10M02DCU324A7G vs 10M04DAU324C8G 比較
詳細な並列比較: 10M02DCU324A7G メーカー: Intel および 10M04DAU324C8G メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | 10M02DCU324A7G | 10M04DAU324C8G |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $6.30 | $0.00 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 2,000 | — |
| Embedded Memory | 110,592 bits | 193,536 bits |
| User I/O Count | 160 | — |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | — |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | — |
| Core Voltage | 1.15 V to 1.25 V | 1.2 V |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| 動作接合温度 | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| 実装タイプ | Surface Mount | Surface Mount |
| Process Technology | 55 nm embedded flash (TSMC) | — |
| RoHS ステータス | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Elements | — | 4,000 |
| User I/O | — | 246 |
| パッケージ | — | 324-LFBGA |
| Package Code | — | U324 |
| Technology | — | 55 nm |
| Ordering Part Number | — | 10M04DAU324C8G |
| Speed Grade | — | C8G |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| 動作温度 | — | [DATA_NEEDED: operating temperature range] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| I/O Standard Support | — | [DATA_NEEDED: I/O standard support] |
| Supply Voltage Range | — | [DATA_NEEDED: supply voltage range] |
| Timing Performance | — | [DATA_NEEDED: timing performance] |
| Embedded Multiplier Count | — | [DATA_NEEDED: embedded multiplier count] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Maximum User I/O | — | 246 |
| Ball Grid Package | — | 324 balls |
| Device Manufacturer | — | Intel / Altera |