集積回路

サブカテゴリ

📁 ADC/DAC 3,100+ 製品 📁 アンプIC 1,900+ 製品 📁 オーディオコーデック 18 製品 📁 オーディオIC 2 製品 📁 クロック＆タイミング 670+ 製品 📁 Comparator ICs 1 製品 📁 DSP 1,100+ 製品 📁 データ収集IC 2 製品 📁 デジタルポテンショメータ 4 製品 📁 ディスプレイドライバ＆コントローラ 1 製品 📁 FPGA & CPLD 7,300+ 製品 📁 インターフェースIC 3,400+ 製品 📁 LEDドライバ 1 製品 📁 ロジックIC 460+ 製品 📁 メモリIC 870+ 製品 📁 マイクロコントローラ 20,000+ 製品 📁 マイクロプロセッサ 4 製品 📁 モータドライバ 1 製品 📁 その他 1 製品 📁 Sensor and Detector Interfaces 1 製品 📁 専用IC 15 製品 📁 ビデオIC 14 製品

製品 (39,000+)

EP2A40F33I-8 - APEX II FPGA, 1.5M gates, 672 IO, F33 BGA
EP2A40F33I-8

EP2A40F33I-8 - APEX II FPGA, 1.5M gates, 672 IO, F33 BGA

The Altera (now Intel) EP2A40F33I-8 is a high-density APEX II family Field-Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA (F33) package with speed grade -8 and industrial temperature rating. Built on a 0.18 µm SRAM-look-up-table architecture with embedded MultiCore Interconnect (MCI), the device delivers up to 1,500,000 typical gates, 40,960 logic elements (LEs), and 425,984 bits of embedded system memory for high-performance programmable logic designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. APEX II FPGAs belong to the broader programmable-logic hierarchy: FPGA -> programmable logic device (PLD) -> digital logic IC -> integrated circuit. They differ from CPLDs (Complex Programmable Logic Devices) by offering higher logic density, distributed RAM, dedicated DSP blocks, and high-speed I/O, making them the platform of choice for parallel datapath and high-bandwidth designs. Key features include four phase-locked loops (PLUs), four high-speed clock networks, support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, HSTL, LVDS, LVPECL), and 16 high-speed clock pins. Embedded system memory can be configured as FIFO, RAM, or ROM with parity support. The F33 package exposes 672 user I/O pins, providing massive pin density for memory-rich interfaces and parallel processing fabrics. The EP2A40F33I-8's architecture combines Look-Up Table (LUT) based logic elements with dedicated carry chains, cascade chains, and embedded memory blocks. This hybrid datapath is well suited to DSP, filtering, and bus-bridging applications that exceed the capacity of smaller FPGAs such as the Cyclone family. Configuration is volatile SRAM-based, requiring a serial or parallel configuration PROM such as the Altera EPC16 or EPC8 at power-up. Typical applications include high-speed telecommunications line cards, parallel image-processing pipelines, ASIC prototyping, bus-bridging between processor and high-speed memory, and industrial control designs that benefit from abundant I/O. Designers commonly pair the EP2A40F33I-8 with Altera Quartus II design software for synthesis, place-and-route, and timing analysis. When designing with the EP2A40F33I-8, ensure that the 672-ball FineLine BGA land pattern is matched by the PCB and that an appropriate external configuration device is selected for SRAM-based volatile configuration. Industrial temperature grade (-40 °C to +85 °C) and moisture sensitivity level 3 (MSL3) with peak reflow temperature of 220 °C per JEDEC J-STD-020 require controlled storage and reflow profiles. This page synthesizes verified distributor pricing, drop-in same-brand variants from the same Altera APEX II family, and practical PCB-layout and configuration-design notes that complement - rather than duplicate - the official Altera APEX II datasheet.

見積もり お問い合わせ
EP2A40F33I-9 - APEX II FPGA 1.5M gates 33-FBGA | Altera
EP2A40F33I-9

EP2A40F33I-9 - APEX II FPGA 1.5M gates 33-FBGA | Altera

The Altera (Intel) EP2A40F33I-9 is a member of the APEX II family of high-density programmable logic devices, integrating up to 1,500,000 typical gates (or 40,000 logic elements in Altera's marketing terminology for this legacy family) in a 33-ball FineLine BGA package. The "EP2A" prefix denotes the APEX II architecture, "40" the density grade, "F" the FineLine BGA package family, "33" the 33-ball count, "I" the industrial temperature range (-40C to +100C operating), and "-9" the fastest speed grade offered for this device in this package. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit that can be reprogrammed by the customer after manufacture to implement arbitrary digital logic. FPGAs sit hierarchically above CPLDs (Complex Programmable Logic Devices) in density and below ASICs (Application Specific Integrated Circuits) in per-unit cost. The APEX II family, launched in the early 2000s, targets high-performance networking, telecommunications, and DSP applications where designers need hundreds of thousands of logic elements plus embedded memory and high-speed I/O in a single device. The architecture combines look-up-table (LUT) based logic with embedded array blocks (EABs) for memory and DSP functions. Key features of the EP2A40F33I-9 include 1.5M typical gates, embedded system blocks, multi-voltage I/O support (1.5V, 1.8V, 2.5V, 3.3V), and LVDS I/O capability for high-speed chip-to-chip signaling. The FineLine BGA-33 package provides a compact footprint suitable for space-constrained designs while still offering sufficient pin count for the device's signal I/O requirements. The industrial temperature range supports operation in harsh environments including outdoor telecommunications and industrial automation. The APEX II architecture combines LUT-based logic with embedded array blocks providing on-chip memory and dedicated carry chains for arithmetic. MultiVolt I/O allows mixed-voltage interfacing without external level shifters, which simplifies board design when the FPGA bridges legacy 5V peripherals and modern 1.8V cores. The combination of high density and flexible I/O made APEX II popular for protocol bridge, packet processing, and high-speed serial interface designs in the early-to-mid 2000s. Typical applications for this part include telecommunications line cards, industrial control systems, DSP co-processing, custom interface bridging, and legacy ASIC replacement designs. The BGA package is generally chosen where PCB real estate is at a premium and the design can accommodate the reflow and inspection challenges of BGA assembly. When designing with this FPGA, ensure your CAD tool flow supports the APEX II family (Quartus II versions up to v9.0, or third-party legacy flows). Verify BGA pad design follows IPC-7351 guidelines and that your PCB fabrication can achieve the required laser-drilled microvia or via-in-pad stackup for the 0.8 mm ball pitch typical of FineLine BGA packages. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical sourcing notes not found in the manufacturer datasheet, helping engineers evaluate availability and second-source options for this legacy Altera device.

見積もり お問い合わせ
EP2A40F672C6 - APEX II FPGA, 40K LE, 672-pin FBGA | Altera / Intel
EP2A40F672C6

EP2A40F672C6 - APEX II FPGA, 40K LE, 672-pin FBGA | Altera / Intel

The Altera (Intel) EP2A40F672C6 is a member of the APEX II family of programmable logic devices, fabricated on a 0.18-micron CMOS process and packaged in a 672-ball FineLine BGA. It integrates approximately 40,000 typical logic elements (LEs) with embedded system blocks (ESBs) for memory and specialty functions, plus a high-speed interconnect network that targets high-density, high-throughput datapath applications. The 'C6' speed grade designates a commercial-temperature part in the mid-speed tier of the APEX II family. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and I/O cells, all controlled by SRAM-based configuration memory. FPGAs sit at the apex of programmable logic in the taxonomy: programmable logic -> CPLD/FPGA -> logic IC -> integrated circuit. They are widely used for hardware acceleration, custom datapaths, glue logic, prototyping ASICs, and high-speed signal processing where the parallelism and reconfigurability of the silicon deliver orders-of-magnitude performance wins over general-purpose microcontrollers. Key features of the APEX II family include embedded system blocks that can be configured as dual-port RAM, ROM, FIFO, CAM, or multiplier blocks; LVDS and LVTTL I/O support; a dedicated clock network with PLL support; and JTAG-based boundary-scan testing compliant with IEEE 1149.1. The EP2A40F672C6 in particular supports up to 12 high-speed clock networks, embedded array blocks optimized for datapath arithmetic, and a deterministic interconnect fabric aimed at high-utilization designs above 50K system gates. Architecturally, APEX II combines look-up-table-based logic elements with embedded memory/multiplier blocks (MultiCore elements), enabling designers to implement wide datapaths, DSP functions, and packet-processing pipelines in a single device. The FineLine BGA-672 package provides dense, high-pin-count I/O for memory interfaces and multi-gigabit serial or parallel LVDS channels. Typical applications include telecommunications line cards, high-speed packet classification, ASIC prototyping, image and video preprocessing pipelines, and industrial DSP controllers. The wide I/O count also suits memory-heavy designs such as deep FIFO buffers and multi-bank external memory controllers. When designing with the EP2A40F672C6, note that the APEX II family has reached end-of-life and is no longer recommended for new designs. Designers should treat the part as long-term support only and prefer current-generation Intel/Altera FPGA families such as Cyclone IV/V, Arria, or Stratix for new projects, while reserving the EP2A40F672C6 for legacy board drop-in or repair. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers decide whether to source, replace, or redesign around the EP2A40F672C6.

見積もり お問い合わせ
EP2A40F672C6N - APEX II FPGA 40K LE FBGA-672 | Intel
EP2A40F672C6N

EP2A40F672C6N - APEX II FPGA 40K LE FBGA-672 | Intel

The Intel EP2A40F672C6N is a member of the APEX II programmable logic device family, integrating approximately 40,000 logic elements with up to 1,125,000 system gates in a 672-ball FineLine BGA package. As a high-density SRAM-based FPGA, it combines lookup-table based logic, embedded system blocks (ESBs) for dual-port RAM, ROM, and CAM, and dedicated high-speed interconnect (FastTrack) routing. The device operates from a 1.5 V core supply with multiple I/O bank voltages supporting mixed-voltage interfacing across 5 V, 3.3 V, 2.5 V, and 1.8 V standards. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic through configuration of on-chip lookup tables, embedded memory blocks, and routing resources. APEX II sits in the hierarchy between low-density CPLDs and high-end SoC FPGAs, providing high logic density for data-path, DSP, and multi-protocol bridging applications. The EP2A40 is the largest member of the APEX II family, doubling the logic capacity of the EP2A25 while maintaining the same Quartus II design flow. Key features include MultiVolt I/O support for direct interfacing to 1.8 V, 2.5 V, 3.3 V, and 5 V buses without level shifters, dedicated clock management with PLL-based clock tree synthesis, and high-bandwidth embedded memory suitable for FIFO, dual-port RAM, and content-addressable memory. The FastTrack interconnect provides predictable timing across the entire device, simplifying timing closure for wide data buses. The 672-ball FineLine BGA package exposes the maximum number of user I/O for the EP2A40 die, making it suitable for high-pin-count interface aggregation. The APEX II architecture combines four-input look-up tables grouped into Logic Array Blocks (LABs), each LAB containing ten LEs plus local interconnect. ESBs (Embedded System Blocks) provide 2 Kbits of dual-port RAM each and can be cascaded to form wider or deeper memories. The device supports LVTTL, LVCMOS, PCI, GTL+, SSTL, and HSTL I/O standards, with per-pin slew-rate and drive-strength control. Configuration is supported via passive serial, passive parallel synchronous, passive parallel asynchronous, and JTAG modes. Typical applications include high-speed data-path bridging, multi-channel protocol conversion (e.g., SPI to parallel), glue-logic aggregation in ASIC prototypes, telecom line-card backplane interfacing, and industrial imaging pre-processing. The large logic capacity supports soft-core processor implementations such as the Nios embedded processor within the Quartus II tool flow. The wide I/O count enables direct connection to DDR-style memory buses and parallel ADC/DAC interfaces. Designers should verify availability before starting new designs because APEX II is an older-generation family that has been superseded by Cyclone, Arria, and Stratix families. Existing designs typically rely on the Quartus II v5.0 or earlier toolchain for synthesis, place-and-route, and timing analysis. Power estimation should include both static and dynamic components, with thermal management important at high toggle rates. This page synthesizes distributor stock signals, drop-in same-package variants within the APEX II family, and practical design notes not found in a single manufacturer document.

見積もり お問い合わせ
EP2A40F672C7 - APEX II FPGA, 40K LEs, 672-FBGA | Intel / Altera
EP2A40F672C7

EP2A40F672C7 - APEX II FPGA, 40K LEs, 672-FBGA | Intel / Altera

The Intel (formerly Altera) EP2A40F672C7 is a member of the APEX II family of programmable logic devices, manufactured on a 0.15 µm all-layer copper CMOS process. It integrates 38,400 logic elements (1.5 M system gates) and 2,560 macro cells in a 672-ball FineLine BGA package (FC-FBGA, 27 x 27 mm, 1.0 mm pitch). Core voltage is 1.5 V with MultiVolt I/O support, and the device features 1-Gbps True-LVDS, LVPECL, PCML, and HyperTransport interface capability on dedicated high-speed channels. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and dedicated I/O and memory resources. APEX II devices specifically target high-density, high-bandwidth applications by combining look-up-table (LUT) based logic with embedded system blocks (ESBs) that can be configured as RAM, ROM, or content-addressable memory. The hierarchy in the taxonomy is: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Key specifications include 492 user I/Os, an internal performance of up to 562 MHz (per datasheet headline figure), 1.55 ns pin-to-pin delay (C7 speed grade), and on-die high-speed serial interface channels supporting 1 Gbps operation. The device also integrates four phase-locked loops for clock management and a multi-voltage I/O bank architecture allowing selectable 1.5 V, 1.8 V, 2.5 V, or 3.3 V interfacing on a per-bank basis without external level shifters. Typical applications span high-performance data path implementation, telecommunications backplanes, RAID controllers, and high-speed serial protocol bridging. The True-LVDS capability makes the EP2A40F672C7 particularly suited for chip-to-chip interconnect at gigabit rates across short backplane traces. When designing with this device, allocate adequate PCB layers for the FC-FBGA escape routing and ensure decoupling is placed immediately adjacent to the BGA balls. The C7 speed grade offers an attractive balance of timing margin and cost for designs that do not require the maximum C8 or C9 grades, and the part is supplied in tray or tape-and-reel packaging as required by production volume. This page consolidates distributor pricing, comparison with related speed-grade and package variants, and design notes specific to APEX II FC-FBGA implementation that are not typically present on a single manufacturer page.

見積もり お問い合わせ
EP2A40F672C7ES - APEX II 1.5M Gates FPGA 672-FBGA | Intel / Altera
EP2A40F672C7ES

EP2A40F672C7ES - APEX II 1.5M Gates FPGA 672-FBGA | Intel / Altera

The Intel / Altera EP2A40F672C7ES is a high-density APEX II family FPGA delivering 1.5M system gates and 38,400 logic elements, fabricated on a 0.15 µm CMOS process and housed in a 672-pin FineLine BGA (FC-FBGA) package measuring 27 × 27 mm with 1.0 mm pitch. It supports up to 492 user I/O and runs at a maximum internal frequency of 562 MHz, with a core voltage of 1.5 V. The device operates across the commercial temperature range, carries the speed grade 7 designation, and ships as an enhanced-status "ES" engineering sample. An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic through a lookup-table and routing fabric. APEX II extends this model with embedded system blocks (ESBs) for dual-port RAM, ROM, and CAM, plus a high-bandwidth MultiCore interconnect that links logic array blocks (LABs), ESBs, and I/O elements (IOEs) on a single die. The hierarchy is: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Key specifications include 1.5M typical gates (40K logic elements), 40,960 maximum logic elements, 2,560 macro cells, 562 MHz core operation, 1.5 V VCCINT with 3.3 V VCCIO support, and 492 user I/O pins. On-chip resources include embedded array blocks, FastRow interconnect, and LVTTL/LVCMOS/SSTL/HSTL I/O standards. The FC-FBGA-672 package with 1.0 mm pitch is suitable for high-density production designs. The APEX II architecture pairs a fine-grained logic array with coarse-grained embedded system blocks, allowing designers to trade off LUT-based logic against dedicated memory and CAM functions. The MultiCore interconnect uses a continuous row-and-column routing fabric, which simplifies timing closure for wide datapath and memory-intensive designs compared with segmented-routing alternatives. Typical applications include high-throughput telecommunications backplanes, network processing line cards, ASIC prototyping, and DSP co-processing. The wide I/O count and large embedded memory footprint make it a fit for protocol bridging, where many parallel channels must be aggregated with on-chip buffering. When selecting APEX II devices, note that ES variants are engineering samples intended for prototyping only; for production, choose C7/C8/C9 commercial or I7/I8 industrial speed-grade parts. The 672-ball FBGA requires controlled-impedance PCB layout and a minimum of 6 PCB layers for proper power distribution. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Altera APEX II family, and design notes not collected in the manufacturer datasheet PDF.

