EP3C5F256C6 vs EP3C16F256I7N 比較
詳細な並列比較: EP3C5F256C6 メーカー: Intel および EP3C16F256I7N メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EP3C5F256C6 | EP3C16F256I7N |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $21.40 | $38.50 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | 963 |
| Total Memory Bits | 423,936 bits | 516096 |
| Embedded Memory | M9K blocks (per Cyclone III family) | 56 M9K blocks (504 Kbit) |
| Embedded 18x18 Multipliers | 23 | 56 |
| User I/Os | 182 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | 65 nm CMOS, low-k | TSMC 60 nm low-leakage |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| パッケージ | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| 実装タイプ | Surface Mount | — |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | — |
| RoHS ステータス | Compliant (lead-free per FBGA package) | — |
| Logic Elements (LEs) | — | 15408 |
| Maximum User I/O Pins | — | 168 |
| 動作温度 | — | -40C to +100C (industrial, I7) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |