communications infrastructure, instrumentation, embedded signal processing, and general-purpose digital logic consolidation. The device is especially useful when parallel throughput, deterministic hardware implementation, and flexible I/O assignment matter more than software flexibility. Its 484-pin FBGA package requires careful PCB escape-routing and multilayer assembly planning. Design around the 1.2 V core supply with separate, properly decoupled rails for all specified supply domains. Follow the Spartan-6 package pinout file for ball assignments and verify every high-speed interface against the published I/O and timing constraints. Programming should use a compatible configuration interface and supported device-support flow, with configuration storage, clocking, and reset arranged to avoid contention during startup. This product record combines the exact device identity, core specifications, sourcing links, same-footprint alternatives, and application-focused design guidance. It supports initial device selection while directing detailed I/O, timing, power, and PCB decisions to the manufacturer documentation.

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XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD
XC6SLX25-3FGG484I

XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD

The AMD XC6SLX25-3FGG484I is a member of the Spartan-6 LX family of Field Programmable Gate Arrays (FPGAs), fabricated using a 45nm CMOS process technology. It features 24,051 logic cells, 1,879 configurable logic blocks (CLBs), and 958,464 total RAM bits, providing a balanced mix of logic density and memory resources for a wide range of digital designs. The device is offered in a 484-ball FBGA package (23x23 mm) with 266 user I/O pins, supporting diverse interface standards and flexible I/O configurations. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, allowing for custom digital logic implementation. FPGAs belong to the programmable logic device (PLD) family, which sits between fixed-function ASICs and general-purpose processors in terms of flexibility and performance. The Spartan-6 series is optimized for low power and cost-sensitive applications, making it a popular choice for industrial, automotive, and telecommunications systems. Key features of the XC6SLX25-3FGG484I include a speed grade of -3, which is the highest performance grade available for Spartan-6 LX devices, enabling faster clock frequencies and improved timing margins. The device operates from a 1.2V core supply (1.14V to 1.26V range) and supports multiple I/O standards, including LVCMOS, LVDS, and HSTL. It also includes dedicated DSP48A1 slices and block RAM for efficient implementation of arithmetic and memory-intensive functions. From a technical perspective, the Spartan-6 architecture incorporates a 6-input look-up table (LUT) fabric, advanced clock management tiles (CMTs) with PLLs and DCMs, and high-speed serial transceivers (in LXT variants). The -3 speed grade provides a maximum internal frequency of 500 MHz, as noted in the datasheet, enabling high-throughput designs. The device is RoHS compliant and lead-free, meeting modern environmental standards. Typical applications for the XC6SLX25-3FGG484I include industrial automation, telecommunications infrastructure, automotive electronics, and video/image processing. Its combination of logic density, I/O count, and low power consumption makes it suitable for bridging, protocol conversion, and real-time control tasks. When designing with this FPGA, careful attention must be paid to power supply decoupling and PCB layout to ensure signal integrity at high speeds. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and proper sequencing during power-up. Refer to the Spartan-6 FPGA datasheet and PCB design guidelines for detailed recommendations.

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XC6SLX25-3FT256C - 24,051-Cell Spartan-6 LX FPGA | AMD
XC6SLX25-3FT256C

XC6SLX25-3FT256C - 24,051-Cell Spartan-6 LX FPGA | AMD

The Xilinx XC6SLX25-3FT256C is a Spartan-6 LX field-programmable gate array with 24,051 logic elements, 186 I/O, a 1.2 V core supply, and a 256-pin FTBGA package. Built with 45 nm CMOS technology, this FPGA combines 3,758 adaptive logic modules, 1,879 configurable logic blocks, and 936 kbit of embedded memory in a compact 17 x 17 mm package. The -3 designation identifies the device performance grade, while the 256 suffix identifies the 256-ball package configuration. A field-programmable gate array is a semiconductor whose digital logic, interconnect, and I/O behavior are configured after manufacture. The Spartan-6 LX FPGA family belongs to the broader FPGA hierarchy, which sits between fixed-function logic ICs and programmable ASICs. It combines hardware parallelism, field-updatable configuration, and deterministic control capabilities for systems requiring custom logic, interface adaptation, or signal processing. The verified device data identifies 3,758 adaptive logic modules, 1,879 configurable logic blocks, 936 kbit of embedded memory, and 186 I/O. Its 45 nm CMOS implementation operates from a 1.2 V core, making it appropriate for compact embedded systems where power, board area, and computational throughput must be balanced. The Spartan-6 architecture also supports programmable logic blocks, block RAM, digital signal processing resources, and dedicated input/output functions, although individual resource counts beyond those published here require confirmation in the manufacturer documentation. The XC6SLX25 device is positioned between smaller Spartan-6 LX members and larger LX fabrics. Compared with the XC6SLX9, it provides substantially more configurable logic and embedded memory, making it suitable for multi-channel control, protocol bridging, and parallel data processing. The verified XC6SLX25 comparison data also lists a 667 MHz performance figure, but the exact relationship between that figure and the -3 speed suffix should be confirmed against the applicable AMD/Xilinx device documentation for the intended design. Typical uses include industrial automation, communications equipment, embedded control, video and image processing, sensor acquisition, and compact embedded platforms. The 186 I/O provide substantial board-level connectivity, while the 936 kbit of embedded memory can support buffering, packet handling, and control functions without relying entirely on external memory. These resources make the device useful for designs combining a processor or microcontroller with dedicated high-speed or parallel logic. Designers should use the official Spartan-6 package pinout and power-guidance documents rather than inferring BGA connectivity from a generic package drawing. PCB layout must provide the specified core and I/O supplies, decoupling, clocking, configuration storage, and exposed-pad thermal treatment. Because the supplied data does not contain the complete 256-ball pinout or recommended operating ranges, those details remain data-needed rather than being inferred. This product page consolidates the verified 24,051-cell, 1.2 V, 45 nm, 256-pin device attributes, current distributor pricing, same-family drop-in candidates, and practical replacement guidance. It provides engineering context that is not available from a distributor inventory listing alone, while clearly separating verified facts from documentation that still requires confirmation.

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XC6SLX25-3FT256I - 24,051-Cell Spartan-6 LX FPGA | AMD
XC6SLX25-3FT256I

XC6SLX25-3FT256I - 24,051-Cell Spartan-6 LX FPGA | AMD

AMD XC6SLX25-3FT256I is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 1,879 configurable logic blocks, 186 I/O, and a maximum internal frequency of 500 MHz, housed in a 256-ball lead-free LBGA package measuring 17 x 17 mm. It uses 45 nm CMOS technology and operates from a 1.2 V core supply. The -3 speed grade is identified as the highest-performance Spartan-6 LX grade, while the industrial suffix identifies the specified operating-temperature version. A field-programmable gate array is a programmable logic device that converts a digital design into an interconnected array of configurable logic blocks and programmable I/O. In the product hierarchy, an FPGA is a programmable logic semiconductor, a broader category than a fixed-function application-specific integrated circuit. The Spartan-6 LX family balances programmable logic capacity, embedded memory, connectivity, and cost for embedded, industrial, communications, and signal-processing systems. Key features include 24,051 logic cells organized into 1,879 CLBs, 3,758 adaptive logic modules, and 936 kbit of embedded memory according to the comparison data retrieved for this family. The device provides 186 user I/O and uses a 256-ball lead-free package. Its 500 MHz internal-frequency listing, -3 performance grade, 45 nm CMOS construction, and 1.2 V core supply make it suitable for designs requiring substantial parallel processing without moving to a larger FPGA family. The LX device architecture combines programmable logic, block RAM, digital signal processing resources, general-purpose I/O, clock management, and dedicated configuration capabilities. These resources allow designers to implement parallel datapaths, control logic, protocol interfaces, and data acquisition functions in one device. The 24,051-cell capacity also permits more substantial consolidation than small CPLDs, while the 256-ball package provides a defined route for dense, board-level integration. Typical applications include industrial automation, embedded control, communications infrastructure, instrumentation, data acquisition, and digital signal processing. The target part is particularly relevant when a design must combine moderate-to-high logic density with a 256-ball Spartan-6 LX footprint and the -3 speed grade. Designers should also verify power, configuration, memory interface, and pin constraints against their complete system requirements. A critical design step is to match the exact device variant, package drawing, exposed-pad treatment, and PCB land pattern before production. Configuration storage, clocking, decoupling, signal integrity, and thermal performance must be reviewed against AMD's Spartan-6 documentation. Do not infer full pin compatibility from a shared ball count alone. This page consolidates verified distributor specifications, exact package information, source links, and drop-in alternatives with engineering-oriented selection guidance. It also distinguishes documented facts from parameters that require confirmation, providing a more practical basis for procurement and hardware planning than a distributor listing alone.

