H5CG24AGBDX022N vs H5CG24AGBDX022 比較

詳細な並列比較: H5CG24AGBDX022N メーカー: SK hynix および H5CG24AGBDX022 メーカー: SK hynix。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。

SK hynix
H5CG24AGBDX022N H5CG24AGBDX022N - 16Gb DDR5 SDRAM DRAM | SK hynix

H5CG24AGBDX022N - 16Gb DDR5 SDRAM DRAM | SK hynix

H5CG24AGBDX022N ✓ 生産中
SK hynix
H5CG24AGBDX022 H5CG24AGBDX022 - DDR5 SDRAM Component | SK hynix

H5CG24AGBDX022 - DDR5 SDRAM Component | SK hynix

H5CG24AGBDX022 ✓ 生産中

仕様比較

パラメータ H5CG24AGBDX022N H5CG24AGBDX022
ブランド SK hynix SK hynix
カテゴリ Memory ICs Memory ICs
ライフサイクル状態 有効 有効
在庫状況 In Stock In Stock
単価(USD) $0.00 $0.00
Manufacturer SK hynix —
Product Family H5CG24 series DDR5 SDRAM —
メモリタイプ DDR5 SDRAM DDR5 SDRAM
Density 16 Gbit (2 GB) [DATA_NEEDED: die density (Gb)]
データレート [DATA_NEEDED: data rate / speed bin] [DATA_NEEDED: data transfer rate]
メモリ構成 [DATA_NEEDED: x8 or x16] [DATA_NEEDED: die organization (x8/x16)]
VDD Supply Voltage [DATA_NEEDED: VDD value] —
VDDQ Supply Voltage [DATA_NEEDED: VDDQ value] —
CASレイテンシ [DATA_NEEDED: CL value] [DATA_NEEDED: CL at rated speed bin]
Bank Groups [DATA_NEEDED: bank group count] —
Package Type [DATA_NEEDED: FBGA package code and body size] [DATA_NEEDED: FBGA ball count / package code]
実装タイプ Surface Mount Surface Mount (BGA)
On-Die ECC Yes (DDR5 generation feature) —
動作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: commercial/industrial range]
インターフェースタイプ SSTL / POD (DDR5 per JEDEC) DDR5 (DFE-based receiver)
RoHS ステータス unknown [DATA_NEEDED: RoHS compliance statement]
MSLレベル [DATA_NEEDED: MSL level] —
Manufacturer Series — H5CG Series (SK hynix DDR5)
Supply Voltage VDD — 1.1 V (DDR5 nominal, per SK hynix DDR5 family)
Speed Grade — [DATA_NEEDED: DDR5 speed bin (Mbps)]
Bank Count — 32 banks / 8 bank groups (DDR5 architecture)
Burst Length — 16 (BL16, DDR5 standard)
ECC — On-die ECC (DDR5 standard feature)
JEDEC Standard — DDR5 SDRAM JEDEC standard compatible

データシート&リソース

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