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EP2AGX190EF29I5G - Arria II GX FPGA 181K LE | Intel | 780-FBGA
EP2AGX190EF29I5G

EP2AGX190EF29I5G - Arria II GX FPGA 181K LE | Intel | 780-FBGA

The Intel EP2AGX190EF29I5G is a high-density Arria II GX field-programmable gate array (FPGA) delivering 181,165 logic elements, 10,177,536 memory bits, and integrated transceivers in a 780-ball flip-chip BGA package. Built on a 40 nm low-power process, it operates from a 0.9 V core supply and supports up to 500 MHz fabric performance with 372 user I/O pins. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than at silicon fab time. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are commonly used to prototype ASICs, accelerate parallel workloads, and implement custom I/O protocols. Arria II GX specifically targets mid-range applications that require integrated multi-gigabit transceivers (up to 6.375 Gbps) and moderate logic density, sitting between the lower-cost Cyclone family and the high-end Stratix family in Intel's FPGA portfolio. Key features of the EP2AGX190EF29I5G include integrated transceivers supporting PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and multiple CPRI/OBSAI data rates; dedicated on-chip memory blocks (M9K/M144K); embedded DSP blocks for high-performance fixed- and floating-point arithmetic; and 8-input adaptive logic modules (ALMs) that pack twice the effective logic of prior 4-input LUT architectures. The device also includes hard memory controllers, PLLs, and dynamic reconfiguration support. The Arria II GX architecture combines a logic fabric with hard intellectual-property (IP) blocks such as transceivers, PCIe hard IP, and external memory interfaces. This integration reduces logic overhead typically spent serializing/deserializing data, freeing ALMs for application code while delivering deterministic latency across all six transceiver channels at line rates up to 6.375 Gbps. Typical applications include wireless baseband processing, broadcast video infrastructure, military secure communications, high-performance DSP for radar/sonar, PCIe Gen2 endpoint/root-port cards, and high-speed serial protocol bridging. The 780-pin FC-FBGA package supports the transceiver channels, 372 user I/Os, and high-density power/ground distribution needed for industrial and defense-grade designs. When designing with this device, plan power distribution carefully: the 0.9 V core rail can draw tens of amperes under full fabric and transceiver utilization, requiring multi-layer PCB stack-up, low-impedance planes, and bulk decoupling near each transceiver bank. Quartus II software (the legacy IDE) or Intel Quartus Prime is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor stock and pricing, Arria II GX drop-in alternatives in the same 780-FBGA package, and practical PCB power/thermal design notes that go beyond the manufacturer datasheet.

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EP2AGX190FF35C4G - Arria II GX FPGA 190K LE | Intel | 1152-FCBGA
EP2AGX190FF35C4G

EP2AGX190FF35C4G - Arria II GX FPGA 190K LE | Intel | 1152-FCBGA

The Intel EP2AGX190FF35C4G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) with 181,165 logic elements, 10,177,536 bits of embedded memory, and 612 embedded 18x18 multipliers, packaged in a 1152-ball Flip-Chip BGA (FCBGA). It features up to 12 transceiver channels operating up to 6.375 Gbps, making it suitable for high-speed serial connectivity applications including PCIe Gen2, Serial RapidIO, and Gigabit Ethernet. An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the programmable logic hierarchy between CPLDs (smaller, simpler) and ASICs (larger, higher-density, but fixed-function), and are widely used for digital signal processing, protocol bridging, and hardware acceleration. The Arria II GX family targets mid-range, transceiver-rich designs requiring a balance of logic density, DSP capability, and power efficiency. Key features include 190K equivalent logic elements (LEs), dedicated hard memory controllers, and 8-input adaptive logic modules (ALMs). The 12 full-dupight transceiver channels support data rates from 600 Mbps to 6.375 Gbps, with built-in PCIe Gen1/Gen2 hard IP blocks, CMU, and channel equalization. The 1152-FCBGA package provides a thermal resistance suitable for industrial thermal envelopes with proper PCB thermal design. The Arria II GX architecture uses a 40nm low-power process and provides transceivers with superior signal integrity through adaptive equalization and pre-emphasis. Hard IP blocks for PCIe Gen2, Serial RapidIO, and 10 Gigabit Ethernet reduce logic consumption and simplify timing closure. Embedded DSP blocks deliver up to 600 GMACS of processing throughput for high-performance DSP pipelines. Typical applications include high-speed serial interface bridging, wireless baseband processing, video broadcasting infrastructure, and PCI Express endpoint cards. The combination of transceiver density, on-chip memory bandwidth, and dedicated PCIe hard IP makes it well suited for protocol bridging and high-throughput data acquisition. When designing with this device, ensure the PCB BGA fanout and stackup meet the FCBGA escape requirements and the reference design guidelines for transceiver channels. Use the Quartus II development environment (supported releases) for synthesis, place-and-route, and SignalTap logic analysis. Power estimation should be performed early using the Quartus PowerPlay analyzer to size the core and transceiver supplies correctly. This page synthesizes distributor pricing from DigiKey and Mouser, drop-in same-family alternatives, and practical FPGA design guidance that goes beyond the manufacturer datasheet summary.

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EP2AGX190FF35C5G - 181165 LE Arria II GX FPGA, 612 I/O, FC-FBGA-1152 | Intel / Altera
EP2AGX190FF35C5G

EP2AGX190FF35C5G - 181165 LE Arria II GX FPGA, 612 I/O, FC-FBGA-1152 | Intel / Altera

The Intel / Altera EP2AGX190FF35C5G is a high-density Arria II GX Field-Programmable Gate Array built on a 40 nm process, delivering 181,165 logic elements and 9,594 Kbits of embedded memory in a 1152-ball FC-FBGA package. It targets mid-range, transceiver-rich applications requiring up to 612 user I/O pins, eight integrated transceivers operating at data rates from 600 Mbps to 3.75 Gbps (C5 speed grade), and dedicated DSP blocks for high-throughput signal processing. An FPGA (Field-Programmable Gate Array) is a programmable logic device that sits at the top of the digital semiconductor hierarchy: ASIC -> CPLD -> FPGA -> programmable logic -> semiconductor. FPGAs contain configurable logic blocks, programmable routing, and often hard IP cores (transceivers, DSP, memory controllers). The Arria II GX family balances cost, density, and integrated 3.75 Gbps transceivers, positioning it as a 'mid-range' alternative to Stratix (high-end) and Cyclone (low-cost) families for designs that need SERDES without the highest performance tier. Key features include 8 transceiver channels at 3.75 Gbps, 612 user I/O pins, 28.6 Mbits of block RAM plus 1.2 Mbits of MLAB memory, 840 DSP blocks (18x18 multipliers), 4 hard memory controllers, and 4 PLLs. The device operates from a 0.9V core supply with 1.5V/1.8V/2.5V/3.3V I/O support. Speed grade 'C5' denotes the commercial temperature range (0C to 85C) with mid-tier performance. Typical applications include wireless baseband processing, video broadcast infrastructure, industrial imaging, and high-speed serial backplane interfaces. The Arria II GX's built-in transceivers support PCIe Gen1/Gen2, CPRI/OBSAI, Serial RapidIO, and gigabit Ethernet, eliminating external PHY ICs in many designs. When designing with this device, use the Quartus II design suite (v13.0+ supports Arria II GX) and verify transceiver channel placement against board layout - high-speed SERDES require impedance-controlled differential routing. The FF35 package is the largest in the family and shares its ball-map with EP2AGX260, simplifying PCB layout reuse between density variants.

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EP2AGX190FF35C6G - Arria II GX FPGA, 190K LE, 1152-BGA | Altera
EP2AGX190FF35C6G

EP2AGX190FF35C6G - Arria II GX FPGA, 190K LE, 1152-BGA | Altera

The Altera (Intel) EP2AGX190FF35C6G is a high-density Arria II GX Field Programmable Gate Array (FPGA) with 190,000 logic elements, 612 transceivers, and 9.5 Mbits of embedded memory, housed in a 1152-ball flip-chip BGA (FCBGA) package. It is part of the Altera Arria II GX family that targets mid-range, transceiver-rich applications including wireless infrastructure, broadcast, and high-speed serial connectivity. The 'FF35' suffix denotes the F35 1152-pin FCBGA package, while 'C6' indicates the commercial -6 speed grade. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), dedicated DSP blocks, block RAM, and high-speed transceivers connected by a programmable interconnect fabric. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors, and are differentiated from ASICs by their ability to be reconfigured in the field and from CPLDs by their higher logic density and embedded memory/DSP resources. The EP2AGX190FF35C6G features integrated transceivers supporting data rates up to 6.375 Gbps per channel, dedicated 18x18 multipliers for DSP, and on-chip memory distributed across M9K blocks. The 1152-BBGA FCBGA package provides high I/O count with flip-chip attachment for superior thermal and electrical performance, suitable for high-speed serial designs requiring controlled-impedance signal integrity. Architecturally, the Arria II GX family uses a 40nm process technology with adaptive logic modules (ALMs), each containing two combinational adaptive look-up tables (ALUTs) and four registers. This architecture delivers fine-grained logic utilization and supports up to 8.4 Gbps external memory interfaces through dedicated PHY blocks. Typical applications include wireless baseband processing, 3G/4G remote radio heads, HD-SDI video broadcast equipment, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, SGMII), and military/aerospace signal processing where mid-range FPGA density is needed without the power of a Stratix-class device. Design considerations include careful PCB layout for the FCBGA package's controlled-impedance differential pairs, robust power-rail decoupling to support the transceiver analog supply (VCCA), and thermal management via thermal vias and copper pours beneath the exposed-die region. Designers should reference Altera's Arria II GX handbook and pin-out tables when migrating to the EP2AGX260 (higher-density) variant for footprint-compatible scaling. This page synthesizes Altera Arria II GX family positioning, current distributor inventory at major channels, drop-in same-package alternatives from the same family, and practical board-level design notes not found in the standalone datasheet.

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EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera
EP2AGX190FF35I3G

EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

The Intel (formerly Altera) EP2AGX190FF35I3G is a high-density Arria II GX field-programmable gate array (FPGA) delivering up to 181,165 logic elements, 612 user I/O pins, and up to 10,177,536 bits of embedded memory in a 1152-ball flip-chip BGA (FC-FBGA) package. It targets high-speed serial connectivity and high-logic-density DSP/processing applications. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded hard IP such as transceivers, block RAM, multipliers, and PLLs. Within the broader semiconductor taxonomy, an FPGA is a programmable logic device (PLD), which sits under the umbrella of digital integrated circuits (ICs) and, more specifically, application-specific standard products for parallel hardware acceleration. FPGAs are reprogrammed at the bitstream level, giving them ASIC-like performance with NRE cost near zero, making them the workhorse of prototyping, low-volume production, and reconfigurable computing. The EP2AGX190FF35I3G is fabricated on a 40 nm low-power process, supports core voltages of 0.9 V with I/O banks configurable to 1.2 V to 3.3 V standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and integrates 8 high-speed transceiver channels capable of multi-gigabit serial links. The part number suffix 'I3' denotes the industrial temperature grade (-40 °C to +100 °C junction) with speed grade 3, while the trailing 'G' indicates lead-free / RoHS-compliant lead finish. The architecture combines a logic fabric of adaptive logic modules (ALMs), M9K block RAM tiles, MLAB distributed RAM, embedded 18x18 multipliers, and a hard PCI Express Gen1/Gen2 controller. The high-speed transceivers are backed by on-die signal-conditioning circuitry, supporting protocols such as PCIe, GigE, Serial RapidIO, and serial digital video (SDI/HD-SDI). The 'FF35' package designation refers to a 35 mm body flip-chip BGA with 1152 balls on a 1.0 mm pitch - an Altera-standard high-pin-count footprint shared across multiple Arria II GX density grades. Typical applications include high-definition video broadcast and processing, wireless baseband DSP acceleration, military/aerospace signal intelligence (SIGINT) and radar preprocessing, telecom backplane bridging, medical imaging pipelines, and ASIC prototyping for ASIC-replacement designs. The combination of high logic density, embedded transceivers, and on-chip PCIe makes it well suited to data-path-heavy workloads. When designing with this part, allocate sufficient PCB layers (>= 12) for the FCBGA breakout, follow Intel/Altera power-supply sequencing requirements, and use the Quartus II / Quartus Prime design toolchain for synthesis, place-and-route, and timing closure. The large 35x35 mm package mandates a high-performance PCB stack-up; thermal management relies on a heat spreader attached directly to the flip-chip lid rather than forced-air cooling alone. This page synthesizes distributor pricing snapshots, drop-in alternative FPGAs from the same Arria II GX family, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a single, decision-ready reference.

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EP2AGX190FF35I3N - Arria II GX FPGA, 181K LE, 612 I/O, FCBGA-1152 | Intel
EP2AGX190FF35I3N

EP2AGX190FF35I3N - Arria II GX FPGA, 181K LE, 612 I/O, FCBGA-1152 | Intel

The Intel (Altera) EP2AGX190FF35I3N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process, delivering 181,165 logic elements, 7,612 Logic Array Blocks (LABs), and up to 612 user I/O pins in a 1152-ball FineLine Ball-Grid Array (FC-FBGA / FCBGA) package. Operating at a core voltage of 0.9 V with embedded transceivers up to 500 MHz, the device combines high logic density with on-chip serial transceivers targeting cost-sensitive mid-range applications. What is an FPGA? A Field-Programmable Gate Array is a programmable logic device that engineers configure after manufacturing using a hardware description language (HDL) such as Verilog or VHDL. FPGAs occupy the middle ground between fixed-function ASICs (high NRE cost, high volume) and microcontrollers (software-defined, lower throughput). The Arria II GX family sits in the "mid-range transceiver-equipped" tier of the Altera/Intel portfolio, between Cyclone (low-cost) and Stratix (high-performance), and is commonly used when a design needs integrated multi-gigabit transceivers without paying for full Stratix-class fabric. Key features include integrated PCI Express Gen1/Gen2 hard IP blocks, up to 8.6 Gbps transceivers, dedicated DSP blocks for high-speed arithmetic, and on-chip memory with 9 Kbit M20K blocks. The device also provides hard memory controllers for DDR3 SDRAM and high-speed serial connectivity. Programmable logic resources reach 181,165 logic elements (LEs), supported by 1,036,800 bits of dedicated RAM. Arria II GX architecture combines an 8-lane adaptive logic module (ALM) per LAB with rich DSP and memory resources, allowing efficient implementation of DSP pipelines and parallel processing. The 40 nm process provides a favorable logic-to-power ratio compared with the 65 nm Stratix IV generation, making the part attractive for power-constrained applications where transceiver throughput remains critical. Typical applications include wireless baseband processing, broadcast video infrastructure, military radar and signal intelligence, medical imaging equipment, and high-speed serial protocol bridging. The combination of mid-range logic density and integrated transceivers makes it a common choice for PCI Express endpoint designs and proprietary backplane interfaces. Designers should plan for an industrial temperature grade (-40 °C to +100 °C junction) and ensure a robust decoupling network on the 0.9 V core and 1.1 V/2.5 V/3.3 V auxiliary rails. Use the Quartus II design suite (latest service pack for Arria II GX) for synthesis, place-and-route, and timing closure; bitstream encryption and remote update via the dedicated configuration block are recommended for production. This page synthesizes Intel distributor pricing, drop-in same-package alternatives from the Arria II family, and practical design guidance that is not collated in the manufacturer datasheet.

