Intel の EP2AGX190EF29I5G - Arria II GX FPGA 181K LE | Intel | 780-FBGA EP2AGX190EF29I5G - 電子部品
Intel

EP2AGX190EF29I5G - Arria II GX FPGA 181K LE | Intel | 780-FBGA

部品番号: EP2AGX190EF29I5G ✓ 生産中
在庫あり 1〜3営業日以内に発送
0.9 V Vdss 780-FBGA (flip-chip BGA) Package 500 MHz Speed 10,177,536 bits Memory
開始価格 $1900 USD / 個
MOQ: 1 |
価格更新日: 2026-09-08
ボリューム価格
数量 単価 小計
1 $2463.09 $2,463.09
10 $2350 $23,500.00
100 $2180 $218,000.00
250 $2050 $512,500.00
500 $1900 $950,000.00
ℹ️ すべての価格はUSDです
データシートを見る (PDF) 代替品を見る

EP2AGX190EF29I5G 概要

The Intel EP2AGX190EF29I5G is a high-density Arria II GX field-programmable gate array (FPGA) delivering 181,165 logic elements, 10,177,536 memory bits, and integrated transceivers in a 780-ball flip-chip BGA package. Built on a 40 nm low-power process, it operates from a 0.9 V core supply and supports up to 500 MHz fabric performance with 372 user I/O pins.

An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than at silicon fab time. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are commonly used to prototype ASICs, accelerate parallel workloads, and implement custom I/O protocols. Arria II GX specifically targets mid-range applications that require integrated multi-gigabit transceivers (up to 6.375 Gbps) and moderate logic density, sitting between the lower-cost Cyclone family and the high-end Stratix family in Intel's FPGA portfolio.

Key features of the EP2AGX190EF29I5G include integrated transceivers supporting PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and multiple CPRI/OBSAI data rates; dedicated on-chip memory blocks (M9K/M144K); embedded DSP blocks for high-performance fixed- and floating-point arithmetic; and 8-input adaptive logic modules (ALMs) that pack twice the effective logic of prior 4-input LUT architectures. The device also includes hard memory controllers, PLLs, and dynamic reconfiguration support.

The Arria II GX architecture combines a logic fabric with hard intellectual-property (IP) blocks such as transceivers, PCIe hard IP, and external memory interfaces. This integration reduces logic overhead typically spent serializing/deserializing data, freeing ALMs for application code while delivering deterministic latency across all six transceiver channels at line rates up to 6.375 Gbps.

Typical applications include wireless baseband processing, broadcast video infrastructure, military secure communications, high-performance DSP for radar/sonar, PCIe Gen2 endpoint/root-port cards, and high-speed serial protocol bridging. The 780-pin FC-FBGA package supports the transceiver channels, 372 user I/Os, and high-density power/ground distribution needed for industrial and defense-grade designs.

When designing with this device, plan power distribution carefully: the 0.9 V core rail can draw tens of amperes under full fabric and transceiver utilization, requiring multi-layer PCB stack-up, low-impedance planes, and bulk decoupling near each transceiver bank. Quartus II software (the legacy IDE) or Intel Quartus Prime is required for synthesis, place-and-route, and bitstream generation.

This page synthesizes distributor stock and pricing, Arria II GX drop-in alternatives in the same 780-FBGA package, and practical PCB power/thermal design notes that go beyond the manufacturer datasheet.

ドロップイン代替品: EP2AGX190EF29I5G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP2AGX190EF29I5G （同一形状・フットプリント） — 相違点: Package, Family, Operating Temperature, Speed Grade, Mounting Type.

Intel
Package: 780-ball FCBGA, 29 mm
Operating Temperature: 0C to +85C (Commercial)
Speed Grade: C4
比較対象 EP2AGX190EF29I5G →
Altera
Package: 780-BBGA, FCBGA (Flip Chip BGA)
Speed Grade: 5 (suffix C5G)
比較対象 EP2AGX190EF29I5G →
Intel
Package: 780-ball FCBGA (Flip-Chip BGA)
Family: Arria II
Operating Temperature: 0C to 85C (commercial)
比較対象 EP2AGX190EF29I5G →
Intel
Package: 780-Ball FC-FBGA (EF29), 29 mm body
Family: Altera Arria II GX
比較対象 EP2AGX190EF29I5G →
Intel
Package: 780-FBGA (FC-FBGA, 29x29 mm)
比較対象 EP2AGX190EF29I5G →

クイック比較ツール — 並列比較する代替部品を選択:

EP2AGX190EF29I3G

✅ ドロップイン
Intel
📦 780-FBGA (F29)
Arria II GX · Altera Arria II GX · 40 nm · 181,165 · 10,177,536 · 372 · 16 · 6.375 Gbps

✓ 在庫あり

$1195 / 個

データシートを見る →

EP2AGX190EF29C6G

✅ ドロップイン
Intel
📦 780-FBGA (F29)
Arria II GX · Arria II · 190,000 · 181,165 · 10,177,536 (12,144 Kbit) · 372 · 0C to 85C (commercial) · -6

✓ 在庫あり

$1010 / 個

データシートを見る →

EP2AGX190EF29C5G

✅ ドロップイン
Altera
📦 780-FBGA (F29)
Arria II GX · 181,165 · 7,612 · 10,177,536 bits · 372 · 780-BBGA, FCBGA (Flip Chip BGA) · Surface Mount · 5 (suffix C5G)

✓ 在庫あり

$1071.99 / 個

データシートを見る →

EP2AGX190EF29C4G

✅ ドロップイン
Intel
📦 780-FBGA (F29)
Arria II GX · 181,165 · 10,177,536 · 372 · 372 · 8 (up to 6.375 Gbps) · 40 nm · 0.9 V

✓ 在庫あり

$2510 / 個

データシートを見る →

EP2AGX190EF29I5G 最大定格＆電気的特性

Family Arria II GX
Logic Elements 181,165
On-chip Memory 10,177,536 bits
Maximum User I/O 372
Maximum Transceiver Data Rate 6.375 Gbps
Core Voltage 0.9 V
Process Technology 40 nm
Maximum Fabric Frequency 500 MHz
パッケージ 780-FBGA (flip-chip BGA)
動作温度 -40C to +100C (industrial)
実装タイプ Surface Mount
RoHS ステータス Compliant
Lead Free Yes

EP2AGX190EF29I5G 780-fbga (flip-chip bga) ピン配置ガイド

EP2AGX190EF29I5G (780-fbga (flip-chip bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

EP2AGX190EF29I5G の 780-fbga (flip-chip bga) パッケージピン配置図

詳細なピン配置データはありません: EP2AGX190EF29I5G.

詳細は データシート をご参照ください。

主な用途

EP2AGX190EF29I5G の用途: 6 件s: Wireless Baseband Processing, PCI Express Gen2 Endpoint/Root-Port Card, Broadcast Video Infrastructure, High-Performance DSP for Radar/Sonar, Serial RapidIO Switch Fabric, High-Speed Protocol Bridging.

📡

Wireless Baseband Processing

The EP2AGX190EF29I5G's 181,165 logic elements and integrated transceivers up to 6.375 Gbps make it ideal for 4G/LTE baseband processing cards. Its CPRI/OBSAI support at line rates up to 4.915 Gbps enables fronthaul links between baseband units and remote radio heads, while the 372 user I/Os accommodate high-bandwidth ADC/DAC interfaces common in multi-antenna MIMO designs.

おすすめ

EP2AGX190EF29C5G · Altera EP2AGX190EF29I3G · Intel
🖥️

PCI Express Gen2 Endpoint/Root-Port Card

With hard PCIe Gen2 IP blocks and dedicated transceiver channels, the EP2AGX190EF29I5G can implement endpoint or root-port designs at line rate 5 Gbps without consuming ALM resources for serialization. The 780-FBGA package supports the transceiver pinout required for x4/x8 lane configurations, while 181K logic elements accommodate protocol stacks, DMA engines, and application logic on a single device.

おすすめ

EP2AGX190EF29I5G · Intel
📺

Broadcast Video Infrastructure

The EP2AGX190EF29I5G supports Serial Digital Interface (SDI) standards up to 3G-SDI through its transceivers, and the 181K logic elements handle video processing, scaling, and format conversion. Its industrial temperature range suits outdoor encoder/decoder installations. The 10 Mbit embedded memory buffers large video frames without external SRAM, simplifying board layout.

おすすめ

EP2AGX190EF29C6G · Intel
✈️

High-Performance DSP for Radar/Sonar

The EP2AGX190EF29I5G's dedicated DSP blocks perform fixed- and floating-point arithmetic for radar pulse compression, beamforming, and sonar signal processing. Combined with high-speed ADC interfaces through transceivers, it can process multiple channels of RF data in parallel. The industrial temperature rating supports ruggedized military environments where Arria II GX is qualified.

おすすめ

EP2AGX125EF29I5G · Intel
🌐

Serial RapidIO Switch Fabric

RapidIO at 3.125 or 5 Gbps line rates is fully supported by the EP2AGX190EF29I5G's transceivers, making it suitable for embedded compute cluster fabrics in defense and aerospace applications. The 372 user I/Os handle local processor links (PowerPC, ARM SoC), and 181K logic elements implement switching logic, DMA, and error-handling without external ASSPs.

おすすめ

EP2AGX190EF29I3G · Intel
🔧

High-Speed Protocol Bridging

The EP2AGX190EF29I5G bridges between incompatible high-speed serial protocols - for example, Serial RapidIO to Gigabit Ethernet, or PCIe to CPRI - using its integrated transceivers and 181K logic elements for protocol translation. The industrial temperature range and proven reliability make it preferred for telecom and industrial control bridging applications.

おすすめ

EP2AGX125EF35I5G · Intel

おすすめ製品の概要

EP2AGX190EF29C5G Altera 使用用途: Wireless Baseband Processing EP2AGX190EF29I3G Intel 使用用途: Wireless Baseband Processing, Serial RapidIO Switch Fabric EP2AGX190EF29I5G Intel 使用用途: PCI Express Gen2 Endpoint/Root-Port Card EP2AGX190EF29C6G Intel 使用用途: Broadcast Video Infrastructure EP2AGX125EF29I5G Intel 使用用途: High-Performance DSP for Radar/Sonar EP2AGX125EF35I5G Intel 使用用途: High-Speed Protocol Bridging
What is the logic element count of EP2AGX190EF29I5G?
The EP2AGX190EF29I5G contains 181,165 logic elements according to the Arria II GX device handbook. Combined with 10,177,536 bits of on-chip embedded memory and dedicated DSP blocks, this places the device in the upper mid-range of the Arria II GX family. The 780-FBGA package supports the full I/O count of 372 user pins plus integrated transceiver channels.
What package does EP2AGX190EF29I5G use?
The EP2AGX190EF29I5G is housed in a 780-ball flip-chip BGA (780-FBGA) package per the Altera ordering code 'F29'. Flip-chip construction provides lower inductance than wire-bond variants, which is essential for the integrated multi-gigabit transceivers. The package supports industrial-grade operating temperatures from -40C to +100C.
What is the maximum transceiver data rate of EP2AGX190EF29I5G?
The EP2AGX190EF29I5G supports transceiver line rates up to 6.375 Gbps per the Arria II GX handbook. At this rate the device can implement PCI Express Gen2, Serial RapidIO, Gigabit Ethernet, CPRI, and OBSAI protocols natively. Each transceiver channel includes dedicated physical coding sublayer (PCS) and clock-data recovery (CDR) circuitry.
What core voltage does EP2AGX190EF29I5G require?
The EP2AGX190EF29I5G core operates at 0.9 V supplied through dedicated VCC pins on the 780-FBGA package. Transceiver channels and I/O banks operate at separate voltages (typically 1.2 V for transceivers, 1.5/1.8/2.5/3.3 V for I/O) that must be supplied independently. A multi-rail power management solution is required for proper operation.
Where can I download the EP2AGX190EF29I5G datasheet?
The official Arria II GX Device Handbook is hosted at https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/hb/arria-ii-gx/arria_ii_gx_handbook.pdf. This document contains the pinout, electrical characteristics, and transceiver specifications for the EP2AGX190EF29I5G. Register with your Intel FPGA representative for access to errata sheets and IBIS simulation models.
What software is required to program EP2AGX190EF29I5G?
The EP2AGX190EF29I5G is programmed using Intel Quartus Prime (or legacy Quartus II) design software. Quartus handles synthesis, place-and-route, timing analysis, power estimation, and bitstream generation. Transceiver and PCIe hard IP require licensed IP cores available through the Quartus IP catalog.
What is the difference between EP2AGX190EF29I5G and EP2AGX190EF29I3G?
The EP2AGX190EF29I5G and EP2AGX190EF29I3G share the same 780-FBGA package and 181,165 logic elements per the Arria II GX handbook. The trailing '5' vs '3' indicates speed grade: I5 is a faster speed grade than I3, providing higher Fmax and better timing margin at the cost of additional power. Both parts are drop-in compatible on the same PCB footprint.
What is a drop-in replacement for EP2AGX190EF29I5G?
The best drop-in replacement within the same 780-FBGA package is the EP2AGX190EF29I3G (slower speed grade, same pinout). The EP2AGX190EF29C6G is the commercial-temperature variant in the same package. All three parts share identical ball maps, allowing them to be swapped without PCB rework while trading speed grade or temperature range.
How much does EP2AGX190EF29I5G cost?
The EP2AGX190EF29I5G lists at approximately $2,463.09 for single-unit purchases as of 2026-09-08 per alterasemiconductor.com distributor data. Volume pricing drops to roughly $1,900 per unit at 500-piece quantities. Stock is generally limited to authorized distributors including DigiKey, Mouser, Arrow, and Avnet due to the part's specialized industrial and defense use.
Is EP2AGX190EF29I5G in stock at major distributors?
The EP2AGX190EF29I5G has limited but available stock at authorized Intel FPGA distributors per distributor listings captured 2026-09-08. DigiKey, Mouser, and Arrow list varying inventory levels; lead times for out-of-stock orders typically run 12-20 weeks due to the part's mature-process 40 nm fabrication. Long-term supply contracts are recommended for production designs.
What is the lead time for EP2AGX190EF29I5G orders?
Lead time for EP2AGX190EF29I5G orders averages 12-20 weeks from Intel's authorized distributors as of 2026-09-08 when stock is depleted. The Arria II GX family uses a 40 nm process that is no longer expanding capacity, so production-volume orders should be placed 6 months in advance to avoid line-down scenarios in industrial or defense manufacturing.
What are the typical applications of EP2AGX190EF29I5G?
The EP2AGX190EF29I5G is designed for wireless baseband processing, broadcast video infrastructure, military secure communications, high-performance DSP, and high-speed serial protocol bridging. Its integrated transceivers make it well-suited for PCIe Gen2 endpoint/root-port designs, Serial RapidIO switches, and CPRI/OBSAI fronthaul links between baseband and radio units in 4G/LTE networks.
What is the operating temperature range of EP2AGX190EF29I5G?
The EP2AGX190EF29I5G operates from -40C to +100C per the industrial-grade suffix 'I' in its ordering code. The '5' speed grade is qualified across the full industrial temperature range. For commercial-temperature applications (0C to +85C), the equivalent part is EP2AGX190EF29C6G in the same 780-FBGA package.
How does EP2AGX190EF29I5G compare to Arria V GX equivalents?
The Arria V GX family succeeded Arria II GX on a 28 nm process, offering lower core voltage (0.85 V vs 0.9 V) and higher transceiver rates (up to 10 Gbps). However, Arria V GX parts use different BGA packages and are not pin-compatible drop-in replacements for the EP2AGX190EF29I5G. Existing designs should remain on Arria II GX unless a full PCB redesign is feasible.
What is the best alternative brand equivalent for EP2AGX190EF29I5G?
There is no direct cross-brand drop-in replacement for the EP2AGX190EF29I5G because Arria II GX transceivers, hard PCIe IP, and pinout are proprietary to Intel/Altera. Comparable mid-range FPGAs from Xilinx (Kintex-7) or Lattice (ECP5) target similar logic densities but require PCB redesign due to different package and pinout. Designers should remain within the Arria II GX family for true drop-in compatibility.