見積もり お問い合わせ
EP2A40F672C7N - APEX II FPGA 1.5M Gates 672-BGA | Intel
EP2A40F672C7N

EP2A40F672C7N - APEX II FPGA 1.5M Gates 672-BGA | Intel

The Intel EP2A40F672C7N is a high-density APEX II family Field-Programmable Gate Array (FPGA) delivering 1.5 million system gates and 38,400 logic cells, fabricated on a 0.15-micron all-layer copper-metal CMOS process with up to eight metal layers. It is packaged in a 672-ball FineLine BGA (FC-FBGA / S-PBGA-B672) measuring 27 x 27 mm with a 1.0 mm ball pitch. The device operates from a 1.5 V core supply, supports up to 492 user I/Os, and offers a typical propagation delay of 1.55 ns with internal performance rated up to 562 MHz. Per the manufacturer datasheet, the EP2A40F672C7N integrates up to 1 Gbps multi-gigabit transceiver-class signaling on selected I/O banks, embedded system blocks, and on-chip RAM, targeting broadband, networking, and DSP-heavy designs. What is a high-density FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hardware blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. APEX II sits in the high-density tier of the taxonomy: FPGA -> programmable logic device (PLD) -> programmable logic IC -> integrated circuit. APEX II was engineered for systems that combine glue logic, datapath arithmetic, on-chip memory, and high-speed serial I/O on a single silicon die, replacing multiple discrete ASICs and reducing BOM cost and board area. Key features of the EP2A40F672C7N include 38,400 logic elements, 1.5 M system gates, 492 user I/Os, 1.55 ns propagation delay, 562 MHz internal performance, MultiVolt I/O support for interfacing with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic families, and a 0.15-µm copper CMOS process. The 'C7' speed grade denotes the commercial temperature range 0 °C to 85 °C with a specific timing closure. The 'N' suffix indicates a lead-free, RoHS-compliant FC-FBGA package. The device supports in-system configuration via passive serial, passive parallel, and JTAG modes, allowing rapid prototyping and field upgrades. Typical applications for the EP2A40F672C7N include 1 Gbps+ networking line cards, custom datapath accelerators, telecommunications backplanes, broadband aggregation, DSP co-processing, and legacy ASIC replacement in telecommunications and storage infrastructure. The large gate count and abundant I/O make it well suited to designs that previously required multiple smaller FPGAs. The MultiVolt I/O simplifies interfacing with legacy 5 V ASICs, memory, and bus transceivers. When designing with the EP2A40F672C7N, ensure the 672-ball FC-FBGA land pattern is matched exactly - this is a 27 x 27 mm, 1.0 mm pitch FineLine BGA that requires PCB microvia stackups and controlled-impedance routing. Decoupling must follow the manufacturer reference design, and unused I/O banks should be configured as outputs driving '0' or tied to defined logic levels. This page synthesizes distributor pricing, pin-compatible APEX II family drop-ins, and practical design notes not found in the manufacturer datasheet.

見積もり お問い合わせ
EP2A40F672C8 - 40K LE APEX II FPGA, 672-Pin BGA | Intel
EP2A40F672C8

EP2A40F672C8 - 40K LE APEX II FPGA, 672-Pin BGA | Intel

The Intel (formerly Altera) EP2A40F672C8 is a member of the APEX II family of FPGAs, manufactured using a 0.15-micron all-layer copper-metal process with up to eight metal layers, and packaged in a 672-ball FineLine BGA measuring 27 x 27 mm with a 1.0 mm pitch. The device integrates 40,000 typical logic elements (LEs) along with embedded memory blocks, dual-port RAM, and dedicated high-speed interfaces supporting 1 gigabit per second LVDS signaling. According to Intel APEX II datasheet documentation, the EP2A40F672C8 is rated for the commercial temperature range (0 C to 85 C) and provides 492 user I/O pins, enabling dense system-level integration for high-throughput applications. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the architectural flexibility of gate arrays with the design-rapid-turnaround of in-system programmability. Within the broader semiconductor taxonomy, an FPGA sits under programmable logic devices -> PLDs -> logic ICs -> integrated circuits, and is widely used to implement custom digital signal processing, glue logic, and high-speed interface bridging in systems that require parallelism and reconfigurability beyond what a microcontroller or DSP can offer. Key features of the EP2A40F672C8 include up to 1.5 Mbits of embedded system memory, 4 phase-locked loops (PLUs) for clock management, and embedded multiplier blocks that simplify DSP-intensive designs. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, HSTL, and LVDS, with on-chip termination options that reduce external component count. The 27 x 27 mm FineLine BGA package exposes the device's full I/O and power-pin count to support the 492 user I/O budget. Architecturally, the APEX II family uses a MultiCore architecture combining fine-grain look-up tables, coarse-grain embedded array blocks (EABs), and dedicated high-speed interfaces, allowing designers to balance logic, memory, and signal-integrity resources within a single fabric. The 0.15-micron copper process delivers high core performance while supporting the simultaneous-switching-output (SSO) headroom needed for 672-ball packaging. Typical applications include high-speed telecommunications line cards, baseband processing for wireless infrastructure, video and image processing pipelines, high-speed serial protocol bridging (RapidIO, POS-PHY, UTOPIA), and ASIC prototyping platforms. The LVDS capability also makes the part attractive for flat-panel display controllers and high-resolution imaging front-ends. When designing with this part, pay close attention to the FineLine BGA PCB land-pattern requirements (1.0 mm pitch), the power-pin decoupling scheme, and the JTAG configuration interface. The -C8 speed grade indicates a 1.55 ns propagation delay, which must be considered when meeting timing closure at high operating frequencies. This page synthesizes distributor availability, BGA-package drop-in alternatives, and practical design notes not consolidated in the original manufacturer datasheet, giving engineers a single decision-ready reference for sourcing the EP2A40F672C8.

見積もり お問い合わせ
EP2A40F672C8N - APEX II 1.5M Gates FPGA | Intel | 672-BGA
EP2A40F672C8N

EP2A40F672C8N - APEX II 1.5M Gates FPGA | Intel | 672-BGA

The Intel (formerly Altera) EP2A40F672C8N is a high-density programmable logic device (PLD) from the APEX II family, built on a 0.15 µm all-layer copper CMOS process with up to eight metal layers. It delivers 1.5M system gates, 38,400 logic cells, and operates at up to 376 MHz internal frequency. The device is housed in a 672-ball FineLine BGA (FC-FBGA) measuring 27 x 27 mm with a 1.0 mm ball pitch, providing 492 user I/Os and supporting 1 Gbps LVDS performance. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. APEX II devices sit in the programmable logic hierarchy as follows: PLD -> CPLD/FPGA -> high-density FPGA with embedded memory and I/O. The APEX II family specifically targets high-performance datapath, communications, and ASIC-replacement designs where dense logic and high I/O count are required. Key features of the EP2A40F672C8N include 1.5 M system gates, 38,400 logic elements, 4 embedded PLLs for clock synthesis, dedicated high-speed LVDS channels supporting 1 Gbps data rates, a 1.5 V nominal core supply (1.425 V to 1.575 V range), and 492 user I/Os. The propagation delay is rated at 1.55 ns for internal logic, and the device supports in-system programming via the JTAG boundary-scan interface per IEEE 1149.1. Architecturally, the EP2A40F672C8N uses a MultiCore structure of Look-up Tables (LUTs), embedded array blocks (EABs) for memory and DSP functions, and FastTrack interconnect routing. The 0.15 µm copper process enables high transistor density while maintaining low dynamic power. Built-in PLLs simplify clock tree synthesis, and LVDS support is critical for high-speed parallel interfaces such as SPI-4.2, Rapid I/O, and POS-PHY. Typical applications include telecommunications switching and routing equipment, ASIC prototyping and emulation, high-speed datapath processing, digital signal processing front-ends, and high-density glue-logic replacement. With 492 user I/Os, the device is well-suited for systems that require wide memory buses (DDR SDRAM controllers) or multiple parallel channel interfaces. When designing with this device, ensure the 1.5 V core supply is generated by a low-noise regulator such as the TPS7A4701 to meet the VCCINT tolerance. The 672-ball BGA package requires a multilayer PCB (typically 6 or more layers) with controlled-impedance routing for LVDS signals and matched-length traces for clocks. This page synthesizes distributor pricing, drop-in same-family Altera/Intel APEX II alternatives, and practical design notes not found in the manufacturer datasheet alone.

見積もり お問い合わせ
EP2A40F672C9 - APEX II FPGA 1.5M Gates 38400 Cells 672-BGA | Altera
EP2A40F672C9

EP2A40F672C9 - APEX II FPGA 1.5M Gates 38400 Cells 672-BGA | Altera

The Altera (Intel) EP2A40F672C9 is a member of the APEX II programmable logic device (PLD) family, fabricated on a 0.15-µm all-layer copper-metal process that supports up to eight layers of metal interconnect. The device integrates 1.5 million system gates with 38,400 logic elements, 492 user I/Os, and a 1.5 V core supply, housed in a 672-ball FineLine BGA package measuring 27 mm × 27 mm with a 1 mm ball pitch. An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic through SRAM-based configuration cells. FPGAs sit hierarchically above CPLDs and below ASICs in the programmable logic taxonomy, and the APEX II family is positioned as a high-density, embedded-multiplier-rich variant that bridged telecom, networking, and DSP prototyping workloads in the early-2000s generation of programmable logic. Key features of the EP2A40F672C9 include support for 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport I/O standards, embedded memory blocks, embedded multipliers, and a maximum toggle performance in the 366 MHz range. The FineLine BGA-672 footprint exposes 492 user I/O pins, providing the channel density required for parallel bus interfaces and high-speed serial links. Operating temperature is graded for commercial use from 0 °C to 85 °C. Architecturally, the APEX II device combines LAB (Logic Array Block) structures with embedded system blocks (ESBs) for dual-port RAM and ROM, and dedicated multiplier blocks optimized for DSP filter pipelines. The 0.15-µm process delivers high logic density while the 1.5 V core minimizes dynamic power for the gate count, and the eight-metal stackup enables efficient routing of wide buses. Typical applications include telecom line-card prototyping, high-speed serial backplane bridging, DSP co-processing, bus-width conversion glue logic, and ASIC prototyping. The 672-ball BGA package and 1.5 V core also suit legacy designs migrated from earlier APEX 20K families that need additional gate capacity and faster I/O standards. When designing with this device, plan power sequencing for the 1.5 V core and I/O bank supplies separately, and follow Altera's BGA layout guidelines for 1 mm-pitch FineLine packages to ensure reliable solder joint integrity through thermal cycling. This page synthesizes distributor pricing, verified same-package alternatives in the APEX II family, and practical design notes not found in the original APEX II datasheet (DS-APEXII-3.0). It is intended as an engineering reference for sourcing, replacement, and lifecycle planning.

見積もり お問い合わせ
EP2A40F672C9ES - APEX II FPGA 1.5M Gates 672-FBGA | Altera
EP2A40F672C9ES

EP2A40F672C9ES - APEX II FPGA 1.5M Gates 672-FBGA | Altera

The Altera (now Intel) EP2A40F672C9ES is a member of the APEX II family of programmable logic devices, delivering 1,500,000 system gates with 38,400 logic elements in a 672-pin Fine-pitch Chip-scale Ball Grid Array (FC-FBGA) package. Built on a 0.15 μm CMOS process and operating from a 1.5 V core supply, the device is rated for speeds up to 366 MHz internal operation with a -9 speed grade marking. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks, interconnect, and I/O cells that designers can configure after manufacturing to implement custom digital functions. Within the wider hierarchy, an FPGA is a type of Programmable Logic Device (PLD), which itself falls under digital logic integrated circuits. The APEX II architecture extends this concept with embedded MultiCore interconnect and embedded system blocks (ESBs) that double as RAM, ROM, or CAM memory, making the device suitable for high-density data-path, telecommunications, and DSP-intensive applications. Key features of the EP2A40F672C9ES include 492 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, HSTL, GTL+), 1.5 M system gates, 38,400 logic cells, dedicated multiplier/clock circuitry, and JTAG-based IEEE 1149.1 boundary-scan support. The device supports in-system programmability via the passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), JTAG, and Altera Fast Passive Parallel (FPP) configuration modes through a serial configuration device such as the EPC2 or EPC8. From an architectural standpoint, the APEX II family combines Look-Up Table (LUT) logic with embedded array blocks, giving designers a flexible trade-off between fine-grained logic and block-level memory. The MultiCore interconnect uses continuous, predictable routing across rows, columns, and embedded blocks, which simplifies timing closure on dense 672-pin designs. The 1.5 V core voltage reduces power consumption versus older 2.5 V families such as APEX 20K, while the -9 speed grade places this part at the high-performance end of the family. Typical applications include high-speed telecommunication backplanes, ATM packet processing, SONET/SDH framer designs, custom DSP pipelines, and PCI bus interfaces. The 672-pin FC-FBGA package provides high signal density for board-constrained designs where 492 I/O channels must be routed out of a single chip. When designing with this device, note that the APEX II family has been classified as legacy/not recommended for new designs. Engineers should verify long-term supply availability with the manufacturer before committing to a new production program, and consider Cyclone III/IV/10 or newer families for greenfield designs while keeping the APEX II for legacy upgrades.

見積もり お問い合わせ
EP2A40F672C9N - APEX II 1.5M Gates FPGA, BGA-672 | Intel
EP2A40F672C9N

EP2A40F672C9N - APEX II 1.5M Gates FPGA, BGA-672 | Intel

The Intel EP2A40F672C9N is a high-density FPGA from the APEX II family, delivering 1.5 million system gates and 38,400 logic elements in a 672-pin FC-FBGA (Fine-pitch Chip-Scale Ball Grid Array) package with 27 x 27 mm body and 1.0 mm ball pitch. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the architectural flexibility of a gate array with the design-turnaround advantage of in-system programmability. Within the wider semiconductor taxonomy, FPGAs sit between fixed-function ASICs and microcontrollers: they offer hardware-level parallelism and deterministic timing, while remaining fully re-programmable. The APEX II family is a second-generation APEX architecture using a 0.15 µm all-layer copper interconnect process with up to eight metal layers, supporting 1 Gbps LVDS I/O performance. Key specifications include 492 user I/O pins, 1.55 ns propagation delay, 366 MHz internal operation, 1.5 V core supply, and an embedded system block (ESB) that delivers up to 1.125 Mbits of dual-port RAM. The Look-up Table (LUT)-based logic elements include carry-chain and register-chain resources for arithmetic-intensive datapaths. The 'C9' speed grade places this part in the mid-speed bin of the family, with '-9' corresponding to approximately 1.5 ns pin-to-pin delay. The APEX II architecture combines four types of structures: Logic Array Blocks (LABs) for fine-grained logic, ESBs for memory and arithmetic, MegaLAB structures that group LABs and ESBs, and FastTrack interconnect for predictable row/column routing. This hierarchy makes the device well-suited to system-on-chip integration where a mix of glue logic, FIFOs, register files, and DSP pipelines must coexist. Typical applications include high-speed telecommunications backplanes, parallel DSP engines for video processing, custom protocol bridges between ASICs, and high-throughput data acquisition systems. The 492 available I/Os make it particularly attractive for bus-intensive designs such as DDR memory controllers, parallel pixel processing, and multi-port network interfaces. When designing with this part, pay close attention to power-plane decoupling: at 366 MHz with 38K logic elements, dynamic current peaks can exceed 3 A. Place at least 16 low-ESR 0.1 µF capacitors directly beneath the BGA footprint, plus four bulk 22 µF capacitors near the corners. Signal-integrity simulations should be performed on all LVDS and clock nets before layout sign-off, since FastTrack routing delay varies with fan-out. This page synthesizes distributor pricing, drop-in APEX II alternatives, and practical design guidance for high-density BGA FPGA implementation not found in the original APEX II datasheet alone.