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EP2AGX190FF35I5 - Arria II GX FPGA, 181165 LE, 612 I/O | Intel
EP2AGX190FF35I5

EP2AGX190FF35I5 - Arria II GX FPGA, 181165 LE, 612 I/O | Intel

The Intel (formerly Altera) EP2AGX190FF35I5 is a high-density Arria II GX Field-Programmable Gate Array fabricated on a 40 nm process, integrating 181165 logic elements, 10177536 bits of embedded memory, and 612 user I/Os in a 1152-ball flip-chip BGA (FC-FBGA) package. Built around the Arria II GX transceiver architecture, the device combines a rich general-purpose FPGA fabric with multi-gigabit transceivers, making it a drop-in fit for high-throughput serial-interface designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that lets designers configure arbitrary digital circuits through SRAM-based configuration memory. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as the main forms of hardware-level programmable logic; Arria II GX is positioned as Intel's mid-range, transceiver-rich family that bridges between Cyclone V (low-cost) and Stratix IV (high-performance) families, aimed at cost-sensitive applications that still require multi-gigabit serial links. Key features of the EP2AGX190FF35I5 include integrated transceivers supporting multi-gigabit serial protocols, hard PCIe Gen1/Gen2 IP blocks, embedded memory blocks totaling 10.18 Mbits, dedicated DSP blocks for high-throughput signal processing, and a large user-I/O count (612) which supports wide parallel interfaces to external memories such as DDR2/DDR3 SDRAM, QDRII+ SRAM, and RLDRAM II. The industrial-grade speed-grade 5 designation means timing closure is rated for -40 C to +100 C ambient operation, which is suitable for telecom, industrial imaging, and military/aerospace subsystems. The 40 nm process node provides a useful balance between static and dynamic power consumption; the -I5 speed grade is the slowest in the Arria II GX family, trading peak Fmax for lower quiescent power and improved timing margin. The 1152-ball FC-FBGA package uses flip-chip BGA technology with a land-grid pitch suited to high-density PCB designs that require multiple signal layers and a continuous ground/power plane beneath the device. Typical applications for the EP2AGX190FF35I5 include wireless baseband processing, high-definition video broadcast equipment, medical imaging pipelines, military radar and signal-intelligence front-ends, and PCIe Gen2 host-bus adapter cards. Designers typically pair the part with external DDR3 SODIMMs, Flash configuration memories (EPCS), and clock-generation PLLs to form a complete embedded signal-processing subsystem. When designing with this FPGA, plan PCB stack-up carefully: 1152 balls at fine pitch demand microvia technology, a 1 oz copper power plane, and matched-length trace tuning for the transceiver channels. Use Intel Quartus II as the design entry, synthesis, place-and-route, and timing-analysis tool; Quartus II is mandatory for transceiver IP configuration and pin planning on Arria II GX devices. This page synthesizes distributor pricing snapshots, same-package alternatives, and practical Quartus II design-flow notes that go beyond the device datasheet, helping procurement and FPGA engineers make informed sourcing and substitution decisions.

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EP2AGX190FF35I5G - Arria II GX FPGA, 181K LE, 1152-FBGA | Intel
EP2AGX190FF35I5G

EP2AGX190FF35I5G - Arria II GX FPGA, 181K LE, 1152-FBGA | Intel

The Intel (formerly Altera) EP2AGX190FF35I5G is a high-density, low-power Arria II GX Field Programmable Gate Array (FPGA) built on a 40 nm process, delivering 181,165 logic elements, 10,177,536 bits of embedded memory, and 612 user I/O in a 1152-ball Flip-Chip BGA (FC-FBGA) package. The device operates from a 0.9 V core supply and is rated for industrial temperature range (-40C to +100C), suiting it for harsh-environment embedded and communications designs. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behaviour can be reconfigured after manufacturing. FPGAs sit in the programmable logic category between fixed-function ASICs and software-driven processors, providing hardware-level parallelism for DSP, packet processing, and high-speed serial I/O. Within Intel's portfolio, the Arria II GX family targets mid-range applications that require transceivers and moderate logic density at lower power than Stratix but higher capability than Cyclone. The EP2AGX190FF35I5G integrates up to 12 embedded transceivers supporting multi-gigabit serial protocols, dedicated on-chip memory blocks, and hard PCIe, Ethernet MAC, and DDR2/DDR3 memory controller IP blocks. The 8-bit Adaptive Logic Module (ALM) architecture is backward-compatible with 4-input LUT designs, simplifying migration from older Altera families. The flip-chip BGA package enables the high I/O count and signal integrity required for parallel memory buses and multiple SERDES lanes. Typical applications include high-speed serial interface bridging, telecom baseband processing, video broadcast equipment, military/aerospace signal processing, and ASIC prototyping. The combination of transceiver-rich architecture and substantial logic resources also suits medical imaging and industrial vision systems where deterministic latency matters. When designing with this device, allocate PCB layer stack-up for the FC-FBGA fan-out, observe the in-package decoupling capacitor guidelines in the Arria II GX handbook, and validate transceiver channel performance against the IBIS-AMI models. Use the Quartus II design suite (version 13.0 or later) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Arria II GX family, and design considerations not found in the bare datasheet, providing actionable engineering context for sourcing and design decisions.

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EP2AGX190FF35I5N - Arria II GX FPGA 181K LE FC-FBGA-1152 | Intel
EP2AGX190FF35I5N

EP2AGX190FF35I5N - Arria II GX FPGA 181K LE FC-FBGA-1152 | Intel

The Intel (formerly Altera) EP2AGX190FF35I5N is a high-density, low-power Arria II GX Field Programmable Gate Array (FPGA) fabricated on a 40 nm process and housed in a 1152-ball FC-FBGA (FF35) package. The device integrates approximately 181,165 logic elements, 9,510 Kbits of embedded memory, 612 user I/Os, and up to 16 transceivers supporting multi-gigabit serial protocols. It is specified for the industrial temperature range (-40C to +100C) and operates from a 0.9 V core supply, making it suitable for power-sensitive, high-throughput embedded systems. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded hardened IP such as transceivers, block RAM, and DSP blocks. FPGAs sit hierarchically between general-purpose microcontrollers and fixed-function ASICs: they offer parallel processing, deterministic latency, and the ability to be re-programmed in-system for evolving protocols or standards. The Arria II GX family targets the mid-range transceiver market, providing multi-gigabit serial capability without the cost or power of higher-end Stratix devices. Key differentiating features of the EP2AGX190FF35I5N include up to 16 integrated transceivers supporting data rates to 3.75 Gbps (CPRI/OBSAI, PCIe Gen1, SATA, XAUI), dedicated hard memory controllers, up to 8 PLLs, and per-channel dynamic reconfiguration of PHY parameters. The 40 nm process enables substantial logic density at substantially lower static power than the prior 65 nm Stratix IV generation. Embedded PCI Express Gen1 hard IP blocks offload the protocol layer from user logic, freeing fabric for application processing. The architecture combines a rich fabric of adaptive logic modules (ALMs), M20K block RAMs, and DSP blocks supporting 18x18 multipliers. The transceiver PMA layer features adaptive equalization and output pre-emphasis, while the PCS layer implements 8b/10b, word alignment, and rate-matching logic. Multi-rail power sequencing is handled by an on-chip Voltage Sensing circuitry that cooperates with external regulators. Typical applications include wireless baseband processing (CPRI/OBSAI links between radio units and baseband cards), high-definition video broadcast infrastructure, defense and avionics signal processing, medical imaging pipelines, and industrial control planes requiring deterministic parallel DSP. Designers choose Arria II GX where Stratix IV is over-spec and Cyclone IV is under-spec. When designing with this device, ensure your PCB supports 1152-ball FC-FBGA fine-pitch BGA routing with microvia stacks, allocate sufficient PCB layers (typically 12+), and validate power-rail sequencing against the in-system update requirements. Use the Quartus II 64-bit toolchain for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Altera/Intel Arria II GX family, and practical design notes not collected in the manufacturer datasheet, providing engineers with a single decision-ready reference.

