XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx
部品番号: XC6SLX25-3FG484C ✓ 生産中XC6SLX25-3FG484C 概要
A field-programmable gate array, or FPGA, is a programmable logic device that combines configurable logic, programmable I/O, and dedicated processing resources on one semiconductor die. FPGAs occupy the programmable-logic hierarchy between fixed-function logic ICs and higher-end adaptive computing devices. They allow hardware functions to be revised through configuration bitstreams rather than redesigning a custom ASIC, reducing prototype cycles and supporting field upgrades.
The XC6SLX25-3FG484C provides 24,051 logic cells and 1,879 configurable logic blocks, according to the indexed Spartan-6 comparison data. Its 500 MHz internal-frequency listing makes it suitable for parallel logic, state-machine, control, interface, and signal-processing designs that require deterministic hardware operation. The 484-BBGA package also exposes substantially more connection options than a small quad-flat package.
The device combines configurable logic with DSP48 processing resources and dedicated block RAM for filtering, transforms, communications encoding, and other data-intensive functions. Its 45 nm CMOS implementation and 1.2 V core voltage place it in the Spartan-6 generation designed to balance programmable logic capacity, I/O connectivity, power efficiency, and cost for cost-sensitive, high-volume equipment.
Typical uses include industrial automation and control, video-processing pipelines, communications infrastructure, instrumentation, embedded systems, and interface consolidation. The 24,051-cell Spartan-6 LX device is particularly appropriate when parallel datapath logic, moderate DSP requirements, and extensive package I/O are needed without moving immediately to a larger FPGA or developing a custom ASIC.
Design planning must account for the BGA escape routing, decoupling, clock integrity, configuration memory, and thermal performance of a 484-ball package. Although the indexed operating-temperature range is 0 to 85 °C, thermal design should be evaluated for the actual board, enclosure, airflow, and activity level rather than relying only on the commercial temperature designation.
This product record combines verified distributor availability, exact package and device identifiers, Spartan-6 family specifications, drop-in same-package comparisons, and procurement-oriented guidance. It distinguishes confirmed data from unavailable numeric pricing, pin-by-pin mapping, and detailed power characteristics so engineers can make sourcing and design decisions without relying on inferred values.
ドロップイン代替品: XC6SLX25-3FG484C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC6SLX25-3FG484C （同一形状・フットプリント） — 相違点: Logic Cells, Package, Process Technology, Speed Grade.
XC6SLX25-N3FG484C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX25-3FGG484C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX25-3FGG484I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX25-2FGG484C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX25-2FG484C
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX25-3FG484C 最大定格＆電気的特性
| Device Type | FPGA |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 24,051 cells |
| Configurable Logic Blocks | 1,879 CLBs |
| Internal Frequency | 500 MHz |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -3 |
| 動作温度 | 0 °C to 85 °C |
| パッケージ | 484-BBGA, 15 x 15 mm, 0.80 mm pitch |
| Package Classification | Lead-free CSBGA-324 |
| Metal Balls | 266 balls |
| Package Reference | MO-275 |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
XC6SLX25-3FG484C mo-275 ピン配置ガイド
XC6SLX25-3FG484C (mo-275 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC6SLX25-3FG484C.
詳細は データシート をご参照ください。
主な用途
XC6SLX25-3FG484C の用途: 6 件s: Industrial Automation and Control, Video and Image Processing, Communications and Interface Consolidation, Embedded Instrumentation, Signal Processing and Filtering, Power-Supply Control and Monitoring.
Industrial Automation and Control
XC6SLX25-3FG484C fits factory-control, sequencing, and machine-interlock systems that benefit from 24,051 logic cells and parallel hardware execution. Its indexed 500 MHz internal frequency supports demanding control pipelines without using a microcontroller for every timing-critical decision. The 484-BBGA package also provides extensive I/O connectivity for sensors, actuators, counters, and communications. According to the AMD Spartan-6 family information, the device provides DSP48 and block-RAM resources that can implement filtering or protocol acceleration alongside control logic. Designers should validate the -3 timing margin and the device's indexed 0 °C to 85 °C operating range against the enclosure temperature.
おすすめ
Video and Image Processing
XC6SLX25-3FG484C is appropriate for parallel video pipelines, pixel transformations, test-pattern generation, and embedded image-processing functions. The 24,051-cell Spartan-6 LX resource pool allows multiple pipeline stages to operate concurrently, while the dedicated DSP and block-RAM resources can accelerate filtering and buffering. Its 500 MHz listed internal frequency provides a useful basis for high-speed datapath design. According to the indexed AMD family information, the -3 grade is the highest-performance Spartan-6 LX option. The engineering trade-off is routing complexity: a 15 x 15 mm, 0.80 mm-pitch BGA requires careful escape routing, layer transitions, and high-speed signal-integrity validation.
おすすめ
Communications and Interface Consolidation
XC6SLX25-3FG484C can consolidate serial interfaces, packet formatting, buffers, and protocol state machines into one programmable Spartan-6 LX device. Its 24,051 logic cells and 1,879 configurable logic blocks allow multiple channels to be processed in parallel, while block RAM supports buffering and frame organization. The listed 500 MHz internal frequency is useful for high-throughput datapaths, and the 484-BBGA package offers more I/O than smaller devices. According to AMD's indexed family materials, DSP48 resources can also support filtering or modulation functions. Designers must verify every high-speed interface's timing, I/O standard, impedance, and pin assignment using the official package files before release.
おすすめ
Embedded Instrumentation
XC6SLX25-3FG484C suits configurable measurement, timing, waveform, and signal-conditioning logic in laboratory or embedded instrumentation. The 24,051 logic cells permit acquisition pipelines, control sequencing, calibration tables, and communications to coexist in one device. Its indexed 500 MHz internal frequency supports parallel sampling and filtering arrangements, while dedicated DSP and RAM resources improve implementation efficiency. According to the supplied AMD family information, the -3 speed grade provides the highest available Spartan-6 LX performance. For a 484-BBGA implementation, engineers should plan stable references, low-noise power distribution, thermal monitoring, and carefully controlled clock routing to preserve measurement quality.
おすすめ
Signal Processing and Filtering
XC6SLX25-3FG484C is well matched to FIR filters, moving averages, waveform conditioning, and fixed-function signal-processing accelerators. The 24,051 logic cells provide parallel multiplier-add and control resources, while the Spartan-6 LX DSP48 blocks and block RAM improve throughput without relying entirely on general-purpose LUT logic. According to the indexed AMD documentation, the device's listed 500 MHz internal frequency and -3 speed grade support demanding sequential processing. A practical design must still map the required multipliers, memories, and I/O into the available resources and check timing after placement and routing. Differential clocks and high-speed data interfaces require controlled impedance, return paths, and BGA escape geometry.
おすすめ
Power-Supply Control and Monitoring
XC6SLX25-3FG484C can implement supervisory sequencing, fault detection, load sharing, telemetry, and power-good logic for embedded power systems. Its 24,051-cell capacity provides more parallelism than required for simple sequencing, leaving room for communication, data logging, and redundant checks. The 500 MHz listed internal frequency permits fast control-loop processing, and the 484-BBGA package offers enough connections for multiple rails and status signals. According to the AMD Spartan-6 family information indexed in the supplied data, the device also supports DSP and RAM resources for monitoring algorithms. Designers must separate sensitive analog measurement paths from switching nodes and confirm all timing against the -3 speed-grade constraints.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC6SLX25-3FG484C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC6SLX25-N3FG484C | XC6SLX25-3FGG484C | XC6SLX25-3FGG484I | XC6SLX25-2FGG484C | XC6SLX25-2FG484C |
|---|---|---|---|---|---|---|
| Package | 484-BBGA, 15 x 15 mm | 484-BBGA, 15 x 15 mm - same package | 484-BBGA, 15 x 15 mm - same package | 484-BBGA, 15 x 15 mm - same package | 484-BBGA, 15 x 15 mm - same package | 484-BBGA, 15 x 15 mm - same package |
| Brand | Advanced Micro Devices, Inc. | Advanced Micro Devices, Inc. | Advanced Micro Devices, Inc. | Advanced Micro Devices, Inc. | Advanced Micro Devices, Inc. | Advanced Micro Devices, Inc. |
| Logic Cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells |
| Speed Grade | -3 | -3N | -3 | -3 | -2 | -2 |
主な差別化要因
- Highest-performance speed grade among the indexed same-package alternatives （vs XC6SLX25-2FG484C)
- Full 24,051-cell density retained in a direct same-package family comparison （vs XC6SLX25-3CSG324C)
- Commercial -3 grade with a 500 MHz listed internal frequency （vs XC6SLX25-2FGG484C)
- Same-family logic density and ball count in the closest indexed cross-reference （vs XC6SLX25-N3FG484C)
設計ノート
Plan the 484-BBGA layout around the verified 15 x 15 mm body and 0.80 mm ball pitch. Use the official AMD package file to establish every ball location, and route high-speed signals through short, referenced escape paths where possible. The package data identifies both a 484-BBGA ordering designation and 266 metal balls, so the approved device and package drawings must be checked before defining pads or starting a PCB revision.
Do not assume that the listed 1.2 V core voltage is the complete board power requirement. The supplied data does not include auxiliary rail voltages, quiescent current, or current per I/O bank. Obtain those values from the manufacturer documentation, then create a power budget covering the FPGA core, configuration circuitry, external memories, I/O loads, and regulators. Add local bulk and high-frequency decoupling only after confirming the official values and layout guidance.
Treat clocks, configuration interfaces, and high-speed I/O as separate signal-integrity problems. The verified data confirms a 500 MHz internal-frequency listing but does not specify every external interface timing limit. Use length matching where required, preserve continuous reference planes, avoid split planes under escape routes, and validate edge rates with actual models. Post-layout timing analysis should include placement, routing, and realistic I/O loading rather than relying on the nominal internal frequency alone.
Begin thermal analysis with the verified commercial operating range of 0 °C to 85 °C, then calculate actual junction temperature from the selected FPGA activity, board construction, airflow, and surrounding components. The supplied data does not contain theta-JA, theta-JC, maximum power, or derating curves, so no numerical junction-temperature claim is made here. Use the official power and thermal tables and preserve thermal paths from the BGA through the PCB stack-up.
コンプライアンス情報
RoHS and REACH compliance are referenced by the indexed AMD certification information, and the package is described as lead-free. No verified AEC-Q100 qualification, halogen-free declaration, or conflict-minerals report was supplied for this exact orderable MPN.
