EP2A40F780 - APEX II 1.5M Gate FPGA 780-pin FBGA | Intel
部品番号: EP2A40F780 ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $195 | $19,500.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $142 | $142,000.00 |
EP2A40F780 概要
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic function is defined by a customer-supplied bitstream rather than fixed at the fab. FPGAs occupy the programmable-logic branch of the broader semiconductor hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit), and unlike ASICs they offer rapid time-to-market and in-system reprogrammability at the cost of higher unit price and static power consumption.
The EP2A40 series is offered in multiple speed grades and package variants to address industrial, communications, and ASIC prototyping workloads. The 'F780' suffix denotes a 780-ball FineLine BGA package with an industrial operating temperature range, providing high I/O density for multi-channel datapath designs.
Typical applications include ASIC prototyping, communications infrastructure, high-speed data-path implementations, custom DSP pipelines, and bus-interface bridging. The device supports SRAM-based configuration and JTAG (IEEE 1149.1) boundary-scan testing for production programming and in-field updates. Quartus II development tools are required for synthesis, place-and-route, and bitstream generation.
When designing with this device, note that APEX II devices are legacy parts with active last-time-buy status at most franchised distributors; long lead times and price premium are typical. Engineers should validate tooling support in Quartus II version compatibility matrices before committing to new designs.
ドロップイン代替品: EP2A40F780 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2A40F780 （同一形状・フットプリント） — 相違点: Package, JTAG Support, Logic Elements, Operating Temperature, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP2A40F724
✅ ドロップイン✓ 在庫あり
$168 / 個
データシートを見る →EP2A40F672C6
✅ ドロップイン✓ 在庫あり
$105 / 個
データシートを見る →EP2A40B724C7
✅ ドロップイン✓ 在庫あり
$650 / 個
データシートを見る →EP2A40B652C7
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP2A25F724
✅ ドロップイン✓ 在庫あり
$112 / 個
データシートを見る →EP2A40F780 最大定格＆電気的特性
| Family | APEX II |
| Device | EP2A40 |
| Typical Gates | 1,500,000 |
| Logic Elements | 30,000 |
| パッケージ | 780-ball FineLine BGA (FBGA) |
| 実装タイプ | Surface Mount |
| Configuration Memory | SRAM-based |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Programming File Format | .sof/.pof via Quartus II |
EP2A40F780 780-ball fineline bga (fbga) ピン配置ガイド
EP2A40F780 (780-ball fineline bga (fbga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2A40F780.
詳細は データシート をご参照ください。
主な用途
EP2A40F780 の用途: 7 件s: ASIC Prototyping, Telecommunications Infrastructure, High-Speed Data Path Implementation, Custom DSP Pipelines, Bus Interface Bridging, Industrial Control Systems, Legacy Test Equipment.
ASIC Prototyping
The EP2A40F780 is well suited to ASIC prototyping because its 1,500,000 typical gates and 30,000 logic elements provide enough capacity to map mid-to-large ASIC netlists onto a single FPGA, and its embedded system blocks (ESBs) can be configured as RAM, ROM, or arithmetic units. Compared with newer FPGAs it offers lower static power at the cost of slower speed grades, but it integrates fully with Quartus II and supports multi-FPGA partitioning. For prototyping legacy ASICs that target older process nodes, the APEX II logic structure maps RTL efficiently and the 780-ball FBGA footprint delivers ample user I/O for chip-level bring-up. Lead times and last-time-buy status make this best for existing designs rather than new starts.
おすすめ
Telecommunications Infrastructure
The EP2A40F780 fits telecommunications infrastructure such as legacy SONET/SDH framer, cross-connect, and protocol-bridge designs where the high pin count and large logic capacity of the 780-ball FBGA enable parallel data-path pipelines. Its JTAG (IEEE 1149.1) support simplifies production programming and in-field firmware updates on installed line cards. The APEX II architecture provides deterministic routing for high-speed serializer-deserializer (SERDES) glue logic and timing-recovery blocks. Engineers maintaining deployed telecom equipment find the part ideal because it matches original design intent exactly while supporting late-stage obsolescence through last-time-buy purchases. Migration to newer Cyclone IV/V is recommended only when full board respins are feasible.
おすすめ
High-Speed Data Path Implementation
The EP2A40F780 supports high-speed data-path implementations such as protocol engines, packet processors, and image-processing pipelines because its 30,000 logic elements and embedded system blocks can be configured as parallel arithmetic units and dual-port RAM. The 780-ball FBGA exposes enough user I/O pins to feed multi-channel parallel buses without multiplexing, simplifying PCB layout and timing closure. Compared with APEX 20KE predecessors the APEX II architecture improves routing density by approximately 30 percent, which helps meet timing on wide datapaths. Engineers should pair the device with external DDR memory controllers implemented in ESB RAM and validate signal-integrity at the BGA breakout with controlled-impedance traces.
おすすめ
Custom DSP Pipelines
The EP2A40F780 enables custom DSP pipelines for baseband processing, modulation/demodulation, and filter banks because its embedded system blocks can be configured as multiplier-accumulator elements and lookup tables, while the LAB fabric implements control state machines. The 780-ball FBGA offers enough I/O for multi-channel parallel sample streams. APEX II is best for legacy DSP designs where migration to newer DSP-optimized FPGAs (such as Intel Cyclone V with hardened DSP blocks) is not cost-effective. Designers should profile critical-path timing in Quartus II TimeQuest and allocate 15-20 percent timing margin to account for process variation on a last-time-buy device.
おすすめ
Bus Interface Bridging
The EP2A40F780 supports bus-interface bridging between legacy and modern buses (PCI, VME, custom parallel buses) because its high I/O count and configurable I/O standards handle mixed-voltage signaling in a single device. The APEX II I/O structure supports LVTTL, LVCMOS, PCI, and SSTL standards, enabling bridges between 3.3V legacy peripherals and 5V backplanes with appropriate external level shifting. Engineers maintaining industrial bus systems find the part ideal because the same bitstream works across multiple board revisions. The 780-ball FBGA footprint accommodates the wide parallel buses typical of bridging designs, and JTAG simplifies bring-up. Plan for EOL transitions by capturing bitstream sources and validation patterns.
おすすめ
Industrial Control Systems
The EP2A40F780 is appropriate for industrial control systems such as PLC controllers, motor-control boards, and process automation equipment because its industrial temperature grade and high logic capacity fit deterministic real-time control loops. The embedded system blocks can store lookup tables for PID controllers and state-machine tables for sequential control. Engineers maintaining long-lifecycle industrial equipment benefit from the part's proven reliability and long-term availability through last-time-buy channels. The 780-ball FBGA footprint supports parallel encoder interfaces and PWM output channels without external logic, simplifying BOM. Always verify RoHS/REACH compliance at order placement because last-time-buy inventory may carry older lead-finish parts.
おすすめ
Legacy Test Equipment
The EP2A40F780 supports legacy test-and-measurement equipment such as ATE pattern generators and protocol analyzers because its high logic density enables parallel stimulus generation, response capture, and pattern sequencing in a single device. The 780-ball FBGA package delivers enough I/O for parallel test channels while keeping PCB routing manageable. APEX II is well matched to existing test platforms where re-validation would require costly recertification. Engineers should keep Quartus II toolchain version pinned for reproducibility, since later Quartus Prime releases dropped APEX II support. Use JTAG for in-system bitstream updates during test-program development.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2A40F780 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2A40F724 | EP2A40F672 | EP2A40B724 | EP2A40B652 | EP2A25F724 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-ball FBGA | 724-ball FBGA | 672-ball FBGA | 724-ball BGA | 652-ball BGA | 724-ball FBGA |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Typical Gates | 1,500,000 | 1,500,000 (same die) | 1,500,000 (same die) | 1,500,000 (same die) | 1,500,000 (same die) | ~900,000 (smaller die) |
| Logic Elements | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | ~16,000 |
| Pin Count | 780 | 724 | 672 | 724 | 652 | 724 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
| Toolchain | Quartus II | Quartus II | Quartus II | Quartus II | Quartus II | Quartus II |
| Configuration Memory | SRAM | SRAM | SRAM | SRAM | SRAM | SRAM |
主な差別化要因
- Highest logic density in APEX II family with 780-ball FBGA （vs EP2A25F724)
- Same die as EP2A40 siblings, larger ball grid for maximum I/O （vs EP2A40B652)
- FPGA-class density in a 780-ball FBGA footprint （vs EP2A40F724)
設計ノート
APEX II devices including the EP2A40F780 require Quartus II design software, NOT the newer Quartus Prime. Quartus Prime releases after v13.0 dropped APEX II device support. Engineers must pin a Quartus II version that includes the EP2A40 device library or the synthesis will fail with 'device not supported' errors. Keep the Quartus II installation archived because license servers for newer Altera software may refuse to activate legacy versions.
The 780-ball FineLine BGA package requires careful PCB land-pattern design, including via-in-pad or dog-bone fan-out, controlled-impedance escape routing, and a multi-layer PCB (typically 6+ layers). Ball pitch is typically 1.0 mm for FineLine BGA, so designers must follow IPC-7351 guidelines for BGA land patterns. Inner balls require via stubs or back-drilling for high-speed signals. Always check Intel's APEX II package specifications for exact ball coordinates and recommended footprint dimensions before committing to PCB layout.
The EP2A40F780 at full utilization (30,000 logic elements switching at high toggle rate) can dissipate 3-5 W; the FBGA package's thermal resistance (theta_JA) is typically 15-25 C/W without airflow. Mount the device on a PCB with adequate thermal vias under the package center, and consider a small heatsink or airflow for high-utilization designs. Estimate junction temperature rise as Pdiss * theta_JA and ensure it stays below 125 C at maximum operating temperature.
Provide clean, low-impedance power distribution for VCCINT (core) and VCCIO (I/O) rails with bulk decoupling capacitors (10-100 uF) close to the device and high-frequency ceramic capacitors (0.1 uF and 1 nF) within 5 mm of every power pin pair. APEX II devices are sensitive to power-supply noise because internal ESB RAM and arithmetic functions can malfunction with rail ripple above 50 mV. Use a multi-layer PCB with dedicated power and ground planes to minimize inductance.
APEX II I/O standards include LVTTL, LVCMOS, PCI, and SSTL; configure VCCIO per bank to match the I/O standard used. For high-speed parallel buses, route signals with matched impedance (typically 50 ohm single-ended, 100 ohm differential) and use series damping resistors near the driver. Perform signal-integrity simulation in HyperLynx or similar tools before board fab. Keep clock and high-speed I/O away from analog or sensitive reference nets to minimize crosstalk.
コンプライアンス情報
Compliance information not present in verified web data. APEX II family is legacy Intel/Altera FPGA line; engineers should verify RoHS/lead-free status with distributor at order placement, especially for last-time-buy stock which may include older lead-finish parts.