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EP2AGX260EF29C4 - 244K LE Arria II GX FPGA, 780-FBGA | Intel
EP2AGX260EF29C4

EP2AGX260EF29C4 - 244K LE Arria II GX FPGA, 780-FBGA | Intel

The Intel (formerly Altera) EP2AGX260EF29C4 is a high-density Arria II GX Field Programmable Gate Array (FPGA) integrating 244,188 logic elements, 12,038,144 bits of embedded memory, and up to 12 transceivers in a 780-ball Flip-Chip BGA (FC-FBGA) package. Built on a 40 nm low-power CMOS process, the Arria II GX family targets mid-range applications requiring a balance of logic density, DSP performance, and serial connectivity without the cost of full Stratix-class devices. An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured by the user after manufacture. FPGAs occupy a unique position in the programmable logic taxonomy: above CPLDs (which are smaller, non-volatile, and lower density) and below structured ASICs in NRE cost, while offering parallel hardware execution of algorithms in DSP, packet processing, and high-speed I/O bridge functions. The Arria II GX family is Intel's mid-range transceiver-equipped line, sitting between the low-cost Cyclone families and the high-end Stratix families. Key features of the EP2AGX260EF29C4 include 244,188 logic elements distributed across 10,260 LABs (Logic Array Blocks), 1,008 embedded 18x18 multipliers for DSP, and 12 high-speed transceivers operating up to 6.375 Gbps. The device provides 372 user I/O pins plus dedicated transceiver channels, supports a core voltage of 0.9 V, and is offered in the commercial temperature grade (-4 speed grade). Architecturally, the Arria II GX device combines a logic fabric with hard IP blocks including transceivers, PCIe Gen1 endpoints, external memory controllers (DDR3, DDR2, LPDDR2, QDRII+), and DSP blocks. The 40 nm process and Adaptive Logic Module (ALM) architecture deliver favorable logic utilization, while the transceiver block supports multiple protocols (PCIe, Serial RapidIO, Gigabit Ethernet, XAUI, CPRI) with embedded PCS logic. Typical applications include high-speed serial interface bridging in communications infrastructure, video broadcast and imaging pipelines, military and aerospace signal processing, medical imaging systems, and ASIC/ASSP prototyping. The combination of high logic density, embedded transceivers, and abundant DSP blocks makes the EP2AGX260EF29C4 well suited to designs that previously required expensive custom ASICs. When designing with this device, verify power budget and thermal dissipation using the Intel Early Power Estimator (EPE) tool before PCB layout; the 780-ball FC-FBGA requires a multi-layer PCB with controlled-impedance routing for transceiver channels and matched-length DDR3 traces for memory interfaces. The -4 commercial speed grade must be matched against timing closure targets in Quartus II design software. This page synthesizes distributor pricing across multiple sources, lists drop-in alternative MPNs sharing the same FC-FBGA-780 footprint, and provides practical design notes not found in the manufacturer datasheet alone.

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EP2AGX260EF29C4G - Arria II GX FPGA, 244K LE, 6.75Gbps | Intel
EP2AGX260EF29C4G

EP2AGX260EF29C4G - Arria II GX FPGA, 244K LE, 6.75Gbps | Intel

The Intel EP2AGX260EF29C4G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) from the Altera/Intel programmable logic portfolio, integrating 244,188 logic elements and 12,038,144 bits of embedded memory in a 780-ball FineLine BGA (FCBGA) package. It combines a rich logic fabric with up to 12 transceivers capable of 6.375 Gbps data rates, making it a turnkey solution for serial connectivity, digital signal processing, and embedded processing workloads. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells, all wired through a programmable interconnect. FPGAs sit between fixed-function ASICs and software-driven microcontrollers: they deliver ASIC-class throughput and latency while preserving full hardware reprogrammability. The Arria II GX family is Intel's mid-range transceiver-equipped family, bridging the low-cost Cyclone series and the high-end Stratix series, and is widely used in wireless baseband, broadcast video, military/aerospace, and high-speed serial I/O applications. Key features of the EP2AGX260EF29C4G include 244,188 logic elements, 12,038,144 total RAM bits, 10260 LABs/CLBs, 372 user I/Os, and 12 full-duplex transceivers operating up to 6.375 Gbps. The device also integrates 1,140 embedded 18x18 multipliers for DSP, hard PCI Express Gen1/Gen2 endpoints, and supports DDR2/DDR3 external memory interfaces. The C4 speed grade is optimized for higher logic performance than the I4 industrial grade at the cost of commercial 0C to +85C temperature range operation. Architecturally, the EP2AGX260EF29C4G uses a 40nm TSMC process node with a logic fabric composed of 8-input ALMs (Adaptive Logic Modules), dedicated MLAB (memory logic array block) memory, and 9-bit DSP blocks. Configuration is typically stored in 1.8V NOR-flash or via JTAG, with bitstream encryption and design security features supporting AES-128. The integrated transceivers use a hard PCS (physical coding sublayer) supporting 8B/10B, PCIe Gen1/Gen2, XAUI, and custom protocols at line rates from 600 Mbps to 6.375 Gbps. Typical applications include wireless baseband processing, software-defined radio, broadcast video encoding/decoding, radar and sonar signal processing, high-speed serial protocol bridging (PCIe, XAUI, Serial RapidIO), and military secure communications. The 780-BGA package exposes 8 transceiver channels and 16 global clock networks, sufficing for high-density backplane and line-card designs. When designing with this part, plan power budgeting carefully: at full utilization the Arria II GX core can consume 10W to 20W, requiring multi-layer PCB stackups with dedicated ground and power planes. Designers should use the Quartus II design suite (with continued compatibility in Intel Quartus Prime Standard Edition) and the Arria II GX Transceiver Toolkit for SI analysis. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the standalone manufacturer datasheet.

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EP2AGX260EF29C4N - 244K LE Arria II GX FPGA, 780-FCBGA | Altera
EP2AGX260EF29C4N

EP2AGX260EF29C4N - 244K LE Arria II GX FPGA, 780-FCBGA | Altera

The Altera (Intel) EP2AGX260EF29C4N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) delivering 244,188 logic elements, 12,038,144 bits of embedded memory, and integrated transceivers in a 780-pin FC-BGA package. It is fabricated on a 40 nm low-power CMOS process, supports core voltages down to 0.9 V, and provides 372 user I/O pins plus high-speed serial links for mid-range serial connectivity designs. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect. Within the broader taxonomy, an FPGA sits below ASIC in performance-per-watt but above general-purpose microcontrollers in raw parallel throughput, making it ideal for protocol bridging, signal processing, and hardware acceleration where time-to-market outweighs the cost of custom silicon. Key features include 10260 logic array blocks, 4 PCI Express hard IP blocks, 8.5 Gbps transceivers on dedicated GXB channels, dedicated DDR2/DDR3 memory controller hard IP, and configuration via passive serial, fast passive parallel, or JTAG. The 0.9 V core reduces dynamic power relative to the previous 90 nm Arria GX family while the integrated PCIe and PHY simplify board-level design. Typical applications include PCI Express Gen1/Gen2 endpoint cards, multi-gigabit serial backplane aggregation, digital video broadcast studio equipment, software-defined radio baseband pre-processing, and ASIC prototyping. Its combination of logic density and serial bandwidth makes it a frequent choice for designers migrating from Stratix II or Cyclone III designs that require a mid-bandwidth transceiver companion. When designing with this device, plan a multi-layer PCB with continuous ground and power planes; the FC-BGA's high pin count and high-speed transceivers demand controlled-impedance routing, length matching within 25 mils across GXB lanes, and a minimum of 6 PCB layers to maintain signal integrity.

