PI7C7300ANAE
PI7C7300ANAE - 3-Port PCI Bridge Interface IC | Diodes Incorporated
Diodes Incorporated PI7C7300ANAE is a 3-port PCI-to-PCI bridge interface IC packaged in a 272-ball PBGA measuring 27 x 27 mm. The device is intended to bridge PCI-compatible expansion or embedded-system buses, consolidating the physical and logical interface functions needed when one PCI host must communicate with multiple PCI agents. Its defining published features are the three-port bridge configuration, conventional parallel PCI interface, and high-density 272-ball BGA package.
A PCI-to-PCI bridge is a specialized interface integrated circuit within the broader PCI interface-controller hierarchy. It sits electrically between two PCI bus segments and allows compatible PCI devices or subsystems on the secondary side to communicate with the host-side PCI bus. Such bridges are especially relevant to embedded computing, industrial control, communications equipment, and legacy PCI expansion systems where a bus translation function is required but a newer host-to-PCI interface is not appropriate.
The PI7C7300ANAE provides three PCI ports for designing systems around multiple downstream PCI agents. This makes it useful where a central host must coordinate several bus participants, including endpoint devices, bridges, or controller functions implemented in an embedded subsystem. Because the device uses a large-array BGA package, its implementation depends on multilayer PCB routing, controlled impedance, solid thermal management, and careful high-speed signal routing rather than a simple two-row peripheral package.
The 272-ball PBGA is the principal mechanical constraint when evaluating this component. Its 27 x 27 mm footprint provides dense access to the PCI bridge's power, ground, clock, control, and data contacts, but it also demands exact land-pattern compliance, ball-to-pad alignment, and assembly-process validation. Tube packaging is listed in the verified distributor data, so procurement and assembly planning should account for the component's handling requirements before committing to a production build.
Typical applications include embedded PCI backplanes, industrial controller platforms, communications gateways, test systems, and specialized expansion chassis that retain conventional PCI connectivity. In these systems, the PI7C7300ANAE serves as the central bus-routing element rather than as a general-purpose processor, memory device, or isolated interface transceiver. Adjacent Ethernet, USB, serial, and industrial interface components may support the wider system, but the bridge remains the component responsible for PCI-to-PCI transaction forwarding.
Designers should obtain the manufacturer datasheet and verify all electrical, timing, clocking, power, thermal, and pin-level requirements before schematic capture or PCB layout. The high-density BGA also benefits from assembly-capability review, impedance-controlled stack-up selection, via placement around the device, and adequate power-plane distribution. This page consolidates verified distributor and datasheet-link information, purchasing considerations, application context, and the limits of the currently available substitute data.
見積もり
お問い合わせ