EP2SGX90EF1152C3N vs EP2SGX90EF1152C3ES 比較
詳細な並列比較: EP2SGX90EF1152C3N メーカー: Intel および EP2SGX90EF1152C3ES メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
Intel
EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel
EP2SGX90EF1152C3ES ⚠ ラストタイムバイ仕様比較
| パラメータ | EP2SGX90EF1152C3N | EP2SGX90EF1152C3ES |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | 有効 | ラストバイ |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $1,280.00 | $2,050.00 |
| Series | Stratix II GX | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | 1.5 V (Enhanced, 'E' suffix) |
| Operating Frequency (max) | 816.9 MHz | — |
| 動作温度 | 0C to +85C (Commercial) | — |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| 実装タイプ | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | C3 |
| Temperature Grade | C3 (Commercial) | Commercial Extended (-40 C to +100 C) |
| Process Node | — | 90 nm |
| Logic Elements | — | 90,960 |
| Embedded Memory | — | 4,520,448 bits (approx. 4.5 Mbit) |
| User I/O Pins | — | 558 |
| パッケージ | — | 1152-BBGA (FineLine BGA, 35x35 mm) |
| High-Speed Transceivers | — | Up to 12 channels (per Stratix II GX family) |
| Transceiver Data Rate | — | Up to 6.375 Gbps per channel (family spec) |
| DSP Blocks | — | Yes, dedicated 18x18 multipliers and accumulators |
| PLL Count | — | [DATA_NEEDED: PLL count for EP2SGX90 variant] |
| User I/O Banks | — | 24 (per package datasheet) |
| Configuration | — | SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG |
| RoHS ステータス | — | Compliant |
| Lead-Free | — | Yes |