見積もり お問い合わせ
EP2A40F672I-7 - 1.5M Gates APEX II FPGA, 672-BGA | Intel / Altera
EP2A40F672I-7

EP2A40F672I-7 - 1.5M Gates APEX II FPGA, 672-BGA | Intel / Altera

The Intel / Altera EP2A40F672I-7 is a member of the APEX II family of Field Programmable Gate Arrays (FPGAs), integrating 1.5 million system gates, 38,400 logic elements, and 562 MHz internal performance in a 672-pin FC-FBGA package on a 0.15 µm CMOS process. It operates from a 1.5 V core supply and is offered in the -7 industrial speed grade, with the 'I' suffix indicating an industrial temperature rating. An FPGA (Field Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, I/O elements, and routing interconnects that the customer programs after manufacture using an HDL (Hardware Description Language) such as Verilog or VHDL. FPGAs sit at the top of the programmable logic hierarchy, alongside CPLDs, and provide higher logic density, parallel processing, and faster time-to-market than ASICs for low-to-mid volume designs. Key features of the EP2A40F672I-7 include 38,400 logic elements, embedded system blocks (ESBs) implementing dual-port RAM, ROM, and CAM functions, four Phase-Locked Loops (PLLs) for clock management, multi-level interconnect with DirectDrive and FastTrack routing, and a high-bandwidth I/O structure supporting LVTTL, LVCMOS, SSTL, HSTL, GTL+, and LVDS signalling. It supports PCI, PCI-X, and RapidIO interconnect standards for embedded applications. The APEX II architecture combines logic elements (LEs), ESBs, and dedicated I/O cells on a single die with continuous high-performance routing. MultiCore interconnect with DirectDrive technology ensures predictable, deterministic timing for high-speed design paths. Four PLLs provide on-chip clock multiplication, division, phase shifting, and skew control. Typical applications include high-speed digital signal processing (DSP), telecommunications backplanes, network switching fabrics, PCI/PCI-X bridge designs, and industrial automation controllers. The combination of large logic capacity and high-speed I/O also suits the part for use as a high-volume prototyping vehicle for ASIC designs. When designing with the EP2A40F672I-7, attention must be paid to power sequencing, signal integrity at high toggle rates, and thermal dissipation. The 672-pin FC-FBGA package requires a 1.27 mm ball pitch PCB and Xilinx/Altera-compatible footprint. This page synthesizes distributor availability, drop-in alternatives sourced from the same APEX II family, and engineering guidance not found in the standalone datasheet.

見積もり お問い合わせ
EP2A40F672I-8 - APEX II FPGA 1.5M Gates | Intel / Altera
EP2A40F672I-8

EP2A40F672I-8 - APEX II FPGA 1.5M Gates | Intel / Altera

The Intel (formerly Altera) EP2A40F672I-8 is a high-density APEX II family Field Programmable Gate Array (FPGA) with 1.5 million system gates, 38,400 logic elements, and a 672-pin FC-FBGA package. It is manufactured on a 0.15 µm process technology and operates from a 1.5 V core supply, with the speed grade -8 indicating a specific internal timing bin and the I-suffix confirming the industrial operating temperature range of -40 °C to +100 °C. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that an engineer can re-program after manufacturing to implement custom digital logic. APEX II sits within the programmable logic device hierarchy as: FPGA → SRAM-based programmable logic → fine-grained LUT architecture → multi-rail multi-voltage I/O support. FPGAs of this density class are typically used in place of ASICs when time-to-market, in-field reprogrammability, or low-to-mid volume production economics are prioritized. Key features of the EP2A40F672I-8 include 1.5M typical gates, 38,400 logic cells, dedicated on-chip memory, embedded multiplier blocks, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL on a per-pin basis. The device integrates a flexible MultiVolt I/O architecture that allows the inputs and outputs to operate at different voltages than the core. According to the Altera APEX II datasheet, internal signal performance supports up to approximately 376 MHz operation. The architecture uses a four-level hierarchy (LUTs, MegaLAB structures, Embedded System Blocks, and FastTrack interconnect) to deliver predictable timing closure across complex designs. The 672-ball FC-FBGA package supports high pin-count, low-inductance interconnects required for high-speed parallel buses and source-synchronous memory interfaces such as DDR. Typical applications include high-speed communications infrastructure, telecom switching fabrics, ASIC prototyping, image and video processing pipelines, military and aerospace digital signal processing, and industrial control systems. The industrial temperature grade makes it suitable for environments that exceed commercial-grade thermal limits. When designing with this part, note that it is now a mature, legacy device that has been superseded by newer Cyclone and Stratix families; supply is constrained to authorized distributors and the broker market. PCB designers must allocate adequate power planes for the 1.5 V core, PLL analog supplies, and reference voltage rails, and must respect the FC-FBGA escape and routing rules for signal-integrity-compliant DDR layouts. This page consolidates broker pricing, same-family drop-in alternatives drawn from the Site MPN list, lifecycle caveats, and practical layout notes that are not visible on a single manufacturer product page.

見積もり お問い合わせ
EP2A40F672I-9 - APEX II FPGA, 1.5M Gates, 672-BGA | Intel
EP2A40F672I-9

EP2A40F672I-9 - APEX II FPGA, 1.5M Gates, 672-BGA | Intel

The Intel EP2A40F672I-9 is a high-density member of the APEX II FPGA family delivering 1.5 million system gates and 38,400 logic elements in a 672-pin FC-FBGA package, manufactured on a 0.15 µm CMOS process. The APEX II family combined the MultiCore architecture with on-chip CAM, dual-port RAM, and high-speed True-LVDS signaling to target high-bandwidth communications, DSP, and datapath-intensive designs. The EP2A40F672I-9 is specified for industrial temperature operation and is built around a 1.5 V core supply with hot-socketing tolerant I/O. An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic blocks, interconnect, and I/O can be reconfigured after manufacturing, providing ASIC-like density and performance with NRE-free prototyping. FPGAs sit hierarchically between general-purpose CPUs/DSPs and fixed-function ASICs: they deliver higher throughput than a processor for parallel tasks, and faster time-to-market than a mask-programmed ASIC. APEX II parts further integrate dedicated CAM blocks and LVDS channels that simplify communications and datapath designs. Key features of the EP2A40F672I-9 include 38,400 logic elements, embedded CAM support, dual-port RAM blocks, True-LVDS I/O, and an industrial operating range. The 672-ball FC-FBGA package provides controlled-impedance routing for high-speed interfaces, while 0.15 µm process technology balances density and static power. The device operates from a 1.5 V core supply with separate VCCIO banks supporting mixed-voltage I/O. Hot-socketing capability allows the device to be inserted into a live backplane without damage or data corruption. Architecturally, APEX II devices pair four-input LUT-based logic elements with embedded system blocks (ESBs) that can be configured as dual-port SRAM, single-port SRAM, ROM, or CAM. True-LVDS receivers and transmitters on dedicated channels deliver data rates up to several hundred Mbps per channel, suitable for LVDS bridges and parallel backplanes. The MultiCore interconnect with DirectDrive technology ensures predictable timing for high-fanout nets across the 672-pin FC-FBGA package. Typical applications include high-speed communications interfaces, ASIC prototyping, datapath co-processing, and DSP accelerator designs. The combination of CAM, dual-port RAM, and LVDS makes APEX II particularly attractive for ATM switching, protocol translation, and PCI-to-PCI bridges. The industrial temperature grade also supports telecom line cards and industrial control backplanes. When designing with the EP2A40F672I-9, pay close attention to power sequencing: VCCINT must reach stable 1.5 V before VCCIO is applied, and vice versa on power-down. The device draws significant inrush current during configuration - use the Altera MAX series (EPM7xxx) or discrete supervisory circuitry to hold the FPGA in reset until supplies stabilize. Decoupling requires at least 22 µF bulk + 0.1 µF + 0.001 µF per power pin group. This page consolidates APEX II datasheet facts, intel/Altera ordering information, and pin-compatible same-family alternatives in a single reference - including 672-pin FC-FBGA drop-in variants and speed-grade siblings - to help procurement and hardware engineers validate EP2A40F672I-9 sourcing decisions.

見積もり お問い合わせ
EP2A40F672I7 - APEX II 1.5M Gates FPGA, 672-pin FC-FBGA | Intel/Altera
EP2A40F672I7

EP2A40F672I7 - APEX II 1.5M Gates FPGA, 672-pin FC-FBGA | Intel/Altera

The Intel/Altera EP2A40F672I7 is a member of the APEX II family of Field Programmable Gate Arrays (FPGAs), delivering 1.5M system gates, 38,400 logic elements, and a 562 MHz core frequency in a 672-pin Fine-pitch Chip-scale Ball Grid Array (FC-FBGA) package. Manufactured on a 0.15 µm CMOS process, this device operates from a 1.5 V core supply and is specified for the industrial temperature range (-40 °C to +85 °C) as indicated by the 'I' speed-grade suffix. The '7' suffix denotes a 7-device speed grade pin-compatible with other speed grades in the EP2A40F672 family. An FPGA is a reprogrammable semiconductor device whose logic function is defined by a user-supplied configuration bitstream rather than by the silicon vendor. APEX II sits in the FPGA taxonomy between traditional CPLDs (low density, glue logic) and high-end SoC FPGAs (multi-million LE with hardened CPUs). Within the broader programmable logic hierarchy, APEX II -> SRAM-based FPGA -> programmable logic -> semiconductor. Its reprogrammability, high pin count, and embedded MultiCore architecture made it popular for telecom line cards, baseband processing, and high-speed data-path prototyping in the early 2000s. Key features of the EP2A40F672I7 include embedded MultiCore blocks combining lookup tables and product-term logic, a high-bandwidth MultiCore interconnect fabric, support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, LVDS), and a configurable JTAG-based configuration port. The APEX II architecture combines fine-grain LUTs with coarse-grain Embedded System Blocks (ESBs) to balance logic density and arithmetic performance. The 672-ball FC-FBGA package exposes 8 dedicated clock inputs, up to 24 user I/O banks, and a high pin density suitable for dense PCB escape routing. Multiple speed grades are available: -6 (fastest), -7, -8, and -9 (slowest). EP2A40F672I7 is the industrial-temperature speed-grade 7 variant. Typical applications include telecommunications line interfaces, DSP co-processing, high-speed bus bridging, and legacy industrial control systems that require drop-in compatibility with other EP2A40 F672-pin FPGAs. Designers should provide a stable 1.5 V core and a separate I/O VCCIO rail (3.3 V or 2.5 V typical), follow Altera's JTAG configuration guidelines, and observe the 220 °C peak reflow temperature limit required by the FC-FBGA's MSL-3 moisture sensitivity rating. This page synthesizes distributor availability, pin-compatible speed-grade alternatives, and lifecycle observations not consolidated in the original APEX II datasheet.

見積もり お問い合わせ
EP2A40F672I7N - APEX II FPGA 1.5M Gates 562MHz 672-FBGA | Intel
EP2A40F672I7N

EP2A40F672I7N - APEX II FPGA 1.5M Gates 562MHz 672-FBGA | Intel

The Intel EP2A40F672I7N is a high-density APEX II family FPGA delivering 1.5 million system gates and 38,400 logic elements (cells) at a maximum internal frequency of 562 MHz, fabricated on a 0.15 µm process and operating from a 1.5 V core supply, housed in a 672-pin FC-FBGA package. It provides 492 user I/O lines and 16 macrocells with 32 product terms per macrocell for flexible combinational and sequential logic implementation. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the high integration of an ASIC with the flexibility of post-manufacture reprogrammability. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. APEX II is Intel's (formerly Altera's) high-performance, multi-volt family targeting datapath-intensive applications such as communications infrastructure, video processing, and custom ASIC prototyping. A 562 MHz internal frequency enables sustained DSP and bus-interface throughput in mid-2000s generation telecom and imaging designs. Key features include 1.5 M system gates, 38,400 logic cells, 16 macrocells, 32 product terms per macrocell, and a 1.55 ns propagation delay (per PLA-mode characterization). The device supports in-system programmability via JTAG and configuration via passive serial, passive parallel, or synchronous modes. Multi-voltage I/O banks permit interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level translation. Embedded block RAM and dedicated carry chains support arithmetic-intensive datapaths. The APEX II architecture combines Look-Up Table (LUT)-based logic elements with a hierarchical routing fabric and embedded array blocks, delivering a balance of fine-grained logic and block-level memory. The 0.15 µm process and 1.5 V core supply reduce dynamic power versus the original 0.18 µm APEX family, while the 672-pin FC-FBGA package provides controlled-impedance signal integrity for high-speed I/O. The 'I7N' suffix denotes industrial temperature grade (-40 °C to +85 °C) and lead-free / Pb-free assembly. Typical applications include telecommunications infrastructure (SONET/SDH framers, ATM switches, baseband processing), video and image processing (broadcast codecs, motion estimation), high-speed datapath bridging (PCI-to-PCI bridges, custom bus interfaces), and ASIC prototyping. The 1.5 M gate capacity supports designs that would otherwise require an entry-level ASIC, while preserving design revision flexibility. When designing with this device, plan power sequencing carefully: 1.5 V core must ramp before I/O banks. Use the JTAG interface for boundary-scan test and in-field firmware updates. Decoupling requires at least 22 low-ESR 0.1 µF capacitors placed close to the package, with bulk capacitance at the regulator outputs. This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the same APEX II family, and practical design considerations not consolidated in the manufacturer datasheet, giving procurement and engineering teams a single source for sourcing decisions.

見積もり お問い合わせ
EP2A40F672I8 - APEX II 1.5M Gates 672-FBGA FPGA | Intel / Altera
EP2A40F672I8

EP2A40F672I8 - APEX II 1.5M Gates 672-FBGA FPGA | Intel / Altera

The Intel (formerly Altera) EP2A40F672I8 is a high-density APEX II family Field-Programmable Gate Array (FPGA) delivering 1.5 million system gates with 38,400 logic cells in a 672-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package. The device is fabricated on a 0.15 um process, operates from a 1.5 V core supply, and supports system clock frequencies up to 376 MHz, making it suitable for high-throughput parallel processing designs. The 'I8' speed grade denotes an industrial temperature range with mid-tier performance optimization, and the '672' package code designates the FC-FBGA footprint. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, multipliers, and I/O cells. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include CPLDs and structured ASICs. Within the APEX II family, the EP2A40 sits at the high-end of the line, offering the largest logic density for applications such as telecommunications line cards, ASIC prototyping, and high-speed DSP pipelines. APEX II devices are SRAM-based and require a configuration flash or controller to load the bitstream at power-up. Key differentiating features include 1.5M system gates, 38,400 logic elements (LEs), embedded MultiNet interconnect, and LVTTL/LVCMOS/LVDS-compatible I/O. The 672-ball FC-FBGA package supports high I/O count (up to 497 user I/Os per the APEX II data book) while preserving a compact board footprint of approximately 27 mm x 27 mm. The device also integrates dedicated circuitry for phase-locked loops (PLUs), double-data-rate (DDR) memory interfaces, and the proprietary True-LVDS signaling used in Altera's APEX II generation. Architecturally, the EP2A40 uses a MultiCore architecture combining fine-grain logic elements with embedded system blocks (ESBs) that can be configured as RAM, ROM, or product-term logic. The 0.15 um six-layer metal process enables the high gate density while keeping standby current moderate. Embedded multiplier blocks (if specified for this density) accelerate DSP functions, and the 376 MHz maximum operating frequency makes the part competitive for SDR baseband and storage-area-network bridging designs. Typical applications include telecommunications line-card interfaces, SONET/SDH framers, high-speed serial protocol bridges, ASIC prototyping, digital signal processing (DSP) farms, and industrial control systems. The wide I/O count also makes the EP2A40F672I8 well-suited for test and measurement instrumentation front-ends where many parallel channels must be sampled or driven simultaneously. When designing with the EP2A40F672I8, ensure adequate power-plane decoupling (typically 0.1 uF + 10 uF per supply pin) and thermal management for industrial-temperature operation up to 100 C junction. The 1.5 V VCCINT core supply must be sequenced with VCCIO to avoid latch-up, and configuration must be sourced from a PROM or flash device through the dedicated configuration pins. This page synthesizes distributor stock data, same-family Altera APEX II drop-in alternatives, and practical design notes not found in the original datasheet, providing information gain beyond what is available on DigiKey, Mouser, or the manufacturer product page.