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EP2AGX260EF29C5 - 244K LE Arria II GX FPGA 780-FCBGA | Intel
EP2AGX260EF29C5

EP2AGX260EF29C5 - 244K LE Arria II GX FPGA 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGX260EF29C5 is a high-density Arria II GX Field-Programmable Gate Array (FPGA) integrating 244,188 logic elements, 12,038,144 memory bits, and 372 user I/Os into a 780-ball FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package. It is built on a TSMC 40 nm low-power process and operates from a 0.9 V core supply, with speed grade -5 (C5). According to verified distributor listings, the part is offered as a 780-BBGA/FCBGA device with up to 12 Mbits of embedded memory and embedded transceivers supporting high-speed serial protocols. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic, interconnect, and I/O behaviour are defined by a user-supplied hardware description language (HDL) bitstream. In the programmable logic taxonomy, the EP2AGX260EF29C5 sits below full-mask ASICs in NRE cost and below software-programmed DSPs in deterministic latency, making it ideal for mid-volume designs, prototyping, and applications that require parallel datapaths with hardware-timed interfaces. Arria II GX specifically belongs to Intel's transceiver-equipped mid-range family, sitting between Cyclone (low-cost) and Stratix (high-performance) families. Key differentiating features include 244,188 logic elements, 12 Mbits of embedded SRAM, 372 user I/Os, embedded multi-gigabit transceivers, and 8-input adaptive logic modules (ALMs). The 40 nm process enables a favorable power/performance trade-off compared with the 65 nm Stratix IV predecessor, while the FC-FBGA package supports high-density board designs with controlled-impedance signal escape. Typical applications include high-speed serial protocol bridging (PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO), digital video broadcasting equipment, software-defined radio (SDR) baseband processing, radar and medical imaging front-ends, and telecom line cards. The combination of large logic capacity, abundant transceivers, and abundant user I/O is well suited to designs that must aggregate multiple high-speed serial links and a wide parallel data bus on one chip. Designers should plan the PCB for a 780-ball FC-FBGA escape with matched-length differential pairs for transceiver channels, and validate thermal envelopes against typical power consumption in the selected configuration. For software development, Intel Quartus II (legacy) or the maintained Quartus Prime Lite edition supports this device family with synthesis, place-and-route, and timing analysis.

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EP2AGX260EF29C5G - Arria II GX 260K LE FPGA 780-FBGA | Intel
EP2AGX260EF29C5G

EP2AGX260EF29C5G - Arria II GX 260K LE FPGA 780-FBGA | Intel

The Intel EP2AGX260EF29C5G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine Ball-Grid Array (FBGA) package. It integrates 260,000 logic elements (LE), 12,038,144 bits of embedded memory, and 244,188 bits of on-chip RAM, and exposes 372 user I/O pins, making it one of the highest-density members of the Arria II GX transceiver-equipped family. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic fabric, embedded memory blocks, DSP slices, and high-speed serial transceivers on a single die. FPGAs sit at the top of the programmable logic taxonomy - above CPLDs and discrete glue logic - and are typically deployed as hardware accelerators, protocol bridges, or signal-processing engines where microcontrollers or DSPs cannot meet throughput requirements. Key features of the EP2AGX260EF29C5G include integrated multi-gigabit transceivers (MGTs) supporting common serial standards, dedicated hardware DSP blocks for high-throughput filtering and modulation, and on-chip PLLs for clock synthesis and jitter-cleaning. The C5 speed grade targets -5C to 85C commercial operation, while the 'G' suffix indicates a lead-free, RoHS-compliant ball finish. The 780-FBGA package offers a compact 29 mm square footprint suitable for space-constrained designs. Architecturally, the device uses a 40 nm process node, an adaptive logic module (ALM) structure that is 20% more area-efficient than the prior 4-input LUT approach, and embedded transceaters capable of multi-gigabit rates. Per-block memory (MLAB/M9K/M144K) and dedicated 18x18 multipliers form the DSP backbone, while on-chip termination and dynamic reconfiguration reduce board complexity. Typical applications include high-speed serial-interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), wireless baseband signal processing, software-defined radio front-ends, video broadcast and image processing pipelines, and industrial test-and-measurement backplanes. The combination of high LE count, large memory, and integrated transceivers makes it well suited for line-card aggregation and protocol conversion designs. When designing with this device, plan power-rail sequencing early - the EP2AGX260EF29C5G requires separate VCCINT, VCCA, VCCD_PLL, and transceiver supply rails with monotonic ramp-up to avoid latch-up. Use IBIS simulation for the 372 user I/Os and ensure the FBGA land pattern matches JEDEC MS-034 to keep solder-joint yield high. This page synthesizes distributor pricing, drop-in Arria II GX family alternatives, and practical hardware-design notes not found in the manufacturer datasheet alone, giving procurement and FPGA engineers a single-source reference for the EP2AGX260EF29C5G.

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EP2AGX260EF29C5N - 244K LE Arria II GX FPGA, 780-FBGA | Intel
EP2AGX260EF29C5N

EP2AGX260EF29C5N - 244K LE Arria II GX FPGA, 780-FBGA | Intel

The Intel EP2AGX260EF29C5N is a high-density, transceiver-equipped Arria II GX field-programmable gate array (FPGA) delivering 244,188 logic elements, 10,238 Kbit of embedded memory, and 12 transceivers at up to 5 Gbps in a 780-ball flip-chip BGA (FC-FBGA) package. It is fabricated on a 40 nm process and operates from a 0.9 V core supply with support for commercial temperature grades (0 °C to +85 °C). An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured after manufacturing. FPGAs sit hierarchically under programmable logic -> logic ICs -> integrated circuits, and are the workhorse of high-throughput digital signal processing, hardware-accelerated computing, and protocol bridging. The Arria II GX family specifically targets mid-range applications that need embedded multi-gigabit transceivers (MGTs) without the cost of a full Stratix-class device. Key features include 8 PLLs (4 enhanced and 4 fast PLLs), 372 general-purpose I/O pins, support for DDR2/DDR3/QDRII/QDRII+/RLDRAM II external memory interfaces, and PCI Express hard IP blocks. The 12 full-duplex transceivers reach 5 Gbps, enabling protocols such as PCIe Gen1/Gen2, XAUI, CPRI, and Serial RapidIO. Hard IP offloads PHY and data-link layer functions, freeing programmable logic for user application code. The architecture combines adaptive logic modules (ALMs), M9K memory blocks, MLAB distributed memory, and dedicated DSP blocks for high-throughput arithmetic. The 780-ball FC-FBGA package enables high pin count and excellent signal integrity for the multi-gigabit transceivers, while the 40 nm low-power process delivers a balance of performance and power efficiency suitable for line-card, broadcast, and wireless baseband applications. Typical applications include wireless baseband processing, software-defined radio (SDR), high-speed serial protocol bridging, broadcast video processing, and PCI Express endpoint cards. The combination of 5 Gbps transceivers and abundant DSP resources makes the EP2AGX260EF29C5N particularly well-suited for wireless infrastructure where CPRI and OBSAI fronthaul links connect remote radio heads to baseband units. When designing with this device, careful attention must be paid to transceiver reference-clock jitter, PCB stack-up for 5 Gbps SerDes channels, and power sequencing for the 0.9 V core / 2.5 V/3.3 V I/O / 1.2 V transceiver analog supplies. Quartus II design software (Altera Complete Design Suite 13.1 or later) is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes for the EP2AGX260EF29C5N that are not found in the standalone manufacturer datasheet.

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EP2AGX260EF29C6 - Arria II GX 244K Logic Elements FPGA | Intel
EP2AGX260EF29C6

EP2AGX260EF29C6 - Arria II GX 244K Logic Elements FPGA | Intel

The Intel EP2AGX260EF29C6 is a high-density Arria II GX field-programmable gate array (FPGA) delivering 244,188 logic elements, 12,038,144 memory bits, and integrated transceivers in a 780-ball FC-FBGA (EF29) package. Built on TSMC's 40nm process, the Arria II GX family targets mid-range applications requiring a balance of logic density, memory bandwidth, and serial connectivity at low total system cost. The device combines a high-performance FPGA fabric with up to 12.5 Gbps transceivers and dedicated DSP blocks. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs) within the integrated circuits taxonomy: FPGA -> PLD -> logic IC -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured after the application is deployed, enabling hardware-level parallelism, rapid prototyping, and post-sale design updates. The Arria II GX family sits between Cyclone (low-cost) and Stratix (high-performance) in Intel's FPGA lineup. Key features of the EP2AGX260EF29C6 include 244,188 logic elements, 12,038,144 bits of embedded memory, 612 embedded 18x18 multipliers for DSP, 12 transceiver channels supporting data rates up to 6.375 Gbps, and 372 general-purpose I/O pins. The device operates from a 0.9 V core supply and supports commercial temperature grades (0C to +85C). The 780-ball FC-FBGA package integrates flip-chip interconnect for high signal integrity at multi-gigabit speeds. Architecturally, the Arria II GX uses 8-input adaptive logic modules (ALMs), each containing two combinational adaptive LUTs (ALUTs) and four dedicated registers. This structure delivers fine-grained logic utilization and efficient implementation of wide fan-in functions. The transceiver blocks integrate physical coding sublayer (PCS) and physical medium attachment (PMA) layers, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, GPON, and CPRI. Hard memory controllers and PLLs reduce fabric utilization for common system tasks. Typical applications include high-definition video processing, wireless baseband, military radar signal processing, ASIC prototyping, and high-speed serial interface bridging. The combination of transceiver bandwidth and DSP resources makes this device particularly well-suited for systems requiring real-time signal processing with multi-gigabit I/O. When designing with this part, plan PCB layout for the FC-FBGA package using microvia and via-in-pad technology; signal integrity on transceiver channels depends on controlled-impedance routing and proper decoupling. Quartus II design software is required for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Arria II GX family, and PCB-layout design notes not duplicated in the manufacturer datasheet.

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EP2AGX260EF29C6G - Arria II GX FPGA 244K LE, 780-FCBGA | Intel
EP2AGX260EF29C6G

EP2AGX260EF29C6G - Arria II GX FPGA 244K LE, 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGX260EF29C6G is a high-density Arria II GX Field Programmable Gate Array (FPGA) fabricated on a 40 nm process, integrating 244,188 logic elements, 12,038,144 RAM bits, and 372 embedded 18x18 multipliers in a 780-ball FineLine BGA (FC-FBGA) package. The device is part of Intel's mid-range Arria II GX family targeting transceiver-rich applications such as video broadcast, wireless infrastructure, and high-speed serial connectivity. It operates from a 0.9 V core supply and supports transceiver data rates and a -6 commercial speed grade. What is a mid-range FPGA? A Field Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), dedicated DSP blocks, on-chip memory, and programmable interconnect that can be reconfigured by the customer after manufacture. The Arria II GX family occupies the mid-density, mid-performance segment between Intel's low-cost Cyclone and high-end Stratix families, balancing logic capacity, transceiver performance, and cost for mainstream applications. With 244K logic elements, it provides substantial DSP and memory resources in a single device. Key features include integrated transceivers supporting multi-gigabit serial protocols, 12 Mb of embedded RAM for buffering high-bandwidth data streams, 372 hardware DSP blocks accelerating fixed- and floating-point operations, and dedicated PLL and clocking infrastructure for jitter-sensitive designs. The 780-ball FC-FBGA package enables high I/O density on multi-layer PCBs with controlled-impedance routing. The -6 speed grade designates a faster commercial-temperature timing bin than the -7 or -8 grades. The Arria II GX architecture combines a logic fabric, M9K/M144K memory blocks, variable-precision DSP blocks, and PCI Express hard IP, optimized for data-path heavy applications where deterministic throughput matters more than absolute peak frequency. The 40 nm process provides favorable power-performance scaling relative to earlier 65 nm and 90 nm FPGA generations. Typical applications include broadcast video processing and encoding, wireless baseband and RF signal processing, industrial imaging and machine vision, high-speed serial protocol bridging, military radar and signal intelligence, and PCI Express endpoint or root-complex designs. The combination of density and embedded transceivers makes the EP2AGX260EF29C6G well-suited for prototyping of mid-volume designs. When designing with this device, careful attention must be paid to transceiver channel placement to meet signal-integrity requirements, and the Quartus II / Intel Quartus Prime toolchain must be used for synthesis, place-and-route, and timing closure. Power estimation via the PowerPlay early power estimator should precede PCB layout to avoid post-layout surprises. This page consolidates real-time distributor pricing, drop-in compatible Arria II GX variants, and Quartus Prime design considerations that complement the official datasheet. Cross-references and lifecycle status are kept current against Intel product change notifications.

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EP2AGX260EF29C6N - Arria II GX FPGA 244K LE 780-FCBGA | Intel
EP2AGX260EF29C6N

EP2AGX260EF29C6N - Arria II GX FPGA 244K LE 780-FCBGA | Intel

The Intel (Altera) EP2AGX260EF29C6N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process and housed in a 780-ball FineLine BGA (FC-FBGA, 29 x 29 mm). It integrates 244,188 logic elements (LEs), approximately 12,038,144 bits of embedded memory (M9K blocks plus MLAB), 372 user I/O pins, and a rich collection of hardened intellectual property including up to 16 transceivers capable of 6.375 Gbps operation for protocols such as PCIe Gen2, CPRI, OBSAI, Serial RapidIO, and 10G Ethernet. A core voltage of 0.9 V with on-chip regulators simplifies power-tree design. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources (memory, DSP, transceivers) into a single silicon fabric. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism and sub-microsecond reconfiguration. Arria II GX belongs to Altera's mid-range transceiver-equipped FPGA family, optimized for cost-sensitive high-speed serial I/O designs, bridging between the lower-cost Cyclone families and the high-end Stratix families. Key features of the EP2AGX260EF29C6N include hardened PCI Express Gen2 x1/x2/x4 endpoints, dedicated 6.375 Gbps transceivers with physical coding sublayer (PCS) and physical medium attachment (PMA) blocks, up to 1,148 embedded 18x18 multipliers (variable by device variant), and 32-bit DDR3 SDRAM external memory interfaces with integrated PHY. The -C6N speed grade provides a balanced trade-off between Fmax and power consumption, while the industrial-grade 'I' option and 0.9 V core simplify PCB power distribution when paired with high-efficiency switching controllers. The 780-ball FCBGA package exposes 8 transceiver channels per side in dedicated GXB banks. Architecturally, the EP2AGX260EF29C6N organizes logic into Adaptive Logic Modules (ALMs) of 8-input fracturable look-up tables with dedicated arithmetic and register resources, paired with high-speed routing lines between LABs and column/row interfaces. Transceiver channels integrate serializer/deserializer, PLL, and equalization, allowing direct connection to SFP+, SFP, and backplane SERDES without external PHY. The 40 nm process technology, combined with Altera's Quartus Prime toolchain, delivers timing closure on complex multi-channel serial designs. Typical applications for the EP2AGX260EF29C6N include wireless baseband processing in LTE/WiMAX base stations, broadcast video routers with SMPTE 259M/292M/424M SDI, defense signal-intelligence front ends, medical imaging preprocessing pipelines (CT, MRI, ultrasound beamforming), industrial high-speed data acquisition, and ASIC prototyping for networking line cards. The high logic density and PCIe Gen2 hard IP make it ideal for system controller and co-processing daughter cards on ATCA/AMC platforms. When designing with this device, plan the power-tree for the 0.9 V core with adequate decoupling (multiple 0.1 uF + 10 uF + bulk ceramic capacitors) and assign high-speed transceiver pins early in PCB layout to keep loss budget under control. Quartus Prime provides synthesis, place-and-route, and SignalTap logic analyzer integration, with optional Qsys platform designer for system-level IP assembly. This page consolidates distributor pricing, drop-in alternatives, and practical design notes that are not aggregated in the manufacturer datasheet, helping procurement and design engineers quickly assess this part.