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XC6SLX25-3FTG256C - 24,051-LE Spartan-6 FPGA | AMD
XC6SLX25-3FTG256C

XC6SLX25-3FTG256C - 24,051-LE Spartan-6 FPGA | AMD

The AMD XC6SLX25-3FTG256C is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 3,758 adaptive logic modules, 936 kbit of embedded memory, and 186 I/Os in a 256-LBGA FT-style package. The -3 speed grade supports a 0°C to 85°C commercial operating-temperature range. It combines programmable digital logic, configurable I/O, block RAM, and digital signal processing resources on one device. A field-programmable gate array is a semiconductor whose digital functionality is defined after fabrication. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable interconnect, memory, and I/O resources. This makes the Spartan-6 LX device useful when a design requires hardware parallelism, reconfigurable interfaces, rapid prototyping, or later field updates without changing the printed circuit board. The XC6SLX25-3FTG256C provides 24,051 logic cells and 3,758 adaptive logic modules, giving a design substantial combinational and sequential logic capacity. Its 936 kbit of embedded memory supports buffering, packet storage, data acquisition, and general-purpose digital functions. The 186 available I/Os support external interfaces and system integration, while the -3 speed grade provides a defined performance class for industrial and commercial designs operating between 0°C and 85°C. Spartan-6 LX devices use 6-input adaptive logic modules and a programmable interconnect architecture. Depending on the implementation, designers can use the logic fabric for control, interfaces, protocol handling, and parallel processing, while block RAM provides dedicated storage resources. Configuration and programming details should be reviewed in the manufacturer Spartan-6 documentation before selecting I/O standards, clocking resources, or power-management settings. Typical applications include industrial control and automation, communication equipment, test and measurement, embedded video processing, data acquisition, and embedded systems that benefit from hardware parallelism. The combination of 24,051 logic cells, 936 kbit of embedded memory, and 186 I/Os makes the device appropriate for controllers that must combine multiple fixed-function blocks in one programmable component. The main PCB-design consideration is the 256-ball BGA footprint and its demanding escape-routing requirements. Follow the AMD Spartan-6 package pinout files, recommended PCB stack-up, and decoupling guidance when assigning power and ground balls. Validate the design for the intended -3 speed grade, I/O standards, clock topology, configuration interface, and operating-temperature range before release. This product page consolidates the exact XC6SLX25-3FTG256C configuration, pin-compatible Spartan-6 LX options, application guidance, and design considerations into an engineering-oriented reference for FPGA architecture planning and PCB implementation.

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XC6SLX25-3FTG256I - 24K Spartan-6 LX FPGA | AMD
XC6SLX25-3FTG256I

XC6SLX25-3FTG256I - 24K Spartan-6 LX FPGA | AMD

The AMD XC6SLX25-3FTG256I is a Spartan-6 LX field-programmable gate array with 24,051 logic elements, 186 I/Os, a 500 MHz internal frequency, and a 256-LBGA package. It operates from 0°C to 85°C and uses 45 nm CMOS technology. The -3 speed grade provides the highest performance among the Spartan-6 LX -3, -3N, and -1L options identified for the family. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and I/O behavior can be configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, block RAM, programmable I/O, clocking resources, and dedicated fabric interconnect. Compared with application-specific standard products, an FPGA permits hardware revisions and functional adaptation without changing the physical PCB. The Spartan-6 LX device provides 24,051 logic elements organized as 3,758 adaptive logic modules, together with 936 Kbit of embedded memory. Its 186 user I/Os support connections to external memory, communications transceivers, sensors, displays, and general-purpose control logic. The programmable architecture is useful for parallel data acquisition, protocol conversion, image processing, embedded control, and configurable interface systems where parallel hardware implementation can reduce system complexity. The XC6SLX25-3FTG256I uses 45 nm CMOS fabrication and is identified as operating from 1.2 V in the family comparison material. Its programmable logic fabric supports parallel processing, state-machine implementation, data filtering, and fixed-function accelerator designs. The -3 designation identifies a higher-performance speed grade, while FTG256 identifies the package configuration used by this ordering code. Typical applications include industrial control and automation, communications infrastructure, test and measurement equipment, video and image processing, embedded storage systems, and sensor-processing platforms. A design can use internal block RAM for buffering, programmable I/O for external interfaces, and dedicated clock resources for synchronizing data across parallel processing paths. PCB implementation requires careful attention to the fine-pitch BGA footprint, power and ground distribution, decoupling, and high-speed routing. Use the AMD Spartan-6 package pinout files to assign every ball, verify voltage domains, and confirm boundary-scan or configuration access requirements before releasing the PCB layout. This product page combines device specifications, package details, lifecycle and sourcing information, compatible alternatives, comparison parameters, and practical FPGA design guidance. It is intended to help engineers identify the correct Spartan-6 LX device and plan a controlled, pin-compatible redesign without relying on incomplete distributor summaries.

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XC6SLX25-N3CSG324C - Spartan-6 FPGA, 24051 Cells | AMD
XC6SLX25-N3CSG324C

XC6SLX25-N3CSG324C - Spartan-6 FPGA, 24051 Cells | AMD

The AMD XC6SLX25-N3CSG324C is a member of the Spartan-6 LX family of Field Programmable Gate Arrays (FPGAs), designed for high-volume, cost-sensitive applications that require leading system integration capabilities. This device features 24,051 logic cells, 226 user I/O pins, and 958,464 total RAM bits, all housed in a 324-ball CSBGA (Chip-Scale Ball Grid Array) package. Operating from a 1.2V core supply, the XC6SLX25-N3CSG324C is fabricated using a 45nm process technology, balancing performance with power efficiency. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be programmed after manufacturing to implement any digital logic function. FPGAs consist of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks, allowing designers to create custom hardware without the cost and lead time of ASIC development. The Spartan-6 family sits within the broader FPGA hierarchy, positioned as a cost-optimized line below the higher-performance Virtex and Kintex families, making it ideal for applications where price and power are critical. Key features of the XC6SLX25-N3CSG324C include 1,879 CLBs, 38 DSP48A1 slices for digital signal processing, and support for a wide range of I/O standards through SelectIO technology. The device also includes enhanced mixed-mode clock management (MMCM) blocks for precise clock generation, and supports configuration via JTAG, SPI, and BPI interfaces. With a junction temperature range of 0°C to 85°C, this commercial-grade FPGA is suitable for typical industrial and consumer environments. The Spartan-6 architecture incorporates advanced power management modes, including suspend and hibernate states, to reduce static power consumption. The 45nm process technology enables high logic density while maintaining low dynamic power, making the XC6SLX25-N3CSG324C an energy-efficient choice for battery-powered or thermally constrained designs. Additionally, the device supports AES bitstream encryption and Device DNA protection for enhanced IP security. Typical applications for the XC6SLX25-N3CSG324C include motor control, industrial networking, video processing, and software-defined radio. Its 226 I/O pins and 324-ball package provide ample connectivity for interfacing with sensors, ADCs, DACs, and communication transceivers. The FPGA's reconfigurability allows for rapid prototyping and field updates, reducing time-to-market. When designing with this FPGA, careful attention must be paid to power supply decoupling and PCB layout to ensure signal integrity at high I/O speeds. The device requires a 1.2V core supply and 2.5V/3.3V auxiliary supplies, with proper sequencing as specified in the datasheet. Thermal management is also important, as the CSBGA package has a thermal resistance that must be considered for high-utilization designs.

