EP2SGX90EF1152C3N vs EP2SGX90EF1152C3ES 비교
다음의 상세 나란히 비교: EP2SGX90EF1152C3N 제조: Intel 및 EP2SGX90EF1152C3ES 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel
EP2SGX90EF1152C3ES ⚠ 최종 구매사양 비교
| 파라미터 | EP2SGX90EF1152C3N | EP2SGX90EF1152C3ES |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 최종 구매 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,280.00 | $2,050.00 |
| Series | Stratix II GX | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | 1.5 V (Enhanced, 'E' suffix) |
| Operating Frequency (max) | 816.9 MHz | — |
| 동작 온도 | 0C to +85C (Commercial) | — |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | C3 |
| Temperature Grade | C3 (Commercial) | Commercial Extended (-40 C to +100 C) |
| Process Node | — | 90 nm |
| Logic Elements | — | 90,960 |
| Embedded Memory | — | 4,520,448 bits (approx. 4.5 Mbit) |
| User I/O Pins | — | 558 |
| 패키지 | — | 1152-BBGA (FineLine BGA, 35x35 mm) |
| High-Speed Transceivers | — | Up to 12 channels (per Stratix II GX family) |
| Transceiver Data Rate | — | Up to 6.375 Gbps per channel (family spec) |
| DSP Blocks | — | Yes, dedicated 18x18 multipliers and accumulators |
| PLL Count | — | [DATA_NEEDED: PLL count for EP2SGX90 variant] |
| User I/O Banks | — | 24 (per package datasheet) |
| Configuration | — | SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG |
| RoHS 상태 | — | Compliant |
| Lead-Free | — | Yes |