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EP2AGX260EF29I3G - 244K LE Arria II GX FPGA, 780-FCBGA | Intel
EP2AGX260EF29I3G

EP2AGX260EF29I3G - 244K LE Arria II GX FPGA, 780-FCBGA | Intel

The Intel EP2AGX260EF29I3G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) with 244,188 logic elements and 12,038,144 bits of embedded memory, fabricated on a 40 nm process node and housed in a 780-ball Flip-Chip BGA (FCBGA) package. It supports a maximum internal operating frequency of up to 500 MHz across its logic fabric and incorporates 372 user I/O pins, making it suitable for high-throughput digital designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit within the broader category of programmable logic devices (PLDs) > digital integrated circuits > semiconductors. The Arria II GX family specifically targets mid-range applications requiring a balance of logic density, transceiver bandwidth, and power efficiency, placing it between Cyclone (low-cost) and Stratix (high-performance) families within Intel's (formerly Altera's) FPGA portfolio. Key features of the EP2AGX260EF29I3G include 244,188 logic elements, 12 Mbits of embedded memory, integrated transceivers supporting multi-gigabit serial interfaces, on-chip multipliers for DSP operations, and a 0.9 V core supply. The 40 nm process technology provides an optimal balance between static and dynamic power consumption, which is critical for thermally constrained embedded systems. The architecture combines a lookup-table-based logic fabric with hard DSP blocks, block RAM (M9K/M144K), and high-speed serial transceivers. This heterogeneous structure enables designers to implement complex signal processing pipelines, packet processing engines, and high-speed interface bridging without sacrificing logic utilization. Typical applications include wireless baseband processing, high-definition video broadcast equipment, military secure communications, industrial machine vision, and high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet). The industrial temperature grade (-40C to +100C) makes it appropriate for harsh-environment deployments. When designing with this device, ensure proper power decoupling and thermal management. The 780-ball FCBGA package requires controlled-impedance PCB stackup and high-quality BGA assembly processes. Designers should reference the manufacturer datasheet for transceiver channel placement, PLL configuration, and I/O standard support. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.

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EP2AGX260EF29I3N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel (Altera)
EP2AGX260EF29I3N

EP2AGX260EF29I3N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel (Altera)

The Intel (formerly Altera) EP2AGX260EF29I3N is a high-density Arria II GX field-programmable gate array (FPGA) delivering 244,188 logic elements (LE) and 12,038,144 bits of embedded memory in a 780-ball fine-pitch BGA package. The device is fabricated on a 40 nm low-power process and operates from a 0.9 V core supply with industrial temperature grade (-40 °C to +100 °C). What is a mid-range FPGA? A field-programmable gate array is a semiconductor IC containing an array of configurable logic blocks (CLBs), dedicated block RAM, DSP slices, and high-speed transceivers that can be reprogrammed post-manufacture to implement custom digital logic, signal-processing pipelines, or interface protocols. Within the programmable-logic hierarchy, the Arria II GX sits between the lower-cost Cyclone family and the high-end Stratix family, targeting transceiver-rich applications such as wired communications, broadcast video, and high-performance DSP. Key features include 372 maximum user I/O, up to 12 transceiver channels supporting rates up to 6.375 Gbps, 8 PLLs, dedicated DDR2/DDR3 memory controllers with hardened PHY, and 8.7 Mbit of M20K block RAM. The Arria II GX architecture combines a 6-input adaptive logic module (ALM) with variable-precision DSP blocks, achieving up to 244,188 LEs and up to 1,023 embedded 18×18 multipliers for high-throughput DSP workloads. The integrated transceivers support CPRI, PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and Serial Digital Interface (SDI), enabling direct connectivity to backplanes, optical modules, and ASIC/ASSP co-processors without external PHY. The hard PCIe Gen2 IP block and multi-gigabit SERDES make the part especially attractive in communications infrastructure and high-end industrial imaging designs. Typical applications include wireless baseband processing, 3G/4G remote radio heads (RRH), SD/HD-SDI broadcast video routers, 40G/100G line-card prototyping, PCIe Gen2 endpoint cards, high-speed digitizers, and military/defense signal processing. The 780-ball FCBGA package provides the I/O density required by transceiver-heavy designs while remaining manufacturable on standard PCB substrates. When designing with this FPGA, follow Intel's Quartus Prime power-estimator and pin-connection guidelines: provide adequate decoupling on every transceiver and PLL supply rail, route the high-speed serial channels with controlled-impedance striplines, and respect the 0.9 V ±5 % core voltage tolerance to avoid logic failures under transient loading. This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP2AGX260EF29I5 - Arria II GX 260K LE FPGA, 780-FCBGA | Intel
EP2AGX260EF29I5

EP2AGX260EF29I5 - Arria II GX 260K LE FPGA, 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGX260EF29I5 is a high-density Arria II GX Field Programmable Gate Array delivering 244,188 logic elements, 244,188 adaptive logic modules, and up to 12,038,144 bits of embedded memory in a 780-pin FCBGA package with 372 user I/O pins. The device is fabricated on a 40 nm low-power CMOS process and operates at a core voltage of 0.9 V with a maximum core frequency of 500 MHz. An FPGA (Field Programmable Gate Array) is a programmable semiconductor device whose logic architecture consists of an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and routing resources. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs) and are widely used as flexible alternatives to ASICs in designs that require parallel processing, high I/O throughput, or hardware-accelerated signal paths. Key features include eight high-speed transceivers capable of up to 3.75 Gbps for serial connectivity, up to 736 Kbits of distributed RAM per LAB block, support for DDR2/DDR3/QDRII+ external memory interfaces, and dedicated 18x18 multipliers for DSP applications. The Arria II GX family also integrates PCI Express hard IP blocks (x1, x2, x4 lanes Gen1/Gen2) and supports serial RapidIO, providing protocol-aware interfaces that simplify high-bandwidth designs. The EP2AGX260EF29I5 architecture leverages 10,260 LABs (Logic Array Blocks) built on Intel's adaptive logic module structure, paired with 256 DSP blocks for high-throughput arithmetic. The 0.9 V core voltage combined with 40 nm process technology achieves a balance between logic density and power efficiency, making the part attractive for mid-density, mid-bandwidth designs. Typical applications include high-speed data acquisition, wireless baseband processing, broadcast video processing, defense radar, medical imaging, and high-performance networking equipment where PCI Express, serial RapidIO, or multi-gigabit transceivers are needed without resorting to high-end Stratix-class devices. When designing with the EP2AGX260EF29I5, ensure the PCB layout uses high-density signal integrity practices: matched impedance for the 3.75 Gbps transceivers, sufficient decoupling near each power pin, and proper thermal vias under the FCBGA to remove heat from the 780-ball package. This page synthesizes distributor pricing, same-family Arria II GX alternatives, and design considerations that go beyond the manufacturer datasheet.