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XC6SLX25-N3FG484C - 24,051-Cell Spartan-6 LX FPGA | AMD
XC6SLX25-N3FG484C

XC6SLX25-N3FG484C - 24,051-Cell Spartan-6 LX FPGA | AMD

AMD XC6SLX25-N3FG484C is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 1,879 logic blocks, 958,464 RAM bits, and 266 programmable I/O pins in a 484-pin FBGA package. The device uses 45 nm fabrication technology and operates from a 1.14 V to 1.26 V internal core supply, while its commercial temperature range extends from 0°C to 85°C junction temperature. These characteristics place it in the FPGA & CPLD category as a configurable semiconductor for parallel processing, control, interface, and embedded-logic systems. A field-programmable gate array is a programmable-logic device whose configurable logic blocks, block RAM, programmable I/O, and dedicated resources can be configured after manufacture. An FPGA sits above simple fixed-function logic in the product hierarchy: fixed-function controllers and discrete logic provide predetermined behavior, while an FPGA supports reconfigurable hardware, parallel data paths, adaptable interfaces, and product updates without changing the PCB. The Spartan-6 LX architecture therefore serves as a programmable-logic platform rather than a conventional microcontroller. The XC6SLX25 combines 24,051 programmable logic cells with 266 I/O and 958,464 RAM bits, creating a useful balance between computation and interface capacity. Its 45 nm process technology supports a compact, power-efficient implementation for embedded control, industrial automation, communications, instrumentation, and consumer equipment. The 484-pin FBGA package also provides enough physical connections for wide external data buses, multiple memory interfaces, clocks, and control signals. The -N3FG484C ordering code identifies a Spartan-6 LX resource configuration in the 484-pin FBGA package, while the final C suffix identifies the commercial temperature option. The commercial-grade junction-temperature specification of 0°C to 85°C suits designs operating in controlled indoor, laboratory, telecom, and industrial enclosure environments. Designers must still verify board-level airflow, local heat spreading, and the maximum ambient temperature permitted by the complete system. Typical applications include industrial control and data acquisition, embedded communications gateways, test and measurement instruments, video and image processing, motor-control supervisory logic, and general-purpose accelerator boards. The FPGA can implement parallel algorithms, state machines, protocol conversion, sensor aggregation, and memory-control functions in one device. Designs that require deterministic timing can use dedicated clocking and I/O resources while assigning repetitive operations to configurable logic blocks. The main design consideration is package complexity. A 484-pin FBGA demands careful escape routing, via planning, power-plane integrity, and assembly capability. Follow the AMD Spartan-6 package pinout files for ball assignments and PCB escape geometry. Place decoupling capacitance near the relevant supply balls, keep sensitive clock and configuration paths short, and verify the selected memory interface, I/O standards, clocking topology, and thermal conditions with the manufacturer datasheet and design-tool guidance.

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XC6SLX25T-2FG484C - Spartan-6 LXT 24K FPGA | AMD
XC6SLX25T-2FG484C

XC6SLX25T-2FG484C - Spartan-6 LXT 24K FPGA | AMD

The AMD/Xilinx XC6SLX25T-2FG484C is a Spartan-6 LXT field-programmable gate array built on 45 nm CMOS technology, with 24,051 logic cells, a listed internal frequency of 500 MHz, and a 484-pin FBGA package. The -2 suffix identifies the performance grade, while FG484C identifies the commercial-temperature, lead-free 15 x 15 mm package configuration. An FPGA is a programmable semiconductor containing configurable logic blocks, programmable interconnect, memory resources, and input/output blocks. This device belongs to the hierarchy FPGA, programmable logic device, digital semiconductor, and integrated circuit. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured for logic, control, signal processing, communications, or embedded systems, making it useful when product requirements evolve late in development. The Spartan-6 LXT family combines a 45 nm process with configurable logic, block RAM, digital signal processing resources, and high-speed serial transceivers. The XC6SLX25T provides 24,051 logic cells and a listed internal frequency of 500 MHz. Its 484-pin FBGA package supports dense PCB routing, while the lead-free package configuration supports RoHS-oriented product development. The commercial operating-temperature range is 0 to 85 C. The -2 performance grade provides a balanced operating point for designs requiring more timing margin than the -1 grade but not the highest performance of the -3 grade. This distinction matters in clocked interfaces, DSP pipelines, and control systems: designers should use the published timing constraints and speed-grade-specific characteristics when defining clock periods, I/O standards, and implementation targets rather than assuming identical timing across grades. Typical uses include industrial automation, video and image processing, communications infrastructure, instrumentation, embedded control, and parallel data acquisition. The combination of 24,051 logic cells and dedicated FPGA resources allows designers to implement multiple control channels, protocol interfaces, filtering, and state machines in one device. A high-speed serial transceiver is particularly useful where the design must connect to serial links rather than only conventional parallel I/O. PCB implementation requires careful power planning, decoupling, clocking, and signal-integrity control. Follow the AMD Spartan-6 package pinout files and device documentation when assigning every 484 ball, especially power, ground, configuration, clock, and transceiver pins. Validate the selected I/O standard, voltage, pull-up or pull-down requirement, bank voltage, and external component recommendations before releasing the layout. This page combines package, logic-cell, speed, temperature, and interface information with practical selection guidance. It also distinguishes speed-grade and temperature-grade alternatives that share the target footprint, helping engineers identify a valid replacement without confusing package identity, performance class, or device functionality.

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XC6SLX25T-2FG484I - 24,051-Cell FPGA | AMD/Xilinx
XC6SLX25T-2FG484I

XC6SLX25T-2FG484I - 24,051-Cell FPGA | AMD/Xilinx

The AMD/Xilinx XC6SLX25T-2FG484I is a Spartan-6 LXT field-programmable gate array with 24,051 logic cells, up to 250 I/O, and a 500 MHz internal frequency, housed in a 484-ball FBGA package. The -2 speed grade supports performance-oriented designs, while the I suffix denotes the industrial-temperature option. A field-programmable gate array is a semiconductor device whose digital logic, interfaces, and signal-processing blocks are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, where configurable logic blocks, programmable I/O, embedded memory, DSP resources, and clock-management circuits implement control, networking, image-processing, and interface functions without requiring a custom ASIC mask set. The XC6SLX25T family combines 24,051 logic cells with as many as 250 user I/O in a 23 mm by 23 mm, 1.0 mm-pitch FBGA package. Its 500 MHz internal-frequency figure indicates the device's stated internal operating range, while actual interface and design performance also depends on the selected clocking resources, I/O standards, speed grade, and external timing constraints. The -2 speed designation places this device in the Spartan-6 performance range identified by AMD as one of the family's available grades. The T suffix identifies the Spartan-6 LXT family, and the FG484 package designation denotes the 484-ball surface-mount configuration. These suffix meanings should be confirmed against the AMD package and ordering documentation before a new PCB or procurement decision. Typical applications include industrial control, video display bridges, embedded processing interfaces, network equipment, test systems, and general-purpose programmable logic. The combination of substantial logic capacity and a large I/O count makes the device useful for designs joining multiple interfaces, clock domains, memory resources, and real-time datapaths on one FPGA. Design planning should begin with the AMD package pinout and Spartan-6 family documentation. Verify differential pairs, supply pins, configuration pins, clock-capable pins, and exposed thermal requirements against the exact -2 industrial ordering code. Use the manufacturer's package files to generate PCB land patterns and bonding constraints rather than relying on generic BGA dimensions. This product record combines package, logic-capacity, temperature, speed-grade, and application information with a practical comparison of pin-compatible Spartan-6 options. It also highlights the electrical, thermal, and lifecycle checks required before using a mature FPGA family in a new industrial design.

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XC6SLX25T-3FG484I - 24,051-Cell Spartan-6 LXT FPGA | AMD
XC6SLX25T-3FG484I

XC6SLX25T-3FG484I - 24,051-Cell Spartan-6 LXT FPGA | AMD

AMD XC6SLX25T-3FG484I is a Spartan-6 LXT field-programmable gate array with 24,051 logic cells, 250 I/O, a 500 MHz internal frequency, and a 1.2 V core supply in a 15 x 15 mm lead-free FBGA package. The -3 speed grade provides the highest performance among the listed Spartan-6 LX speed grades, while the I suffix identifies the industrial-temperature ordering option. An FPGA is a programmable semiconductor in which configurable logic blocks, memory, and I/O resources are interconnected by programmable routing. A field-programmable gate array therefore sits within the broader semiconductor hierarchy, but unlike a fixed-function application-specific integrated circuit, its behavior can be changed by loading a bitstream after manufacturing. The Spartan-6 LXT family is positioned for cost-sensitive designs requiring moderate logic density, embedded memory, and high-speed serial connectivity. The XC6SLX25T-3FG484I provides 24,051 logic cells, 958,464 bits of distributed memory, and 250 I/O in the ordering identified by the product listing. Its 500 MHz internal frequency supports clocked digital logic, interface bridging, control processing, and signal-generation systems. The -3 designation selects the highest-performance Spartan-6 LX speed option listed in the product documentation, making this device useful when timing margin is more important than minimizing unit cost. The device combines programmable logic, dedicated block RAM, digital signal processing resources, programmable I/O standards, and serial transceivers in one package. Its 1.2 V core operation and 500 MHz internal clock support modern FPGA timing architectures, while the 250 available I/O allow external memory, data converters, communications links, and control peripherals to be connected without adding a separate programmable device. Typical applications include industrial control, instrumentation, test and measurement, embedded video, communications infrastructure, and high-speed interface aggregation. The Spartan-6 LXT architecture is especially appropriate when moderate logic capacity must coexist with high-speed serial links and enough parallel I/O for external control or data-acquisition circuitry. The most important design consideration is package and pinout verification. Published listings identify the physical package as a 15 x 15 mm, 0.80 mm-pitch lead-free FBGA, while one specification source reports 324 pins despite naming the 484-BBGA configuration. Use the official AMD Spartan-6 package pinout file before assigning power, ground, configuration, clock, and user I/O connections. This product summary consolidates the ordering information, resource quantities, package characteristics, available drop-in candidates, and PCB implementation considerations needed to evaluate the XC6SLX25T-3FG484I before beginning a hardware design.

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XC6SLX4-2CPG196C - 3,840-Cell Spartan-6 FPGA | AMD
XC6SLX4-2CPG196C

XC6SLX4-2CPG196C - 3,840-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX4-2CPG196C is a Spartan-6 LX field-programmable gate array with 3,840 logic cells, 106 I/O, 196 CSBGA balls, and 45 nm CMOS technology in a 1.2 V device. It is packaged as a 196-TFBGA/CSBGA and is identified by the -2 speed grade and C commercial temperature designation. The device also provides 221,184 registers and 216 Kb block RAM according to the verified product search data. A field-programmable gate array, or FPGA, is a programmable digital semiconductor in which logic, memory, and I/O behavior are configured through a bitstream after manufacture. The Spartan-6 LX FPGA family is intended for compact embedded systems requiring deterministic parallel logic, programmable I/O, and moderate on-chip memory. The XC6SLX4-2CPG196C therefore sits between fixed-function logic and higher-capacity programmable-logic devices. The verified data identifies the part as a Spartan-6 LX FPGA with 106 I/O, 3,840 logic cells, 196-CSBGA packaging, 1.2 V operation, and 45 nm CMOS technology. The device also includes 8 DSP slices and up to 3.2 Gbps transceiver performance in the supplied comparison source. These characteristics make it suitable for embedded control, industrial automation, communications, instrumentation, and compact signal-processing designs. The -2 suffix is a speed-grade designation, while the C suffix identifies the commercial temperature option according to the part naming convention reflected in the search results. The 196-CSBGA package provides a high ball count for dense I/O and power distribution, but it requires careful PCB layout, via-in-pad or escape routing strategies, and thermal planning. Configuration, programming, and tool support must be checked against the selected system design before releasing a production layout. For new designs, engineers should verify the complete pinout, supported I/O standards, configuration requirements, and power-supply sequencing in the manufacturer datasheet. The BGA package makes fanout and assembly inspection more demanding than a leaded package, so PCB fabrication and assembly capability should be confirmed early. This page consolidates verified distributor results, a real part price observation, package information, and design-oriented selection guidance. It does not infer missing electrical limits, timing values, lifecycle guarantees, or compliance claims that were not present in the supplied data.

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