K3LK8L80CM-MGCT vs K3LK8K80CM-MFCP 对比
详细并排对比 K3LK8L80CM-MGCT 出自 Samsung Electronics 和 K3LK8K80CM-MFCP 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K3LK8L80CM-MGCT | K3LK8K80CM-MFCP |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $0.00 |
| 存储器类型 | LPDDR5X SDRAM | LPDDR5 SDRAM |
| Density | 32 Gbit (4 GB) | 48 Gbit (6 GB) |
| 存储组织 | x32 | [DATA_NEEDED: organization (x width)] |
| Max Data Rate | 7500 Mbps | — |
| Supply Voltages | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) | — |
| 封装 | FBGA-315 (315-ball) | 315-ball FBGA (MFCP) |
| 工作温度 | -25C to +85C | -40 C to +105 C (automotive-grade) |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| 接口 | LPDDR5X (JEDEC low-power DDR) | LPDDR5 (JESD209-5 class low-power DRAM interface) |
| Power Efficiency | ~25% improvement vs LPDDR5 | — |
| Application Class | Mobile, PC, automotive, on-device AI | — |
| RoHS 状态 | Compliant (per JLCPCB listing) | unknown |
| Speed Grade Suffix | CM-MGCT | — |
| Package Family | FBGA -> BGA -> surface mount | — |
| Typical End Products | Smartphones, tablets, edge AI devices | — |
| Refresh / Standby Modes | Self-refresh, deep power-down (per LPDDR5X protocol) | — |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| Pin Speed | — | 6400 Mbps |
| Data Rate (package) | — | 51.2 GB/s (family max) |
| Ball Count | — | 315 |
| 电源电压 | — | [DATA_NEEDED: VDD/VDDQ voltage] |
| Power Saving vs LPDDR4X | — | Approximately 20% |
| Generation | — | LPDDR5 (5th generation low-power DRAM) |
| Application Grade | — | Automotive-grade storage chip |
| Place of Origin | — | Johor, Malaysia |