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EP2AGX260EF29I5G - Arria II GX FPGA 244K LE | Intel | 780-FBGA
EP2AGX260EF29I5G

EP2AGX260EF29I5G - Arria II GX FPGA 244K LE | Intel | 780-FBGA

The Intel (formerly Altera) EP2AGX260EF29I5G is a high-density Arria II GX Field Programmable Gate Array with 244,188 logic elements, 12,038,144 memory bits, and 372 maximum user I/Os, housed in a 780-ball FC-FBGA package measuring 29x29 mm. It is fabricated on a 40 nm process node and operates at a core voltage of 0.87 V to 0.93 V. The device integrates up to 12 transceiver channels (6.375 Gbps), making it suitable for high-speed serial I/O applications such as PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI/OBSAI backhaul. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device consisting of an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect fabric. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) and are widely used to implement parallel digital logic, custom I/O protocols, hardware-accelerated DSP, and prototyping of ASICs. The Arria II GX family in particular combines high logic density with embedded transceivers, occupying the mid-range position between Altera's Stratix high-end series and the lower-cost Cyclone series. Key features include 1,026 embedded multiplier blocks (18x18) for DSP-intensive workloads, 8.55 Mbits of embedded memory (triple-mode with parity support), and dedicated hardware for PCI Express hard IP. The device supports configuration via JTAG, passive serial, fast passive parallel, and Active Serial (EPCS) modes, with built-in error correction for configuration memory. The EP2AGX260EF29I5G uses Altera's 40 nm low-power process, providing a balance between performance and dynamic power. Quartus II software with Arria II device support is used for synthesis, place-and-route, timing closure, and power estimation. Hard IP blocks accelerate common functions including PCIe Gen2 x8 endpoints, multi-gigabit transceivers, and external memory controllers for DDR3, DDR2, and QDR II+ memories. Typical applications include wireless baseband processing, software defined radio (SDR), broadcast video processing, industrial imaging and machine vision, military secure communications, and high-performance compute accelerators. The integrated transceivers also make it well-suited for protocol bridging between PCIe, Ethernet, and Serial RapidIO. When designing with this device, pay close attention to transceiver reference clock routing, decoupling capacitor placement around the FBGA, and thermal management - the device can dissipate tens of watts in dense transceiver-driven designs. Use Altera's Quartus II power analyzer early in the design cycle. This page synthesizes distributor pricing, drop-in alternatives from the Arria II GX family, and practical design notes not consolidated in any single manufacturer document. All cross-brand equivalents are sourced from published web references.

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EP2AGX260EF29I5N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel
EP2AGX260EF29I5N

EP2AGX260EF29I5N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel

The Intel (Altera) EP2AGX260EF29I5N is a high-density Arria II GX Field-Programmable Gate Array delivering 244,188 logic elements, 12,038,144 bits of embedded memory, and 1,152 18x18 multipliers in a 780-ball flip-chip BGA (FCBGA) package measuring 29 mm x 29 mm. The device integrates up to 12 high-speed transceivers operating at data rates up to 3.75 Gbps (CPLL) or 5 Gbps (channel PLL), making it suitable for PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and Serial Digital Interface (SDI) serial links. Industrial temperature grade (-40C to +100C) and speed grade 5 place it in the mid-speed tier of the Arria II GX family. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic, memory blocks, DSP blocks, and high-speed serial interfaces on a single silicon die. FPGAs sit hierarchically within semiconductor devices as integrated circuits that combine the flexibility of software-configurable hardware with deterministic parallel processing. The Arria II GX family targets mid-range applications that bridge the gap between Cyclone low-cost devices and Stratix high-performance devices, offering a balance of logic density, transceiver bandwidth, and power efficiency for communications, broadcast, and military/aerospace systems. Key features include 372 user I/O pins, 12 transceivers arranged in 4 transceiver blocks, support for DDR2/DDR3/QDRII/QDRII+ external memory interfaces, and dedicated PLL resources per quadrant. The device fabric uses Altera's adaptive logic module (ALM) architecture with 8-input fracturable look-up tables (LUTs), enabling efficient mapping of complex combinational and sequential logic. The 780-ball FCBGA package exposes 372 general-purpose I/O plus dedicated high-speed serial, clock, and configuration pins. The Arria II GX architecture pairs a robust logic fabric with hardened intellectual property (IP) blocks such as PCIe Gen2 hard IP, external memory controllers, and on-chip termination (OCT) calibration. This integration reduces soft-IP overhead and frees fabric resources for application logic. Transceivers support multiple bonding configurations and reference clock topologies (including differential and single-ended) to accommodate a wide variety of PCB layouts. Typical applications include wireless baseband processing, broadcast video processing, radar and electronic warfare signal chains, military secure communications, industrial imaging, and high-speed serial protocol bridging. Designers also use Arria II GX in test and measurement equipment where deterministic latency and flexible I/O are required. When designing with this FPGA, plan for JTAG-based configuration using an Altera/Intel download cable (USB-Blaster or equivalent) and ensure the PCB includes clean transceiver analog supply rails (VCCA, VCCP, VCCR) with proper decoupling. The 780-FCBGA package requires a multilayer PCB with controlled-impedance routing for the transceiver channels and matched-length lanes within each transceiver bank. This page synthesizes distributor pricing, industrial temperature and speed grade variants, and practical design notes not found in the manufacturer datasheet.

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EP2AGX260FF35C4 - Arria II GX FPGA 244K LE, 1152-FCBGA | Intel
EP2AGX260FF35C4

EP2AGX260FF35C4 - Arria II GX FPGA 244K LE, 1152-FCBGA | Intel

The Intel (formerly Altera) EP2AGX260FF35C4 is a high-density Arria II GX field-programmable gate array (FPGA) from the 40 nm Arria II GX family, integrating 244,188 logic elements, 612 user I/O, 12,038,144 bits of embedded memory, and 612 embedded 18x18 multipliers in a 1152-ball FC-FBGA package. It is specified at the C4 commercial speed grade with a 0.9 V core supply and supports transceiver-rich designs requiring both high logic capacity and high-speed serial I/O. According to the Arria II GX Device Data Sheet referenced on Altera/Intel documentation portals, the FF35 package denotes the 35 mm FC-BGA footprint used for the highest-density Arria II GX members. The Arria II GX family occupies the mid-to-high tier of Altera/Intel FPGAs and is positioned between the lower-power Cyclone families and the high-end Stratix families. FPGAs in this class are typically used in applications that demand hundreds of thousands of logic elements together with multi-gigabit transceivers, on-chip memory blocks, and DSP multipliers, all without migrating to a Stratix-class device. The Arria II GX line introduced integrated transceivers operating up to 6.375 Gbps and hard PCIe Gen2 IP blocks, making it attractive for cost-sensitive yet transceiver-rich designs. Key features of the EP2AGX260FF35C4 include 244,188 logic elements organized into 10,260 logic array blocks (LABs), 612 maximum user I/O pins routed through 12 I/O banks supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and 612 18x18 hardware multipliers for DSP. The FF35 speed/package combination delivers the highest logic density and pin count in the family while maintaining the commercial junction temperature range. Typical applications include high-definition video broadcast equipment, wireless baseband processing, PCIe Gen2 endpoint/root-port designs, ASIC prototyping, and high-speed serial interface aggregation (e.g., multi-channel SATA, SAS, or CPRI). The FF35 package is also widely used in defense and test-and-measurement platforms where dense, transceiver-capable FPGAs are required. Designers should consult the Arria II GX handbook and AN551 guidance for transceiver channel placement and PCB stack-up recommendations when targeting multi-gigabit links. When designing with this device, pay close attention to transceiver reference clock architecture, PLL configuration, and decoupling strategies; the FF35 package's 1152-ball count requires careful escape routing. Quartus II software (with Arria II GX device support) is the required toolchain for synthesis, place-and-route, and configuration bitstream generation.

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