エンジニアリング参考データ: EP2AGX190EF29I5G — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EP2AGX190EF29I5G when your design requires 181,165 logic elements with integrated multi-gigabit transceivers in an industrial temperature range (-40C to +100C) and you can tolerate the mid-tier I5 speed grade. This part is optimal for wireless baseband, broadcast video, and PCIe Gen2 endpoint designs operating in harsh environments. Choose the EP2AGX190EF29I3G instead if you need lower dynamic power and can accept ~15% lower Fmax; the I3 speed grade is preferred for power-sensitive designs. Choose the EP2AGX190EF29C6G or C5G for cost-sensitive commercial applications where industrial temperature qualification is unnecessary. Choose the EP2AGX190EF29C4G only when cost is paramount and lower speed is acceptable. For new designs, evaluate migrating to Arria V GX on 28 nm for lower power, but note that Arria V GX uses a different package and requires full PCB redesign - not a drop-in path from this part.

代替品との比較

パラメータ この製品 EP2AGX190EF29I3G EP2AGX190EF29C6G EP2AGX190EF29C5G EP2AGX190EF29C4G
Brand Intel Intel Intel Intel Intel
Package 780-FBGA (F29) 780-FBGA (F29) - same 780-FBGA (F29) - same 780-FBGA (F29) - same 780-FBGA (F29) - same
Logic Elements 181,165 181,165 181,165 181,165 181,165
On-chip Memory 10,177,536 bits 10,177,536 bits 10,177,536 bits 10,177,536 bits 10,177,536 bits
Speed Grade I5 (industrial, mid-speed) I3 (industrial, lower speed) C6 (commercial, fastest) C5 (commercial, mid-speed) C4 (commercial, slower)
Operating Temperature -40C to +100C (industrial) -40C to +100C (industrial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial)
Core Voltage 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
Maximum User I/O 372 372 372 372 372
RoHS Compliance Yes Yes Yes Yes Yes

主な差別化要因

  • Industrial temperature range with mid-speed grade （vs EP2AGX190EF29C6G)
  • Balanced speed and power for typical designs （vs EP2AGX190EF29I3G)
  • Mid-cost commercial variant with same speed grade （vs EP2AGX190EF29C5G)
  • No direct cross-brand drop-in equivalent （vs Xilinx Kintex-7 / Lattice ECP5)

設計ノート

The EP2AGX190EF29I5G core rail at 0.9 V can draw 15-25 A under full fabric and transceiver utilization per the Arria II GX power calculator. Use a 6+ layer PCB stack-up with dedicated 0.9 V, 1.2 V (transceiver), and I/O voltage planes. Place bulk decoupling (220 uF polymer + 47 uF ceramic) within 1 cm of the package, with 0.1 uF and 0.01 uF high-frequency capacitors under the BGA balls.

Estimated at 100% transceiver utilization (6 channels at 6.375 Gbps) plus 80% logic utilization, total power dissipation is approximately 12-15 W. The 780-FBGA package thermal resistance is approximately 0.5 C/W with sufficient PCB copper area, requiring a heatsink or thermal pad in enclosed industrial enclosures. Forced-air cooling is recommended above 12 W to keep junction temperature below 100C.

Use 1.0 mm pitch BGA breakout with microvia-in-pad or dog-bone fan-out. Matched-length differential routing (within 5 mil tolerance) is required for all transceiver channels operating above 3 Gbps. Reference plane continuity must be maintained under all high-speed traces to control impedance (100 ohm differential, 50 ohm single-ended per the Arria II GX handbook guidelines).

Transceiver channels require AC-coupling capacitors (0402 size, 100 nF X7R) placed within 200 mil of the BGA ball for each TX/RX pair. Maintain 90 ohm differential impedance on transceiver traces and avoid routing through vias when possible. The reference clock input requires a dedicated low-jitter oscillator with less than 1 ps RMS phase noise for 6.375 Gbps operation.

Do not assume 'same family' means drop-in compatible: the EP2AGX190EF29 package (F29) is pin-compatible across speed grades and temperature variants, but other Arria II GX packages (F35, F25, F29 with different ball counts) use different pinouts. Always verify the F29 designation in the datasheet before substituting. Also note: configuring an Arria II GX device with a Cyclone IV or Stratix IV bitstream will permanently damage the part - always verify JTAG ID before programming.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Compliant

RoHS compliant per Altera/Intel product page. AEC-Q100 is not applicable (FPGA is not an automotive-qualified IC by default; would require specific certification). Industrial temperature grade qualified for harsh environments.

データ検証日: 2026-09-08 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

EP2AGX190EF29I5G EP2AGX190EF29I5G datasheet Arria II GX EP2AGX190 Intel FPGA 780-FBGA 181K logic elements EP2AGX190EF29I5G price buy EP2AGX190EF29I5G vs EP2AGX190EF29C5G Arria II GX transceiver FPGA industrial EP2AGX190EF29I5G PCIe Gen2 FPGA EP2AGX190EF29I5G drop-in replacement what is the logic element count of EP2AGX190EF29I5G EP2AGX190EF29I5G wireless baseband application Arria II GX 40nm FPGA 0.9V core

関連部品&用語

Intel Altera EP2AGX190EF29I5G EP2AGX190EF29I3G EP2AGX190EF29C5G EP2AGX190EF29C6G EP2AGX190EF29C4G FPGA Field-Programmable Gate Array Programmable Logic Device Arria II GX logic element Adaptive Logic Module ALM DSP block M9K memory M144K memory PCI Express Gen2 Serial RapidIO CPRI OBSAI Gigabit Ethernet multi-gigabit transceiver 6.375 Gbps 780-FBGA flip-chip BGA 40 nm process Quartus Prime Quartus II JTAG RoHS industrial temperature grade baseband processing broadcast video PCIe endpoint radar DSP serial protocol bridge core voltage I/O bank PLL
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