見積もり お問い合わせ
EP2A40F672I8N - APEX II FPGA 1.5M Gates 672-BGA | Intel / Altera
EP2A40F672I8N

EP2A40F672I8N - APEX II FPGA 1.5M Gates 672-BGA | Intel / Altera

The Intel (formerly Altera) EP2A40F672I8N is a high-density member of the APEX II FPGA family, integrating 1,500,000 system gates, 38,400 logic elements (cells), and a maximum operating frequency of 376 MHz on a 0.15 micrometer process, supplied from a 1.5 V core rail and packaged in a 672-pin FC-FBGA. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines the integration density of an ASIC with the flexibility of in-system reconfiguration. Within the broader semiconductor taxonomy, FPGAs sit alongside CPLDs in the programmable logic category, then up through logic ICs to integrated circuits. APEX II specifically targets high-performance, gate-array-class designs where the design captures data-path, DSP and embedded-memory functions on a single fabric. Key features include 38,400 logic cells, 1.5M system gates, 376 MHz maximum internal frequency, on-chip embedded system blocks (ESBs) for memory and arithmetic functions, MultiCore interconnect routing, and LVTTL/LVCMOS/PCI/HSTL/SSTL I/O support. The 672-pin FC-FBGA package is a wire-bond-style fine-pitch BGA designed for high pin-count, moderate-thermal APEX II designs. The device is fabricated on a 0.15 micrometer process and uses a 1.5 V core supply, with separate VCCIO banks that can be set to 3.3 V, 2.5 V, or 1.8 V to match mixed-voltage interfaces. MultiCore routing fabric combined with ESBs allows each logic array block to be paired with dedicated RAM or product-term resources, giving designers a tight balance between register-rich control logic and memory-rich datapath logic. Typical applications include high-speed telecommunications line cards, networking routers, software-defined radio basestation processing, image processing pipelines, and ASIC prototyping. The 1.5M-gate density and 376 MHz performance make it well suited to designs that aggregate multiple channels of DSP, glue-logic plus embedded memory in a single chip. When designing with this device, plan power sequencing so the 1.5 V core rail ramps before any 3.3 V VCCIO bank that drives into the core. Decoupling must combine bulk tantalum or polymer capacitors near the package with high-frequency ceramic capacitors placed adjacent to each bank. This page synthesizes distributor availability, same-family APEX II drop-in variants, and practical PCB power-design guidance not collected in the legacy datasheet alone, providing a quicker decision path for new designs and EOL re-sourcing.

見積もり お問い合わせ
EP2A40F672I9 - APEX II FPGA 1.5M Gates 672-FBGA | Intel
EP2A40F672I9

EP2A40F672I9 - APEX II FPGA 1.5M Gates 672-FBGA | Intel

The Intel EP2A40F672I9 is a member of the APEX II family of field-programmable gate arrays (FPGAs), manufactured on a 0.15 µm CMOS process and packaged in a 672-pin FC-FBGA (flip-chip fine-pitch BGA). It integrates 1.5 million system gates and 38,400 logic cells, and is qualified for industrial-temperature operation (the "I" suffix). An FPGA (field-programmable gate array) is a type of programmable logic device that allows engineers to implement custom digital logic circuits after the silicon has been fabricated. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs and SPLDs, and are widely used for glue logic, high-speed interfacing, DSP, and prototyping prior to ASIC tape-out. The APEX II family is an older generation of multi-gate FPGAs introduced in the early 2000s for high-density applications. Key features of the EP2A40F672I9 include 1.5 M system gates, 38,400 logic elements, embedded memory blocks, and support for multiple I/O standards. The device is supplied from a 1.5 V core rail and operates at a maximum internal clock frequency of 366 MHz. It supports in-system programmability via the IEEE 1149.1 JTAG interface, allowing configuration via Altera/Intel Quartus or legacy MAX+PLUS II software. The 672-ball FC-FBGA package is a high-pin-count surface-mount solution suited for high-speed signalling. The EP2A40F672I9 architecture combines look-up-table (LUT)-based logic, dedicated carry chains for arithmetic, embedded array blocks (EABs) for memory and DSP operations, and a high-speed interconnect fabric. Compared with earlier APEX devices, APEX II introduced higher density and improved routing, enabling single-chip solutions for telecom, networking, and digital-signal-processing systems. The 366 MHz internal performance rating reflects typical register-to-register paths and pipeline-friendly design style. Typical applications include high-density glue logic in telecom equipment, custom DSP and video/image processing pipelines, network packet processors, industrial control and instrumentation front-ends, and prototype ASICs that require rapid design iteration. The 672-ball BGA package provides enough I/O for multi-gigabit parallel buses and multiple memory interfaces. When designing with this device, ensure proper BGA layout with controlled-impedance traces and matched-length routing for high-speed signals. Power-decoupling, multi-rail sequencing (1.5 V core plus separate VCCIO banks), and thermal management (junction temperatures under the industrial grade range) are critical to reliability. Configuration memory planning and JTAG chain design must follow Intel/Altera application guidance. This page synthesizes distributor pricing, the APEX II family cross-reference, and practical design notes not found in the manufacturer datasheet alone.

見積もり お問い合わせ
EP2A40F672I9N - APEX II FPGA, 1.5M Gates, 672-FBGA | Intel / Altera
EP2A40F672I9N

EP2A40F672I9N - APEX II FPGA, 1.5M Gates, 672-FBGA | Intel / Altera

The Intel (formerly Altera) EP2A40F672I9N is a high-density APEX II family FPGA fabricated on a 0.15 micrometer process, delivering up to 1.5 million system gates with 38,400 logic cells in a 672-ball FineLine BGA (FC-FBGA) package. The device operates from a 1.5 V core supply, supports up to 492 user I/O lines, and is rated for an internal clock frequency of 366 MHz, making it suitable for high-throughput parallel datapath designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory blocks, and programmable I/O cells that the designer wires up after manufacture using an SRAM, antifuse, or flash configuration cell. The APEX II family sits within the broader taxonomy programmable logic device (PLD) -> CPLD/FPGA hybrid -> SRAM-based FPGA -> high-density FPGA, and combines LUT-based logic with dedicated MultiCore interconnect and True-LVDS support for high-speed parallel interfaces. Compared to a CPLD, an FPGA of this density is normally used for ASIC prototyping, complex datapath glue logic, and DSP-style arithmetic pipelines rather than simple decoder/decoder-replacement functions. Key features of the EP2A40F672I9N include MultiCore architecture supporting both fine-grain and coarse-grain look-up tables, embedded system blocks (ESBs) that double as dual-port RAM, and a high-speed True-LVDS interface capable of 840 Mbps per channel. The device supports LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, HSTL, and differential LVDS/LVPECL I/O standards, and provides dedicated clock management blocks with PLL for frequency synthesis and phase shifting. In terms of architecture, the APEX II device integrates Logic Array Blocks (LABs) containing 10 LEs each, interconnected via the MultiCore interconnect, and offers up to 1.6 Mbits of embedded SRAM. The 0.15 micrometer CMOS process gives the device its 1.5 V core operation, while the I/O banks can be driven from 1.5 V up to 3.3 V depending on the chosen standard. Configuration is supported via passive serial, passive parallel, JTAG, and Altera's EPC configuration devices. Typical applications include ASIC prototyping, telecommunications line-card processing, high-speed image and video pipelines, test and measurement instrumentation, and PCI/PCI-X bus interface logic. Industrial and medical imaging systems frequently rely on the APEX II family because of the abundant dual-port memory and high I/O count. Military and aerospace customers adopt the I-temperature grade (suffix I9) for extended -40 C to +100 C operation. When designing with this device, ensure the Quartus II design toolchain (or legacy MAX+PLUS II) is available, plan the I/O bank voltages carefully, and respect the 1.5 V core supply decoupling guidance. The 672-ball FC-FBGA package requires X-ray inspection and controlled reflow profiles; thermal management is normally handled by the PCB copper pad array under the package. This page synthesizes distributor pricing, pin-compatible APEX II drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

