10M02DCU324A7G vs 10M04DAU324C8G 비교
다음의 상세 나란히 비교: 10M02DCU324A7G 제조: Intel 및 10M04DAU324C8G 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 10M02DCU324A7G | 10M04DAU324C8G |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $6.30 | $0.00 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 2,000 | — |
| Embedded Memory | 110,592 bits | 193,536 bits |
| User I/O Count | 160 | — |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | — |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | — |
| Core Voltage | 1.15 V to 1.25 V | 1.2 V |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| 동작 접합 온도 | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| 실장 유형 | Surface Mount | Surface Mount |
| Process Technology | 55 nm embedded flash (TSMC) | — |
| RoHS 상태 | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Elements | — | 4,000 |
| User I/O | — | 246 |
| 패키지 | — | 324-LFBGA |
| Package Code | — | U324 |
| Technology | — | 55 nm |
| Ordering Part Number | — | 10M04DAU324C8G |
| Speed Grade | — | C8G |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| 동작 온도 | — | [DATA_NEEDED: operating temperature range] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| I/O Standard Support | — | [DATA_NEEDED: I/O standard support] |
| Supply Voltage Range | — | [DATA_NEEDED: supply voltage range] |
| Timing Performance | — | [DATA_NEEDED: timing performance] |
| Embedded Multiplier Count | — | [DATA_NEEDED: embedded multiplier count] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Maximum User I/O | — | 246 |
| Ball Grid Package | — | 324 balls |
| Device Manufacturer | — | Intel / Altera |