EP2SGX90EF1152C3N vs EP2SGX90EF1152I3 比較
詳細な並列比較: EP2SGX90EF1152C3N メーカー: Intel および EP2SGX90EF1152I3 メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EP2SGX90EF1152C3N | EP2SGX90EF1152I3 |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | 有効 | ラストバイ |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $1,280.00 | $1,480.00 |
| Series | Stratix II GX | Stratix II GX |
| Family | Stratix II GX | — |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Operating Frequency (max) | 816.9 MHz | — |
| 動作温度 | 0C to +85C (Commercial) | — |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-ball FC-FBGA (flip-chip) |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| 実装タイプ | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | — |
| Temperature Grade | C3 (Commercial) | — |
| Logic Elements | — | 90,960 |
| Adaptive Logic Modules (ALMs) | — | 558 |
| Equivalent Logic Cells (CLBs) | — | 90,960 |
| Total RAM Bits | — | 4,520,448 |
| Maximum Operating Frequency | — | 622.08 MHz |
| Core Supply Voltage (VCCINT) | — | 1.2 V nominal (1.15 V to 1.25 V) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Terminal Form | — | Ball |
| Terminal Pitch | — | [DATA_NEEDED: ball pitch] |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Configuration Architecture | — | Enhanced Configuration (EPC) devices supported |
| RoHS ステータス | — | Compliant |