見積もり お問い合わせ
EP2A40F724 - APEX II FPGA 1.5M Gates 655360 Cells | Altera
EP2A40F724

EP2A40F724 - APEX II FPGA 1.5M Gates 655360 Cells | Altera

The Intel (formerly Altera) EP2A40F724 is a high-density APEX II programmable logic device in the APEX (Advanced Logic Element Matrix) family, delivering approximately 1,500,000 system gates with 655,360 logic cells and 38,400 dedicated RAM bits. It is housed in a 724-ball FineLine BGA (F724) package and operates on a 1.5 V core supply, with multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) compatible with LVCMOS, LVTTL, HSTL, SSTL, LVDS, and PCI interfaces. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that can be re-programmed to implement virtually any digital logic function. FPGAs sit within the programmable logic hierarchy alongside CPLDs, occupying a higher-density tier that allows them to integrate entire subsystems - processors, memory controllers, and high-speed serial interfaces - onto a single device. The APEX II family specifically targets high-performance applications requiring large logic capacity and embedded memory. Key features of the EP2A40F724 include built-in support for LVDS data rates up to 840 Mbps, embedded CAM (Content-Addressable Memory) blocks for networking lookup tables, four PLL clock managers with up to eight clock outputs per device, and 12 dedicated clock pins. The device provides up to 498 user I/O pins via the 724-ball FineLine BGA package, supporting hot-socketing and IEEE 1149.1 JTAG boundary-scan testing for board-level diagnostics. The APEX II architecture combines a MultiCore architecture with LUT-based logic elements, allowing designers to allocate resources between combinational logic, dual-port RAM, CAM, and arithmetic functions within a single device. The 0.15 µm CMOS process technology balances high performance with low static power dissipation, while the dedicated memory and CAM blocks eliminate the need for external lookup memory in routing and classification applications. Typical applications for the EP2A40F724 include telecommunications switching equipment, network routers and switches, high-speed serial protocol bridges, digital signal processing front-ends, and ASIC prototyping platforms. The combination of high gate count, embedded CAM, and LVDS support makes it well-suited for packet classification, bus interfaces, and glue-logic consolidation. When designing with this FPGA, ensure robust 1.5 V core decoupling with low-ESR ceramic capacitors placed close to each power pin. Signal integrity for LVDS lanes requires matched-length routing and 100 ohm differential termination. Programming is performed via JTAG or the Altera ByteBlaster/USB-Blaster download cable, and configuration memory can be loaded from a serial PROM such as the EPC16 or EPC64. This page synthesizes verified distributor stock data, drop-in alternatives from the same APEX II family, and practical design notes not aggregated in the manufacturer datasheet, supporting both procurement decisions and board-level implementation.

見積もり お問い合わせ
EP2A40F780 - APEX II 1.5M Gate FPGA 780-pin FBGA | Intel
EP2A40F780

EP2A40F780 - APEX II 1.5M Gate FPGA 780-pin FBGA | Intel

The Intel (formerly Altera) EP2A40F780 is a member of the APEX II family of programmable logic devices, providing approximately 1,500,000 typical gates (30,000 logic elements) housed in a 780-pin FineLine BGA (FBGA) package. The APEX II architecture combines look-up table (LUT)-based logic with embedded system blocks (ESBs) for high-density combinational and sequential design implementation, targeting high-performance data path and datapath-intensive applications. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic function is defined by a customer-supplied bitstream rather than fixed at the fab. FPGAs occupy the programmable-logic branch of the broader semiconductor hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit), and unlike ASICs they offer rapid time-to-market and in-system reprogrammability at the cost of higher unit price and static power consumption. The EP2A40 series is offered in multiple speed grades and package variants to address industrial, communications, and ASIC prototyping workloads. The 'F780' suffix denotes a 780-ball FineLine BGA package with an industrial operating temperature range, providing high I/O density for multi-channel datapath designs. Typical applications include ASIC prototyping, communications infrastructure, high-speed data-path implementations, custom DSP pipelines, and bus-interface bridging. The device supports SRAM-based configuration and JTAG (IEEE 1149.1) boundary-scan testing for production programming and in-field updates. Quartus II development tools are required for synthesis, place-and-route, and bitstream generation. When designing with this device, note that APEX II devices are legacy parts with active last-time-buy status at most franchised distributors; long lead times and price premium are typical. Engineers should validate tooling support in Quartus II version compatibility matrices before committing to new designs.

見積もり お問い合わせ
EP2A40FB724C8 - APEX II FPGA 540 I/O 724-BGA | Altera (Intel)
EP2A40FB724C8

EP2A40FB724C8 - APEX II FPGA 540 I/O 724-BGA | Altera (Intel)

The Altera (Intel) EP2A40FB724C8 is a member of the APEX II family of high-density Field-Programmable Gate Arrays (FPGAs) housed in a 724-ball Fine-pitch Ball Grid Array (FBGA) package. The device integrates approximately 40,000 typical gates, 540 user I/O pins, 655,360 bits of embedded RAM, and 38,400 logic elements, targeting high-performance data-path, telecommunication, and DSP front-end designs where both logic density and pin count are critical. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic blocks and interconnect via a hardware description language after manufacture. FPGAs occupy a hierarchical position from programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> programmable logic device family -> semiconductor. APEX II sits between older APEX 20K devices and the Stratix/GX families, offering a MultiCore architecture that combines look-up-table (LUT) logic with embedded system blocks (ESBs) for on-chip dual-port RAM, content-addressable memory, and FIFO functions. Key features of the EP2A40FB724C8 include 540 user I/O pins, 655,360 bits of total RAM, 38,400 logic elements, an operating core voltage of 1.425 V to 1.575 V, a 724-ball FCBGA package measuring 35 mm x 35 mm, and a -8 speed grade designation. The MultiCore structure embeds up to 28,620 LUTs and dedicated carry/chain routing for high-speed arithmetic, while the embedded system blocks provide configurable dual-port SRAM with byte enables. JTAG (IEEE 1149.1) boundary-scan test is supported for board-level verification. The architectural depth comes from combining fine-grained logic elements with coarse-grained ESBs, allowing engineers to map both random control logic and wide datapath or buffer memories without external components. The -8 speed grade designates a specific transistor-speed bin, with lower numbers indicating faster parts; system clocks and I/O toggling rates are defined per speed grade in the APEX II family datasheet. Typical applications include high-speed telecommunication line cards, network switches and routers, ASIC prototyping, DSP co-processing front-ends, and large-format imaging or video processing pipelines. With 540 user I/O, the EP2A40FB724C8 supports wide external memory buses and multiple parallel interface standards. Designers should note the 724-BGA package requires multilayer PCB construction with controlled-impedance routing and BGA-specific fanout. Power estimation requires Quartus II power analyzer data, since APEX II core and I/O currents scale with toggle rate and logic utilization. This page synthesizes distributor availability, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

見積もり お問い合わせ