MPC855TZQ80D4 vs MPC855TVR66D4 比較
詳細な並列比較: MPC855TZQ80D4 メーカー: NXP Semiconductors および MPC855TVR66D4 メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | MPC855TZQ80D4 | MPC855TVR66D4 |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | Microcontrollers | Microcontrollers |
| ライフサイクル状態 | 製造終了 | 製造終了 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $61.40 | $55.40 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Type | Microprocessor Unit (MPU) | — |
| Series | PowerQUICC MPC8xx (MPC855T) | — |
| Core Architecture | Power Architecture MPC8xx, 32-bit | — |
| Core Clock Frequency | 80 MHz | — |
| Communication Processor Module (CPM) | Integrated RISC engine with FCC/ATM/HDLC | — |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC | Fast Ethernet (100 Mbps) |
| Serial Protocols | ATM, HDLC, SS#7 (via CPM) | — |
| PCMCIA Interface | Yes (1 or 2 slots) | — |
| Memory Bus Width | 32-bit (external) | — |
| データバス幅 | 32 bit | 32 bit |
| Process Technology | 0.32 um CMOS | 0.32 µm |
| 動作温度 | 0 °C to +95 °C (commercial 'Z' grade) | 0 °C to +95 °C |
| パッケージ | 357-pin PBGA, 25 x 25 mm (ZQ/ZU tray) | 357-PBGA (25x25 mm) |
| 実装タイプ | Surface Mount, BGA | Surface Mount |
| RoHS ステータス | Not compliant (SnPb-ball BGA, pre-RoHS generation) | [DATA_NEEDED: RoHS status] |
| Lead-Free | No (SnPb solder balls) | [DATA_NEEDED: lead-free status] |
| Lifecycle | Discontinued — see Discontinuance PCN | — |
| Processor Series | — | MPC8xx / PowerQUICC |
| Core | — | MPC8xx (single core) |
| 最大クロック周波数 | — | 66 MHz |
| Communication Interfaces | — | ENET, ATM, HDLC, PCMCIA |
| Communication Processor Module | — | Yes (CPM, dedicated RISC engine) |
| カテゴリ | — | Microprocessors (MPU) |
| Tray Packaging | — | Tray |