K3LK8L80CM-MGCT vs K3LK8K80CM-MFCP 比較
詳細な並列比較: K3LK8L80CM-MGCT メーカー: Samsung Electronics および K3LK8K80CM-MFCP メーカー: Samsung Electronics。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | K3LK8L80CM-MGCT | K3LK8K80CM-MFCP |
|---|---|---|
| ブランド | Samsung Electronics | Samsung Electronics |
| カテゴリ | Memory ICs | Memory ICs |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $0.00 | $0.00 |
| メモリタイプ | LPDDR5X SDRAM | LPDDR5 SDRAM |
| Density | 32 Gbit (4 GB) | 48 Gbit (6 GB) |
| メモリ構成 | x32 | [DATA_NEEDED: organization (x width)] |
| Max Data Rate | 7500 Mbps | — |
| Supply Voltages | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) | — |
| パッケージ | FBGA-315 (315-ball) | 315-ball FBGA (MFCP) |
| 動作温度 | -25C to +85C | -40 C to +105 C (automotive-grade) |
| 実装タイプ | Surface Mount (BGA) | Surface Mount |
| インターフェース | LPDDR5X (JEDEC low-power DDR) | LPDDR5 (JESD209-5 class low-power DRAM interface) |
| Power Efficiency | ~25% improvement vs LPDDR5 | — |
| Application Class | Mobile, PC, automotive, on-device AI | — |
| RoHS ステータス | Compliant (per JLCPCB listing) | unknown |
| Speed Grade Suffix | CM-MGCT | — |
| Package Family | FBGA -> BGA -> surface mount | — |
| Typical End Products | Smartphones, tablets, edge AI devices | — |
| Refresh / Standby Modes | Self-refresh, deep power-down (per LPDDR5X protocol) | — |
| MSLレベル | [DATA_NEEDED: MSL level] | — |
| Pin Speed | — | 6400 Mbps |
| Data Rate (package) | — | 51.2 GB/s (family max) |
| Ball Count | — | 315 |
| 電源電圧 | — | [DATA_NEEDED: VDD/VDDQ voltage] |
| Power Saving vs LPDDR4X | — | Approximately 20% |
| Generation | — | LPDDR5 (5th generation low-power DRAM) |
| Application Grade | — | Automotive-grade storage chip |
| Place of Origin | — | Johor, Malaysia |