EP3SE260F1517I4N vs EP3SE260F1517I3N 对比
详细并排对比 EP3SE260F1517I4N 出自 Intel 和 EP3SE260F1517I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260F1517I4N | EP3SE260F1517I3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $10,500.00 | $2,275.00 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | 16,672,768 bits |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | Yes (dedicated multiply-accumulate) |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | TSMC 65 nm | 65 nm |
| 封装 | 1517-BBGA, FCBGA | 1517-ball FC-FBGA |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| 工作温度 | -40 °C to +100 °C (Industrial) | — |
| Operating Temperature Grade | Industrial (I4) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| MSL 等级 | [DATA_NEEDED: MSL classification] | — |
| Family | — | Stratix® III E |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 976 |
| Speed Grade | — | -3 (fastest) |
| Temperature Grade | — | Industrial (I): -40 °C to +100 °C |
| 工作结温 | — | -40 °C to +100 °C |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |
| RoHS 状态 | — | Compliant |
| Lead-Free | — | Yes |
| Internal Logic Performance | — | Up to 500 MHz |
| Memory Subsystems | — | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers |