EP3SE260F1517I4N vs EP3SE260F1517I3N 比較
詳細な並列比較: EP3SE260F1517I4N メーカー: Intel および EP3SE260F1517I3N メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EP3SE260F1517I4N | EP3SE260F1517I3N |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | ラストバイ | Obsolete |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $10,500.00 | $2,275.00 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | 16,672,768 bits |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | Yes (dedicated multiply-accumulate) |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | TSMC 65 nm | 65 nm |
| パッケージ | 1517-BBGA, FCBGA | 1517-ball FC-FBGA |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| 動作温度 | -40 °C to +100 °C (Industrial) | — |
| Operating Temperature Grade | Industrial (I4) | — |
| 実装タイプ | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| MSLレベル | [DATA_NEEDED: MSL classification] | — |
| Family | — | Stratix® III E |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 976 |
| Speed Grade | — | -3 (fastest) |
| Temperature Grade | — | Industrial (I): -40 °C to +100 °C |
| 動作接合温度 | — | -40 °C to +100 °C |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |
| RoHS ステータス | — | Compliant |
| Lead-Free | — | Yes |
| Internal Logic Performance | — | Up to 500 MHz |
| Memory Subsystems | — | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers |